MSI K9AGM2-F User manual

i
K9AGM2Series
MS-7327(V1.X)Mainboard
G52-73271X2

ii
CopyrightNotice
The materialinthisdocumentistheintellectual propertyof MICRO-STAR
INTERNATIONAL.Wetakeeverycareinthe preparationof thisdocument, butno
guaranteeisgivenastothecorrectnessofitscontents.Ourproductsareunder
continualimprovementand wereservetherighttomakechangeswithoutnotice.
Trademarks
Alltrademarksarethepropertiesoftheirrespectiveowners.
NVIDIA,theNVIDIAlogo,DualNet, and nForceareregisteredtrademarksortrade-
marksofNVIDIACorporationin theUnitedStatesand/orothercountries.
AMD,Athlon ,Athlon XP,Thoroughbred ,andDuron areregisteredtrade-
marksofAMDCorporation.
Intel®andPentium®areregisteredtrademarksofIntelCorporation.
PS/2and OS®/2areregisteredtrademarksofInternationalBusiness Machines
Corporation.
Windows®95/98/2000/NT/XPareregisteredtrademarksofMicrosoftCorporation.
Netware®isaregisteredtrademarkofNovell,Inc.
Award®isaregisteredtrademarkofPhoenixTechnologiesLtd.
AMI®isaregisteredtrademarkofAmericanMegatrendsInc.
RevisionHistory
Revision RevisionHistory Date
V1.0 Firstrelease March2007
TechnicalSupport
Ifaproblemariseswithyoursystemandnosolutioncanbeobtainedfromtheuser’s
manual,pleasecontactyourplaceofpurchaseorlocaldistributor.Alternatively,
pleasetrythefollowing helpresourcesforfurtherguidance.
Visit theMSI websiteforFAQ,technical guide,BIOSupdates,driverupdates,
andotherinformation: http://www.msi.com.tw/program/service/faq/
faq/esc_faq_list.php
Contactourtechnicalstaff at: http://support.msi.com.tw/

iii
SafetyInstructions
CAUTION: Dangerofexplosionifbatteryisincorrectlyreplaced.
Replaceonlywiththe sameorequivalenttype recommendedbythe
manufacturer.
1. Alwaysread thesafetyinstructionscarefully.
2. KeepthisUser’sManualforfuturereference.
3. Keepthisequipmentawayfromhumidity.
4. Laythisequipmentonareliableflatsurfacebeforesetting itup.
5. Theopeningsontheenclosureareforairconvectionhenceprotectstheequip-
ment fromoverheating.DONOTCOVERTHEOPENINGS.
6. Makesurethevoltageofthe powersourceandadjustproperly110/220Vbe-
foreconnectingtheequipmenttothepowerinlet.
7. Placethe powercordsuchawaythatpeoplecannotstepon it. Donotplace
anythingoverthepowercord.
8. AlwaysUnplug thePowerCordbeforeinsertinganyadd-oncardormodule.
9. All cautionsand warningsontheequipmentshouldbenoted.
10. Neverpouranyliquidintotheopeningthatcoulddamage orcauseelectrical
shock.
11. If anyof thefollowing situationsarises, gettheequipmentcheckedbyaservice
personnel:
†Thepowercordorplugisdamaged.
†Liquid haspenetratedintotheequipment.
†Theequipmenthasbeen exposedtomoisture.
†Theequipmenthasnotworkwelloryoucannotgetitworkaccording to
User’sManual.
†Theequipmenthasdroppedand damaged.
†Theequipmenthasobvioussign of breakage.
12.DONOTLEAVETHISEQUIPMENTINANENVIRONMENTUNCONDITIONED,STOR-
AGETEMPERATUREABOVE600C(1400F),IT MAYDAMAGETHEEQUIPMENT.

iv
FCC-BRadio Frequency Interference Statement
Thisequipmenthasbeen
tested and found tocomply
withthe limitsforaClassB
digitaldevice,pursuanttoPart
15of the FCCRules.Theselimitsaredesignedtoprovidereasonable protection
againstharmful interferenceinaresidentialinstallation.Thisequipmentgenerates,
usesand canradiateradiofrequencyenergyand,ifnotinstalledand used in accor-
dancewiththeinstructions,maycauseharmful interferencetoradiocommunications.
However,thereisno guarantee thatinterferencewill notoccurin aparticular
installation.Ifthisequipmentdoescauseharmful interferencetoradioortelevision
reception,whichcanbedeterminedbyturning theequipmentoff and on,the useris
encouragedtotrytocorrecttheinterferencebyone ormoreof themeasureslisted
below.
†Reorientorrelocatethereceiving antenna.
†Increasetheseparationbetweentheequipmentand receiver.
†Connecttheequipmentintoanoutleton acircuitdifferentfromthatto
whichthereceiverisconnected.
†Consultthedealeroranexperiencedradio/televisiontechnicianforhelp.
Notice1
Thechangesormodificationsnotexpresslyapprovedbythepartyresponsible for
compliancecould void theuser’sauthoritytooperatetheequipment.
Notice2
Shieldedinterfacecablesand A.C.powercord,ifany,mustbeusedinorderto
complywiththeemissionlimits.
VOIRLANOTICED’INSTALLATIONAVANTDERACCORDERAURESEAU.
Micro-StarInternational
MS-7327
ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothe
followingtwoconditions:
(1)thisdevicemaynotcauseharmfulinterference,and
(2)thisdevicemustaccept anyinterferencereceived,includinginterferencethat
maycauseundesiredoperation.

v
WEEE (WasteElectricaland ElectronicEquipment) Statement

vi

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CONTENTS
CopyrightNotice.........................................................................................................ii
Trademarks..................................................................................................................ii
RevisionHistory.........................................................................................................ii
TechnicalSupport......................................................................................................ii
SafetyInstructions...................................................................................................iii
FCC-BRadioFrequencyInterferenceStatement.............................................iv
WEEE (WasteElectricaland ElectronicEquipment) Statement.......................v
English......................................................................................................................En-1
Specifications....................................................................................................En-2
CentralProcessing Unit:CPU...........................................................................En-5
Memory...............................................................................................................En-7
Connectors,Jumpers,Slots.............................................................................En-9
BackPanel........................................................................................................En-18
BIOSSetup.......................................................................................................En-21
SoftwareInformation......................................................................................En-25
Deutsch....................................................................................................................De-1
Spezifikationen..................................................................................................De-2
Hauptprozessor:CPU.......................................................................................De-5
Speicher.............................................................................................................De-7
Anschlüsse,Steckbrückenund Slots.............................................................De-9
HinteresAnschlusspaneel.............................................................................De-18
BIOSSetup.......................................................................................................De-21
Software-Information......................................................................................De-25
Fran ais.....................................................................................................................Fr-1
Spécificités.........................................................................................................Fr-2
CentralProcessing Unit:CPU............................................................................Fr-5
Mémoire...............................................................................................................Fr-7
Connecteurs,Cavaliers,Slots..........................................................................Fr-9
PanneauArrière...............................................................................................Fr-18
Configuration duBIOS......................................................................................Fr-21
InformationdeLogiciel.....................................................................................Fr-25
Русский ....................................................................................................................Ru-1
Характеристики ...............................................................................................Ru-2
Центральный процессор (CPU).....................................................................Ru-5
Папять ...............................................................................................................Ru-7
Соединители, перемычки, разъемы ............................................................Ru-9
Задняя панель ...............................................................................................Ru-18
Настройка BIOS..............................................................................................Ru-21
Сведения опрограммном обеспечении ...................................................Ru-25

En-1
InstallationGuide
English
K9AGM2
User’sGuide
English

En-2
MS-7327Mainboard
Specifications
ProcessorSupport
-AMD®Athlon64 /Athlon64 X2AM2processorsinSKT940 package
-Supports4pinCPUFanPin-HeaderwithFan Speed Control
-Supportsup to5000+andhigterCPU
(ForthelatestinformationaboutCPU, pleasevisit
http://www.msi.com.tw/cpusupport.htm)
SupportedFSB
-1000 MHz
Chipset
-NorthBridge:AMD®690G/690Vchipset
-SouthBridge:SB600 chipset
MemorySupport
-DDRII 800/667/533/400DRAM(4GBMax)
-2DDRII DIMMs(240pin/1.8V)
(Formoreinformation oncompatiblecomponents,pleasevisit
http://www.msi.com.tw/testreport.htm)
LAN (Optional)
-Supports10/100 FastEthernetby8101E
-Supports10/100/1000 FastEthernetby8111B
1394 (Optional)
-Supports2IEEE1394 ports, transferrateisup to400Mbps
-ControlledbyVIAVT6308 (optional)
Audio
-ChipintegratedbyRealtek®ALC888
-Flexible8-channelaudiowithjack sensing
-CompliantwithAzalia1.0spec
IDE
-1IDEportbySB600
-SupportsUltraDMA66/100/133 mode
-SupportsPIO,BusMasteroperationmode
SATA
-SATAII portsbySB600
-SupportsfourSATAII device
-Supportsstorageand datatransfersatup to300MB/s
Floppy
-1floppyport
-Supports1FDD with360K,720K, 1.2M,1.44Mand2.88Mbytes

En-3
InstallationGuide
English
Connectors
Back panel
-1PS/2mouseport
-1PS/2keyboardport
-1HDMIport(optional)
-1VGAport
-1parallelportsupporting SPP/EPP/ECPmode
-4USB2.0Ports
-1LANjack
-6flexibleaudiojacks
-11394port(optional)
On-BoardPinheaders
-3USB 2.0pinheaders
-11394 pinheader(optional)
-1TV-outpinheader(optional)
-1Audiopinheader
-1CD-inconnector
-1SPDIFoutconnector(optional)
-1SPDIFinconnector(optional)
-4SerialATAports
Slots
-1PCI Expressx16 slot
-2PCIslots
-1PCIExpress x1slot
FormFactor
-Micro-ATX(24.4cmX21.5cm)
Mounting
-6mountingholes

En-4
MS-7327Mainboard
QuickComponentsGuideofK9AGM2Series
(MS-7327v1.X)Mainboard
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En-5
InstallationGuide
English
The mainboardsupportsAMD®processor.ThemainboardusesaCPUsocket
calledSocketAM2foreasyCPUinstallation.Ifyou donothavethe CPUcooler,
consultyourdealerbeforeturningonthecomputer.
ForthelatestinformationaboutCPU,pleasevisithttp://www.msi.com.tw/program/prod-
ucts/mainboard/mbd/pro_mbd_cpu_support.php
1
Central ProcessingUnit:CPU
CPUInstallationProceduresforSocketAM2
1.Pleaseturnoffthe powerandunplugthepowercordbe-
foreinstallingtheCPU.
2.Pull theleversideways awayfromthesocket.Makesureto
raisethe leverup toa90-degreeangle.
3.LookforthegoldarrowoftheCPU.Thegoldarrowshould
pointasshowninthepicture.TheCPUcanonlyfitinthe
correctorientation.
4.If theCPUiscorrectlyinstalled,thepinsshouldbe com-
pletelyembeddedintothesocketand cannotbeseen.Pleasenotethatany
violation ofthe correctinstallationproceduresmaycausepermanentdamagesto
yourmainboard.
5.Pressthe CPUdownfirmlyintothesocket and closethelever. Asthe CPUislikelyto
movewhiletheleverisbeing closed,always closetheleverwithyourfingerspress-
ingtightlyon topoftheCPUtomakesuretheCPUisproperlyand completely
embedded intothesocket.
Goldarrow
CorrectCPU
placement
Important
Overheating
Overheatingwill seriouslydamage the CPUand system.Always makesurethe
cooling fancan workproperlytoprotectthe CPUfromoverheating.Makesure
thatyouapplyaneven layerofthermalpaste(orthermaltape)betweenthe CPU
andtheheatsinktoenhanceheatdissipation.
ReplaceingtheCPU
WhilereplacingtheCPU,alwaysturnoff the ATXpowersupplyorunplug the
powersupply spowercordfromthegrounded outletfirsttoensurethe safetyof
CPU.
Overclocking
Thismainboardisdesignedtosupportoverclocking.However,pleasemake
sureyourcomponentsareabletotoleratesuchabnormalsetting, whiledoing
overclocking.Anyattempttooperatebeyond productspecificationsisnot
recommended. We donotguarantee thedamages orrisks causedbyinad-
equateoperationorbeyond productspecifications.

En-6
MS-7327Mainboard
Installing CPUCoolerSet
Whenyouareinstalling theCPU, make suretheCPUhas aheatsinkand acooling
fanattachedonthetoptopreventoverheating. If youdonothavetheCPUcooler,
consultyourdealerbeforeturningonthecomputer.
1.Positionthecoolingsetontotheretentionmechanism.Hookoneendoftheclipto
hookfirst.
2.Thenpress downtheotherend ofthe cliptofasten thecooling setonthetopofthe
retentionmechanism.LocatetheFixLeverand lift upit.
3.Fastendownthe lever.
4.AttachtheCPUFancabletotheCPUfanconnectoronthe mainboard.
FixedLever
Important
Mainboardphotosshowninthissectionarefordemonstrationofthe CPU/cooler
installationonly. Theappearanceofyourmainboardmayvarydepending onthe
modelyoupurchase.

En-7
InstallationGuide
English
Memory
DDR
Specification :184-pin,2.5v.
Singlechanneldefinition :All DIMM slotsareGREENcolor.
Dualchannelsdefinition :DIMMslot(s)onChannelAaremarkedinGREENcolor.
DIMMslot(s)onChannelBaremarkedinPurplecolor.
DDR2
Specification :240-pin,1.8v.
Singlechanneldefinition :All DIMM slotsareGREENcolor.
Dualchannelsdefinition :DIMMslot(s)onChannelAaremarkedinGREENcolor.
DIMMslot(s)onChannelBaremarkedinOrangecolor.
64x2=128 pin 56x2=112 pin
40x2=80pin 52x2=104 pin
2
3
Important
-DDR2memorymodulesarenot interchangeablewithDDR and the DDR2stan
dardisnotbackwardscompatible. You shouldalwaysinstallDDR2memory
modulesinthe DDR2DIMM slots.
-InDual-Channelmode,makesurethatyouinstall memorymodulesof thesame
typeanddensity indifferentchannelDIMM slots.
-Toenablesuccessfulsystemboot-up, always insertthe memorymodulesintothe
DIMM1first.

En-8
MS-7327Mainboard
InstallingMemoryModules
Youcanfind thenotchonthememorymodulesand thevoltontheDIMM slotswhether
DDRorDDR2.Followtheproceduresbelowtoinstall thememorymoduleproperly.
1.The memorymoduleshasonlyone notchonthecenterandwillonlyfitintheright
orientation.
2.InsertthememorymoduleverticallyintotheDIMMslot.Thenpushitinuntilthe
goldenfingeronthememorymoduleisdeeplyinserted inthe DIMMslot.
3.Theplasticclipateachside oftheDIMMslot will automaticallyclose.
Important
Youcan barelysee the golden fingerif the memorymoduleisproperlyinserted in
theDIMMslot.
Volt Notch

En-9
InstallationGuide
English
Connectors,Jumpers, Slots
FloppyDisk Drive Connector
Thisconnectorsupports360KB, 720KB, 1.2MB, 1.44MBor2.88MBfloppydiskdrive.
5
FanPowerConnectors
Thefan powerconnectorssupportsystemcooling fanwith+12V.TheCPUFANsupports
SmartFAN function.Whenconnectthewiretotheconnectors,always takenotethat the
redwireisthe positiveand shouldbeconnectedtothe+12V, theblack wireisGround
andshouldbeconnectedtoGND.Ifthe mainboardhasaSystemHardwareMonitor
chipseton-board,youmustuseaspeciallydesigned fanwithspeedsensortotake
advantageofthefan control.
SYSFAN/NB FAN/
POWERFAN
SENSORorNC
+12V
GND
4
IDEconnector
ThisconnectorsupportsIDEharddiskdrives,opticaldisk drivesand otherIDE devices.
6
CPUFAN
SENSOR
+12V
GND
Control
Important
1.Pleaserefertothe recommended CPUfansatprocessor sofficialwebsiteor
consultthe vendorsforproperCPUcooling fan.
2.Fancoolersetwith3or4pinspowerconnectorarebothavailableforCPUFAN.
Important
Ifyou installtwoIDE devicesonthe samecable,youmustconfigurethe drives
separatelytoMaster/Slavemodebysettingjumpers.RefertoIDEdevices
documentationsuppliedbythevendorsforjumpersetting instructions.

En-10
MS-7327Mainboard
FrontPanelConnectors
Theseconnectorsareforelectricalconnection tothefrontpanelswitchesandLEDs.
TheJFP1iscompliantwithIntel®Front PanelI/OConnectivityDesign Guide.
1
29
10
HDD
LED Reset
Switch
Power
LED Power
Switch
JFP1 JFP2
7
8
PowerLED
Speaker
1
2
IEEE1394 Connector(Green)
ThisconnectorallowsyoutoconnecttheIEEE1394deviceviaanoptionalIEEE1394
bracket.
8
9
SerialATAConnector
Thisconnectorisahigh-speedSerialATAinterfaceport. Eachconnectorcanconnectto
oneSerialATAdevice.
7
Important
Pleasedonot foldthe SerialATAcableinto90-degreeangle.Otherwise,data
loss mayoccurduring transmission.
1 2
910
TPA+
Ground
TPB+
Cablepower
Key(nopin)
TPA-
Ground
TPB-
Cablepower
Ground
IEEE1394Bracket
(Optional)

En-11
InstallationGuide
English
S/PDIF-OutConnectororS/PDIF-InConnector
ThisconnectorisusedtoconnectS/PDIF(Sony&PhilipsDigitalInterconnectFormat)
interfacefordigitalaudiotransmission.
SPDIFBracket(Optional)
FrontUSBConnector(Yellow)
Thisconnector,compliantwithIntel®I/OConnectivityDesign Guide,isidealforcon-
necting high-speedUSB interfaceperipheralssuchas USBHDD, digitalcameras, MP3
players, printers, modemsandthelike.
SPDIF_In
VCC
SPDIF_in
GND
SPDIF_Out
VCC
SPDIF_out
GND
USBOC
10
1 2
VCC
USB0-
USB0+
GND
Key(nopin)
VCC
USB1-
USB1+
GND
9
Important
Notethatthepinsof VCCandGND mustbeconnectedcorrectlytoavoidpossible
damage.
10
FrontPanelAudioConnector(AzaliaSpec)
Thisconnectorallowsyoutoconnect thefrontpanelaudioand iscompliantwithIntel®
FrontPanelI/OConnectivityDesignGuide.
11
12
12
910
MIC _L
MIC_R
LINEout_R
Front_JD
LINEout_L
Ground
Presence#
MIC_JD
NC(Nopin)
LINEout_JD
USB2.0Bracket
(Optional)

En-12
MS-7327Mainboard
CD-InConnector
Thisconnectorisprovided forexternalaudioinput.
ChassisIntrusionConnector
Thisconnectorconnectstothechassisintrusionswitchcable.Ifthechassisisopened,
thechassisintrusion mechanismwillbeactivated. Thesystemwill recordthisstatusand
showawarning message onthescreen. Toclearthewarning,youmustentertheBIOS
utilityandcleartherecord.
GND R
L
FrontPanelAudioConnector(AC97 Spec)
Thisconnectorallowsyoutoconnect thefrontpanelaudioand iscompliantwithIntel®
FrontPanelI/OConnectivityDesignGuide.
15
12
910
AUD_MIC
AUD_MIC_BIAS
AUD_FPout_R
HP_ON
AUD_FPout_L
AUD_GND
AUD_VCC
AUD_RET_R
Key
AUD_RET_L
13
Important
Ifyou don twanttoconnecttothe frontaudioheader,pins5&6,9&10have
tobe jumperedinordertohavesignaloutputdirectedtothe rearaudioports.
Otherwise,theLine-Outconnectoron the backpanelwillnotfunction.
14
1
2CINTRU
GND
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4
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