MSI MS-6137 v5.X User manual

i
Version 5.0
G52-MA00452
MS-6137 (v5.X) Micro ATX Mainboard
MSI
MICRO-STAR INTERNATIONAL

ii
Manual Rev: 5.0
Release Date: Sept. 2001
FCC-B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class
B digital device, pursuant to part 15 of the FCC rules. These limits are designed
to provide reasonable protection against harmful interference when the equip-
ment is operated in a commercial environment. This equipment generates, uses
and can radiate radio frequency energy and, if not installed and used in accor-
dance with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to
cause harmful interference, in which case the user will be required to correct
the interference at his own expense.
Notice 1
The changes or modifications not expressly approved by the party respon-
sible for compliance could void the user’s authority to operate the equipment.
Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to
comply with the emission limits.
VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU
RESEAU.
Micro-Star International MS-6137
Tested to comply
with FCC Standard
For Home or Office Use

iii
Edition
Sept. 2001
Copyright Notice
The material in this document is the intellectual property of MICRO-
STAR INTERNATIONAL. We take every care in the preparation
of this document, but no guarantee is given as to the correctness of its
contents. Our products are under continual improvement and we re-
serve the right to make changes without notice.
Trademarks
All trademarks used in this manual are the property of their respective
owners.
Intel and Pentium are registered trademarks of Intel Corporation.
PS/2 and OS/2 are registered trademarks of IBM Corporation.
Windows 95/98/2000 and Windows NT are registered trademarks of Microsoft.
Netware is a registered trademark of Novell.
Award is a registered trademark of Award Software Inc.
Revision History
Revision Revision History Date
V5.0 First release for PCB 5.X Sept. 2001

iv
1. Always read the safety instructions carefully.
2. Keep this User’s Manual for future reference.
3. Keep this equipment away from humidity.
4. Lay this equipment on a reliable flat surface before setting it up.
5. The openings on the enclosure are for air convection hence protects the
equipment from overheating. DO NOT COVER THE OPENINGS.
6. Make sure the voltage of the power source and adjust properly 110/220V
before connecting the equipment to the power inlet.
7. Place the power cord such a way that people can not step on it. Do not
place anything over the power cord.
8. Always Unplug the Power Cord before inserting any add-on card or module.
9. All cautions and warnings on the equipment should be noted.
10. Never pour any liquid into the opening that could damage or cause electri-
cal shock.
11. If any of the following situations arises, get the equipment checked by a
service personnel:
zThe power cord or plug is damaged
zLiquid has penetrated into the equipment
zThe equipment has been exposed to moisture
zThe equipment has not work well or you can not get it work according
to User’s Manual.
zThe equipment has dropped and damaged
zIf the equipment has obvious sign of breakage
12. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT
UNCONDITIONED,STORAGETEMPERATUREABOVE600 C(1400F),IT
MAY DAMAGE THE EQUIPMENT.
Safety Instructions
CAUTION: Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the
manufacturer.

v
CONTENTS
Chapter 1. Introduction ............................................................... 1-1
Mainboard Specification ............................................................ 1-2
Mainboard Layout ..................................................................... 1-4
Quick Components Guide ......................................................... 1-5
Key Features ............................................................................ 1-6
MSI Special Features ................................................................ 1-7
T.O.P Tech™ (optional) ....................................................... 1-7
PC Alert™ III ....................................................................... 1-8
Chapter 2. Hardware Setup ........................................................ 2-1
Central Processing Unit: CPU ................................................... 2-2
CPU Installation Procedures ............................................... 2-2
CPU Core Speed Derivation Procedure ................................ 2-3
Memory Installation ................................................................... 2-4
Memory Bank Configuration ................................................ 2-4
Memory Installation Procedures .......................................... 2-5
Power Supply ............................................................................ 2-6
ATX 20-Pin Power Connector: JWR1 ................................... 2-6
Back Panel ............................................................................... 2-7
Mouse Connector: JKBMS1 ................................................ 2-7
Keyboard Connector: JKBMS1 ............................................ 2-8
USB Connectors ................................................................. 2-8
Serial Port Connector: COM A & COM B ............................ 2-9
Joystick/Midi Connectors .................................................... 2-9
Audio Port Connectors ........................................................ 2-9
Parallel Port Connector: LPT1 ........................................... 2-10
VGA DB 15 Pin Connector ................................................ 2-11
Connectors ............................................................................. 2-12
Floppy Disk Drive Connector: FDD .................................... 2-12
Power Saving Switch Connector: JGS1 ............................. 2-12

vi
Hard Disk Connectors: IDE1 & IDE2 ................................. 2-13
Fan Power Connectors: CPUFAN/SFAN1/PSFAN1 ........... 2-14
CD-In Connector: CD_IN ................................................... 2-15
Aux Line-In Connector: AUX_IN ......................................... 2-15
Modem-In Connector: MODEM_IN .................................... 2-15
Wake On LAN Connector: JWOL1 .................................... 2-16
Wake On Ring Connector: JMDM1 ................................... 2-16
Front Panel Connector: JFP1 or JFP2 (optional Intel spec) 2-17
Front Audio Header: JAUD2 or JAUD1 (optional Intel spec) 2-18
USB Front Header: USB3 or USB2 (optional Intel spec) .... 2-19
IrDA Infrared Module Header: IR or IR2 (optional Intel spec)2-20
Chassis Intrusion Switch Connector: J1 ............................ 2-21
Jumpers .................................................................................. 2-22
Clear CMOS Jumper: JBAT1 ............................................. 2-22
BIOS Flash Jumper: JP3 ................................................... 2-23
Onboard Audio Jumper: JP2 .............................................. 2-23
Slots ....................................................................................... 2-24
AMR (Audio Modem Riser) Slot ........................................ 2-24
PCI Slots .......................................................................... 2-24
ISA Slot ............................................................................ 2-24
PCI Interrupt Request Routing ........................................... 2-25
Chapter 3. AWARD®BIOS Setup .................................................. 3-1
Entering Setup .......................................................................... 3-2
Control Keys ............................................................................. 3-2
Getting Help .............................................................................. 3-3
The Main Menu ......................................................................... 3-4
Standard CMOS Features ......................................................... 3-6
Advanced BIOS Features .......................................................... 3-8
Advanced Chipset Features .................................................... 3-12
Integrated Peripherals ............................................................. 3-15

vii
Power Management Setup ...................................................... 3-20
PNP/PCI Configurations .......................................................... 3-24
PC Health Status .................................................................... 3-26
Frequency/Voltage Control ...................................................... 3-27
Load Fail-Safe/Optimized Defaults .......................................... 3-28
Set Supervisor/User Password ................................................ 3-30
Save & Exit Setup ................................................................... 3-32
Exit Without Saving ................................................................. 3-33
Appendix: Glossary ..................................................................... A-1

Introduction
1-1
Chapter 1.
Introduction 1
The MS-6137 v5.X Micro-ATX WH1 mainboard is a high-performance
computer mainboard based on Intel®810/810E chipset. It is designed for Intel®
Celeron-TualatinTM, Pentium®III and VIA®C3, Samuel2 processors for inex-
pensive business/personal desktop markets.
The Intel®810/810E chipset is the first generation Integrated Graphics
chipset for Intel®CeleronTM and Pentium®III processors. The graphics accel-
erator architecture consists of dedicated multi-media engines executing in par-
allel to deliver high performance 3D, 2D and motion compensation video capa-
bilities. An integrated centralized memory arbiter allocates memory bandwidth
to multiple system agents to optimize system memory utilization. A new chipset
component interconnect, the hub interface, is designed into the Intel®810/
810E chipset to provide an efficient communication channel between the memory
controller hub and I/O controller hub.
The Intel® 810/810E chipset contains three core components. The GMCH
integrates 66/100/133MHz for 810 and 66/100/133 MHz for 810E, P6 family sys-
tem bus controller, integrated 2D/3D graphics accelerator, 100MHz SDRAM
controller and high-speed hub interface for communication with the ICH0/ICH.
The ICH0/ICH integrates an Ultra ATA/33 (ICH0) or Ultra ATA/66 (ICH)
controller, USB host controller, LPC interface controller, FWH interface
controller, PCI interface controller, AC`97 digital controller and a hub interface
for communication with the GMCH/GMCHO. The Intel®82802 Firmware Hub
(FWH) component is part of the Intel®810E chipset. The FWH is key to ena-
bling future security and manageability infrastructure for the PC platform.
This chapter includes the following topics:
Mainboard Specification 1-2
Mainboard Layout 1-4
Quick Components Guide 1-5
Key Features 1-6
MSI Special Features 1-7

Chapter 1
1-2
CPU
zSupports Intel®Socket 370 Pentium III, Celeron-Tualatin, VIA C3, and Samuel2
processors.
zSupports up to 1.1GHz CPU.
Chipset
zIntel®810/810E (GMCH) chipset. (421 BGA)
- Integrated Graphics Controller.
- Intel DDM Architecture.
- SDRAM Memory Independent of System Bus.
zIntel®ICH chipset. (241 BGA)
- AC’97 Controller Integrated.
- 2 full IDE channels, up to ATA66.
- Low Pin Count interface for SIO.
Front Side Bus (FSB)
z66/100/133MHz clocks are supported.
Main Memory
zSupport two 168-pin DIMM sockets.
zSupport a maximum memory size of 256MB(64-bit) or 512MB(128-bit)
SDRAM.
Slots
zOne AMR (Audio Modem Riser) slot.
zThree PCI 2.2 32-bit PCI bus slots (support 3.3v/5v PCI bus interface)
zOne 16-bit ISA bus slot (optional).
On-Board IDE
zAn IDE controller on the ICH chipset provides IDE HDD/CD-ROM with
PIO, Bus Master and Ultra DMA66 operation modes.
zCan connect up to four IDE devices.
On-Board Peripherals
zOn-Board Peripherals include:
- 1 floppy port supports 2 FDDs with 360K, 720K, 1.2M, 1.44M and
2.88Mbytes.
- 2 serial ports (COM A + COM B).
Mainboard Specification

Introduction
1-3
- 1 parallel port supports SPP/EPP/ECP mode.
- 4 USB ports (Rear * 2/ Front * 2).
- 1 IrDA connector for SIR.
- 1 VGA port.
- 1 audio/game port.
Video
zGMCH chip integrated.
z2D/3D Graphics.
TV-Out (optional)
zProvide AV-composite and S-video output.
zTV output supporting up to 800*600.
Audio
zAC97 2.0 interface.
zICH chip integrated.
BIOS
zThe mainboard BIOS provides “Plug & Play” BIOS which detects the pe-
ripheral devices and expansion cards of the board automatically.
zThe mainboard provides a Desktop Management Interface (DMI) function
which records your mainboard specifications.
Dimension
zMicro ATX Form Factor.
Mounting
z6 mounting holes.

Chapter 1
1-4
Mainboard Layout
MS-6137 v5.X Micro ATX Mainboard
Intel
810 (GMCH)
chipset)
Intel
ICH
BIOS
USB
ports
Top : mou se
Bottom: keyboard
Top :
Game port
Bottom:
Line-Out
Line-In
Mic
Top : Parallel Port
Bottom:
COM A
VGA Port
SOCKET 370
USB3
JFP1
JAUD2
PSFAN1
SFAN1
CPUFAN
JP2
Codec
JP3 JWOL1
J1
Winbond
W83627HF-AW
JMDM1
IR
JGS1
JBAT1
Winbond
W83628
CD_IN
MODEM_IN
AUX_IN
BATT
+
ATX
Power Supply
PCI Slot 3
PCI Slot 2
PCI Slot 1
IDE1
IDE2
DIMM1
DIMM2
COM B
FDD
AMR1
ISA Slot
USB2
(Optional)
IR2
(Optional)
JAUD1
(Optional)
JFP2
(Optional)

Introduction
1-5
Quick Components Guide
Component Function Reference
JWR1 ATX power connector See p. 2-6
JKBMS1 Mouse/keyboard connector See p. 2-7
USB Connectors Connecting to USB devices See p. 2-8
COM A & COM B Serial port connector See p. 2-9
LPT1 Parallel port connector See p. 2-10
VGA port Connecting to VGA monitor See p. 2-11
FDD Floppy disk drive connector See p. 2-12
JGS1 Power saving switch connector See p. 2-12
IDE1~ IDE2 Hard disk connectors See p. 2-13
CPU/SYS/PS FAN Fan power connectors See p. 2-14
CD/AUX/MODEM_IN CD/AUX/Modem-in connectors See p. 2-15
JWOL1 Wake on LAN connector See p. 2-16
JMDM1 Wake on ring connector See p. 2-16
JFP1/JFP2 Front panel connector See p. 2-17
JAUD1/JAUD2 Front panel audio connector See p. 2-18
USB2/USB3 Connecting to USB devices See p. 2-19
IR/IR2 IrDA infrared module connector See p. 2-20
JBAT1 Clear CMOS jumper See p. 2-21
JP3 BIOS flash jumper See p. 2-22
J1 TV NTSC/PAL jumper See p. 2-22
JP2 Onboard audio jumper See p. 2-23
AMR Slot Connecting to AMR cards See p. 2-24
PCI Slots Connecting to expansion cards See p. 2-24
ISA Slot Connecting to expansion cards See p. 2-24

Chapter 1
1-6
zMicrosoft®PC99 Compliant
zMicro ATX Form Factor
zAudio/Video Chip Integrated
zSupport DMI(Desktop Management Interface) through BIOS
zTCAV (Build-in BIOS Anti-Virus)
zTOP Tech. (Thermal Overheat Protection Technology)
zPC Alert™ III system hardware monitor
zLAN Wake Up Function
zModem (Internal/External) Ring Wake Up Function
zSuspend to RAM/Disk
zSupport PC2001
Key Features

Introduction
1-7
MSI Special Features
T.O.P Tech™ (optional)
The T.O.P TechTM is an extended sensing device that can 100% accu-
rately detect the CPU’s temperature. You can find out the temperature on BIOS
setup menu. The PC AlertTM also provides the information.
CPU temperature on Setup menu
CPU Warning Temperature [Disabled]
Current System Temp.
Current CPU Temperature
Current Top Tech. III Temp.
SYSTEM fan
POWER fan
CPU fan
Vcore
VTT
3.3V
+5V
+12V
-12V
-5V
VBAT(V)
5VSB(V)
Chassis Intrusion Detect [Disabled]
Shutdown Temperature [Disabled]
Item Help
Menu Level >
↑ ↓ → ← Move Enter:Select +/-/PU/PD:Value F10:Save ESC:Exit F1:General Help
F5:Previous Values F6:Fail-Safe Defaults F7:Optimized Defaults
CMOS Setup Utility - Copyright(C) 1984-2001 Award Software
PC Health Status

Chapter 1
1-8
PC Alert™ III
The PC AlertTM III is a utility you can find in the CD-ROM disk. The
utility is just like your PC doctor that can detect the following PC hardware
status during real time operation:
* monitor CPU & system temperatures
* monitor fan speed(s)
* monitor system voltage
* monitor chassis intrusion
If one of the items above is abnormal, the program main screen will be
immediately shown on the screen, with the abnormal item highlighted in red.
This will continue to be shown,until user disables the warning.
Note: Items shown on PC Alert III vary depending on your system’s
status.

Introduction
1-9
Features:
zNetwork Management
- Monitoring & remote control
zBasic System Utilities
- Scandisk & Defragment to maintain your HDD
z3D Graphics Design
- Enables a more friendly user interface
zSofware Utilities
- SoftCooler Optimized Cooling

Hardware Setup
2-1
Chapter 2.
Hardware Setup
This chapter provides you with the information about hardware setup
procedures. While doing the installation, be careful in holding the components
and follow the installation procedures. For some components, if you install in
the wrong orientation, the components will not work properly.
Use a grounded wrist strap before handling computer components. Static
electricity may damage the components.
This chapter contains the following topics:
2
Central Processing Unit: CPU 2-2
Memory Installation 2-4
Power Supply 2-6
BackPanel 2-7
Connectors 2-12
Jumpers 2-22
Slots 2-24

Chapter 2
2-2
Central Processing Unit: CPU
The mainboard supports Intel®CeleronTM/Pentium®III processors. The
mainboard uses a CPU socket called PGA370 for easy CPU installation. When
you are installing the CPU, make sure the CPU has a heat sink and a cooling
fanattachedon the toptoprevent overheating. If you donot find the heat sink
and cooling fan, contact your dealer to purchase and install them before turn-
ing on the computer.
CPU Installation Procedures
Overheating will seriously damage the CPU and system,
always make sure the cooling fan can work properly to
protect the CPU from overheating.
WARNING!
1. Pull the lever sideways away
from the socket. Then, raise
the lever up to a 90-degree
angle.
2. Look for the gold arrow.
The gold arrow should point
towards the end of lever.
The CPU will only fit in the
correct orientation.
3. Hold the CPU down firmly,
and then close the lever to
complete the installation.
Open Lever
Gold Arrow
Sliding
Plate
Close
Lever

Hardware Setup
2-3
CPU Core Speed Derivation Procedure
If CPUClock = 100MHz
Core/Bus ratio = 9
then CPU core speed = Host Clock x Core/Bus ratio
= 100MHzx9
= 900MHz
Overclocking
This motherboard is designed to support overclocking.
However, please make sure your components are able to
tolerate such abnormal setting, while doing overclocking.
Any attempt to operate beyond product specifications is not
recommended. We do not guarantee the damages or risks
caused by inadequate operation or beyond product
specifications.
WARNING!

Chapter 2
2-4
Synchronous DRAM is a type of dynamic RAM memory chip that has
been widely used starting in the latter part of the 1990s. SDRAMs are based on
standard dynamic RAM chips, but have sophisticated features that make them
considerably faster. First, SDRAM chips are fast enough to be synchronized
with the CPU's clock, which eliminates wait states. Second, the SDRAM chip is
divided into two cell blocks, and data is interleaved between the two so that
while a bit in one block is being accessed, the bit in the other is being prepared
for access. This allows SDRAM to burst the second and subsequent, contigu-
ous characters at a rate of 10ns, compared to 60ns for the first character.
SDRAM provides 800 MBps or 1 GBps data transfer depending on
whether the bus is 100MHz or 133MHz.
Memory Installation
The mainboard supports a maximum memory size of 256MB (64-bit tech-
nology) or 512MB (128-bit technology for SDRAM). It provides two 168-pin
unbuffered DIMMs (Double In-Line Memory Module) slots. It supports 8 MB
to 128 Mbytes DIMM memory module.
Memory Bank Configuration
DIMM1
DIMM2