Murata GCJ188R71H222KA01 Series User manual

GCJ188R71H222KA01_ (0603, X7R:EIA, 2200pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
・Soldering Method
Reflow
5.Package
Product specifications in this catalog are as of May.15,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
g
0.2 to 0.5
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 125 °C
(25 °C)
0.5 min.
(1)-1 L
1.6±0.2
(1)-2 W
0.8±0.1
This product specification is applied to Soft Termination Chip Multilayer Ceramic Capacitors used for Automotive Electronic equipment.
(2) T
e
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±10 %
(6)
Capacitance
Tolerance
2200 pF
0.8±0.1
-55 to 125 °C
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
J
f330mm Reel
PAPER W8P4
10000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GCJ 18 8R7 1H 222 K A01 D
GCJ188R71H222KA01-01 1
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No Specification. AEC-Q200 Test Method
Pre-and Post-Stress 
Electrical Test
2 High Temperature The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
Exposure (Storage) specifications in the following table.
Set the capacitor for 1000+/-12h at 150+/-3℃.
Appearance No marking defects Set for 24+/-2h at room temperature, then measure.
Capacitance Within +/-12.5%
Change ・Initial measurement for high dielectric constant type
D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
for 24+/-2h at room temperature.Perform the initial measurement.
Insulation Within the specified initial value.
Resistance
25℃
3 Temperature Cycling The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table. Perform the 1000 cycles test according to the four heat treatments
Appearance No marking defects listed in the following table.
Set for 24+/-2h at room temperature, then measure.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
Insulation Within the specified initial value.
・Initial measurement
Resistance
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
25℃for 24+/-2h at room temperature.
Perform the initial measurement.
4 Destructive No defects or abnormalities Per EIA-469
Physical Analysis
5 Moisture Resistance The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.
Apply the 24h heat (25℃to 65℃) and humidity (80%RH to 98%RH)
Appearance No marking defects
treatment shown below, 10 consecutive times.
Set for 24+/-2h at room temperature, then measure.
Capacitance Within +/-10.0%
Change
D.F. Within the specified initial value.
Insulation Within the specified initial value.
Resistance
25℃
・Initial measurement
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
6 Biased Humidity The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.

Appearance No marking defects
at 85+/-3℃and 80%RH to 85%RH humidity for 1000+/-12h.
The charge/discharge current is less than 50mA.
Capacitance Within +/-12.5%
Remove and set for 24+/-2h at room temperature, then measure.
Change
・Initial measurement
D.F. Within the specified initial value.
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
Insulation ・F
Resistance (Whichever is smaller)
25℃
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
1
-
Step
1
2
3
4
Temp.
(C)
Min.Operating Temp.+0/-3
Room
Temp.
Max.Operating Temp. +3/-0
Room
Temp.
Time
(min.)
15+/-3
1
15+/-3
1
One cycle 24hours
Hours
Initial measuremt
+10
- 2 ℃
Humidity
90～98%
Humidity
80～98%
Humidity
80～98%
Humidity
90～98%
Humidity
90～98%
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Temperature
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
(℃)
JEMCGS-00479H 2
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No Specification. AEC-Q200 Test Method
7 Operational Life The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.
Apply 200%* of the rated voltage for 1000+/-12h at 125+/-3℃.
Appearance No marking defects Set for 24+/-2h at room temperature, then measure.
The charge/discharge current is less than 50mA.
Capacitance R1,R7 : Within +/-10.0%
Change C7 : Within +/-12.5%
・Initial measurement
Apply the test voltage at the max. operating temp. +/-3°C for 1h
D.F. Within the specified initial value. and then let sit for 24+/-2h at room temperature,then measure.
*GCJ21BR71C225/GCJ32EC7YJ106 only: 150% of the rated voltage
Insulation ・F
Resistance (Whichever is smaller)
25℃
8 External Visual No defects or abnormalities Visual inspection
9 Physical Dimension Within the specified dimensions Using Measuring instrument of dimension.
10 Resistance to Appearance No marking defects
Per MIL-STD-202 Method 215
Solvents Solvent 1 : 1 part (by volume) of isopropyl alcohol
Capacitance Within the specified initial value. 3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
D.F. Within the specified initial value. Solvent 3 : 42 parts (by volume) of water
1 part (by volume) of propylene glycol monomethyl ether
Insulation Within the specified initial value.
1 part (by volume) of monoethanolamine
Resistance
25℃
11 Mechanical Appearance No marking defects Solder the capacitor on the test substrate(glass epoxy board).
Shock
Three shocks in each direction should be applied along 3 mutually
Capacitance Within the specified initial value.
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
D.F. Within the specified initial value.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
Insulation Within the specified initial value.
Resistance
25℃
12 Vibration Appearance No marking defects Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
Capacitance Within the specified initial value.
a total amplitude of 1.5mm, the frequency being varied uniformly
between the approximate limits of 10 and 2000Hz.
D.F. Within the specified initial value. The frequency range, from 10 to 2000Hz and return to 10Hz,
should be traversed in approximately 20 minutes.
Insulation Within the specified initial value. This motion should be applied for 12 items in each 3 mutually
Resistance perpendicular directions (total of 36 times).
25℃
13 Resistance to The measured and observed characteristics should satisfy the Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
Soldering Heat specifications in the following table.
solder solution at 260+/-5℃for 10+/-1s.
Appearance No marking defects
Set at room temperature for 24+/-2h, then measure.
Capacitance Within the specified initial value.
・Initial measurement
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
D.F. Within the specified initial value. for 24+/-2h at room temperature.
Perform the initial measurement.
Insulation Within the specified initial value.
Resistance
25℃
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
JEMCGS-00479H 3
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No Specification. AEC-Q200 Test Method
14 Thermal Shock The measured and observed characteristics shall satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.
Perform the 300 cycles according to the two heat treatments listed
Appearance No marking defects
in the following table(Maximum transfer time is 20s).
Set for 24+/-2h at room temperature, then measure.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
・Initial measurement
Insulation Within the specified initial value.
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
Resistance for 24+/-2h at room temperature.
25℃Perform the initial measurement.
15 ESD Appearance No marking defects
Per AEC-Q200-002
Capacitance Within the specified initial value.
D.F. Within the specified initial value.
Insulation Within the specified initial value.
Resistance
25℃
16 Solderability
95% of the terminations is to be soldered evenly and (a) Preheat at 155℃for 4h. After preheating, immerse the capacitor
continuously. in a solution of rosin ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃or
an eutectic solder solution at 235+/-5℃for 5+0/-0.5s.
(b) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of rosin
ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or an eutectic solder solution at 235+/-5℃for 5+0/-0.5s.
(c) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of rosin
ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5s at 260+/-5℃.
17 Electrical Appearance No defects or abnormalities Visual inspection.
Chatacteri-
zation Capacitance Shown in Rated value.
The capacitance/D.F. should be measured at 20℃/25℃at the frequency
and voltage shown in the table.
D.F. 0.05 max.
Insulation ・F The insulation resistance should be measured with a DC voltage not
Resistance (Whichever is smaller)
exceeding the rated voltage at 25℃and 125℃within 2 minutes of
25 ℃charging.
Insulation ・F
Resistance (Whichever is smaller)
125℃
Dielectric No failure No failure should be observed when 250% of the rated voltage is
Strength applied between the terminations for 1 to 5s,
provided the charge/ discharge current is less than 50mA.
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
Char. Frequency Voltage
C ≦10㎌1.0+/-0.1kHz 1.0+/-0.2Vrms
Step
1
2
Temp.
(℃)
Min.Operating Temp.+0/-3
Max.Operating Temp.+3/-0
Time
(min)
15+/-3
15+/-3
JEMCGS-00479H 4
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No Specification. AEC-Q200 Test Method
18 Board Flex Appearance No marking defects
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Capacitance Within ±10.0%
Then apply a force in the direction shown in Fig 2 for 60s.
Change
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
D.F. Within the specified initial value.
such as heat shock.
Insulation Within the specified initial value.
Resistance
25℃
(in mm)
t:1.6mm (GCJ15:0.8mm)
19 Terminal Appearance No marking defects
Solder the capacitor on the test substrate(glass epoxy board)
Strength
shown in Fig3.
Capacitance Within the specified initial value. Then apply 18N* force in parallel with the test jig for 60s.
The soldering should be done either with an iron or using the reflow
D.F. Within the specified initial value. method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
*GCJ15: 2N
Insulation Within the specified initial value.
Resistance
25℃
(in mm)
Fig.3 t:1.6mm (GCJ15:0.8mm)
20 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
Apply a force.
< Chip L dimension : 2.5mm max. > < Chip Length : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness ≦0.5mm rank : 8N
< Chip L dimension : 3.2mm max. >
Chip thickness < 1.25mm rank : 15N
Chip thickness ≧1.25mm rank : 54.5N < Chip Length : 3.2mm min. >
Fig.4
Speed supplied the Stress Load : 0.5mm/s
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
Iron Board
L
0.6L
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Solder resist
Baked electrode or
Copper foil
b
Type
a
b
c
GCJ15
0.5
1.5
0.6
GCJ18
0.6
2.2
0.9
GCJ21
0.8
3.0
1.3
GCJ31
2.0
4.4
1.7
GCJ32
2.0
4.4
2.6
Type
a
b
c
GCJ15
0.4
1.5
0.5
GCJ18
1.0
3.0
1.2
GCJ21
1.2
4.0
1.65
GCJ31
2.2
5.0
2.0
GCJ32
2.2
5.0
2.9
45
45
Flexure：5
(High Dielectric Type)
Capacitance meter
Pressurizing
speed:1.0mm/s
Pressurize
支持台
ｺﾝﾃﾞﾝｻ
45
45
Fig.2
R4
20
50 min.
100
40
a
c
b
Land
f4.5
c
Fig.1
JEMCGS-00479H 5
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No Specification. AEC-Q200 Test Method
21 Capacitance No bias R1,R7 : Within +/-15% The capacitance change should be measured after 5 minutes
Temperature (-55℃to +125℃)
 at each specified temperature stage.
Characteristics C7 : Within +/-22% Capacitance value as a reference is the value in step 3.
(-55℃to +125℃)

50% of the rated
R1 : Within +15/-40%
voltage
(-55℃to +125℃)

*for W.V.:50V max.
only.
・Initial measurement
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max.Operating Temp.+/-3
5
Reference Temp.+/-2
50% of
the rated voltage
(For R1)
6
Min.Operating Temp.+/-3
7
Reference Temp.+/-2
8
Max.Operating Temp.+/-3
JEMCGS-00479H 6
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1.Tape Carrier Packaging(Packaging Code:D/E/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
 
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:L Code:J/F Code:K
5(L Dimensions Tolerance:±0.1
and WT Dimensions Tolerance:±0.05)
10000 50000
5(L Dimensions Tolerance:±0.15
and WT Dimensions Tolerance:±0.1)
10000 40000
GCJ18 84000 10000
64000 10000
94000 10000
B3000 10000
93000 10000
M3000 10000
C2000 6000
GCJ32 D/E 1000 4000
1.2 Dimensions of Tape
(1)GCJ15 <Paper Tape> (in mm)
Package
GCJ Type
Type
GCJ15
GCJ21
GCJ31
L W T
1.0±0.1
0.5±0.05 0.5±0.05 0.65 1.20
1.0±0.15
0.5±0.1 0.5±0.1 0.70 1.20
*3 Nominal value
B *3
Type
Dimensions(Chip)
A*3
GCJ15
5
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
0.8 max.
*2
0.05 max.
JEMCGP-01896G 7
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(2)GCJ18/21
<Paper Tape> (in mm)
(2)GCJ21/31/32 <Plastic Tape> (in mm)
Package
GCJ Type
LW T
1.6±0.2 0.8±0.1 0.8±0.1 1.05±0.10 1.85±0.10
1.6±0.3 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
6 0.6±0.1
9 0.85±0.1
GCJ18
8
1.2 max.
GCJ21
2.0±0.3
1.25±0.2
1.55±0.15
2.30±0.15
Type
A
B
ｔ
Dimensions(Chip)
LW T
2.0±0.3 1.25±0.2 1.25±0.2
1.45±0.20 2.25±0.20
2.0±0.35 1.25±0.25 1.25±0.25
1.50±0.20 2.30±0.20
9 0.85±0.1
3.2±0.4
3.2±0.3 1.6±0.3
3.2±0.4 1.6±0.4 1.6±0.4
2.10±0.20 3.60±0.20
D 2.0±0.3 3.0 max.
2.5±0.3 3.7 max.
2.5 +0.35/-0.3 2.5 +0.35/-0.3
3.10±0.20 3.85±0.20 4.0 max.
E
GCJ32
2.0 max.
Type
A
B
2.5 max.
2.0 max.
GCJ31
1.90±0.20
3.50±0.20
t
Dimensions(Chip)
3.2±0.3
GCJ21
B
2.5±0.3
2.80±0.20
3.50±0.20
M
1.15±0.2
C
1.6±0.3
3.2±0.4
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
JEMCGP-01896G 8
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Package
GCJ Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GCJ32 max.
16.5 max.
10±1.5
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01896G 9
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1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence)
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GCJ Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01896G 10
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