Murata GCJ188R71H222KA01 Series User manual

GCJ188R71H222KA01_ (0603, X7R:EIA, 2200pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
・Soldering Method
Reflow
5.Package
Product specifications in this catalog are as of May.15,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
g
0.2 to 0.5
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 125 °C
(25 °C)
0.5 min.
(1)-1 L
1.6±0.2
(1)-2 W
0.8±0.1
This product specification is applied to Soft Termination Chip Multilayer Ceramic Capacitors used for Automotive Electronic equipment.
(2) T
e
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±10 %
(6)
Capacitance
Tolerance
2200 pF
0.8±0.1
-55 to 125 °C
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
J
f330mm Reel
PAPER W8P4
10000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GCJ 18 8R7 1H 222 K A01 D
GCJ188R71H222KA01-01 1
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No Specification. AEC-Q200 Test Method
Pre-and Post-Stress 
Electrical Test
2 High Temperature The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
Exposure (Storage) specifications in the following table.
Set the capacitor for 1000+/-12h at 150+/-3℃.
Appearance No marking defects Set for 24+/-2h at room temperature, then measure.
Capacitance Within +/-12.5%
Change ・Initial measurement for high dielectric constant type
D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
for 24+/-2h at room temperature.Perform the initial measurement.
Insulation Within the specified initial value.
Resistance
25℃
3 Temperature Cycling The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table. Perform the 1000 cycles test according to the four heat treatments
Appearance No marking defects listed in the following table.
Set for 24+/-2h at room temperature, then measure.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
Insulation Within the specified initial value.
・Initial measurement
Resistance
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
25℃for 24+/-2h at room temperature.
Perform the initial measurement.
4 Destructive No defects or abnormalities Per EIA-469
Physical Analysis
5 Moisture Resistance The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.
Apply the 24h heat (25℃to 65℃) and humidity (80%RH to 98%RH)
Appearance No marking defects
treatment shown below, 10 consecutive times.
Set for 24+/-2h at room temperature, then measure.
Capacitance Within +/-10.0%
Change
D.F. Within the specified initial value.
Insulation Within the specified initial value.
Resistance
25℃
・Initial measurement
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
6 Biased Humidity The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.

Appearance No marking defects
at 85+/-3℃and 80%RH to 85%RH humidity for 1000+/-12h.
The charge/discharge current is less than 50mA.
Capacitance Within +/-12.5%
Remove and set for 24+/-2h at room temperature, then measure.
Change
・Initial measurement
D.F. Within the specified initial value.
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
Insulation ・F
Resistance (Whichever is smaller)
25℃
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
1
-
Step
1
2
3
4
Temp.
(C)
Min.Operating Temp.+0/-3
Room
Temp.
Max.Operating Temp. +3/-0
Room
Temp.
Time
(min.)
15+/-3
1
15+/-3
1
One cycle 24hours
Hours
Initial measuremt
+10
- 2 ℃
Humidity
90～98%
Humidity
80～98%
Humidity
80～98%
Humidity
90～98%
Humidity
90～98%
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Temperature
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
(℃)
JEMCGS-00479H 2
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No Specification. AEC-Q200 Test Method
7 Operational Life The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.
Apply 200%* of the rated voltage for 1000+/-12h at 125+/-3℃.
Appearance No marking defects Set for 24+/-2h at room temperature, then measure.
The charge/discharge current is less than 50mA.
Capacitance R1,R7 : Within +/-10.0%
Change C7 : Within +/-12.5%
・Initial measurement
Apply the test voltage at the max. operating temp. +/-3°C for 1h
D.F. Within the specified initial value. and then let sit for 24+/-2h at room temperature,then measure.
*GCJ21BR71C225/GCJ32EC7YJ106 only: 150% of the rated voltage
Insulation ・F
Resistance (Whichever is smaller)
25℃
8 External Visual No defects or abnormalities Visual inspection
9 Physical Dimension Within the specified dimensions Using Measuring instrument of dimension.
10 Resistance to Appearance No marking defects
Per MIL-STD-202 Method 215
Solvents Solvent 1 : 1 part (by volume) of isopropyl alcohol
Capacitance Within the specified initial value. 3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
D.F. Within the specified initial value. Solvent 3 : 42 parts (by volume) of water
1 part (by volume) of propylene glycol monomethyl ether
Insulation Within the specified initial value.
1 part (by volume) of monoethanolamine
Resistance
25℃
11 Mechanical Appearance No marking defects Solder the capacitor on the test substrate(glass epoxy board).
Shock
Three shocks in each direction should be applied along 3 mutually
Capacitance Within the specified initial value.
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
D.F. Within the specified initial value.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
Insulation Within the specified initial value.
Resistance
25℃
12 Vibration Appearance No marking defects Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
Capacitance Within the specified initial value.
a total amplitude of 1.5mm, the frequency being varied uniformly
between the approximate limits of 10 and 2000Hz.
D.F. Within the specified initial value. The frequency range, from 10 to 2000Hz and return to 10Hz,
should be traversed in approximately 20 minutes.
Insulation Within the specified initial value. This motion should be applied for 12 items in each 3 mutually
Resistance perpendicular directions (total of 36 times).
25℃
13 Resistance to The measured and observed characteristics should satisfy the Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
Soldering Heat specifications in the following table.
solder solution at 260+/-5℃for 10+/-1s.
Appearance No marking defects
Set at room temperature for 24+/-2h, then measure.
Capacitance Within the specified initial value.
・Initial measurement
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
D.F. Within the specified initial value. for 24+/-2h at room temperature.
Perform the initial measurement.
Insulation Within the specified initial value.
Resistance
25℃
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
JEMCGS-00479H 3
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No Specification. AEC-Q200 Test Method
14 Thermal Shock The measured and observed characteristics shall satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.
Perform the 300 cycles according to the two heat treatments listed
Appearance No marking defects
in the following table(Maximum transfer time is 20s).
Set for 24+/-2h at room temperature, then measure.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
・Initial measurement
Insulation Within the specified initial value.
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
Resistance for 24+/-2h at room temperature.
25℃Perform the initial measurement.
15 ESD Appearance No marking defects
Per AEC-Q200-002
Capacitance Within the specified initial value.
D.F. Within the specified initial value.
Insulation Within the specified initial value.
Resistance
25℃
16 Solderability
95% of the terminations is to be soldered evenly and (a) Preheat at 155℃for 4h. After preheating, immerse the capacitor
continuously. in a solution of rosin ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃or
an eutectic solder solution at 235+/-5℃for 5+0/-0.5s.
(b) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of rosin
ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or an eutectic solder solution at 235+/-5℃for 5+0/-0.5s.
(c) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of rosin
ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5s at 260+/-5℃.
17 Electrical Appearance No defects or abnormalities Visual inspection.
Chatacteri-
zation Capacitance Shown in Rated value.
The capacitance/D.F. should be measured at 20℃/25℃at the frequency
and voltage shown in the table.
D.F. 0.05 max.
Insulation ・F The insulation resistance should be measured with a DC voltage not
Resistance (Whichever is smaller)
exceeding the rated voltage at 25℃and 125℃within 2 minutes of
25 ℃charging.
Insulation ・F
Resistance (Whichever is smaller)
125℃
Dielectric No failure No failure should be observed when 250% of the rated voltage is
Strength applied between the terminations for 1 to 5s,
provided the charge/ discharge current is less than 50mA.
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
Char. Frequency Voltage
C ≦10㎌1.0+/-0.1kHz 1.0+/-0.2Vrms
Step
1
2
Temp.
(℃)
Min.Operating Temp.+0/-3
Max.Operating Temp.+3/-0
Time
(min)
15+/-3
15+/-3
JEMCGS-00479H 4
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No Specification. AEC-Q200 Test Method
18 Board Flex Appearance No marking defects
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Capacitance Within ±10.0%
Then apply a force in the direction shown in Fig 2 for 60s.
Change
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
D.F. Within the specified initial value.
such as heat shock.
Insulation Within the specified initial value.
Resistance
25℃
(in mm)
t:1.6mm (GCJ15:0.8mm)
19 Terminal Appearance No marking defects
Solder the capacitor on the test substrate(glass epoxy board)
Strength
shown in Fig3.
Capacitance Within the specified initial value. Then apply 18N* force in parallel with the test jig for 60s.
The soldering should be done either with an iron or using the reflow
D.F. Within the specified initial value. method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
*GCJ15: 2N
Insulation Within the specified initial value.
Resistance
25℃
(in mm)
Fig.3 t:1.6mm (GCJ15:0.8mm)
20 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
Apply a force.
< Chip L dimension : 2.5mm max. > < Chip Length : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness ≦0.5mm rank : 8N
< Chip L dimension : 3.2mm max. >
Chip thickness < 1.25mm rank : 15N
Chip thickness ≧1.25mm rank : 54.5N < Chip Length : 3.2mm min. >
Fig.4
Speed supplied the Stress Load : 0.5mm/s
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
Iron Board
L
0.6L
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Solder resist
Baked electrode or
Copper foil
b
Type
a
b
c
GCJ15
0.5
1.5
0.6
GCJ18
0.6
2.2
0.9
GCJ21
0.8
3.0
1.3
GCJ31
2.0
4.4
1.7
GCJ32
2.0
4.4
2.6
Type
a
b
c
GCJ15
0.4
1.5
0.5
GCJ18
1.0
3.0
1.2
GCJ21
1.2
4.0
1.65
GCJ31
2.2
5.0
2.0
GCJ32
2.2
5.0
2.9
45
45
Flexure：5
(High Dielectric Type)
Capacitance meter
Pressurizing
speed:1.0mm/s
Pressurize
支持台
ｺﾝﾃﾞﾝｻ
45
45
Fig.2
R4
20
50 min.
100
40
a
c
b
Land
f4.5
c
Fig.1
JEMCGS-00479H 5
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No Specification. AEC-Q200 Test Method
21 Capacitance No bias R1,R7 : Within +/-15% The capacitance change should be measured after 5 minutes
Temperature (-55℃to +125℃)
 at each specified temperature stage.
Characteristics C7 : Within +/-22% Capacitance value as a reference is the value in step 3.
(-55℃to +125℃)

50% of the rated
R1 : Within +15/-40%
voltage
(-55℃to +125℃)

*for W.V.:50V max.
only.
・Initial measurement
Perform a heat treatment at 150+0/-10 ℃for 1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200 Test Item
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max.Operating Temp.+/-3
5
Reference Temp.+/-2
50% of
the rated voltage
(For R1)
6
Min.Operating Temp.+/-3
7
Reference Temp.+/-2
8
Max.Operating Temp.+/-3
JEMCGS-00479H 6
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1.Tape Carrier Packaging(Packaging Code:D/E/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
 
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:L Code:J/F Code:K
5(L Dimensions Tolerance:±0.1
and WT Dimensions Tolerance:±0.05)
10000 50000
5(L Dimensions Tolerance:±0.15
and WT Dimensions Tolerance:±0.1)
10000 40000
GCJ18 84000 10000
64000 10000
94000 10000
B3000 10000
93000 10000
M3000 10000
C2000 6000
GCJ32 D/E 1000 4000
1.2 Dimensions of Tape
(1)GCJ15 <Paper Tape> (in mm)
Package
GCJ Type
Type
GCJ15
GCJ21
GCJ31
L W T
1.0±0.1
0.5±0.05 0.5±0.05 0.65 1.20
1.0±0.15
0.5±0.1 0.5±0.1 0.70 1.20
*3 Nominal value
B *3
Type
Dimensions(Chip)
A*3
GCJ15
5
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
0.8 max.
*2
0.05 max.
JEMCGP-01896G 7
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(2)GCJ18/21
<Paper Tape> (in mm)
(2)GCJ21/31/32 <Plastic Tape> (in mm)
Package
GCJ Type
LW T
1.6±0.2 0.8±0.1 0.8±0.1 1.05±0.10 1.85±0.10
1.6±0.3 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
6 0.6±0.1
9 0.85±0.1
GCJ18
8
1.2 max.
GCJ21
2.0±0.3
1.25±0.2
1.55±0.15
2.30±0.15
Type
A
B
ｔ
Dimensions(Chip)
LW T
2.0±0.3 1.25±0.2 1.25±0.2
1.45±0.20 2.25±0.20
2.0±0.35 1.25±0.25 1.25±0.25
1.50±0.20 2.30±0.20
9 0.85±0.1
3.2±0.4
3.2±0.3 1.6±0.3
3.2±0.4 1.6±0.4 1.6±0.4
2.10±0.20 3.60±0.20
D 2.0±0.3 3.0 max.
2.5±0.3 3.7 max.
2.5 +0.35/-0.3 2.5 +0.35/-0.3
3.10±0.20 3.85±0.20 4.0 max.
E
GCJ32
2.0 max.
Type
A
B
2.5 max.
2.0 max.
GCJ31
1.90±0.20
3.50±0.20
t
Dimensions(Chip)
3.2±0.3
GCJ21
B
2.5±0.3
2.80±0.20
3.50±0.20
M
1.15±0.2
C
1.6±0.3
3.2±0.4
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
JEMCGP-01896G 8
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Package
GCJ Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GCJ32 max.
16.5 max.
10±1.5
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01896G 9
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1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence)
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GCJ Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01896G 10
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Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip multilayer ceramic capacitors (henceforth just "capacitors") may be affected by the
storage conditions. Please use them promptly after delivery.
1-1. Maintain appropriate storage for the capacitors using the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
High temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging
materials. If more than six months have elapsed since delivery, check packaging, mounting, etc. before use.
In addition, this may cause oxidation of the electrodes. If more than one year has elapsed since delivery,
also check the solderability before use.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-4642H 11
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2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
The load should be contained so that the self-heating
of the capacitor body remains below 20°C ,
whenmeasuring at an ambient temperature of 25°C.
Caution
!
10 1 2 3
Current (Ar.m.s.)
4 5 6
Temperature Rise (℃)
100kHz
10
100 Ripple Current
500kHz
1MHz
[Example of Temperature Rise (Heat Generation) in Chip
Multilayer Ceramic Capacitors in Contrast to Ripple Current]
Sample:R(R1) characteristics 10 Rated voltage: DC10V
E
E
E
E
0
0
0
0
JEMCGC-4642H 12
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5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
010 20 30
DC Voltage (V) 40 50
[Example of DC Voltage Characteristics]
Sample: R(R1) Characteristics 
Capacitance Change (%)
00.5 1
AC Voltage (Vr.m.s.) 1.5 2
[Example of AC Voltage Characteristics]
Sample: X7R(R7) Characteristics 
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
C0G(5C)
X7R(R7)
JEMCGC-4642H 13
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■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
Locate chip horizontal to the
direction in which stress acts.
(Bad Example) (Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Caution
Contents of Measures
Screw Hole Recommended
!
①
②
③
1C
1B
1A
Perforation
Slit
A
B
C
D
①
1A
JEMCGC-4642H 14
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3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
Check the mounting in the actual device under actual use conditions ahead of time.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
[Incorrect]
[Correct]
2.Dirt particles and dust accumulated in the suction nozzle and suction mechanism prevent the nozzle from
moving smoothly. This creates excessive force on the capacitor during mounting, causing cracked chips.
Also, the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.
The suction nozzle and the locating claw must be maintained, checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Support Pin
JEMCGC-4642H 15
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4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and

2. When components are immersed in solvent after mounting,

between the component and the solvent within the range
shown in the table 1. Temperature
Incase of Lead Free Solder
( ): In case of Pb-Sn Solder
[Allowable Reflow Soldering Temperature and Time]
Table 1
Series
GC□
GC□
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Peak
Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
3. When a capacitor is mounted at a temperature lower than the peak reflow temperature recommended by the
solder manufacturer, the following quality problems can occur. Consider factors such as the placement of

dropping below the peak temperature specified. Be sure to evaluate the mounting situation beforehand and
verify that none of the following problems occur.
･Drop in solder wettability
･Solder voids
･Possible occurrence of whiskering
･Drop in bonding strength
･Drop in self-alignment properties
･Possible occurrence of tombstones and/or shifting on the land patterns of the circuit board
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking
loose from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Inverting the PCB
Pb-Sn Solder
Lead Free Solder
230 to 250℃
240 to 260℃
Atmosphere
Air
Air or N2
Caution
Chip Dimension(L/W) Code
Temperature Differential
18/21/31
≦190℃
32
≦130℃
!
SolderingTemperature(℃)
SolderingTime(s)
280
270
260
250
240
230
220
0
30
60
120
90
Temperature(℃)
PeakTemperature
(170℃)
(150℃)
(130℃)
(200℃)
Soldering
Gradual
Cooling
Preheating
ΔT
60-120seconds
30-60 seconds
Time
190℃
170℃
150℃
220℃
JEMCGC-4642H 16
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4-2.Flow Soldering
1. This product is not apply flow soldering.
4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,
and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending
on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the
adhesive strength and other problems.
Table 3
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu

2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown
in Figure 1.
Table 4
Distance 5mm or more
Hot Air Application angle 45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
Application Time (3216M / 1206 size or smaller)
Less than 30 seconds
(3225M / 1210 size or larger) (3216M , 3225M : Metric size code)
3. Optimum solder amount when re-working with a soldering iron
3-1. If the solder amount is excessive, the risk of cracking is higher
during board bending or any other stressful condition.
Too little solder amount results in a lack of adhesive strength
on the outer electrode termination, which may result
in chips breaking loose from the PCB.
Please confirm that solder has been applied smoothly is in section
and rising to the end surface of the chip.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from touching
the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
GC□
32
280℃max.
150℃min.
≦130℃
Air
GC□
18/21/31
350℃max.
150℃min.
≦190℃
Air
Caution
Series
Chip Dimension
(L/W) Code
Temperature of
Soldering Iron tip
Preheating
Temperature
Temperature

Atmosphere
!
One-hole Nozzle
an Angle of 45
[Figure 1]
SolderAmount
JEMCGC-4642H 17
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5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure
it does not degrade the capacitors.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Level of stress on board
High
Medium
Medium
Low
Recommended
×
△*
△*
◯
Caution
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
!
Peeling
Test-probe
Support Pin
Test-probe
①
1A
JEMCGC-4642H 18
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(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig] [Hand Separation]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]
[Disc Separator]
Top Blade Top Blade Top Blade Top Blade
Bottom Blade Bottom Blade Bottom Blade Bottom Blade
[V-groove Design]
Depth too Shallow
Depth too Deep
Example of Recommended
V-groove Design
Not Recommended
Left-right Misalignment
Low-Angle
Caution
Recommended
Not recommended
Recommended
Not recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Printed Circuit Board
Top Blade
V-groove Bottom Blade
Top Blade Printed Circuit Board
V-groove
!
Board Cropping Jig
V-groove
Printed Circuit Board
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCGC-4642H 19
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(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
2-3. Attaching/Removing Sockets and/or Connectors
Insertion and removal of sockets and connectors, etc., might cause the board to bend.
Please insure that the board does not warp during insertion and removal of sockets and connectors, etc.,
or the bending may damage mounted components on the board.
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Caution
!
Suction Nozzle
Component with Leads
Socket
Screwdriver
[ Outline Drawing ] Router
JEMCGC-4642H 20
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