Murata GCJ319R71H104KA01 Series User manual

GCJ319R71H104KA01_ (1206, X7R, 0.1uF, 50Vdc)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Feb.1,2013,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
CHIP MONOLITHIC CERAMIC CAPACITOR SOFT TERMINATION TYPE FOR AUTOMOTIVE
g
0.3 to 1.0
0.1 uF
Temp. Range
(Ref.Temp.)
(8) Packaging
mark
(4)
DC Rated
Voltage
Packaging Unit
±10 %
-55 to 125 °C
-15 to 15 %
-55 to 125 °C
(25 °C)
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
(5) Nominal
Capacitance
(6)
Capacitance
Tolerance
50 Vdc
Only Reflow Soldering
1.5 min.
(2) T
0.85±0.1
This product specification is applied to Chip Monolithic Ceramic Capacitor Soft Termination Type used for Automotive
Electronic equipment.
This product is applied for Only Reflow Soldering.
(1)-1 L
3.2±0.3
(1)-2 W
1.6±0.3
e
L
f180mm Reel
EMBOSSED W8P4
3000 pcs./Reel
K
f330mm Reel
EMBOSSED W8P4
10000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)DC Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code
(7)Murata’s
Control Code
T
L
W
e
e
g
GCJ 31 9R7 1H 104 K A01 L
GCJ319R71H104KA01-01 1

1 Pre-and Post-Stress
Electrical Test
2High Temperature The measured and observed characteristics should satisfy the
Set the capacitor for 1000±12 hours at 150±3℃. Set for
Exposure (Storage) specifications in the following table. 24±2 hours at room temperature, then measure.
Appearance No marking defects
Capacitance R1,R7,C7 : Within ±12.5%
Change
D.F. R1,R7,C7 : 0.05 max.
I.R.
More than 10,000MΩor 500Ω・F
(Whichever is smaller)
3 Temperature Cycling The measured and observed characteristics should satisfy the Fix the capacitor to the supporting jig in the same manner and under
specifications in the following table. the same conditions as (19). Perform the 1000 cycle test according
Appearance No marking defects to the four heat treatments listed in the following table. Set for 24±2
Capacitance R1,R7,C7 :Within ±7.5% hours at room temperature, then measure
Change
D.F. R1,R7,C7 : 0.05 max.
I.R.
More than 10,000MΩor 500Ω・F
(Whichever is smaller)
・Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 ℃for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
4 Destructive No defects or abnormalities Per EIA-469.
Phisical Analysis
5 Moisture Resistance The measured and observed characteristics should satisfy the
Apply the 24-hour heat (25 to 65℃) and humidity (80 to 98%)
specifications in the following table.
treatment shown below, 10 consecutive times.
Appearance No marking defects
Set for 24±2 hours at room temperature, then measure.
Capacitance R1,R7,C7 : Within ±10.0%
Change
D.F.
R1,R7,C7 : 0.05 max.
I.R.
More than 10,000MΩor 500Ω・F
(Whichever is smaller)
6 Biased Humidity The measured and observed characteristics should satisfy the
Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)
specifications in the following table.
at 85±3℃and 80 to 85% humidity for 1000±12 hours.
Appearance No marking defects
Remove and set for 24±2 hours at room temprature, then measure.
Capacitance R1,R7,C7 : Within ±12.5%
The charge/discharge current is less than 50mA.
Change
D.F.
R1,R7,C7 : 0.05 max.
I.R.
More than 1,000MΩor 50Ω・F
(Whichever is smaller)
-
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
Step
1
2
3
4
Temp.
(℃)
-55+0/-3
Room
Temp.
125+3/-0
(for R1,R7,C7)
Room
Temp.
Time
(min.)
15±3
1
15±3
1
One cycle 24hours
Hours
Initial measuremt
+10
- 2 ℃
Humidity
90～98%
Humidity
80～98%
Humidity
80～98%
Humidity
90～98%
Humidity
90～98%
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Temperature
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
(℃)
JEMCGS-00479C 2

7Operational Life The measured and observed characteristics should
Apply 200%* of the rated voltage for 1000±12 hours at 125±3℃.
satisfy the specifications in the following table. (for R1,R7,C7).
Appearance No marking defects
Set for 24±2 hours at room temperature, then measure.
Capacitance R1,R7 : Within ±10.0% The charge/discharge current is less than 50mA.
Change C7 : Within ±12.5%
D.F. R1,R7,C7 : 0.05 max.
・Initial measurement for high dielectric constant type.
Apply 200%* of the rated DC voltage for one hour at the maximun
operating temperature ±3℃. Remove and set for 24±2 hours at
I.R.
More than 1,000MΩor 50Ω・Froom temperature. Perform initial measurement.
(Whichever is smaller) *GCJ21BR71C225/GCJ32EC7YJ106 only: 150% of the rated voltage
8External Visual No defects or abnormalities Visual inspection
9Phisical Dimension Within the specified dimensions Using calipers
10 Resistance Appearance No marking defects
Per MIL-STD-202 Method 215
to Solvents Capacitance Within the specified tolerance Solvent 1 : 1 part (by volume) of isopropyl alcohol
Change 3 parts (by volume) of mineral spirits
D.F. R1,R7,C7 : 0.05 max. Solvent 2 : Terpene defluxer
Solvent 3 : 42 parts (by volume) of water
I.R.
More than 10,000MΩor 500Ω・F1part (by volume) of propylene glycol monomethylether
(Whichever is smaller)
1 part (by volume) of monoethanolomine
11 Mechanical Appearance No marking defects
Three shocks in each direction should be applied along 3 mutually
Shock Capacitance Within the specified tolerance
perpendicular axes of the test specimen (18 shocks).
Change
The specified test pulse should be Half-sine and should have a
D.F. R1,R7,C7 : 0.05 max.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
I.R.
More than 10,000MΩor 500Ω・F
(Whichever is smaller)
12 Vibration Appearance No marking defects
Solder the capacitor to the test jig (glass epoxy board) in the same
Capacitance Within the specified tolerance
manner and under the same conditions as (19). The capacitor
Change
should be subjected to a simple harmonic motion having a total
D.F. R1,R7,C7 : 0.05 max.
amplitude of 1.5mm, the frequency being varied uniformly between
the approximate limits of 10 and 2000Hz. The frequency range, from
I.R.
More than 10,000MΩor 500Ω・F10 to 2000Hz and return to 10Hz, should be traversed in
(Whichever is smaller) approximately 20 minutes. This motion should be applied for 12
items in each 3 mutually perpendicular directions (total of 36 times).
13 Resistance to The measured and observed characteristics should
Immerse the capacitor in a eutectic solder solution at 260±5℃for
Soldering Heat satisfy the specifications in the following table.
10±1 seconds. Set at room temperature for 24±2 hours, then
Appearance No marking defects
measure.
Capacitance Within the specified tolerance
Change
・Initial measurement for high dielectric constant type
D.F. R1,R7,C7 : 0.05 max.
Perform a heat treatment at 150+0/-10 ℃for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
I.R. More than 10,000MΩor 500Ω・F
(Whichever is smaller)
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
JEMCGS-00479C 3

14 Thermal Shock The measured and observed characteristics should satisfy
Fix the capacitor to the supporting jig in the same manner and under
the specifications in the following table.
the same conditions as (19). Perform the 300 cycles according to
Appearance No marking defects
the two heat treatments listed in the following table(Maximum
Capacitance R1,R7,C7: Within ±7.5%
transfer time is 20 seconds). Set for 24±2 hours at room
Change
temperature, then measure
D.F. R1,R7,C7: 0.05 max.
I.R.
More than 10,000MΩor 500Ω・F
(Whichever is smaller)
・Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 ℃ for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
15 ESD Appearance No marking defects
Per AEC-Q200-002
Capacitance Within the specified tolerance
Change
D.F. R1,R7,C7 : 0.05 max.
I.R.
More than 10,000MΩor 500Ω・F
(Whichever is smaller)
16 Solderability (a) Preheat at 155℃for 4 hours. After preheating, immerse the
and continuously. capacitor in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-
5902) (25% rosin in weight propotion). Immerse in
eutectic solder solution for 5+0/-0.5 seconds at 235±5℃.
(b) should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight
propotion). Immerse in eutectic solder solution for 5+0/-0.5
seconds at 235±5℃.
(c) should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight
propotion). Immerse in eutectic solder solution for 120±5
seconds at 260±5℃.
17 Electrical Appearance No marking defects Visual inspection.
Chatacteri- Capacitance Within the specified tolerance
The capacitance/Q/D.F. should be measured at 20℃/25℃at the
zation Change
frequency and voltage shown in the table.
D.F. R1,R7,C7 : 0.05 max.
I.R. 25℃More than 10,000MΩor 500Ω・FThe insulation resistance should be measured with a DC voltage not
(Whichever is smaller) exceeding the rated voltage at 25℃and 125℃(for R1,R7,C7) within 2
minutes of charging.
I.R. 125℃More than 1,000MΩor 10Ω・F
(Whichever is smaller)
Dielectric No failure No failure should be observed when 250% of the rated voltage is
Strength applied between the terminations for 1 to 5 seconds, provided the
charge/ discharge current is less than 50mA.
95% of the terminations is to be soldered evenly
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
Step
1
2
Temp.(℃）
-55+0/-3
125+3/-0
(for R1,R7,C7)
Time
(min.）
15±3
15±3
Char.
Item
R1,R7,C7
(C≦10μF)
Frequency
1±0.1kHz
Voltage
1±0.2Vrms
JEMCGS-00479C 4

18 Board Flex Appearance No marking defects
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig1 using a eutectic solder. Then apply a force in the direction
shown in Fig 2 for 5±1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
Capacitance R1,R7,C7: Within ±10.0%
soldering is uniform and free of defects such as heat shock.
Change
D.F. R1,R7,C7 : 0.05max.
I.R.
More than 10,000MΩor 500Ω・F（in mm）
(Whichever is smaller)
19 Terminal Appearance No marking defects Solder the capacitor to the test jig (glass epoxy board) shown in
Strength Fig.3 using a eutectic solder. Then apply *10N force in parallel with
Capacitance Within specified tolerance
the test jig for 10±1sec.
Change The soldering should be done either with an iron or using the reflow
D.F. R1,R7,C7 : 0.05max. method and should be conducted with care so that the soldering is
uniform and gree of defects such as heat shock
5N(GCJ18)
I.R.
More than 10,000MΩor 500Ω・F
(Whichever is smaller)
（in mm）
20 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
< Chip L dimension : 2.5mm max. > Apply a force.
< Chip Length : 2.5mm max. >
< Chip L dimension : 3.2mm min. >
Chip thickness < 1.25mm rank : 15N
Chip thickness ≧1.25mm rank : 54.5N
< Chip Length : 3.2mm min. >
Speed supplied the Stress Load : 0.5mm / sec.
Chip thickness > 0.5mm rank : 20N
Chip thickness ≦0.5mm rank : 8N
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
Type
a
b
c
GCJ18
0.6
2.2
0.9
GCJ21
0.8
3.0
1.3
GCJ31
2.0
4.4
1.7
GCJ32
2.0
4.4
2.6
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0 .05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
4.0±0.1
1.75±0.1
b
f4.5
c
Fig.1
t: 1.6mm
Type
a
b
c
GCJ18
1.0
3.0
1.2
GCJ21
1.2
4.0
1.65
GCJ31
2.2
5.0
2.0
GCJ32
2.2
5.0
2.9
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Solder resist
Baked electrode or
Copper foil
b
Fig.3
Iron Board
20
45
45
R4
114
Flexure：≦5
(High Dielectric Type)
Capacitance meter
Pressurizing
speed:1.0mm/s
Pressurize
支持台
ｺﾝﾃﾞﾝｻ
45
45
Fig.2
L
0.6L
Fig.4
JEMCGS-00479C 5

21 Capacitance No bias R1,R7 : Within ±15% The capacitance change should be measured after 5 min. at
Temperature (-55℃to +125℃)
 each specified temperature stage.
Characteristics C7 : Within ±22%
(-55℃to +125℃)
 (1) High Dielectric Constant Type
The ranges of capacitance change compared with the above 20℃/
25℃value over the temperature ranges shown in the table should
be within the specified ranges.
50% of the rated R1: Within +15/-40%
voltage
*for W.V.: 50V max.
only.
Initial measurement for high dielectric constant type.
Perform a heat treatment at 150+0/-10℃for one hour
and then set for 24±2 hours at room temperature.
Perform the initial measurement.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
Step
Temperature(℃)
Applying
Voltage(V)
1
20±2/25±2
No bias
2
-55±3(for R1,R7,C7)
3
20±2/25±2
4
125±3(for R1,R7,C7)
5
20±2
50% of
The rated voltage
6
-55±3(for R1)
7
20±2
8
125±3(for R1)
JEMCGS-00479C 6

1.Tape Carrier Packaging(Packaging Code:D/E/F/L/J/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel φ330mm reel
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:L Code:F/J Code:K
GCJ18
4000 10000
64000 10000
94000 10000
B3000 10000
93000 10000
M3000 10000
C2000 6000
GCJ32 D/E
1000 4000
1.2 Dimensions of Tape
(1)GCJ18/21 (in:mm)
Code GCJ18 GCJ21
A 1.05±0.1 1.55±0.15
B 1.85±0.1 2.3±0.15
Ｐａｃｋａｇe
ＧＣＪ Ｔｙｐｅ
Type
GCJ21
GCJ31
T: 0.85 max
1.1 max.
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
b1
a1
JEMCGP-01896 7

(2)GCJ21/31/32 T:0.85 min.
(in:mm)
Code GCJ21 GCJ31 GCJ32
A 1.45±0.2 1.9±0.2 2.8±0.2
B 2.25±0.2 3.5±0.2 3.5±0.2
Ｐａｃｋａｇe
ＧＣＪ Ｔｙｐｅ
＊4
＊4
1.7 max.(T≦1.25mm)
2.5 max. (T:1.35/1.6mm)
3.0 max. (T:1.8/2.0mm)
3.7 max. (T≧2.5mm)
0.25±0.1(T≦1.80mm)
0.3±0.1(T：2.5mm)
4.0±0.1
1.75±0.1
4.0±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
2.0±0.1
φ1.5
+0.1
-0
JEMCGP-01896 8

Ｐａｃｋａｇe
ＧＣＪ Ｔｙｐｅ
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
φ21±0.8
ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 2.2.
Hole for Chip : As specified in 2.2.
Base Tape : As specified in 2.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GCJ32 max.
16.5 max.
10±1.5
φ180+0/-3.0
φ330±2.0
φ50 min.
φ13±0.5
2.0±0.5
Chip
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01896 9

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2. There are possibly
to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Ｐａｃｋａｇe
ＧＣＪ Ｔｙｐｅ
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01896 10