Murata GQM1555C2DR75BB01 Series User manual

GQM1555C2DR75BB01_ (0402, C0G, 0.75pF, DC200V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of May.24,2014,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
0.3 min.
(1)-1 L
1.0±0.05
(1)-2 W
0.5±0.05
e
RF High Frequency Chip Monolithic Ceramic Capacitor
mark
(4)
DC Rated
Voltage
Packaging Unit
200 Vdc
Temp. Range
(Ref.Temp.)
(8) Packaging
Temp. coeff
or Cap. Change
This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
Electronic equipment.
(2) T
0.5±0.05
-55 to 125 °C
0±30 ppm/°C
25 to 125 °C
(25 °C)
(6)
Capacitance
Tolerance
0.75 pF
Specifications and Test
Methods
(Operating
Temp. Range)
±0.1 pF
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
g
0.15 to 0.35
(5) Nominal
Capacitance
J
f330mm Reel
PAPER W8P2
50000 pcs./Reel
D
f180mm Reel
PAPER W8P2
10000 pcs./Reel
W
f180mm Reel
PAPER W8P1
20000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)DC Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code
(7)Murata’s
Control Code
GQM 15 55C 2D R75 B B01 D
GQM1555C2DR75BB01-01 1

No Item Test Method
1 Operating
5C : -55℃to 125℃Reference Temperature : 25℃
Temperature Range
2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may
be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
3 Appearance No defects or abnormalities. Visual inspection.
4 Dimension Within the specified dimensions. Using calipers.
5 Dielectric Strength No defects or abnormalities. No failure should be observed when test voltage*
is applied between the terminations for 1 to 5 seconds,
provided the charge/discharge current is less than 50mA.
6 Insulation More than 10,000MΩ The insulation resistance should be measured with a DC voltage
Resistance
not exceeding the rated voltage at 25℃and 75%RH max.
and within 2 minutes of charging, provided the charge/discharge
current is less than 50mA.
7 Capacitance Within the specified tolerance.
The capacitance/Q should be measured at 25℃at the frequency
and voltage shown in the table.
8 Q
30pFmin. : Q≧1400
30pFmax.: Q≧800+20C
C:NominalCapacitance (pF)
9Capacitance Temperature Within the specified tolerance.(Table A-1) The capacitance change should be measured after 5 min. at
Temperature Coefficient each specified temp. stage.
Characteristics The temperature coefficient is determined using the capacitance
measured in step 3 as a reference.
When cycling the temperature sequentially from step 1 through 5
the capacitance should be within the specified tolerance for the
Capacitance Within ±0.2% or ±0.05pF temperature coefficient and capacitance change as Table A-1.
Drift (Whichever is larger.) The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
10 Adhesive Strength of No removal of the terminations or other defect Solder the capacitor on the test jig (glass epoxy board) shown
Termination should occur. in Fig.3 using an eutectic solder.
Then apply 5N force in parallel with the test jig for 10±1seconds.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
11 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test jig (glass epoxy board) shown
Resistance in Fig.3 using an eutectic solder.
Capacitance Within the specified tolerance. The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
Q
30pFmin. : Q≧1400 uniformly between the approximate limits of 10 and 55Hz.
30pFmax.: Q≧800+20C The frequency range, from 10 to 55Hz and return to 10Hz,
should be traversed in approximately 1 minute.
C:NominalCapacitance (pF)
This motion should be applied for a period of 2 hours in each 3
mutually perpendicular directions(total of 6 hours).
12 Deflection Appearance No defects or abnormalities.
Solder the capacitor on the test jig (glass epoxy board) shown
in Fig.1 using an eutectic solder.
Capacitance Within ±5% or ±0.5pF
Then apply a force in the direction shown in Fig 2 for 5±1seconds.
Change (Whichever is larger) The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and
free of defects such as heat shock.
13 Solderability 75% of the terminations is to be soldered Immerse the capacitor in a solution of ethanol (JIS-K-8101)
of Termination evenly and continuously. and rosin (JIS-K-5902) (25% rosin in weight proportion).
Preheat at 80 to 120℃for 10 to 30 seconds.
After preheating, immerse in an eutectic solder solution for
2±0.5 seconds at 230±5℃or Sn-3.0Ag-0.5Cu solder solution
for 2±0.5 seconds at 245±5℃
■SPECIFICATIONS AND TEST METHODS
Specification
*test voltage
rated voltage test voltage
100V 300% of rated voltage
200V 250% of rated voltage
Char.
Item
5C
(1000pF and below)
Frequency
10.1MHz
Voltage
0.5 to 5Vrms
Step
Temperature(C)
1
252
2
-553
3
252
4
1253
5
252
JEMCNS-02795 2

No Item Test Method
14 Resistance to The measured and observed characteristics should Preheat the capacitor at 120 to 150℃for 1 minute.
Soldering Heat
satisfy the specifications in the following table. Immerse the capacitor in an eutectic solder solution or
Appearance No defects or abnormalities. Sn-3.0Ag-0.5Cu solder solution at 270±5℃for 10±0.5 seconds.
Set at room temperature for 24±2 hours, then measure.
Capacitance Within ±2.5% or ±0.25 pF
Change (Whichever is larger)
Q30pFmin.:Q≧1400
30pFmax.:Q≧800+20C
C:NominalCapacitance
(pF)
I.R. More than 10,000MΩ
Dielectric No defects.
Strength
15 Temperature The measured and observed characteristics should Solder the capacitor on the test jig (glass epoxy board) shown
Cycle satisfy the specifications in the following table. in Fig.3 using an eutectic solder.
Appearance No defects or abnormalities. Perform the five cycles according to the four heat treatments
shown in the following table.
Capacitance Within ±2.5% or ±0.25pF Set for 24±2 hours at room temperature, then measure.
Change (Whichever is larger)
Q30pFmin. : Q≧1400
30pFmax.: Q≧800+20C
C:NominalCapacitance
(pF)
I.R.
More than 10,000MΩ
Dielectric No defects.
Strength
16 Humidity The measured and observed characteristics should Solder the capacitor on the test jig (glass epoxy board) shown
Steady State satisfy the specifications in the following table. in Fig.3 using an eutectic solder.
Appearance No defects or abnormalities. Set the capacitor at 40±2℃and 90 to 95% humidity
for 500±12 hours.
Capacitance Within ±5％or ±0.5pF Remove and set for 24±2 hours at room temperature,
Change (Whichever is larger) then measure.
Q30pF and over : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
C:Nominal Capacitance(pF)
I.R.
More than 1,000MΩ
17 Humidity Load The measured and observed characteristics should Solder the capacitor on the test jig (glass epoxy board) shown
satisfy the specifications in the following table. in Fig.3 using an eutectic solder.
Appearance No defects or abnormalities. Apply the rated voltage at 40±2℃and 90 to 95% humidity
for 500±12 hours.
Capacitance Within ±7.5% or ±0.75pF Remove and set for 24±2 hours at room temperature, then
Change (Whichever is larger) measure. The charge/discharge current is less than 50mA.
Q30pF and over : Q≧200
30pF and below : Q≧100+10C/3
I.R. More than 500MΩ
18 The measured and observed characteristics should Solder the capacitor on the test jig (glass epoxy board) shown
Load satisfy the specifications in the following table. in Fig.3 using an eutectic solder.
Appearance No defects or abnormalities. Apply 200% of the rated voltage at the maximum operating
temperature±3℃for 1000±12 hours.
Capacitance Within ±3% or ±0.3pF Set for 24±2 hours at room temperature, then measure.
Change (Whichever is larger) The charge/discharge current is less than 50mA.
Q30pF and over : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
C:Nominal Capacitance(pF)
I.R.
More than 1,000MΩ
Table A-1
* Nominal values denote the temperature coefficient within a range of 25℃to 125℃(for 5C)
■SPECIFICATIONS AND TEST METHODS
Specification
10pF and below : Q≧200+10C
C:Nominal Capacitance(pF)
10pF and below : Q≧200+10C
High Temperature
Step
Temp.(C)
Time (min.)
1
Min.
Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.
Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
Char.
Nominal Values
(ppm/C) *
Capacitance Change from 25C (%)
-55C
-30C
-10C
Max.
Min.
Max.
Min.
Max.
Min.
5C
030
0.58
-0.24
0.40
-0.17
0.25
-0.11
JEMCNS-02795 3

Adhesive Strength of Termination, Vibration Resistance,Temperature Cycle,
Test method : Deflection Humidity ,Humidity Load,High Temperature Load
・Test substrate ・Test substrate
Material : Copper-clad laminated sheets for PCBs Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin) (Glass fabric base, epoxy resin)
Thickness : 0.8mm Thickness : 0.8mm
Copper foil thickness : 0.035mm Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
(Coat with heat resistant resin for solde)
Fig.1 (in:mm) Fig.3 (in mm)
Fig.2 (in mm)
■SPECIFICATIONS AND TEST METHODS
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Glass epoxy board
Solder resist
Baked electrode or
copper foil
b
45
45
R230
20
50
Flexure:≦1
Capacitance meter
Pressurizing
speed
1.0mm/sec.
Support
Capacitor
Pressurize
45
45
Type
a
b
c
GQM15
0.4
1.5
0.5
Type
a
b
c
GQM15
0.4
1.5
0.5
JEMCNS-02795 4

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel φ330mm reel
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:W Code:L Code:J/ F Code:K
10000(W8P2) 20000(W8P1) 50000(W8P2)
4000 10000
4000 10000
1000 4000
1.2 Dimensions of Tape
(1)GQM15(W8P2 CODE:D/E/J/F)
Code GQM15
A *3 0.65
B *3 1.15
*3 Nominal value
ｔ0.8 max.
(2)GQM15(W8P1 CODE:W)
Code GQM15
A *3 0.65
B *3 1.15
*3 Nominal value
ｔ0.8 max.
PACKAGING
GQM Type
Type
GQM21
GQM22
GQM18
GQM15
*1,*2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCNP-01900A 5

(3)GQM18/GQM21 (in mm)
Code GQM18 GQM21
A 1.05±0.1 1.55±0.15
B 1.85±0.1 2.3±0.15
(4)GQM22
Code GQM22
A 2.8*
B 3.5* *Nominal Value
PACKAGING
GQM Type
4.0±0.1
4.0±0.1
2.0±0.05
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
1.1 max.
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
2.5 max.
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1
JEMCNP-01900A 6

PACKAGING
GQM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
φ21±0.8
10±1.5
16.5 max.
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
φ180+0/-3.0
φ330±2.0
φ50 min.
φ13±0.5
2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCNP-01900A 7

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows. (in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
1.13 Label that show the customer part number, our part number, our company name, inspection
number and quantity, will be put in outside of reel.
PACKAGING
GQM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCNP-01900A 8

Caution
■ Limitation of Applications
Please contact us before using our products for the applications listed below
which require especially high reliability for the prevention of defects which
might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions: Room Temperature of +5℃to +40℃and a Relative
Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months,
as prolonged storage may cause oxidation of the electrodes.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,
hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
!
JEMCNC-0012M 9

■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes.
The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit), please carefully consider the temperature
characteristics, and carefully confirm the various characteristics in actual use conditions
and the actual system.
□Typical Temperature Caracteristics X7R □Typical Temperature Characteristics X5R
Sample: 0.1μF, Rated Voltage 50VDC Sample: 22μF, Rated Voltage 4VDC
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC
voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
Caution
!
-20
-10
-15
-5
5
0
10
15
20
Temperature (°C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change (%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (°C)
-75 -50 -25 025 50 75 100
CapacitanceChange (%)
JEMCNC-0012M 10

3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the
rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the
rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage DC voltage+AC AC voltage Pulse voltage
（E：Maximum possible applied voltage.）
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
2.Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also
necessary to consider the withstand voltage and impulse withstand voltage defined for each device.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no
large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC
voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore
check the self-heating condition.
Please confirm the surface temperature of the capacitor
so that the temperature remains within the upper limits
of the operating temperature, including the rise in
temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage,
heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
1-1. The load should be contained to the level such that
when measuring at atmospheric temperature of 25°C,
the product's self-heating remains below 20°C and
the surface temperature of the capacitor in the actual
circuit remains within the maximum operating temperature.
Caution
!
1
10
100
0 1 2 3
Current (Ar.m.s.) 4 5 6
Temperature Rise (°C)
[Example of Temperature Rise (Heat Generation)
in Chip Monolithic Ceramic Capacitors in Contrast
to Ripple Current]
Sample: R characteristics 10μF, Rated voltage:DC10V
Ripple Current
100kHz
500kHz
1MHz
E
E
E
E
0
0
0
0
JEMCNC-0012M 11

5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in actual operating conditions in an
actual system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in
a AC circuit.
6. Capacitance Aging
1. The high dielectric constant type capacitors
[Example of Change Over Time (Aging characteristics) ]
have the characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
Caution
!
-100
-80
-60
-40
-20
0
20
010 20 30
DC Voltage (V) 40 50
[DC Voltage Characteristics]
Sample: X7R Characteristics 0.1μF, Rated Voltage 50VDC
Capacitance Change (%)
00.5 1
AC Voltage (Vr.m.s.) 1.5 2
[AC Voltage Characteristics]
Sample: X7R Characteristics 10μF, Rated Voltage 6.3VDC
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
5C
R7
R6
JEMCNC-0012M 12

7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the
capacitor.
Do not use a fallen capacitor because the quality and reliability may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner of another printed circuit board
should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.
Caution
Floor
Crack
Mounting printed circuit board
Crack
!
JEMCNC-0012M 13

■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing
or bending of the board.
[Component Direction]
Locate chip horizontal to the
direction in which stress acts.
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating
the board.
It is best to implement all of the following three measures; however, implement as
many measures as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component
parallel to the board separation surface.
A > D
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component
away from the board separation surface.
A > C
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that
occurs during the tightening of the screw. Mount the capacitor in a position as far away from
the screw holes as possible.
Caution
!
Screw Hole Recommended
①
②
③
1C
1B
1A
Perforation
Slit
A
B
C
D
①
1A
JEMCNC-0012M 14

2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any bending damage or cracking. Please take into account the
following precautions and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
[Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Backup Pin
JEMCNC-0012M 15

4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes Reflow
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of Temperature
tin is used. Please confirm the solderability of tin plated Incase of Lead Free Solder
termination chips before use. ( ): In case of Pb-Sn Solder
3. When components are immersed in solvent after mounting, Vapor Reflow
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Table 1
GQM15/GQM18/GQM21
GQM22
[Allowable Reflow Soldering Temperature and Time]
Recommended Conditions
Reflow Vapor Reflow
Peak Temperature
230 to 250℃230 to 240℃240 to 260℃
Atmosphere Air
Saturated vapor
of inactive solvent
Air or N2
Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu In the case of repeated soldering, the accumulated
4. Optimum Solder Amount for Reflow Soldering soldering time must be within the range shown above.
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in in section
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Inverting the PCB
Caution
Part Number
Temperature Differential
Pb-Sn Solder
Lead Free Solder
ΔT≦190℃
ΔT≦130℃
!
Temperature(℃)
PeakTemperature
(170℃)
(150℃)
(130℃)
(200℃)
Soldering
Gradual
Cooling
Preheating
ΔT
60-120seconds
30-60 seconds
Time
190℃
170℃
150℃
220℃
SolderingTemperature(℃)
SolderingTime(s)
280
270
260
250
240
230
220
0
30
60
120
90
Temperature(℃)
PeakTemperature
(170℃)
(150℃)
(130℃)
ΔT
Soldering
Gradual
Cooling
Preheating
Time
60-120seconds
20seconds max.
190℃
170℃
150℃
0.2mm min.
JEMCNC-0012M 16

4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2. [Standard Conditions for Flow Soldering]
Table 2 Temperature Differential
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB. [Allowable Flow Soldering Temperature and Time]
Preheating conditions are shown in table 2. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the electrodes and end termination.
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT) In the case of repeated soldering, the accumulated
between the component and solvent within the range soldering time must be within the range shown above.
shown in the table 2.
Recommended Conditions Pb-Sn Solder Lead Free Solder
90 to 110℃100 to 120℃
240 to 250℃250 to 260℃
Air
N2
Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Caution
Part Number
GQM18/GQM21
ΔT≦150℃
Atmosphere
Preheating Peak Temperature
Soldering Peak Temperature
!
Soldering mperature(℃)
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature(℃)
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90 seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
JEMCNC-0012M 17

4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs
internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal
stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause
of cracks. Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the
fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 2. A hot plate, hot air type preheater, etc. can be used
for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration
of the adhesive strength and other problems.
Table 3
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may
occur due to thermal shock. To prevent this problem, follow the conditions shown in Table 3.
Table 4
Distance 5mm or more
Hot Air Application angle 45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
(GQM15/18/21/22)
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the
angle shown in Figure 1.
Application Time
Caution
280℃max.
ΔT≦130℃
Air
Part Number
Temperature
of Soldering
Iron tip
Air
GQM22
Temperature
Differential
(ΔT)
150℃min.
GQM15/GQM18/GQM21
350℃max.
150℃min.
ΔT≦190℃
Atmosphere
Preheating
Temperature
!
One-hole Nozzle
[Figure 1]
an Angle of 45°
JEMCNC-0012M 18

3. Optimum solder amount when re-working with a soldering iron
3-1. In the case of 0603 (in inch) / 1608 (in mm) and smaller
sizes (GQM15/18), the top of the solder fillet should
be lower than 2/3 of the thickness of the component or
0.5mm, whichever is smaller.
In the case of 0805 (in inch) / 2012(in mm) and larger in section
sizes (GQM21/22), the top of the solder fillet
should be lower than 2/3 of the thickness of the component.
If the solder amount is excessive, the risk of cracking is higher
during board bending or under any other stressful condition.
3-2. A soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep
the soldering iron from touching the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate,
resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide backup pins on the back side of the PCB to prevent warping or flexing.
Install backup pins as close to the capacitor as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[ Recommended ]
Caution
[ Not Recommended ]
!
Peeling
Test-probe
Backup
Pin
Test-probe
SolderAmount
JEMCNC-0012M 19

7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
Bending Twisting
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disk separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[ Outline of jig ]
Caution
Recommended
Not recommended
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disk Separator
3) Router Type Separator
High
Medium
Medium
Low
Level of stress on board
×
△*
△*
◯
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Recommended
!
Board Cropping Jig
V-groove
Printed Circuit Board
①
1A
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCNC-0012M 20