Murata GRJ216R71H223KE01 Series User manual

GRJ216R71H223KE01_ (0805, X7R:EIA, 22000pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.7,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
g
0.2 to 0.7
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 125 °C
(25 °C)
0.7 min.
(1)-1 L
2.0±0.3
(1)-2 W
1.25±0.2
This product specification is applied to Chip Monolithic Ceramic Capacitor Soft Termination Type used for General Electronic equipment.
(2) T
e
Chip Monolithic Ceramic Capacitor Soft Termination Type for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±10 %
(6)
Capacitance
Tolerance
22000 pF
0.6±0.1
-55 to 125 °C
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
J
f330mm Reel
PAPER W8P4
10000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GRJ 21 6R7 1H 223 K E01 D
GRJ216R71H223KE01-01 1

■Specifications and Test Methods
No
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities.
Measurement Point : Between the terminations
Test Voltage : 250% of the rated voltage
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
5 Insulation Resistance(I.R.) 
Measurement Point : Between the terminations
Measurement Voltage :
DC Rated Voltage
Charging Time :
1 min
Charge/discharge current :
50mA max.
Measurement Temperature:
Room Temperature
6 Capacitance Shown in Rated value.
Measurement Temperature:
Room Temperature
7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,D7 : 0.1 max.
D8 : 0.15 max
8
Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) The capacitance change should be measured after 5 min.
Characteristics R1,R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.
of Capacitance R6 : Within +/-15% (-55°C to +85°C) In case of applying voltage, the capacitance change should be
C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of
C7 : Within+/-22% (-55°C to +125°C) each temp. stage.
C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.
D7 : Within +22/-33% (-55°C to +125°C)
D8 : Within +22/-33% (-55°C to +105°C)
50% of B1: Within +10/-30%
the rated R1: Within +15/-40%
voltage
･Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRJ03 2
GRJ15/GRJ18 5
GRJ21/GRJ31/GRJ32 10
Capacitance
Frequency
Voltage
C≦
(10V min.)
1.0+/-0.1kHz
1.0+/-0.2Vrms
C≦
(6.3V max.)
1.0+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp. +/-3
3
Reference Temp.+/-2
4
Max.Operating Temp. +/-3
5
Reference Temp.+/-2
50% of
the rated voltage
(For B1,R1)
6
Min.Operating Temp. +/-3
7
Reference Temp.+/-2
8
Max.Operating Temp.+/-3
JEMCGS-02814D 2

No
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration : A simple harmonic motion
Capacitance Within the specified initial value. 10Hz to 55Hz to 10Hz (1min)
Total amplitude : 1.5mm
D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test Pressurization method : Shown in Fig.2
Flexure : 3mm(GRJ18/21/31/32)
Capacitance Within +/-10% 5mm(GRJ03/15)
Change Holding Time : 5+/-1s
Soldering Method : Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and Test Method : Solder bath method
continuously. Flux Solution of rosin ethanol 25(mass)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time : 2+/-0.5s
13
Resistance Appearance No defects or abnormalities. Test Method : Solder bath method

to Solder : Sn-3.0Ag-0.5Cu
Soldering Capacitance Within +/-7.5% Solder Temp. : 270+/-5℃
Heat
Change Immersion time : 10+/-0.5s
Exposure Time : 24+/-2h
D.F. Within the specified initial value. Preheat : GRJ31 size max.: 120℃to 150℃for 1 min
GRJ32 size : 100℃to 120℃for 1 min
I.R. Within the specified initial value. and 170℃to 200℃for 1 min
· Initial measurement
Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Perform the 100 cycles according to the four heat treatments
shown in the following table.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
I.R. Within the specified initial value. Exposure Time : 24+/-2h
· Initial measurement
Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature Test Temperature :
40+/-2℃
High Test Humidity : 90%RH to 95%RH
Humidity Capacitance Within +/-12.5% Test Time : 500+/-12h
(Steady) Change Applied Voltage : DC Rated Voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
I.R.  let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Max. Operating Temp. +/-3℃
Capacitance Within +/-12.5% Test Time : 1000+/-12h
Change Applied Voltage : 150% of the rated voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-02814D 3

Test method : Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRJ03/GRJ15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change , High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Fig.3
c
b
a
Solder Resist
Chip Capacitor
Land
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GRJ03
0.3
0.9
0.3
GRJ15
0.4
1.5
0.5
GRJ18
1.0
3.0
1.2
GRJ21
1.2
4.0
1.65
GRJ31
2.2
5.0
2.0
GRJ32
2.2
5.0
2.9
Type
Dimension (mm)
a
b
c
GRJ03
0.3
0.9
0.3
GRJ15
0.4
1.5
0.5
GRJ18
1.0
3.0
1.2
GRJ21
1.2
4.0
1.65
GRJ31
2.2
5.0
2.0
GRJ32
2.2
5.0
2.9
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
JEMCGS-02814D 4

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
3
8
6
9
B
9
M
C
D/E
1.2 Dimensions of Tape
(1)GRJ03/15 <Paper Tape W8P2 Code:D/E/J/F> (in mm)
3
*3 Nominal value
(2)GRJ03 <Paper Tape W8P1 包装記号:W>
3
*3 Nominal value
0.5 max.
GRJ03
0.6±0.05
0.3±0.05
0.3±0.05
0.39
0.69
Type
Dimensions(Chip)
A *3
B *3
t
L
W
T
0.5±0.15
0.5±0.15
0.72
1.25
1.0±0.2
0.5±0.2
0.5±0.2
0.75
1.35
0.5 max.
GRJ15
5
1.0±0.07
0.5±0.07
0.5±0.07
0.65
1.15
0.8 max.
1.0±0.15
GRJ03
0.6±0.05
0.3±0.05
0.3±0.05
0.39
0.69
Type
Dimensions(Chip)
A *3
B *3
t
L
W
T
GRJ32
1000
4000
10000
2000
6000
GRJ31
3000
10000
3000
3000
10000
GRJ21
4000
10000
4000
10000
GRJ18
4000
10000
5 (Dimensions
Tolerance:±0.15 min.)
10000(W8P2)
40000(W8P2)
GRJ15
5(Dimensions
Tolerance:±0.07)
10000(W8P2)
50000(W8P2)
Code:W
Code:L
Code:J/F
Code:K
GRJ03
15000(W8P2)
30000(W8P1)
50000(W8P2)
Package
GRJ Type
Type


Paper Tape
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
Code:D/E
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
0.8 max.
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-02403H 5

(3)GRJ18/21<Paper Tape> (in mm)
L
W T
1.6±0.2 0.8±0.1 0.8±0.1 1.05±0.10 1.85±0.10
1.6±0.3 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
6 0.6±0.1
9 0.85±0.1
(4)GRJ21/31/32 <Plastic Tape> (in mm)
L
W T
2.0±0.3 1.25±0.2 1.25±0.2 1.45±0.20 2.25±0.20
2.0±0.35 1.25±0.25 1.25±0.25 1.60±0.20 2.40±0.20
9 0.85±0.1
3.2±0.4
3.2±0.3 1.6±0.3
3.2±0.4 1.6±0.4 1.6±0.4 2.15±0.20 3.65±0.20
D 2.0±0.3 3.0 max.
E 2.5±0.3 3.7 max.
GRJ32
3.2±0.4
2.5±0.3
2.80±0.20
3.50±0.20
M
1.15±0.2
C
2.5 max.
GRJ21
B
2.0 max.
GRJ31
3.2±0.3
1.6±0.3
1.90±0.20
3.50±0.20
1.7 max.
Type
Dimensions(Chip)
A
B
t
2.0±0.3
1.25±0.2
1.55±0.15
2.30±0.15
GRJ18
8
1.15 max.
GRJ21
Type
Dimensions(Chip)
A
B
t
Package
GRJ Type
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
JEMCGP-02403H 6

Package
GRJ Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRJ32 max.
16.5 max.
10±1.5
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-02403H 7

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence)
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N* in the direction as shown below.
* GRJ03:0.05N～0.5N
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GRJ Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-02403H 8

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt ,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-02595C 9

2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
1-1. The load should be contained to the level
such that when measuring at atmospheric
temperature of 25°C, the product's self-heating
remains below 20°C and the surface
temperature of the capacitor in the actual circuit
remains within the maximum operating
temperature.
Caution
!
1
10
100
0 1 2 3
Current (Ar.m.s.) 4 5 6
TemperatureRise (C)
[Example of Temperature Rise (Heat Generation) in Chip
Monolithic Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10 Rated voltage: DC10V
Ripple Current
100kHz
500kHz
1MHz
E
E
E
E
0
0
0
0
JEMCGC-02595C 10