Murata GRJ216R71H223KE01 Series User manual

GRJ216R71H223KE01_ (0805, X7R:EIA, 22000pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.7,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
g
0.2 to 0.7
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 125 °C
(25 °C)
0.7 min.
(1)-1 L
2.0±0.3
(1)-2 W
1.25±0.2
This product specification is applied to Chip Monolithic Ceramic Capacitor Soft Termination Type used for General Electronic equipment.
(2) T
e
Chip Monolithic Ceramic Capacitor Soft Termination Type for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±10 %
(6)
Capacitance
Tolerance
22000 pF
0.6±0.1
-55 to 125 °C
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
J
f330mm Reel
PAPER W8P4
10000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GRJ 21 6R7 1H 223 K E01 D
GRJ216R71H223KE01-01 1

■Specifications and Test Methods
No
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities.
Measurement Point : Between the terminations
Test Voltage : 250% of the rated voltage
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
5 Insulation Resistance(I.R.) 
Measurement Point : Between the terminations
Measurement Voltage :
DC Rated Voltage
Charging Time :
1 min
Charge/discharge current :
50mA max.
Measurement Temperature:
Room Temperature
6 Capacitance Shown in Rated value.
Measurement Temperature:
Room Temperature
7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,D7 : 0.1 max.
D8 : 0.15 max
8
Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) The capacitance change should be measured after 5 min.
Characteristics R1,R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.
of Capacitance R6 : Within +/-15% (-55°C to +85°C) In case of applying voltage, the capacitance change should be
C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of
C7 : Within+/-22% (-55°C to +125°C) each temp. stage.
C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.
D7 : Within +22/-33% (-55°C to +125°C)
D8 : Within +22/-33% (-55°C to +105°C)
50% of B1: Within +10/-30%
the rated R1: Within +15/-40%
voltage
･Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRJ03 2
GRJ15/GRJ18 5
GRJ21/GRJ31/GRJ32 10
Capacitance
Frequency
Voltage
C≦
(10V min.)
1.0+/-0.1kHz
1.0+/-0.2Vrms
C≦
(6.3V max.)
1.0+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp. +/-3
3
Reference Temp.+/-2
4
Max.Operating Temp. +/-3
5
Reference Temp.+/-2
50% of
the rated voltage
(For B1,R1)
6
Min.Operating Temp. +/-3
7
Reference Temp.+/-2
8
Max.Operating Temp.+/-3
JEMCGS-02814D 2

No
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration : A simple harmonic motion
Capacitance Within the specified initial value. 10Hz to 55Hz to 10Hz (1min)
Total amplitude : 1.5mm
D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test Pressurization method : Shown in Fig.2
Flexure : 3mm(GRJ18/21/31/32)
Capacitance Within +/-10% 5mm(GRJ03/15)
Change Holding Time : 5+/-1s
Soldering Method : Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and Test Method : Solder bath method
continuously. Flux Solution of rosin ethanol 25(mass)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time : 2+/-0.5s
13
Resistance Appearance No defects or abnormalities. Test Method : Solder bath method

to Solder : Sn-3.0Ag-0.5Cu
Soldering Capacitance Within +/-7.5% Solder Temp. : 270+/-5℃
Heat
Change Immersion time : 10+/-0.5s
Exposure Time : 24+/-2h
D.F. Within the specified initial value. Preheat : GRJ31 size max.: 120℃to 150℃for 1 min
GRJ32 size : 100℃to 120℃for 1 min
I.R. Within the specified initial value. and 170℃to 200℃for 1 min
· Initial measurement
Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Perform the 100 cycles according to the four heat treatments
shown in the following table.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
I.R. Within the specified initial value. Exposure Time : 24+/-2h
· Initial measurement
Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature Test Temperature :
40+/-2℃
High Test Humidity : 90%RH to 95%RH
Humidity Capacitance Within +/-12.5% Test Time : 500+/-12h
(Steady) Change Applied Voltage : DC Rated Voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
I.R.  let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Max. Operating Temp. +/-3℃
Capacitance Within +/-12.5% Test Time : 1000+/-12h
Change Applied Voltage : 150% of the rated voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-02814D 3

Test method : Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRJ03/GRJ15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change , High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Fig.3
c
b
a
Solder Resist
Chip Capacitor
Land
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GRJ03
0.3
0.9
0.3
GRJ15
0.4
1.5
0.5
GRJ18
1.0
3.0
1.2
GRJ21
1.2
4.0
1.65
GRJ31
2.2
5.0
2.0
GRJ32
2.2
5.0
2.9
Type
Dimension (mm)
a
b
c
GRJ03
0.3
0.9
0.3
GRJ15
0.4
1.5
0.5
GRJ18
1.0
3.0
1.2
GRJ21
1.2
4.0
1.65
GRJ31
2.2
5.0
2.0
GRJ32
2.2
5.0
2.9
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
JEMCGS-02814D 4

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
3
8
6
9
B
9
M
C
D/E
1.2 Dimensions of Tape
(1)GRJ03/15 <Paper Tape W8P2 Code:D/E/J/F> (in mm)
3
*3 Nominal value
(2)GRJ03 <Paper Tape W8P1 包装記号:W>
3
*3 Nominal value
0.5 max.
GRJ03
0.6±0.05
0.3±0.05
0.3±0.05
0.39
0.69
Type
Dimensions(Chip)
A *3
B *3
t
L
W
T
0.5±0.15
0.5±0.15
0.72
1.25
1.0±0.2
0.5±0.2
0.5±0.2
0.75
1.35
0.5 max.
GRJ15
5
1.0±0.07
0.5±0.07
0.5±0.07
0.65
1.15
0.8 max.
1.0±0.15
GRJ03
0.6±0.05
0.3±0.05
0.3±0.05
0.39
0.69
Type
Dimensions(Chip)
A *3
B *3
t
L
W
T
GRJ32
1000
4000
10000
2000
6000
GRJ31
3000
10000
3000
3000
10000
GRJ21
4000
10000
4000
10000
GRJ18
4000
10000
5 (Dimensions
Tolerance:±0.15 min.)
10000(W8P2)
40000(W8P2)
GRJ15
5(Dimensions
Tolerance:±0.07)
10000(W8P2)
50000(W8P2)
Code:W
Code:L
Code:J/F
Code:K
GRJ03
15000(W8P2)
30000(W8P1)
50000(W8P2)
Package
GRJ Type
Type


Paper Tape
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
Code:D/E
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
0.8 max.
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-02403H 5