Murata GRM0335C1HR30WD01 Series User manual

CHIP MONOLITHIC CERAMIC CAPACITOR
GRM0335C1HR30WD01_ (0201, C0G, 0.3pF, 50Vdc)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Aug.3,2011,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
0.2 min.
(8) Packaging
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
±0.05 pF
-55 to 125 °C
0±30 ppm/°C
25 to 125 °C
(25 °C)
(3) Temperature Characteristics
(Public STD Code):F(EIA)
e
Specifications and Test
Methods
(Operationg
Temp. Range)
g
Temp. coeff
or Cap. Change
(5) Nominal
Capacitance
(6)
Capacitance
Tolerance
50 Vdc
0.3 pF
Temp. Range
(Ref.Temp.)
mark
0.3±0.03
(4)
DC Rated
Voltage
0.1 to 0.2
(1)-2 W
0.3±0.03
(2) T
Packaging Unit
(1)-1 L
0.6±0.03
D
f180mm Reel
PAPER
15000 pcs./Reel
J
f330mm Reel
PAPER
50000 pcs./Reel
B
Bulk Bag
1000 pcs./Bag
C
Bulk Case
50000 pcs./Case
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)DC Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code
(7)Murata’s
Control Code
T
L
W
e
e
g
GRM 03 35C 1H R30 W D01 D
1GRM0335C1HR30WD01-01

SPECIFICATIONS AND TEST METHODS
No.
Item
Specification
Test Method
Temperature
Compensating Type
High Dielectric Type
1
Operating Temperature
Range
-55C to +125C
R6 : -55C to + 85C R7 : -55C to +125C
C8 : -55C to + 105C E4 : 10C to + 85C
F5 : -30C to + 85CL8/R9 : -55C to +150C
Reference Temperature : 25C
2
Rated Voltage
See the previous pages
The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor. When AC voltage is
superimposed on DC voltage, VP-P or VO-P, whichever is larger,
should be maintained within the rated voltage range.
3
Appearance
No defects or abnormalities
Visual inspection.
4
Dimension
Within the specified dimensions
Using calipers or Microscope. (GRM02 size is based on Microscope)
5
Dielectric
Strength
No defects or abnormalities
No failure should be observed when 300% of the rated voltage (C
to 7U and 1X) or 250% of the rated voltage (R6, R7,C8,E4 and F5) is
applied between the terminations for 1 to 5 seconds, provided the
charge/ discharge current is less than 50mA.
6
Insulation Resistance
More than 10,000Mor 500∙F
(whichever is smaller)
The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at 25C and 75%RH max. and within 2
minutes of charging.
7
Capacitance
Within the specified tolerance
The capacitance/Q/D.F. should be measured at 25C at the
frequency and voltage shown in the table.
8
Q/
Dissipation Factor
(D.F.)
30pF and over :
Q ≧1000
30pF and below :
Q ≧400+20C
C:Nominal
Capacitance (pF)
[R6,R7,C8,L8]
W.V.:100V : 0.025max.(C < 0. 068F)
: 0.05max.(C ≧0.068F)
W.V.:25/50V :0.025max.
W.V.:16/10V :0.035max.
W.V.:6.3V/4V :0.05max. (C < 3.3F)
:0.1max.(C ≧3.3F)
[R9]W.V.:50V: 0.05max.
[E4] W.V.:25Vmin :0.025max.
[F5] W.V.:25Vmin.
:0.05max. (C 0.1F) :0.09max. (C ≧0.1F)
W.V.:16/10V:0.125max. W.V.:6.3V:0.15max.
9
Capacitance
Temperature
Character-ist
ics
Capacitance
Change
Within the specified
tolerance.
(Table A -1)
The capacitance change should be measured after 5 min. at
each specified temperature stage.
(1)Temperature Compensating Type
The temperature coefficient is determind using the capacitance
measured in step 3 as a reference. When cycling the temperature
sequentially from step1 through 5 (C+25C to +125C , other
temp. coeffs.:+25C to +85C ) the capacitance should be within
the specified tolerance for the temperature coefficient and
capacitance change as Table A-1. The capacitance drift is
caluculated by dividing the differences betweeen the maximum and
minimum measured values in the step 1,3 and 5 by the cap value in
step 3.
(2) High Dielectric Constant Type
The ranges of capacitance change compared with the 25C value
over the temperature ranges shown in the table should be within
the specified ranges.
Initial measurement for high dielectric constant type.
Perform a heat treatment at 150+0/-10Cfor one hour
and then set for 24±2 hours at room temperature.
Perform the initial measurement.
Temperature
Coefficent
Within the specified tolerance.
(Table A -1)
Capacitance
Drift
Within ±0.2% or ±0.05 pF
(Whichever is larger.)
Not apply to 1X/25V
10
Adhesive Strength of
Termination
No removal of the terminations or other defect should occur.
Solder the capacitor to the test jig (glass epoxy board) shown in Fig.1
using a eutectic solder. Then apply *10N force in parallel with the test
jig for 10±1sec.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
*5N (GR15, GRM18)
2N (GR03),1N(GR02)
(in:mm)
Type
a
b
c
GR02
0.2
0.56
0.23
GR03
0.3
0.9
0.3
GR15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
GRM43
3.5
7.0
3.7
GRM55
4.5
8.0
5.6
c
Baked electrode or
copper foil
Solder resist
a
b
Fig.1
Char.
Item
C
to 7U,1X
(1000pF and
below)
C
to 7U,1X
(more than 1000pF)
R6,R7,C8,F5
(C ≦10F)
R6,R7,F5
(C>10F)
E4
Frequency
1±0.1MHz
1±0.1kHz
120±24Hz
1±0.1kHz
Voltage
0.5 to 5Vrms
1±0.2Vrms
0.5±0.1Vrms
0.5±0.05Vrms
Step
Temperature(C )
1
25±2
2
-55±3(forC to 7U/1X/R6/R7/C8/L8/R9)
-30±3(for F5), 10±3(for E4)
3
25±2
4
150±3(for R9),125±3(for C/R7),
105±3(for C8),85±3(for other TC)
5
25±2
Char.
Temp. Range
Reference
Temp.
Cap. Change
R6
-55C to +85C
25C
Within ±15%
R7
-55C to +125C
Within ±15%
C8
-55C to +105C
Within ±22%
L8
-55C to +125C
Within ±15%
+125C to+150C
Within+15/-40%
R9
-55C to+150C
Within ±15%
E4
+10C to +85C
Within+22/-56%
F5
-30C to +85C
Within+22/-82%
JEMCGS-0015Q 2

SPECIFICATIONS AND TEST METHODS
No.
Item
Specification
Test Method
Temperature
Compensating Type
High Dielectric Type
11
Vibration
Resistance
Appearance
No defects or abnormalities
Solder the capacitor on the test jig (glass epoxy board) in the
same manner and under the same conditions as(10). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 minute. This motion should be
applied for a period of 2 hours in each 3 mutually perpendicular
directions(total of 6 hours).
Capacitance
Within the specified tolerance
Q/D.F.
30pF and over :
Q ≧1000
30pF and below:
Q ≧400+20C
C:Nominal
Capacitance (pF)
[R6,R7,C8,L8]
W.V.:100V : 0.025max. (C < 0. 068F)
: 0.05max.(C ≧0.068F)
W.V.:25/50V :0.025max.
W.V.:16/10V :0.035max.
W.V.:6.3V/4V :0.05max. (C < 3.3F)
:0.1max.(C ≧3.3F)
[R9]W.V.:50V: 0.05max.
[E4] W.V.:25Vmin. :0.025max
[F5] W.V.:25Vmin.
:0.05max. (C 0.1F) :0.09max.(C ≧0.1F)
W.V.:16/10V:0.125max. W.V.:6.3V:0.15max.
12
Deflection
Appearance
No defects or abnormalities.
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig.2 using a eutectic solder. Then apply a force in the direction
shown in Fig 3 for 5±1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
(in:mm)
Capacitance
Change
Within ±5% or ±
0.5pF
(Whichever is larger)
Within ±10%
13
Solderability of
Termination
75% of the terminations is to be soldered evenly and continuously
Immerse the capacitor in a solution of ethanol(JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight propotion). Preheat at
80 to 120C for 10 to 30 seconds. After preheating , immerse
in an eutectic solder solution for 2±0.5 seconds at 230±5C or
Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±
5C.
14
Resistance to
Soldering Heat
The measured and observed characteristics should satisfy the specifications in
the following table
Preheat the capacitor at *120 to 150C for 1 minute. Immerse
the capacitor in an eutectic solder solution* or Sn-3.0Ag-0.5Cu
solder solution at 270±5C for 10±0.5 seconds. Set at room
temperature for 24±2 hours, then measure.
*Not apply to GRM02
∙Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10C for one hour and
then set at room temperature for 24±2 hours.
Perform the initial measurement.
*Preheating for GRM32/43/55
Appearance
No defects or abnormalities
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger)
R6,R7,C8,L8,R9:Within ±7.5%
E4,F5:Within ±20%
Q/D.F.
30pF and over :
Q ≧1000
30pF and below:
Q ≧400+20C
C:Nominal
Capacitance (pF)
[R6,R7,C8,L8]
W.V.:100V : 0.025max.(C < 0. 068F)
: 0.05max. (C ≧0.068F)
W.V.:25/50V :0.025max.
W.V.:16/10V :0.035max.
W.V.:6.3V/4V :0.05max.(C < 3.3F)
:0.1max.(C ≧3.3F)
[R9]W.V.:50V: 0.05max.
[E4] W.V.:25Vmin :0.025max
[F5] W.V.:25Vmin
:0.05max. (C 0.1F) :0.09max. (C ≧0.1F)
W.V.:16/10V:0.125max. W.V.:6.3V:0.15max.
I.R.
More than 10,000Mor 500F(Whichever is smaller)
Dielectric
Strength
No defects
Type
a
b
c
GR02
0.2
0.56
0.23
GR03
0.3
0.9
0.3
GR15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
GRM43
3.5
7.0
3.7
GRM55
4.5
8.0
5.6
(GR02/03,GR15:0.8mm)
100
Fig.2
40
a
b
c
t : 1.6mm
f4.5
45
45
R230
20
50
Pressunzing
speed:1.0mm/sec.
Pressunze
Flexure:
≦1
Capacitance meter
Fig.3
Step
Temperature
Time
1
100C to 120C
1 min.
2
170C to 200C
1 min.
JEMCGS-0015Q 3

No.
Item
Specification
Test Method
Temperature
Compensating Type
High Dielectric Type
15
Temperature Cycle
The measured and observed characteristics should satisfy the specifications in
the following table
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10). Perform the five cycles
according to the four heat treatments shown in the following
table. Set for 24±2 hours at room temperature, then measure
∙Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10C for one hour and
then set at room temperature for 24±2 hours. Perform the initial
measurement
Appearance
No defects or abnormalities
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger)
R6,R7,C8,L8,R9:Within ±7.5%
E4,F5:Within ±20%
Q/D.F.
30pF and over :
Q ≧1000
30pF and below:
Q ≧400+20C
C:Nominal
Capacitance (pF)
[R6,R7,C8,L8]
W.V.:100V : 0.025max. (C < 0. 068F)
: 0.05max.(C ≧0.068F)
W.V.:25/50V :0.025max.
W.V.:16/10V :0.035max.
W.V.:6.3V/4V :0.05max. (C < 3.3F)
:0.1max. (C ≧3.3F)
[R9]W.V.:50V: 0.05max.
[E4] W.V.:25Vmin. :0.025max
[F5] W.V.:25Vmin.
:0.05max. (C 0.1F) :0.09max.(C ≧0.1F)
W.V.:16/10V:0.125max. W.V.:6.3V:0.15max.
I.R.
More than 10,000Mor 500F (Whichever is smaller)
Dielectric
Strength
No defects
16
Humidity
Steady State
The measured and observed characteristics should satisfy the specifications in
the following table
Set the capacitor at 40±2C and in 90 to 95% humiduty for
500±12 hours.
Remove and set for 24±2 hours at room temperature, then
measure.
Appearance
No defects or abnormalities
Capacitance
Change
Within ±5% or ±0.5pF
(Whichever is larger)
R6,R7,C8,L8,R9:Within ±12.5%
E4,F5:Within ±30%
Q/D.F.
30pF and over : Q ≧350
10pF and over,
30pF and below:
Q ≧275 + C
10pF and below:
Q ≧200+10C
C:Nominal
Capacitance(pF)
[R6,R7,C8,L8]
W.V.:100V : 0.05max. (C < 0.068F)
: 0.075max. (C ≧0.068F)
W.V.:25/50V :0.05max.
W.V.:16/10V :0.05max.
W.V.:6.3V/4V:0.075max. (C < 3.3F)
:0.125max. (C ≧3.3F)
[R9]W.V.:50V: 0.075max.
[E4] W.V.:25Vmin.:0.05max.
[F5] W.V.:25Vmin.
:0.075max. (C0.1F) :0.125max. (C≧0.1F)
W.V.:16/10V:0.15max. W.V.:6.3V:0.2max.
I.R.
More than 1,000Mor 50F(Whichever is smaller)
Dielectric
Strength
No defects
17
Humidity Load
The measured and observed characteristics should satisfy the specifications in
the following table
Apply the rated voltage at 40±2C and 90 to 95% humidity for
500±12 hours.
Remove and set for 24±2 hours at room temprature, then
measure.
The charge/discharge current is less than 50mA.
∙Initial measurement for F5/16Vmax.
Apply the rated DC voltage for 1 hour at 40±2C .
Remove and set for 24±2 hours at room temperature.
Perform initial measurement.
Appearance
No defects or abnormalities
Capacitance
Change
Within ±7.5% or ±0.75pF
(Whichever is larger)
R6,R7,C8,L8,R9:Within ±12.5%
E4:Within ±30%
F5:Within ±30% (W.V.>10V)
F5:Within +30/-40% (W.V. ≦10V)
Q/D.F.
30pF and over : Q ≧200
30pF and below:
Q≧100 + C
C:Nominal
Capacitance(pF)
[R6,R7,C8,L8]
W.V.:100V : 0.05max. (C < 0.068F)
: 0.075max. (C ≧0.068F)
W.V.:25/50V :0.05max.
W.V.:16/10V :0.05max.
W.V.:6.3V/4V:0.075max. (C < 3.3F)
:0.125max. (C ≧3.3F)
[R9]W.V.:50V: 0.075max.
[E4] W.V.:25Vmin.:0.05max.
[F5] W.V.:25Vmin.
:0.075max. (C0.1F) :0.125max. (C≧0.1F)
W.V.:16/10V:0.15max. W.V.:6.3V:0.2max.
I.R.
More than 500Mor 25∙F(Whichever is smaller)
Dielectric
Strength
No defects
5
2
10
3
Step
1
2
3
4
Temp.(C)
Min.
Operating
Temp. +0/-3
Room
Temp.
Max.
Operating
Temp. +3/-0
Room
Temp.
Time
(min.)
30±3
2 to 3
30±3
2 to 3
SPECIFICATIONS AND TEST METHODS
JEMCGS-0015Q 4

SPECIFICATIONS AND TEST METHODS
No.
Item
Specification
Test Method
Temperature
Compensating Type
High Dielectric Type
18
High Temperature
Load
The measured and observed characteristics should satisfy the specifications
in the following table
Apply 200% of the rated voltage at the maximun operating
temperature ±3C for 1000±12 hours . Set for 24±2 hours at
room temperature, then measure.
The charge/discharge current is less than 50mA.
∙Initial measurement for high dielectric constant type.
Apply 200% of the rated DC voltage at the maximun operating
temperature ±3C for one hour. Remove and set for 24±2
hours at room temperature.Perform initial measurement.
Appearance
No defects or abnormalities
Capacitance
Change
Within ±3% or ±0.3pF
(Whichever is larger)
R6,R7,C8,L8,R9:Within ±12.5%
E4:Within ±30%
F5:Within±30% (Cap<1.0F)
F5:Within +30/-40% (Cap≧1.0F)
Q/D.F.
30pF and over :
Q ≧350
10pF and over,
30pF and below:
Q ≧275+ C
10pF and below:
Q ≧200+10C
C:Nominal
Capacitance(pF)
[R6,R7,C8,L8]
W.V.:100V : 0.05max. (C < 0.068F)
: 0.075max. (C ≧0.068F)
W.V.:25/50V :0.05max.
W.V.:16/10V :0.05max.
W.V.:6.3V/4V:0.075max. (C < 3.3F)
:0.125max. (C ≧3.3F)
[R9]W.V.:50V: 0.075max.
[E4] W.V.:25Vmin.:0.05max.
[F5] W.V.:25Vmin.
:0.075max. (C0.1F) :0.125max.(C≧0.1F)
W.V.:16/10V:0.15max. W.V.:6.3V:0.2max.
I.R.
More than 1,000Mor 50F(Whichever is smaller)
Dielectric
Strength
No defects
Table A-1
Char.
Nominal Values
(ppm/C) Note 1
Capacitance Change from 25 C
-55
-30
-10
Max.
Min.
Max.
Min.
Max.
Min.
5C
0±30
0.58
-0.24
0.40
-0.17
0.25
-0.11
6C
0±60
0.87
-0.48
0.59
-0.33
0.38
-0.21
6P
-150±60
2.33
0.72
1.61
0.50
1.02
0.32
6R
-220±60
3.02
1.28
2.08
0.88
1.32
0.56
6S
-330±60
4.09
2.16
2.81
1.49
1.79
0.95
6T
-470±60
5.46
3.28
3.75
2.26
2.39
1.44
7U
-750±120
8.78
5.04
6.04
3.47
3.84
2.21
1X
+350~-1000
-
-
-
-
-
-
Note 1Nominal values denote the temperature coefficient within a range of 25 Cto 125C(for C)/85C(for other TC).
5
2
JEMCGS-0015Q 5

P A C K A G I N G
G R M / F T y p e
There are three type of packaging for chip monolithic ceramic capacitor.
Please specify the packaging code.
1.Bulk Packaging(Packaging Code=B):In a bag.
Minimum Quantity : 1000(pcs./bag) , Only GR43S, GR55E/F : 500(pcs./bag)
2.Tape Carrier Packaging(Packaging Code:D/E/F/L/J/K)
2.1 Minimum Quantity(pcs./reel)
Type
f180 reel
f330 reel
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
Code:D/E
Code:L
Code:J /F
Code:K
GR02
40000 *
GR03
15000
50000
GR15
10000
50000
GR18
4000
10000
GR21
5/6/9
4000
10000
A/B
3000
10000
GR31
6/9
4000
10000
M/X
3000
10000
C
2000
6000
GR32
5/6/9
4000
10000
A/M
3000
10000
N
2000
8000
C
2000
6000
R/D/E
1000
4000
GR43
M
1000
5000
N/C/R
1000
4000
D
1000
4000
E
500
2000
S
500
1500
GR55
M
1000
5000
N/C/R
1000
4000
D
1000
4000
E
500
F/X
300
1500
* 4mm width 1mm pitch Plastic Taping.
2.2 Dimensions of Tape
(1)GR02
Code
GR02
A *3
0.23
*3 Nominal
value
B *3
0.43
t
0.5 max.
＊2 ＊1
φ0.8±0.04
2.0±0.04
0.9±0.05
4.0±0.05
1.8±0.02
＊1,2：1.0±0.02
0.05 Max.
Ａ
Ｂ
t
0.15～0.4
(in : mm)
JEMCGP-2694T 6

P A C K A G I N G
G R M / F T y p e
2.2 Dimensions of Tape
(2)GR03/15
(3) GR18/21/31/32 T:0.85 max.
Code
GR18
GR21
GR31
GR32
A
1.05±0.1
1.55±0.15
2.0±0.2
2.8±0.2
B
1.85±0.1
2.3±0.15
3.6±0.2
3.6±0.2
Code
GR03
GR15
A *3
0.37
0.65
*3 Nominal
value
B *3
0.67
1.15
t
0.5 max.
0.8 max.
(in : mm)
1.75±0.1
＊2
4.0±0.1
＊1,2：2.0±0.05
φ1.5＋０．１
－０
b1
Ｂ
Ａ
a1
3.5±0.05
8.0±0.3
1.75±0.1
＊1 ＊2
0.05 以下
＊2
＊1
φ0.8±0.04
4.0±0.1
8.0±0.3
3.5±0.05
＊1,2：1.0±0.02
0.05 Max.
Ａ
Ｂ
t
＊1
φ1.5
+0.1
-0
Ａ
Ｂ
Ｂ
t
*1,2：2.0±0.05
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
0.8 max.(T=0.5mm)
1.15 max.(T≦0.85mm)
Ａ
Ｂ
JEMCGP-2694T 7

P A C K A G I N G
G R M / F T y p e
(4) GR21/31/32 T:1.0 min.
Code
GR21
GR31
(Dimensions Tolerance
:±0.2within）
GR31
(Dimensions Tolerance
:±0.3）
GR32
A
1.45±0.2
1.9±0.2
2.1±0.2
2.8±0.2
B
2.25±0.2
3.5±0.2
3.6±0.2
3.5±0.2
(5) GR43/55
*1
2.5 max. (T≦1.8mm)
3.7 max. (T= 2.0/2.5mm)
4.7 max. (T≧2.8mm)
Code
GR43
GR55
A *2
3.6
5.2
B *2
4.9
6.1
*2Nominal
value
*1
0.3±0.1
+0.1
0
+0.1
0
f1.5
－0
0
+0.1
0
+0.1
0
8.0±0.1
4.0±0.1
*
*：2.0±0.1
12.0±0.3
5.5±0.1
1.75±0.1
A
B
*
0.25±0.1 (T≦2.0mm)
0.3±0.1 (T:2.5mm)
4.0±0.1
4.0±0.1
2.0±0.1
A
B
8.0±0.3
3.5±0.05
1.75±0.1
*
1.7 max. (T≦1.25mm)
2.5 max. (T:1.35/1.6mm)
3.0 max. (T:1.8/2.0mm)
3.7 max. (T≧2.5mm)
f1.5
－0
0
+0.1
0
(in : mm)
JEMCGP-2694T 8

P A C K A G I N G
G R M / F T y p e
Chip
Fig.1 Package Chips
Fig.2 Dimensions of Reel
2.0±0.5
f21±0.8
W1
W
Fig.3 Taping Diagram
Top Tape : Thickness 0.06
Feeding Hole :As specified in 2.2.
Hole for Chip : As specified in 2.2.
Base Tape : As specified in 2.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
f180+0/-3.0
f330±2.0
f50 min.
(in : mm)
f13±0.5
W
w1
GR02
8.0 max
5±1.5
GR32 max.
16.5 max.
10±1.5
GR43/55
20.5 max.
14±1.5
JEMCGP-2694T 9

P A C K A G I N G
G R M / F T y p e
2.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
2.4 Part of the leader and part of the vacant section are attached
as follows.
(in : mm)
2.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
2.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
2.7 The top tape and base tape are not attached at the end of the tape for a minimum of
5 pitches.
2.8 There are no jointing for top tape and bottom tape.
2.9 There are no fuzz in the cavity.
2.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
2.11 Reel is made by resin and appeaser and dimension is shown in Fig 2. There are possibly
to change the material and dimension due to some impairment.
2.12 Peeling off force : 0.1 to 0.6N*in the direction as shown below.
* GR02,03:0.05N~0.5N
2.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 Min.
190 Min.
210 Min.
165 ~180°
Top tape
JEMCGP-2694T 10

P A C K A G I N G
G R M / F T y p e
3.Bulk Case Packaging (Packaging Code=C)
Fig.4 Dimensions of Bulk case
3.1 Minimum Quantity(pcs./case)
GR15
50000
GR18
15000 *
GR21
6
10000
B
5000 *
* There are parts number without bulk case.
3.2 Case is made by resin of transparence or semitransparency, and appeaser and dimension
is shown in Fig.4.
There are possibility to change the material and dimension due to some impairment.
3.3 Case must be marked in Customer ‘s part number, MURATA part number, MURATA name,
Inspection number and quantity(pcs).
110±0.7
31.5±0.35
36.0±0.35
6.8±0.1
8.8±0.1
12.0±0.1
1.5
3.0
2.0
－0
0
+ 0.2
0
+ 0
0
－0.1
0
+ 0.1
0
－0
0
(in : mm)
JEMCGP-2694T 11

Caution
■ Limitation of use
Please contact our sales representatives or product engineers before using our products for the applications
listed below which require of our products for other applications than specified in this product.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or requirements to the applications listed in the above
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store capacitors in the following conditions: Temperature of +5℃to +40℃and a Relative Humidity
of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect the solderability and the packaging performance
Please use product within six months of receipt.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,
hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
!
JEMCGC-2701U 12

■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes.
The following actions are recommended in order to insure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance.
Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
□Typical temperature characteristics Char.R6 (X5R)
□Typical temperature characteristics Char.R7 (X7R)
□Typical temperature characteristics Char.F5 (Y5V)
2.Measurement of Capacitance
1. Measure capacitance with the voltage and the frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage
applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
Caution
-20
-15
-10
-5
0
5
10
15
20
-75 -50 -25 025 50 75 100
Capacitance Change (%)
Temperature (℃)
-100
-80
-60
-40
-20
0
20
40
-50 -25 025 50 75 100
Capacitance Change (%)
Temperature (℃)
!
JEMCGC-2701U 13

3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the
rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the
rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage DC voltage+AC AC voltage Pulse voltage
（E：Maximum possible applied voltage.）
1-2. Influence of overvoltage
Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4. Applied Voltage and Self-heating Temperature
1. When the capacitor is used in a high-frequency voltage, pulse voltage, application,
be sure to take into account self-heating may be caused by resistant factors of the capacitor.
1-1. The load should be contained to the level such that when measuring at atomospheric temperature
of 25℃,the product's self-heating remains below 20℃and surface temperature of the capacitor in the
actual circuit remains wiyhin the maximum operating temperature.
Caution
E E E E
0 0
0
0
!
JEMCGC-2701U 14

5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC
voltage applied.
Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the capacitance.
(1) Whether the capacitance change caused by the
applied voltage is within the range allowed or not.
□DC voltage characteristics
(2) In the DC voltage characteristics, the rate of capacitance
change becomes larger as voltage increases.
Even if the applied voltage is below the rated voltage.
When a high dielectric constant type capacitor is in a
circuit that needs a tight (narrow) capacitance tolerance.
Example: a time constant circuit., please carefully
consider the characteristics of these capacitors, such as
their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the
intended environment and operating conditions.
2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
□AC voltage characteristics
6. Capacitance Aging
1. The high dielectric constant type capacitors have the characteristic
in which the capacitance value decreases with passage of time.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance. Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
Caution
-60
-50
-40
-30
-20
-10
0
10
20
30
0.0 0.5 1.0 1.5 2.0 2.5
Capacitance Change (%)
AC Voltage (Vr.ms.)
-100
-80
-60
-40
-20
0
20
02468
Capacitance Change(%)
DC Voltage (VDC)
!
JEMCGC-2701U 15

7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and reliability may be deteriorated.
3. When printed circuit boards are piled up or handled, the corners of another printed circuit board
should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.
■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing
or bending of the board.
[Component Direction]
Locate chip horizontal to the
direction in which stress acts
[Chip Mounting Close to Board Separation Point]
Chip arrangement
Worst A-C-(B~D) Best
Caution
Floor
Crack
Mounting printed circuit board
Crack
!
A
B
C
D
Perforation
Slit
JEMCGC-2701U 16

2.Information before mounting
1. Do Not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any bending damage or cracking. Please take into account the
following precautions and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
[Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
Suction Nozzle
Board Deflection
Support Pin
Board Guide
!
JEMCGC-2701U 17

4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes Infrared Reflow
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
Tin is used. Please confirm the Solderability of Tin plated
termination chips before use. Vapor Reflow
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Table 1
GR□02/03/15/18/21/31
[Allowable Soldering Temperature and Time]
GR□32/43/55
Recommended Conditions
Infrared Reflow Vapor Reflow
Peak Temperature
230～250℃230～240℃240～260℃
Atmosphere Air Air Air or N2
Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack. * GRM02/03: 1/3 of Chip Thickness min.
4-2. Too little solder paste results in a lack of adhesive in section
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm* min.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Inverting the PCB
Caution
Part Number
Temperature Differential
ΔT≦190℃
ΔT≦130℃
Pb-Sn Solder
Lead Free Solder
0.2mm* min.
!
Soldering
Soldering
60-120 seconds
60-120 seconds
30-60 seconds
20 seconds
Soldering Temperature(℃)
280
270
260
250
240
230
220
Time
Time
Temperature(℃)
Peak Temperature
200℃
170℃
150℃
130℃
Gradual
Cooling
Temperature(℃)
Peak Temperature
170℃
150℃
130℃
Gradual
Cooling
0
30
60
90
120
Soldering Time(sec.)
Preheating
Preheating
JEMCGC-2701U 18

4-2.Flow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Flow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in table 2. It is required to
keep temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between electrodes and end termination.
[Allowable Soldering Temperature and Time]
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and solvent within the range
shown in the table 2.
4. Do not apply flow soldering to chips not listed in Table 2.
Table 2 Temperature Differential
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions Pb-Sn Solder Lead Free Solder
90～110℃100～120℃
240～250℃250～260℃
Air N2
Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition. in section
Preheating Peak Temperature
Soldering Peak Temperature
Atmosphere
Caution
Part Number
ΔT≦150℃
GR□18/21/31
Up to Chip Thickness
Adhesive
!
Temperature(℃)
Soldering Peak
Preheating Peak
Soldering
Gradual
Cooling
Preheating
△Ｔ
30-90 seconds
5 seconds max.
Time
280
270
260
240
230
220
250
Soldering Temperature(℃)
0
30
60
90
120
Soldering Time(sec.)
JEMCGC-2701U 19

4-3.Correction with a Soldering Iron
1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of
the components will decrease because the extreme temperature change can cause deformations inside the
components. In order to prevent mechanical damage to the components, preheating is required for both
the components and the PCB board. Preheating conditions, (The "Temperature of the Soldering Iron tip",
"Preheating Temperature", "Temperature Differential" between the iron tip and the components and the
PCB), should be within the conditions of table 3. It is required to keep the temperature differential
between the soldering Iron and the component surfaces (ΔT) as small as possible.
2. After soldering, do not allow the component/PCB to rapidly cool down.
3. The operating time for the re-working should be as short as possible. When re-working time is
too long, it may cause solder leaching, and that will cause a reduction in the adhesive
strength of the terminations.
Table 3
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder amount when re-working with a Soldering lron
4-1. In case of sizes smaller than 0603, (GR□03/15/18),
the top of the solder fillet should be lower than 2/3's
of the thickness of the component or 0.5mm whichever
is smaller. In case of 0805 and larger sizes, (GR□21/
31/32/43/55), the top of the solder fillet should be lower in section
than 2/3's of the thickness of the component. If the
solder amount is excessive, the risk of cracking is higher
during board bending or under any other stressful condition.
4-2. A Soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep
the soldering iron from touching the components during the re-work.
4-3. Solder wire with ø0.5mm or smaller is required for soldering.
4-4.Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,
chips may crack and solder joints may break.
Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping.
Caution
350℃max.
150℃min.
ΔT≦190℃
Air
Part Number
Temperature
of Soldering
Iron tip
ΔT≦130℃
Air
Preheating
Temperature
GR□03/15/18/21/31
Temperature
Differential
(ΔT)
Atmosphere
GR□32/43/55
280℃max.
150℃min.
Solder Amount
!
JEMCGC-2701U 20