Murata ZRB15XR61A475KE01 Series User manual

ZRB15XR61A475KE01_ (0402, X5R:EIA, 4.7uF, DC10V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Jun.8,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
g
0.1 to 0.4
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 10 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 85 °C
(25 °C)
Only Reflow Soldering
0.3 min.
(1)-1 L
1.0±0.15
(1)-2 W
0.5±0.15
This product specification is applied to Chip Monolithic Ceramic Capacitor on Interposer used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
(2) T
e
Chip Monolithic Ceramic Capacitor on Interposer for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±10 %
(6)
Capacitance
Tolerance
4.7 uF
0.65±0.15
-55 to 85 °C
D
f180mm Reel
PAPER W8P2
8000 pcs./Reel
J
f330mm Reel
PAPER W8P2
30000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging Code

Code
ZRB 15 XR6 1A 475 K E01 D
ZRB15XR61A475KE01-01 1

No Item Test Method
1 Operating R6 : -55°C to 85°C Standard Temperature : 25°C
Temperature Range R7 : -55°C to 125°C
C8 : -55°C to 105°C
D7 : -55°C to 125°C
2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage range.
3 Appearance No defects or abnormalities. Visual inspection.
4 Dimension Within the specified dimensions. Using calipers.
5 Dielectric Strength No defects or abnormalities. No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
6 Insulation
∙F The insulation resistance should be measured with a DC voltage not
Resistance exceeding the rated voltage at Standard Temperature and 75%RH max.
and within 1 minutes of charging, provided the charge/discharge current
is less than 50mA.
7 Capacitance Within the specified tolerance. The capacitance / D.F. should be measured at Standard Temperature
at the frequency and voltage shown in the table.
8 Dissipation Factor R6,R7,C8,D7 : 0.1 max.
(D.F.)
【7.Capacitance】
Perform a heat treatment at 150+0/-10℃for one hour and then set for
24±2 hour at room temperature. Perform the initial measurement.
To apply the test voltge through the Interposer board termination.
9Capacitance No bias R6 : Within ±15% (-55°C to +85°C) The capacitance change should be measured after 5min. at each
Temperature R7 : Withn ±15% (-55°C to +125°C) specified temp. stage.
Characteristics C8 : Within ±22% (-55°C to +105°C) In case of applying voltage, the capacitance change should be
D7 : Within +22%,-33% (-55°C to +125°C) measured after 1 more min. with applying voltage in equilibration
of each temp. stage.
· Measurement Voltage
ZRB15X R6 1A 475 only : 0.10±0.03Vrms
Test Conditions
To apply the test voltge through the Interposer board termination.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for one hour and then set
at room temperature for 24±2 hours.
Perform the initial measurement.
10 Adhesive Strength of No removal of the terminations or other defect should occur. Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
Termination using an eutectic solder.
Then apply 5N force in parallel with the test jig for 10+/-1sec.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering
is uniform and free of defects such as heat shock.
■SPECIFICATIONS AND TEST METHODS
Specification
Capacitance
Frequency
Voltage
C≦
(10V min.)
1±0.1kHz
1.0±0.2Vrms
C≦
(6.3V max.)
1±0.1kHz
0.5±0.1Vrms
C＞
120±24Hz
0.5±0.1Vrms
Step
Temperature(C)
Applying
voltage(V)
1
25+/-2(for R6,R7,C8,D7)
No bias
2
-55+/-3(for R6,R7,C8,D7)
3
25+/-2(for R6,R7,C8,D7)
4
85+/-3(for R6)
125±3(forR7,D7)
105±3(for C8)
JEMCGS-04493 2

No Item Test Method
11 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
Resistance using an eutectic solder.
Capacitance Within the specified tolerance. The capacitor should be subjected to a simple harmonic motion having
a total amplitude of 1.5mm, the frequency being varied uniformly between
D.F. R6,R7,C8,D7 : 0.1 max.
the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz, should be traversed
in approximately 1 minute. This motion should be applied for a period of
2 hours in each 3 mutually perpendicular directions(total of 6 hours).
12 Deflection Appearance No defects or abnormalities.
Solder the capacitor on the test jig (glass epoxy board) shown in Fig.1
using an eutectic solder.
Capacitance Within ±10%
Then apply a force in the direction shown in Fig 2 for 5±1 sec.
Change The soldering should be done by the reflow method and should be conducted
with care so that the soldering is uniform and free of defects such as heat
shock.
13 Solderability 75% of the terminations is to be soldered evenly Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin
of Termination and continuously. (JIS-K-5902) (25% rosin in weight proportion) .
Preheat at 80 to 120℃for 10 to 30 seconds.
After preheating, immerse in an eutectic solder solution for 2±0.5 seconds
at 230±5℃or Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5℃.
14 Resistance to Appearance No defects or abnormalities. Test Conditions : Reflow method
Soldering Heat Solder : Sn-3.0Ag-0.5 Cu solder
Capacitance R6,R7,C8,D7 : Within ±7.5%
Change Solder Temperature : 255°C ±10°C[Peak Temperature]
Heat Time of over 200°C : 120s min
D.F. R6,R7,C8,D7 : 0.1 max. Exposure to room temperature : 24±2h
Pre-heat : Following conditions
I.R.
∙F
Dielectric No defects. · Initial measurement
Strength
Perform a heat treatment at 150+0/-10°C for one hour and then set at room
temperature for 24±2 hours.
Perform the initial measurement.
15
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
Sudden using an eutectic solder.
Change Capacitance R6,R7,C8,D7 : Within ±7.5% Perform the five cycles according to the four heat treatments
Change shown in the following table.
Set for 24±2 hours at room temperature, then measure.
D.F. R6,R7,C8,D7 : 0.1 max.
I.R.
∙F ・Initial measurement
Perform a heat treatment at 150+0/-10°C for one hour and then let sit
for 24±2 hours at room temperature. Perform the initial measurement.
Dielectric No defects. ・GRM188B30J106M Measurement after test:
Strength Perform a heat treatment and then let sit for 24±2 hours at room
temperature, then measure.
16
High Appearance No defects or abnormalities. Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
Temperature using an eutectic solder.
High Capacitance R6,R7,C8,D7 : Within ±12.5% Apply the rated voltage at 40±2℃and 90 to 95% humidity for 500±12 hours.
Humidity Change The charge/discharge current is less than 50mA.
(Steady)
・Initial measurement
D.F. R6,R7,C8,D7 : 0.2max.
Perform a heat treatment at 150+0/-10°C for one hour and then let sit
for 24±2 hours at room temperature. Perform the initial measurement.
・Measurement after test
I.R.
∙F Perform a heat treatment and then let sit for 24±2 hours at room
temperature, then measure.
17 Durability Appearance No defects or abnormalities. Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
using an eutectic solder.
Capacitance R6,R7,C8,D7 : Within ±12.5% Apply 100% of the rated voltage for 1000±12 hours at the maximum
Change operating temperature ±3℃. The charge/ discharge current is less than 50mA.
・Initial measurement
Perform a heat treatment at 150+0/-10°C for one hour and then let sit
D.F. R6,R7,C8,D7 : 0.2max. for 24±2 hours at room temperature. Perform the initial measurement.
・Measurement after test
Perform a heat treatment and then let sit for 24±2 hours at room
I.R. 
temperature, then measure.
■SPECIFICATIONS AND TEST METHODS
Specification
Step
Temp.(C)
Time (min)
1
Min. Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
Table1
Temperature
Time
150C to 160C
2 min.
JEMCGS-04493 3

Recommended derating conditions on voltage and temperature
These Part Numbers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test with 100% × rated voltage
as testing voltage at the maximum operating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
Useful Lifetime for mobile application specific MLCC
These MLCC products are designed for use in devices with a typical lifetime of less than 5 years.
(Examples: Cellular phone, Smartphone, Tablet PC, Digital camera, Watch, Electronics dictionary,
Small-scale server, IPC-9592B class1 equipment, etc.)
These MLCC products are designed so that the useful lifetime can be extended longer than 5 years
under the following conditions:
「80% of the rated voltage or less, Maximum operating temperature -20 degree C or less」
Extended useful lifetime, under specific operating conditions, can be estimated from
the chart on the left.
※The useful lifetime is the time when cumulative failure rate becomes 1%.
※Please note that the useful lifetime data is for reference only and not guaranteed.
■SPECIFICATIONS AND TEST METHODS
0.1
1
10
100
40 50 60 70 80 90 100 110 120 130
Usuful Lifetime [Year]
Product Temperture [℃]
at rated voltage x 80%
85℃Type 105℃Type
JEMCGS-04493 4

Adhesive Strength of Termination,Vibration Resistance,Resistance to Soldering Heat (Reflow method)
Test method : Deflection Temperature Sudden Change,High Temperature High Humidity(Steady) ,Durability
・Test substrate ・Test substrate
Material : Copper-clad laminated sheets for PCBs Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin) (Glass fabric base, epoxy resin)
Thickness : 1.6mm (ZRB15: t:0.8mm) Thickness : 1.6mm (ZRB15: t:0.8mm)
Copper foil thickness : 0.035mm Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
（Coat with heat resistant resin for solder）
Fig.1 (in mm) Fig.3 (in mm)
Fig.2 (in mm)
■SPECIFICATIONS AND TEST METHODS
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Glass epoxy board
Solder resist
Baked electrode or
copper foil
b
45
45
R230
20
50
Flexure:≦1
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
Type
Dimension (mm)
a
b
c
ZRB15
0.4
1.5
0.5
ZRB18
1.0
3.0
1.2
Type
Dimension (mm)
a
b
c
ZRB15
0.4
1.5
0.5
ZRB18
1.0
3.0
1.2
JEMCGS-04493 5

1.Tape Carrier Packaging(Packaging Code:D/L/J/K)
1.1 Minimum Quantity(pcs./reel)
1.2 Dimensions of Tape
(1)ZRB15 (in:mm)
7
*3 Nominal value
1.0±0.15
0.5±0.15
1.0±0.2
0.5±0.2
1.0+0.22/-0.2
0.7±0.15
1.0±0.22
0.65±0.2
0.65±0.15
0.8
ZRB15
X
t *3
L
W
T
1.3
0.95
6
10000
Product Dimensions
A *3
B *3
X/7
8000
30000
Type
ZRB18
A
3000
Plastic Tape
4000
Code:D
Code:L
Code:J
Package
ZRB Type
Type


Paper Tape
Plastic Tape
Paper Tape
ZRB15
Code:K
8000
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-02345F 6

(2)ZRB18 (in:mm)
L W T
6 1.6±0.22 0.6±0.2
A 1.6±0.2 1.0±0.2
*1 Nominal value
Package
ZRB Type
Type
Product Dimensions
A *1
B *1
t
1.1
2.0
1.7 max.
ZRB18
0.8±0.2
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1
JEMCGP-02345F 7

Package
ZRB Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
W
w1
ZRB15/18
16.5 max.
10±1.5
180+0/-3.0
330±2.0
 min.

2.0±0.5
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Chip
JEMCGP-02345F 8

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
ZRBType
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-02345F 9

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip MLCC on Interposer (ZR□series) may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt ,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-02188C 10