Murata SCC1000 Series User manual

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Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
ASSEMBLY INSTRUCTIONS FOR SCC1000 SERIES
Technical Note 82
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Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
Table of Contents
ASSEMBLY INSTRUCTIONS FOR SCC1000 SERIES......................................................................... 1
1Objective......................................................................................................................................... 3
2Murata's 32-lead Dual In-line Package (DIL-32)............................................................................ 3
3DIL-32 Package Outline and Dimensions..................................................................................... 4
4Tape and reel specifications......................................................................................................... 5
5Printed Circuit Board (PCB) Level Guidelines............................................................................. 7
5.1 PCB design recommendations.................................................................................................. 7
5.2 Solder paste.............................................................................................................................. 7
5.3 Stencil....................................................................................................................................... 8
5.4 Paste printing............................................................................................................................ 8
5.5 Component picking and placement........................................................................................... 8
5.6 Reflow soldering ....................................................................................................................... 9
5.7 Moisture sensitivity level (MSL) classification.......................................................................... 10
5.8 Inspection ............................................................................................................................... 10
5.9 Precautions............................................................................................................................. 12
5.9.1 Mechanical shocks ........................................................................................................... 12
5.9.2 Vibration........................................................................................................................... 12
5.9.3 Chemicals......................................................................................................................... 12
5.9.4 Coatings........................................................................................................................... 12
5.9.5 Vacuum level.................................................................................................................... 13
5.9.6 Air blowing........................................................................................................................ 13
5.9.7 ESD.................................................................................................................................. 13
5.9.8 Moisture............................................................................................................................ 13
6Hand Soldering Guidelines ......................................................................................................... 13
6.1 METHOD A: Soldering of components with soldering iron....................................................... 13
6.2 METHOD B: Soldering by applying solder paste and then using reflow heating or soldering iron
14
7Rework Guidelines....................................................................................................................... 14
7.1 Instructions for desoldering and removing of component......................................................... 15
8Environmental Aspects ............................................................................................................... 17
9References ................................................................................................................................... 17
2 SCC1xx0_1640-21648-0004-E-0519

3 (17)
Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
1 Objective
This document provides general guidelines for Printed Circuit Board (PCB) design and assembly of
Murata's SCC1000 series components. It should be emphasized that this document serves only as
a design guideline to help develop the optimal assembly conditions. It is essential that users also
use their own manufacturing practices and experience to be able to fulfill the needs of varying end-
use applications.
2 Murata's 32-lead Dual In-line Package (DIL-32)
The SCC1000 series products are SMD DIL-32 components, pick-and-place mountable, and reflow
solderable. These components are completely lead-free and designed to meet the demanding lead
free soldering processes. The package consists of a pre-molded plastic housing, with a copper
based lead frame having gull-wing type of lead pins on the side of the package to provide electrical
contact to the PCB. A metal lid is attached to the top of the package. The DIL-32 package is
presented in Figure 1.
Figure 1. Three dimensional view of the DIL-32 package.
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Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
3 DIL-32 Package Outline and Dimensions
The outline and dimensions for the DIL-32 package are presented in Figure 2.
Figure 2. Outline and dimensions for DIL-32 package. Dimensions are in millimeters [mm].
All tolerances are according to ISO 2768-f unless otherwise specified.
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Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
4 Tape and reel specifications
Packing tape dimensions are presented in Figure 3. The unreeling direction and component
polarity on tape are presented in Figure 4.
Figure 3. Packing tape dimensions for the DIL-32 Package. Dimensions are in millimeters [mm].
Figure 4. Package orientation on the tape and unreeling direction on tape.
Direction of unreeling
PIN 1 IDENTIFIER
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