Myray Hyperion X5 3D User manual

Sede legale ed amministrativa / Head Quarter
CEFLA s.c. Via Selice Prov.le 23/a - 40026 Imola (BO) - Italy
tel.+39 0542 653111 / fax +39 0542 653344
hyperion X5 3D CEPH/CEPH Ready
After Sales Service
Plant Via Bicocca 14/C 40026 Imola (BO) - Italy
tel.+39 0542 653742 / service.radiology@cefla.it
cod. 97071251 - rev. 07 / 27.05.22
Technical manual


97071251
rev.07
27.05.2022
EN


1
hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN CONTENTS
Contents
1. GENERAL WARNINGS...............................................................................................................................................................3
1.1 Foreword ..............................................................................................................................................................................3
1.2 Safety instructions................................................................................................................................................................3
2. PACKAGING AND HANDLING...................................................................................................................................................7
2.1 Handling and storage ...........................................................................................................................................................7
2.2 Damage during shipment .....................................................................................................................................................7
3. PREINSTALLATION....................................................................................................................................................................9
4. DEVICE INSTALLATION AND CALIBRATION ........................................................................................................................ 11
4.1 Assembly instructions......................................................................................................................................................... 11
4.1.1 Removal of packaging............................................................................................................................................ 11
4.1.2 Wall mounting.........................................................................................................................................................12
4.1.3 Freestanding base..................................................................................................................................................13
4.1.4 Wall-mounted column.............................................................................................................................................14
4.1.5 Cinematic group installation ...................................................................................................................................17
4.1.6 CEPH arm installation (if present) ..........................................................................................................................26
4.1.7 Check during the assembling .................................................................................................................................30
4.1.8 Checking after mechanical installation ...................................................................................................................30
4.2 Cover installation................................................................................................................................................................31
4.3 Covers removal ..................................................................................................................................................................37
4.4 Operating system conguration .........................................................................................................................................39
4.4.1 System requirements..............................................................................................................................................39
4.4.2 Preliminary operations............................................................................................................................................39
4.4.3 Operating system settings......................................................................................................................................39
4.4.3.1 Power management settings...................................................................................................................40
4.4.3.2 Operating system optimization settings...................................................................................................42
4.4.3.3 Disabling “Windows Auto-Update Service”..............................................................................................44
4.4.3.4 Disabling Windows update sharing over the network (low data trac) ...................................................45
4.4.3.5 Firewall Settings, privacy and security ....................................................................................................45
4.4.3.6 “Windows Defender” settings ..................................................................................................................46
4.4.3.7 Device installation settings ......................................................................................................................48
4.4.4 PC-Device connection ...........................................................................................................................................51
4.4.4.1 Case 1 - Device-PC direct connection (Setting a static IP address on the network card).......................51
4.4.4.2 Case 2 - Device-PC connection over the network (Setting a dynamic IP address on the network card) 52
4.4.5 Conguration of “Intel®” network card for sensors.................................................................................................54
4.5 Software installation ...........................................................................................................................................................57
4.5.1 “Acquisition Server Plus” software installation........................................................................................................57
4.5.2 CBCT panel installation ..........................................................................................................................................59
4.5.3 “Acquisition Server Plus” conguration...................................................................................................................59
4.5.3.1 Device search and connection ................................................................................................................61
4.5.3.2 Sensor search and connection................................................................................................................65
4.5.4 Pleora driver installation .........................................................................................................................................69
4.5.5 Driver installation checks........................................................................................................................................75
4.5.6 iRYS software installation and conguration ..........................................................................................................77
4.6 2D Calibration ....................................................................................................................................................................87
4.6.1 Tube head warm-up................................................................................................................................................87
4.6.2 Preliminary actions .................................................................................................................................................90
4.6.3 Machine conguration ............................................................................................................................................92
4.6.4 PAN verify X-Ray alignement .................................................................................................................................95
4.6.5 PAN Verify Sensor Calibration..............................................................................................................................105
4.6.6 PAN Verify Mechanical Centering.........................................................................................................................107
4.6.7 Laser Calibration .................................................................................................................................................. 111
4.6.8 CEPH Verify X-ray Alignment ............................................................................................................................... 115
4.6.8.1 Manual regulation of the secondary collimator......................................................................................124
4.6.9 CEPH Verify Sensor Compliance ........................................................................................................................129
4.6.10 CEPH Verify Sensor Calibration .........................................................................................................................132
4.6.11 CEPH Verify Mechanical Centering ....................................................................................................................134
4.6.12 Headrest Calibration ..........................................................................................................................................139
4.6.13 Nasion calibration...............................................................................................................................................143
4.6.14 Backup Calibration Data to File..........................................................................................................................145
4.6.15 Aligning the ear guide rings ................................................................................................................................147
4.7 3D Calibration ..................................................................................................................................................................151
4.7.1 Beam Limiter Test.................................................................................................................................................151
4.7.2 Blank Acquisition and Daily Check .......................................................................................................................157
4.7.3 Cylindrical test phantom acquisition (“Mattarellum”).............................................................................................161
4.7.4 3D calibration backup...........................................................................................................................................169
4.7.5 QA Phantom Scan (optional)................................................................................................................................170

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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN
CONTENTS
5. CONTROL PANELS AND DISPLAY SYMBOLS ....................................................................................................................181
5.1 Console onboard the machine .........................................................................................................................................181
5.2 Pushbutton panel on CEPH arm ......................................................................................................................................182
6. SERVICE MENU......................................................................................................................................................................183
7. CIRCUIT BOARDS..................................................................................................................................................................185
7.1 Unit block diagram ...........................................................................................................................................................185
7.2 LOGIC board (97661808) ................................................................................................................................................186
7.2.1 Connector list........................................................................................................................................................188
7.2.2 Diagnostic leds .....................................................................................................................................................188
7.3 POWER board (97662307) ..............................................................................................................................................190
7.3.1 Connector list........................................................................................................................................................192
7.3.2 Diagnostic leds .....................................................................................................................................................192
7.4 BRUSH DC (97662306) ...................................................................................................................................................194
7.4.1 Connector list........................................................................................................................................................196
7.4.2 Diagnostic leds .....................................................................................................................................................196
7.5 CEPH keyboard (97661913) ............................................................................................................................................197
7.5.1 Connector list........................................................................................................................................................198
7.6 PAN Sensor interface (97661912)....................................................................................................................................199
7.6.1 Connector list........................................................................................................................................................199
7.7 CEPH Sensor interface (97661912).................................................................................................................................200
7.7.1 Connector list........................................................................................................................................................200
7.8 3D Panel interface (97661579) ........................................................................................................................................201
7.8.1 Connector list........................................................................................................................................................202
7.9 Keyboard (97661484) ......................................................................................................................................................203
7.9.1 Connector list........................................................................................................................................................203
8. CONNECTIVITY ......................................................................................................................................................................205
8.1 2D sensors / 3D panel IP address amendment................................................................................................................205
8.2 Firmware upgrade ............................................................................................................................................................205
8.2.1 Device rmware upgrade......................................................................................................................................205
8.2.2 Sensors rmware upgrade ...................................................................................................................................206
8.3 Remote support................................................................................................................................................................209

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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN GENERAL WARNINGS
1. GENERAL WARNINGS
1.1 FOREWORD
The device described in this manual is manufactured by CEFLA s.c. - via Selice Provinciale 23/A - 40026 Imola (BO)
Italia, which is the manufacturer, in compliance with the applicable European Directives detailed in the declaration of
conformity.
These technical instructions are addressed to the personnel in charge of repair and/or maintenance operations of
CEFLA s.c. equipment and contain all the necessary information.
CEFLA s.c. shall be responsible for the safety, reliability and eciency of the equipment provided that:
• installation, any modications, settings or repairs are made by authorised technical personnel using CEFLA s.c.
original spare parts
• In case of installation in medical locations: the electrical installation of the relevant location complies with IEC 60364-
7-710:2002 Standards (Standards on electrical installations of medical locations) or with the equivalent Standards in
force in the country of installation
• the equipment is used as outlined in User Manual
• in case of installation of an X-ray unit: The room where the X-ray unit is installed complies with the ocial Directives
on protection from radiation in the country of use
1.2 SAFETY INSTRUCTIONS
All the safety instructions that help prevent any hazardous situations and operate the equipment in a trouble-free
manner are given in the user’s manual as explained below:
SYMBOL DESCRIPTION
ATTENTION: General mandatory action sign
ATTENTION: Wear protective gloves
ATTENTION: Wear foot protection
ATTENTION: Use protective eyewear
ATTENTION: Use protective clothings
ATTENTION: Connect an earth terminal to the ground

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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN
GENERAL WARNINGS
SYMBOL DESCRIPTION
ATTENTION: Refer to instruction manual-booklet
ATTENTION: Disconnect mains plug from electrical outlet
WARNING: See the technical manual
WARNING: Failure to observe instructions may result in equipment damage or injury to the user
WARNING: High voltage
WARNING: Crushing of hands
WARNING: Radioactive material or ionizing radiation
WARNING: Keep clear of moving parts
WARNING: Laser beam
WARNING: Hot surface
WARNING: Biological hazard
WARNING: Sharp objects
WARNING: Corrosive substances

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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN GENERAL WARNINGS
SYMBOL DESCRIPTION
WARNING: Combustible and ammable materials
DANGER: Tipping over
DANGER: Heavy object. Two persons are required
WARNING!
ALWAYS DISCONNECT power supply before performing any maintenance or cleaning operation.
The packed device must be handled using, where possible, suitable mechanical means (forklift, pallet
truck, etc.) and following the indications on the package.
In case of manual handling, the device must be lifted by several persons using the suitable available
means and, if possible, it must be moved with a truck or similar means.
Wear the proper protections

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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN
GENERAL WARNINGS

7
1
2
3
4
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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN PACKAGING AND HANDLING
2. PACKAGING AND HANDLING
2.1 HANDLING AND STORAGE
Indications regarding storage, handling and unpacking are given on the outside of the cardboard packaging.
These indications must be strictly observed.
1) The package must be kept upright in the direction indicated by the arrows at all times
during handling and storage
2) Avoid banging the package
3) Keep the package free from damp
4) Do not use hooks to handle the package
5) A nameplate indicates the required ambient conditions for storage:
a) temperature from -10° to +70° C
b) relative humidity from 10 to 90%
c) atmospheric pressure from 500 to 1060 hPa
It is recommended to transport and store the device at a temperature not lower than that indicated on the
packing. A prolonged exposure to a low temperature can damage the device.
The packed device must be handled using, where possible, suitable mechanical means (forklift,
pallet truck, etc.) and following the indications on the package.
In case of manual handling, it must be lifted by two or more persons using the suitable available
means.
2.2 DAMAGE DURING SHIPMENT
When the device is received, check the packing container for any damage suered.
If the packages are found to be damaged on delivery, accept them with reserve by signing the delivery note and
indicating that the “CONTENTS ARE ACCEPTED BUT THEY NEED TO BE CHECKED”.
If the contents are actually damaged, notify the shipping agent and request insurance compensation for damage within
ve work days. The claim is to be made by the person who commissioned the shipping agent. I.e.:
• if the goods are delivered “carriage forward”, the receiver shall notify the shipping agent
• if the goods are shipped “carriage free” or “free delivered”, the consigner shall notify the shipping agent and le a
claim for damages. In this case, CEFLA s.c. shall be informed as soon as possible.
The damaged parts returned to CEFLA s.c. for replacement shall be placed inside the same damaged package.
Return to CEFLA s.c. shall be “carriage free” (at the expense of the consigner), while shipment back to the customershall
be at the expense of CEFLA s.c. (carriage free).

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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN
PACKAGING AND HANDLING

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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN PREINSTALLATION
3. PREINSTALLATION
Follow instructions described in the INSTALLATION PLAN, available on Extranet.

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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN
PREINSTALLATION

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1
2
hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN DEVICE INSTALLATION AND CALIBRATION » Assembly instructions
4. DEVICE INSTALLATION AND CALIBRATION
4.1 ASSEMBLY INSTRUCTIONS
Installation of the device unit must be done by qualied technicians in accordance with the mechanical and electrical
assembly instructions dened as follows. Check that the voltage indicated on the system info plate corresponds to that
of the electrical system.
REQUIRED INSTRUMENTS
4.1.1 REMOVAL OF PACKAGING

12
3
Standard Optional
1
1
MIN
10mm
hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN
DEVICE INSTALLATION AND CALIBRATION » Assembly instructions
4.1.2 WALL MOUNTING
For further information, see the supplied INSTALLATION DIAGRAM.

13
3
1
4
2
±h
CEPHCEPH
NO CEPHNO CEPH
CEPHCEPH
NO CEPHNO CEPH
hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN DEVICE INSTALLATION AND CALIBRATION » Assembly instructions
4.1.3 FREESTANDING BASE
For further information, see the supplied
INSTALLATION DIAGRAM.

14
1273mm
1 2
3
4
220kg220kg
M8M8
x6x6
MAX
30mm
D
B
A
C
5
20mm
M8M8
x6x6
M8M8
x4x4
hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN
DEVICE INSTALLATION AND CALIBRATION » Assembly instructions
4.1.4 WALL-MOUNTED COLUMN
Not included
Not
included
Included

15
6
x2x2
CC
x2x2
BB
x2x2
GG
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hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN DEVICE INSTALLATION AND CALIBRATION » Assembly instructions
ONLY IF CEPH ARM
IS PRESENT
Put the screws in place
before xing the column to
the wall (do not tighten)
See “Screw kit”, section
“Cinematic group installation”
Tighten

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9
10
CHECK!
hyperion X5 3D CEPH/CEPH Ready - TECHNICAL MANUAL
EN
DEVICE INSTALLATION AND CALIBRATION » Assembly instructions
The stabilisation bushes must be
screwed until they stop at the bottom
The bushes must not protrude beyond the inner column
If the bushes are not ush with the column,
check the correct tightening of the nuts and the bushes
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1
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