
Copyright © Neoway Technology Co., Ltd
Contents
1 About N11 .................................................................................................. 2
1.1 Overview ...................................................................................................................................... 2
1.2 Block Diagram.............................................................................................................................. 2
1.3 Specifications ............................................................................................................................... 3
2 Pin Description .......................................................................................... 5
2.1 Pin Allocation................................................................................................................................ 5
2.2 Pin Definition ................................................................................................................................ 6
3 Application Interfaces ................................................................................ 8
3.1 Power Supply ............................................................................................................................... 8
3.1.1 Design Requirements.......................................................................................................... 8
3.1.2 Power-On/Off Control and Procedure ............................................................................... 12
3.2 UART.......................................................................................................................................... 15
3.3 DTR and RING........................................................................................................................... 18
3.3.2 DTR Pin ............................................................................................................................. 18
3.3.3 RING Signal....................................................................................................................... 18
3.4 SIM Card .................................................................................................................................... 19
3.5 LIGHT......................................................................................................................................... 21
3.6 RF............................................................................................................................................... 22
3.6.1 RF Design and PCB Layout .............................................................................................. 22
3.6.2 Recommended RF Connection ......................................................................................... 24
4 Electric Features and Reliability .............................................................. 25
4.1 Electric Feature .......................................................................................................................... 25
4.2 Temperature ............................................................................................................................... 25
4.3 Current ....................................................................................................................................... 26
4.4 ESD Protection........................................................................................................................... 27
5 RF Features............................................................................................. 28
5.1 Operating Band .......................................................................................................................... 28
5.2 Transmitting Power and Receiving Sensitivity ........................................................................... 28
5.2.1 Transmitting Power............................................................................................................ 28
5.2.2 Receiving Sensitivity.......................................................................................................... 30
6 PCB Foot Print......................................................................................... 31
7 Mounting N11 onto the Application Board................................................ 32
8 Package................................................................................................... 33
9 Abbreviations ........................................................................................... 34