Neoway N75 Installation manual

Hardware User Guide
Issue 1.1 Date 2020-01-16

N75 Hardware User Guide
Copyright
Copyright © Neoway Technology Co., Ltd
i
Copyright © Neoway Technology Co., Ltd 2019. All rights reserved.
No part of thisdocument may bereproduced or transmitted in any form orby any means without prior written
consent of Neoway Technology Co., Ltd.
is the trademark of Neoway Technology Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
This document provides a guide for users to use N75.
This document is intended for system engineers (SEs), development engineers, and test engineers.
THIS GUIDE PROVIDES INSTRUCTIONS FOR CUSTOMERS TO DESIGN THEIR APPLICATIONS.
PLEASE FOLLOW THE RULES AND PARAMETERS IN THIS GUIDE TO DESIGN AND COMMISSION.
NEOWAY WILL NOT TAKE ANY RESPONSIBILITY OF BODILY HURT OR ASSET LOSS CAUSED BY
IMPROPER OPERATIONS.
THE INFORMATION IN THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE DUE TO
PRODUCT VERSION UPDATE OR OTHER REASONS.
EVERY EFFORT HAS BEEN MADE IN PREPARATION OF THIS DOCUMENT TO ENSURE ACCURACY
OF THE CONTENTS, BUT ALL STATEMENTS, INFORMATION, AND RECOMMENDATIONS IN THIS
DOCUMENT DO NOT CONSTITUTE A WARRANTY OF ANY KIND, EXPRESS OR IMPLIED.
Neoway provides customers complete technical support. If you have any question, please contact your
account manager or email to the following email addresses:
[email protected]
[email protected]
Website: http://www.neoway.com

N75 Hardware User Guide
Contents
Copyright © Neoway Technology Co., Ltd
ii
Contents
1 About N75..................................................................................................1
1.1 Product Overview......................................................................................................................... 1
1.2 Block Diagram.............................................................................................................................. 2
1.3 Basic Features ............................................................................................................................. 3
2 Module Pins...............................................................................................5
2.1 Pad Layout ................................................................................................................................... 5
2.2 Pin Description ............................................................................................................................. 6
3 Application Interfaces ..............................................................................12
3.1 Power Interfaces ........................................................................................................................ 12
3.1.1 VBAT.................................................................................................................................. 12
3.1.2 DVDD_1P8 ........................................................................................................................ 17
3.2 Control Interfaces....................................................................................................................... 17
3.2.1 PWRKEY_N ...................................................................................................................... 17
3.2.2 RESET_N .......................................................................................................................... 20
3.3 Peripheral Interfaces .................................................................................................................. 21
3.3.2 USB ................................................................................................................................... 21
3.3.3 USIM.................................................................................................................................. 23
3.3.4 UART................................................................................................................................. 25
3.3.5 SDC ................................................................................................................................... 28
3.3.6 I2S/PCM ............................................................................................................................ 31
3.3.7 SPI..................................................................................................................................... 36
3.3.8 I2C ..................................................................................................................................... 38
3.4 Network and Connection............................................................................................................ 42
3.4.1 Ethernet ............................................................................................................................. 42
3.4.2 WLAN ................................................................................................................................ 44
3.4.3 Bluetooth ........................................................................................................................... 47
3.5 RF Interface................................................................................................................................ 49
3.5.1 ANT_MAIN/ANT_DIV antenna interface ........................................................................... 49
3.5.2 ANT_GNSS Interface ........................................................................................................ 51
3.5.3 Antenna Assembling.......................................................................................................... 54
3.6 GPIO .......................................................................................................................................... 55
3.7 MUX Interfaces .......................................................................................................................... 56
3.8 Other Interfaces ......................................................................................................................... 59
3.8.1 GNSS_LNA_EN ................................................................................................................ 59
3.8.2 ADC ................................................................................................................................... 59
3.8.3 RING.................................................................................................................................. 59
3.8.4 DTR ................................................................................................................................... 60
3.8.5 USB_BOOT ....................................................................................................................... 62
4 Electric Feature and Reliability ................................................................63
4.1 Electric Features ........................................................................................................................ 63

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4.2 Temperature Features................................................................................................................ 65
4.3 ESD Protection........................................................................................................................... 65
5 RF Features.............................................................................................66
5.1 Operating Bands ........................................................................................................................ 66
5.2 TX Power and RX Sensitivity ..................................................................................................... 67
5.3 GNSS Features.......................................................................................................................... 68
6 Mechanical Features ...............................................................................70
6.1 Dimensions................................................................................................................................. 70
6.2 Label........................................................................................................................................... 71
6.3 Packing....................................................................................................................................... 71
6.3.1 Reel&Tape ......................................................................................................................... 71
6.3.2 Moisture............................................................................................................................. 73
7 Mounting N75 onto the Application Board ...............................................74
7.1 Bottom Dimensions .................................................................................................................... 74
7.2 Application Foot Print ................................................................................................................. 75
7.3 Stencil......................................................................................................................................... 75
7.4 Solder Paste............................................................................................................................... 75
7.5 SMT Furnace Temperature Curve.............................................................................................. 76
8 Safety Recommendations .......................................................................77
Conformity and Compliance ....................................................................78
A.1 Approvals ................................................................................................................................... 78
A.2 American Notice......................................................................................................................... 78
A.2.1 Modify................................................................................................................................ 78
A.2.2 FCC Class A Digital Device Notice ................................................................................... 78
A.2.3 FCC Class B Digital Device Notice ................................................................................... 79
Abbreviation ............................................................................................80

N75 Hardware User Guide
Table of Figures
Copyright © Neoway Technology Co., Ltd
iv
Table of Figures
Figure 1-1 Block Diagram .................................................................................................................. 2
Figure 2-1 N75 pin definition (Top View)............................................................................................ 5
Figure 3-1 Current peaks and voltage drops (GSM/GPRS) ............................................................ 13
Figure 3-2 Recommended design 1................................................................................................. 13
Figure 3-3 Recommended design 2................................................................................................. 14
Figure 3-4 Recommended design 3................................................................................................. 15
Figure 3-5 Recommended design 4................................................................................................. 15
Figure 3-6 Reference design of startup controlled by button........................................................... 18
Figure 3-7 Reference design of startup controlled by MCU............................................................. 18
Figure 3-8 Reference design of automatic start once powered up.................................................. 18
Figure 3-9 N75 on/off timing............................................................................................................. 19
Figure 3-10 Reset controlled by button............................................................................................ 20
Figure 3-11 Reset circuit with transistor separating ......................................................................... 20
Figure 3-12 Reset timing of N75 ...................................................................................................... 20
Figure 3-13 USB connection ............................................................................................................ 22
Figure 3-14 Reference design of USB OTG function....................................................................... 22
Figure 3-15 Reference design of USIM card interface..................................................................... 24
Figure 3-16 Reference design of UART connection (with flow control) ........................................... 25
Figure 3-17 Reference design of UART connection (without flow control) ...................................... 25
Figure 3-18 Recommended level shifting circuit 1........................................................................... 26
Figure 3-19 Recommended level shifting circuit 2........................................................................... 27
Figure 3-20 Recommended level shifting circuit 3........................................................................... 27
Figure 3-21 SD connection .............................................................................................................. 29
Figure 3-22 SDC SDR timing ........................................................................................................... 30
Figure 3-23 SDC DDR timing........................................................................................................... 30
Figure 3-24 I2S connection .............................................................................................................. 32
Figure 3-25 I2S timing...................................................................................................................... 32

N75 Hardware User Guide
Table of Figures
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Figure 3-26 PCM connection ........................................................................................................... 33
Figure 3-27 PCM sync signal timing in primary mode ..................................................................... 34
Figure 3-28 PCM data input timing in primary mode ....................................................................... 34
Figure 3-29 PCM data output timing in primary mode ..................................................................... 34
Figure 3-30 PCM sync signal timing in auxiliary mode .................................................................... 35
Figure 3-31 PCM data input timing in auxiliary mode ...................................................................... 35
Figure 3-32 PCM data output timing in auxiliary mode.................................................................... 35
Figure 3-33 SPI connection.............................................................................................................. 37
Figure 3-34 SPI timing ..................................................................................................................... 37
Figure 3-35 I2C connection.............................................................................................................. 39
Figure 3-36 I2C data transmission................................................................................................... 39
Figure 3-37 I2C timing...................................................................................................................... 40
Figure 3-38 SGMII connection ......................................................................................................... 42
Figure 3-39 Connection between MDIO and PHY........................................................................... 43
Figure 3-40 MDIO input timing......................................................................................................... 44
Figure 3-41 MDIO output timing....................................................................................................... 44
Figure 3-42 WLAN connection......................................................................................................... 45
Figure 3-43 SDIO SDR timing.......................................................................................................... 46
Figure 3-44 SDIO DDR timing.......................................................................................................... 46
Figure 3-45 Bluetooth connection .................................................................................................... 48
Figure 3-46 L network ...................................................................................................................... 49
Figure 3-47 Split capacitor network.................................................................................................. 49
Figure 3-48 Pi network ..................................................................................................................... 50
Figure 3-49 Recommended RF PCB design 1 ................................................................................ 51
Figure 3-50 GNSS RF structure....................................................................................................... 51
Figure 3-51 Reference Design of Passive GNSS Antenna.............................................................. 52
Figure 3-52 Reference design of active GNSS antenna.................................................................. 53
Figure 3-53 Reference layout of GNSS antenna traces .................................................................. 54
Figure 3-54 Specifications of MM9329-2700RA1 ............................................................................ 55
Figure 3-55 RF connections............................................................................................................. 55
Figure 3-56 Pulse wave for an incoming call ................................................................................... 59

N75 Hardware User Guide
Table of Figures
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Figure 3-57 RING indicator for SMS ................................................................................................ 60
Figure 3-58 Process of entering sleep mode ................................................................................... 60
Figure 3-59 Incoming call service process....................................................................................... 61
Figure 3-60 Outgoing call service process....................................................................................... 61
Figure 3-61 Process of exiting from sleep mode ............................................................................. 61
Figure 3-62 Reference design of USB_BOOT................................................................................. 62
Figure 6-1 N75 dimensions .............................................................................................................. 70
Figure 6-2 N75 label......................................................................................................................... 71
Figure 7-1 Bottom view .................................................................................................................... 74
Figure 7-2 Recommended Application Foot Print (Top View) .......................................................... 75
Figure 7-3 SMT furnace temperature curve..................................................................................... 76

N75 Hardware User Guide
Table of Tables
Copyright © Neoway Technology Co., Ltd
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Table of Tables
Table 1-1 Variant and frequency bands.............................................................................................. 1
Table 2-1 IO types and level features................................................................................................. 6
Table 2-2 Pin description.................................................................................................................... 7
Table 3-1 DVDD_1P8 electrical features ......................................................................................... 17
Table 3-2 Compliant standards of peripheral interfaces................................................................... 21
Table 3-3 SD card feature parameters............................................................................................. 28
Table 3-4 Timing parameters of SDC interface................................................................................ 31
Table 3-5 Timing parameters of I2S interface .................................................................................. 33
Table 3-6 PCM work modes ............................................................................................................. 33
Table 3-7 Parameters of PCM timing in primary mode .................................................................... 34
Table 3-8 Parameters of PCM timing in auxiliary mode................................................................... 36
Table 3-9 Timing parameters of SPI interface.................................................................................. 38
Table 3-10 I2C feature parameters .................................................................................................. 38
Table 3-11 I2C timing parameters (standard mode)......................................................................... 40
Table 3-12 I2C timing parameters (fast mode)................................................................................. 41
Table 3-13 I2C timing parameters (fast mode plus)......................................................................... 41
Table 3-14 SDIO/WLAN feature parameters.................................................................................... 45
Table 3-15 Timing parameters of SDIO/WLAN interface ................................................................. 47
Table 3-16 MUX pins........................................................................................................................ 56
Table 4-1 Electric features................................................................................................................ 63
Table 4-2 Current consumption of N75 ............................................................................................ 63
Table 4-3 Temperature features ....................................................................................................... 65
Table 4-4 ESD protection features ................................................................................................... 65
Table 5-1 Operating Bands .............................................................................................................. 66
Table 5-2 RF TX power .................................................................................................................... 67

N75 Hardware User Guide
About This Document
Copyright © Neoway Technology Co., Ltd
viii
About This Document
Scope
This document is applicable to the N75 series.
It defines the features, indicators, and test standards of the N75 module and provides reference for the
hardware design of each interface.
Reference designs in this document are only for reference. Customers should design applications
based on actual scenarios and conditions. Please contact Neoway FAE if you have any questions or
doubts.
Audience
This document is intended for system engineers (SEs), development engineers, and test engineers.
Change History
Issue
Date
Change
Changed By
1.0
2015-09
Initial draft
Wang Qiang
1.1
2020-01
⚫Deleted B14 from N75-NA and N75-A
⚫Changed N75-E to N75-EA and change the
GSM/GPRS/EDGE band to 900/1800 MHz
⚫Added N75-LA and N75-NF
⚫Deleted N75-JP
⚫Added the wireless rate of TDD-LTE in section 1.3
⚫Changed the units of t(sync) and t(syncd) from ns to μs
in Table 3-7 and changed the units of t(auxsync),
t(auxsynca), and t(auxsyncd) from ns to μs in Table 3-8
⚫Updated the RF features
Dong Liuting

N75 Hardware User Guide
About This Document
Copyright © Neoway Technology Co., Ltd
ix
Conventions
Symbol
Indication
This warning symbol means danger. You are in a situation that could cause fatal
device damage or even bodily damage.
Means reader be careful. In this situation, you might perform an action that
could result in module or product damages.
Means note or tips for readers to use the module
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Neoway_N75_Product_Specifications
Neoway_N75_AT_Command_Mannual
Neoway_N75_EVK_User_Guide