Nokia NSM-3 Guide

PAMS Technical Documentation
NSM–3/3D Series Transceivers
Issue 4 02/2002 Nokia Corporation.
System Module

NSM–3/3D
System Module PAMS Technical Documentation
Page 2 Issue 4 02/2002
Nokia Corporation
CONTENTS
Transceiver NSM–3/3D 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differences between NSM–3 and NSM–3D 7. . . . . . . . . . . . . .
Introduction NSM–3 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction NSM–3D 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operation Modes 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interconnection Diagram 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Module 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband Module 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Summary 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External and Internal Signals and Connections 12. . . . . . . . .
DC (charger) connector 12. . . . . . . . . . . . . . . . . . . . . . . . . . .
Service connector 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery connector 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM card connector 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTC backup battery 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery charging 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Startup Charging 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery Overvoltage Protection 15. . . . . . . . . . . . . . . . . . . .
Battery Removal During Charging 17. . . . . . . . . . . . . . . . . .
PWM 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery Identification 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery Temperature 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage Regulators 20. . . . . . . . . . . . . . . . . . . . . . . .
Switched Mode Supply VSIM 21. . . . . . . . . . . . . . . . . . . . . .
Power Up and Power Down 21. . . . . . . . . . . . . . . . . . . . . . . . .
Power up with a charger 21. . . . . . . . . . . . . . . . . . . . . . . . . .
Power Up With The Power Switch (PWRONX) 22. . . . . . .
Power Up by RTC 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Up by IBI 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Down 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modes of Operation 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acting Dead 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Active Mode 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sleep Mode 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charging 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio control 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCM serial interface 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Control 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MAD2 WD1 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memories 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MAD memory configuration 35. . . . . . . . . . . . . . . . . . . . . . .

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Memory 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Program and Data Memory 35. . . . . . . . . . . . . . . . . . . . . . .
Work Memory 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MCU Memory Requirements 35. . . . . . . . . . . . . . . . . . . . . .
MCU Memory Map 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Programming 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COBBA GJP 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real Time Clock 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTC backup battery charging 38. . . . . . . . . . . . . . . . . . . . . .
RF Module 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Ratings 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Characteristics 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Frequency Plan 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC characteristics 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Regulators 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution Diagram 41. . . . . . . . . . . . . . . . . . . . . . . . . .
RF Functional Description 42. . . . . . . . . . . . . . . . . . . . . . . . . . .
Frequency synthesizer 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AGC strategy 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AFC function 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC–compensation 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver characteristics 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter characteristics 47. . . . . . . . . . . . . . . . . . . . . . . . . . .
Parts list of RM7L (EDMS Issue 6.0) Layout 11 Code: 0201386 48
Parts list of RM7L (EDMS Issue 10.1) Layout 16 Code: 0201386 56. . . . . . . . .
Parts list of RM7L (EDMS Issue 11.2) Layout 18 Code: 0201386 64. . . . . . . . .
Parts list of RM7L (EDMS Issue 12.5) Layout 19 Code: 0201386 72. . . . . . . . .
Parts list of RM7L (EDMS Issue 13.5) Layout 21 Code: 0201386 80. . . . . . . . . .
Parts list of RM7LD (EDMS Issue 2.1) Layout 03 Code: 0201682 88. . . . . . . . .
Parts list of RM7LD (EDMS Issue 2.4) Layout 03 Code: 0201682 96. . . . . . . .
Parts list of RM7LD (EDMS Issue 3.2) Layout 05 Code: 0201682 104. . . . . . . .
Parts list of RM7LD (EDMS Issue 3.3) Layout 05 Code: 0201682 112. . . . . . . .
Hardware ID chart for NSM–3/3D System module 120. . . . . . . . . . .

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System Module PAMS Technical Documentation
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Schematic Diagrams: RM7L layout 11 HW 1120(at the back of the binder)
Connection between RF and BB modules (Version 1110 Ed. 16) layout 11 A–1
Baseband Block Interconnections (Version 1110 Edition 11) for layout 11 A–2
Circuit Diagram of Power Supply (Version 1110 Edition 17) for layout 11 A–3
Circuit Diagram of CPU Block (Version 1110 Edition 12) for layout 11 A–4
Circuit Diagram of RF Block (Version 1110 Edition 28) for layout 11 A–5
Circuit Diagram of Audio and RFI (Version 1110 Edition 15) for layout 11 A–6
Circuit Diagram of IR Module (Version 1110 Edition 10) for layout 11 A–7
Circuit Diagram of UI (Version 1110 Edition 12) for layout version 11 A–8
Layout Diagram of RM7L – Top (Version 11) A–9. . . . . . . . . . . . . . . .
Layout Diagram of RM7L – Bottom (Version 11) A–9. . . . . . . . . . . . .
Testpoints of RM7L – Bottom (Version 11) A–10. . . . . . . . . . . . . . . . . .
Schematic Diagrams: RM7L layout 16 HW 1210–1621(at the back of the binder)
Connection between RF and BB modules (Version 1410 Ed. 20) layout 16 A–11
Baseband Block Interconnections (Version 1410 Edition 18) for layout 16 A–12
Circuit Diagram of Power Supply (Version 1510 Edition 26) for layout 16 A–13
Circuit Diagram of CPU Block (Version 1410 Edition 16) for layout 16 A–14
Circuit Diagram of RF Block (Version 1410 Edition 37) for layout 16 A–15
Circuit Diagram of Audio and RFI (Version 1410 Edition 20) for layout 16 A–16
Circuit Diagram of IR Module (Version 1410 Edition 13) for layout 16 A–17
Circuit Diagram of UI (Version 1410 Edition 14) for layout version 16 A–18
Layout Diagram of RM7L – Top (Version 16) A–19. . . . . . . . . . . . . . . .
Layout Diagram of RM7L – Bottom (Version 16) A–19. . . . . . . . . . . .
Testpoints of RM7L – Bottom (Version 16) A–20. . . . . . . . . . . . . . . . . .
Schematic Diagrams: RM7L layout 18 HW1800 (at the back of the binder)
Layout Diagram of RM7L – Top (Version 18) A–21. . . . . . . . . . . . . . . .
Layout Diagram of RM7L – Bottom (Version 18) A–21. . . . . . . . . . . .
Testpoints of RM7L – Bottom (Version 18) A–22. . . . . . . . . . . . . . . . . .
Schematic Diagrams: RM7L layout 19 HW1903–2000 (at the back of the binder)
Connection between RF and Baseband (HW1910 Edit 4) layout 19 A–23
Baseband Block Interconnections (HW1910 Edit 4) layout 19 A–24
Circuit Diagram of Power Supply (HW1910 Edit 4) layout 19 A–25.

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PAMS Technical Documentation
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Circuit Diagram of CPU Block (HW 1910 Edit 5) for layout 19 A–26
Circuit Diagram of RF Block (HW 1910 Edit 4) for layout 19 A–27. .
Circuit Diagram of Audio and RFI (HW1910 Edit 4) layout 19 A–28
Circuit Diagram of IR Module (HW 1910 Edit 4) for layout 19 A–29.
Circuit Diagram of UI (HW 1910 Edit 4) for layout version 19 A–30
Layout Diagram of RM7L – Top (Version 19) A–31. . . . . . . . . . . . . . . .
Layout Diagram of RM7L – Bottom (Version 19) A–31. . . . . . . . . . . .
Testpoints of RM7L – Bottom (Version 19) A–32. . . . . . . . . . . . . . . . . .
Schematic Diagrams: RM7L layout 21 HW2100–2103 (at the back of the binder)
Connection between RF and Baseband (HW2103 Ed2) layout 21 A–33. . . . . . .
Baseband Block Interconnections (HW2103 Edit 3) for layout 21 A–34. . . . . . .
Circuit Diagram of Power Supply (HW2103 Edit 5) for layout 21 A–35
Circuit Diagram of CPU Block (HW2103 Edit 3) for layout 21 A–36.
Circuit Diagram of RF Block (HW2103 Edit 5) for layout 21 A–37. . .
Circuit Diagram of Audio and RFI (HW2103 Edit 20) layout 21 A–38
Circuit Diagram of IR Module (HW2103 Edit 17) for layout 21 A–39
Circuit Diagram of UI (HW2103 Edit 3) for layout version 21 A–40.
Layout Diagram of RM7L – Top (Version 21) A–41. . . . . . . . . . . . . . . .
Layout Diagram of RM7L – Bottom (Version 21) A–41. . . . . . . . . . . .
Testpoints of RM7L (Version 21) A–42. . . . . . . . . . . . . . . . . . . . . . . . . .
Schematic Diagrams: RM7LD layout 03 HW3.01–3.02 (at the back of the binder)
Connection between RF and BB modules (Version 1410 Ed. 4) layout 03 A–D1
Baseband Block Interconnections (Version 1410 Edition 4) for layout 03 A–D2
Circuit Diagram of Power Supply (Version 1510 Edition 7) for layout 03 A–D3
Circuit Diagram of CPU Block (Version 1410 Edition 04) for layout 03 A–D4
Circuit Diagram of RF Block (Version 1410 Edition 3) for layout 03 A–D5
Circuit Diagram of Audio and RFI (Version 1410 Edition 4) for layout 03 A–D6
Circuit Diagram of IR Module (Version 1410 Edition 2) for layout 03 A–D7
Circuit Diagram of UI (Version 1410 Edition 4) for layout version 03 A–D8
Layout Diagram of RM7LD – Top (Version 03) A–D9. . . . . . . . . . . . . .
Layout Diagram of RM7LD – Bottom (Version 03) A–D9. . . . . . . . . . .
Testpoints of RM7LD – Bottom (Version 03) A–D10. . . . . . . . . . . . . . . .

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Schematic Diagrams: RM7LD layout 05 HW5.01 (at the back of the binder) . . .
Connection between RF and BB (Version 1410 Edit 7) layout 05 A–D11. . . . . . .
Baseband Block Interconnections (Version 1410 Edit 6) layout 05 A–D12. . . .
Circuit Diagram of Power Supply (Version 1510 Edit 8) layout 05 A–D13. . . . . .
Circuit Diagram of CPU Block (Version 1410 Edit 7) layout 05 A–D14
Circuit Diagram of RF Block (Version 1410 Edit 13) layout 05 A–D15.
Circuit Diagram of Audio and RFI (Version 1410 Edit 4) layout 05 A–D16. . . . .
Circuit Diagram of IR Module (Version 1410 Edit 2) layout 05 A–D17
Circuit Diagram of UI (Version 1410 Edit 5) for layout 05 A–D18. . . .
Layout Diagram of RM7LD – Bottom (Version 05) A–D19. . . . . . . . . . .
Layout Diagram of RM7LD – Top (Version 05) A–D19. . . . . . . . . . . . . .
Testpoints of RM7LD (Version 05) A–D20. . . . . . . . . . . . . . . . . . . . . . . .
Schematic Diagrams: RM7LD layout 05 HW5.02 (at the back of the binder) . . .
Connection between RF and Baseband modules (Version 5.02 Edit 8) for layout
version 05 A–D21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband Block Interconnections (Version 5.02 Edit 7) layout 05 A–D22. . . . . .
Circuit Diagram of Power Supply (Version 5.02 Edit 9) layout 05 A–D23. . . . .
Circuit Diagram of CPU Block (Version 5.02 Edit 8) layout 05 A–D24. . . . . . . .
Circuit Diagram of RF Block (Version 5.02 Edit 14) layout 05 A–D25.
Circuit Diagram of Audio and RFI (Version 5.02 Edit 6) layout 05 A–D26. . . . . .
Circuit Diagram of IR Module (Version 5.02 Edit 3) layout 05 A–D27.
Circuit Diagram of UI (Version 5.02 Edit 6) layout 05 A–D28. . . . . . . .
Layout Diagram of RM7LD – Bottom (Version 05) A–D29. . . . . . . . . . .
Layout Diagram of RM7LD – Top (Version 05) A–D29. . . . . . . . . . . . . .
Testpoints of RM7LD (Version 05) A–D30. . . . . . . . . . . . . . . . . . . . . . . .

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PAMS Technical Documentation
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Transceiver NSM–3/3D
Differences between NSM–3 and NSM–3D
The main differences are in A–cover and display module. NSM–3 and
NSM–3D share the same accessories. Other differences between the
phones are stated in the text. See also Product Variants –section in this
manual.
Introduction NSM–3
The NSM–3 is a dual band transceiver unit designed for the GSM900 (in-
cluding EGSM) and GSM1800 networks. It is both GSM900 phase 2 power
class 4 transceiver (2W) and GSM1800 power class 1 (1W) transceiver.
The transceiver consists of System/RF module (RM7L), Display module
(UX7) and assembly parts.
The transceiver has a full graphic display and the user interface is based
on a Jack style UI with two soft keys.
An internal antenna is used, there is no connection to an external anten-
na.
The transceiver has a low leakage tolerant earpiece and an omnidirec-
tional microphone located in B–cover, providing an excellent audio quality.
The transceiver supports a full rate, an enhanced full rate and a half rate
speech decoding.
An integrated IR link provides a connection between two NSM–3 trans-
ceivers or a transceiver and a PC (internal data), or a transceiver and a
printer.
The small SIM ( Subscriber Identity Module ) card is located below the
back cover of the phone.
Introduction NSM–3D
The NSM–3DX is a dualband radio transceiver unit for the E–GSM900 and
GSM1800 networks. GSM power class is 4 and PCN power class is 1. It is
a true 3 V transceiver, with user changeable A–cover and internal vibra.
The transceiver consists of System/RF module (RM7LD), Display module
(UX7V) and assembly parts.
The transceiver has full graphic display and the user interface is based on
Jack style UI with two soft keys.
NSM–3D phone is equipped with an internal antenna and there isn’t any
external antenna connector.
The transceiver has leakage tolerant earpiece and omnidirectional micro-
phone, providing excellent audio quality. Transceiver supports full rate,
enhanced full rate and half rate speech decoding.

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Integrated IR link provides for connection between two NSM–3DX trans-
ceivers or a transceiver and a PC (internal data), or a transceiver and a
printer.
The small SIM ( Subscriber Identity Module ) card is located below the
back cover of the phone.
Operation Modes
There are five different operation modes:
– power off mode
– idle mode
– active mode
– charge mode
– local mode
In the power off mode only the circuits needed for power up are supplied.
In the idle mode circuits are powered down and only sleep clock is run-
ning.
In the active mode all the circuits are supplied with power although some
parts might be in the idle state part of the time.
The charge mode is effective in parallel with all previous modes. The
charge mode itself consists of two different states, i.e. the fast charge and
the maintenance mode.
The local mode is used for alignment and testing.

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Interconnection Diagram
Module
Radio
RM7L, RM7LD
LCD
SIM Battery
Charger
Antenna
2+2
Earpiece
IR Link
64
2
2
14
2
9
Keyboard
module
8
module
HF/HS
4
Mic

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System Module
Baseband Module
The baseband architecture supports a power saving function called ”sleep
mode”. This sleep mode shuts off the VCTCXO, which is used as system
clock source for both RF and baseband. During the sleep mode the sys-
tem runs from a 32 kHz crystal. The phone is waken up by a timer run-
ning from this 32 kHz clock supply. The sleeping time is determined by
some network parameters. The sleep mode is entered when both the
MCU and the DSP are in standby mode and the normal VCTCXO clock
has been switched off.
The battery charging is controlled by a PWM signal from the CCONT. The
PWM duty cycle is determined by a charging software and is fed to the
CHAPS charging switch.
Standard chargers (two wires) provide coarse supply power, which is
switched by the CHAPS for suitable charging voltage and current. Ad-
vanced chargers (three wires) are equipped with a control input. Three
wire chargers are treated like two wire ones.
Block Diagram
CCONT
UI
SIM
MAD
CHAPS
COBBA
BATTERY
PA SUPPLY
RF SUPPLIES
BB SUPPLY
TX/RX SIGNALS
BASEBAND
VBAT
+
MEMORIES
COBBA SUPPLY
EXT. AUDIO
IR
32kHz
CLK
13MHz
CLK
SLEEP CLOCK
SYSTEM CLOCK
HS–connector Charger
connector

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Technical Summary
The baseband module consists four ASICs; CHAPS, CCONT, COBBA–
GJP and MAD2WD1, which take care of the baseband functions of the
engine.
The baseband is running from a 2.8V power rail, which is supplied by a
power controlling ASIC CCONT. In the CCONT there are 6 individually
controlled regulator outputs for RF–section and two outputs for the base-
band. In addition there is one +5V power supply output (V5V). The
CCONT contains also a SIM interface, which supports both 3V and 5V
SIM–cards. A real time clock function is integrated into the CCONT, which
utilizes the same 32kHz clock supply as the sleep clock. A backup power
supply is provided for the RTC, which keeps the real time clock running
when the main battery is removed. The backup power supply is a re-
chargable battery. The backup time with the battery is ten minutes mini-
mum.
The interface between the baseband and the RF section is mainly han-
dled by a COBBA ASIC.COBBA provides A/D and D/A conversion of the
in–phase and quadrature receive and transmit signal paths and also A/D
and D/A conversions of received and transmitted audio signals to and
from the user interface. The COBBA supplies the analog TXC and AFC
signals to RF section according to the MAD DSP digital control. Data
transmission between the COBBA and the MAD is implemented using se-
rial bus for high speed signalling and for PCM coded audio signals. Digital
speech processing is handled by the MAD ASIC. COBBA is a dual volt-
age circuit, the digital parts are running from the baseband supply VBB
and the analog parts are running from the analog supply VCOBBA.
The baseband supports both internal and external microphone inputs and
speaker outputs. Input and output signal source selection and gain control
is done by the COBBA according to control messages from the MAD.
Keypad tones, DTMF, and other audio tones are generated and encoded
by the MAD and transmitted to the COBBA for decoding. A buzzer and an
external vibra alert control signals are generated by the MAD with sepa-
rate PWM outputs.
EMC shieding is implemented using a metallized plastic frame. On the
other side the engine is shielded with PCB grounding. Heat generated by
the circuitry will be conducted out via the PCB ground planes.

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External and Internal Signals and Connections
This section describes the external electrical connection and interface lev-
els on the baseband. The electrical interface specifications are collected
into tables that covers a connector or a defined interface.
DC (charger) connector
DC (charger) connector is physically integrated in the same component
with the accessory interface connector. DC connector has both jack and
contact pads for desk stand.
Service connector
Name Parameter Min Typ Max Unit Remark
MBUS Serial clock
from the
Prommer
0
2.0 logic low logic low 0.8 2.85 VPrommer detection and Seri-
al Clock for synchronous
communication
FBUS_RX Serial data
from the
Prommer
0
2.0 logic low logic high 0.8 2.85 VReceive Data from
Prommer to Baseband
FBUS_TX Data ac-
knowledge to
the Prommer
0
2.0 logic low logic high 0.5 2.85 VTransmit Data from Base-
band to Prommer
GND GND 0 0 V Ground
The service connector is used as a flash programming interface for up-
dating (i.e. re–programming) the flash program memory and an electrical
access for services to the engine.
When the flash prommer is connected to the phone supply power is pro-
vided through the battery contacts and the phone is powered up with a
pulse given to the BTEMP line.
Battery connector
The BSI contact on the battery connector is used to detect when the bat-
tery is to be removed to be able to shut down the operations of the SIM
card before the power is lost if the battery is removed with power on. The
BSI contact disconnects earlier than the supply power contacts to give
enough time for the SIM and LCD shut down.
Name Min Typ Max Unit Notes
VBATT 3.0 3.9 4.2 VBattery voltage
BSI 0 2.85 V Battery size indication
Phone has 100kohm pull up resistor.
SIM Card removal detection
(Treshold is 2.4V@VBB=2.8V)
67 68 69 kohm Battery indication resistor (BLB–2)
0 0 1 kohm Battery indication resistor (service battery)

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NotesUnitMaxTypMinName
BTEMP 0 1.4 V Battery temperature indication
Phone has a 100k (+–5%) pullup resistor,
Battery package has a NTC pulldown resistor:
47k+–5%@+25C , B=4050+–3%
2.1
5 10 3 20 V ms Phone power up by battery (input) Power up pulse width
1.9
90 100 2.85 200 V ms Battery power up by phone (output) Power up pulse width
0 1 kohm Local mode initialization (in production)
BGND 0 0 V Battery ground
SIM card connector
The SIM card connector is located on the engine board beside the battery
pack.
Pin Name Parameter Min Typ Max Unit Notes
4 GND GND 0 0 V Ground
3, 5 VSIM 5V SIM Card
3V SIM Card 4.8 2.8 5.0 3.0 5.2 3.2 VSupply voltage
6 DATA 5V Vin/Vout
3V Vin/Vout
4.0
0
2.8
0
”1”
”0”
”1”
”0”
VSIM
0.5
VSIM
0.5
VSIM data
Trise/Tfall max 1us
2 SIMRST 5V SIM Card
3V SIM Card 4.0 2.8 ”1” ”1” VSIM VSIM VSIM reset
1 SIMCLK Frequency
Trise/Tfall 3.25 25 MHz ns SIM clock
RTC backup battery
The RTC block in CCONT needs a power backup to keep the clock run-
ning when the phone battery is disconnected. The backup power is sup-
plied from a rechargable polyacene battery that can keep the clock run-
ning ten minutes minimum. The backup battery is charged from the main
battery through CHAPS.
Signal Parameter Min Typ Max Unit Notes
VBACK Backup battery charg-
ing from CHAPS 3.02 3.15 3.28 V
Backup battery charg-
ing from CHAPS 100 200 500 uA Vout@VBAT–0.2V
VBACK Backup battery supply
to CCONT 2 3.28 V
Backup battery supply
to CCONT 80 uA

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Power Distribution
In normal operation the baseband is powered from the phone‘s battery.
The battery consists of one Lithium–Ion cell. An external charger can be
used for recharging the battery and supplying power to the phone.
The baseband contains parts that control power distribution to whole
phone excluding those parts that use continuous battery supply. The bat-
tery feeds power directly to the CCONT and UI (buzzer and display and
keyboard lights).
The power management circuit CHAPS provides protection against over-
voltages, charger failures and pirate chargers etc. that would otherwise
cause damage to the phone.
CCONT SIM
+
CHARGER CONNECTOR
CHAPS
COBBA
BATTERY
PA SUPPLY RF SUPPLIES
VBB
BASEBAND
VBAT
VCOBBA VSIM
VBB
CNTVR PWM
VBAT
PWRONX
PURX
VIN
UI
BACKUP
RTC
MEMORIES
MAD
LIM
VBB
Battery charging
The electrical specifications give the idle voltages produced by the ac-
ceptable chargers at the DC connector input. The absolute maximum in-
put voltage is 30V due to the transient suppressor that is protecting the
charger input. At phone end there is no difference between a plug–in
charger or a desktop charger. The DC–jack pins and bottom connector
charging pads are connected together inside the phone.

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VIN
CHAPS
10k
1n
PWM
VBAT
GND
CCONT
L_GND
CHARGER
PWM_OUT
TRANSCEIVER
0R22
VCHAR
ICHAR
100k
22k
1u
2A
30V
VCH
VOUT
RSENSE
GND
CCONTINT
MAD
LIM
MAD
Startup Charging
When a charger is connected, the CHAPS is supplying a startup current
minimum of 130mA to the phone. The startup current provides initial
charging to a phone with an empty battery. Startup circuit charges the
battery until the battery voltage level is reaches 3.0V (+/– 0.1V) and the
CCONT releases the PURX reset signal and program execution starts.
Charging mode is changed from startup charging to PWM charging that is
controlled by the MCU software. If the battery voltage reaches 3.55V
(3.75V maximum) before the program has taken control over the charg-
ing, the startup current is switched off. The startup current is switched on
again when the battery voltage is sunken 100mV (nominal).
Parameter Symbol Min Typ Max Unit
VOUT Start– up mode cutoff limit Vstart 3.45 3.55 3.75 V
VOUT Start– up mode hysteresis
NOTE: Cout = 4.7 uF Vstarthys 80 100 200 mV
Start–up regulator output current
VOUT = 0V ... Vstart Istart 130 165 200 mA
Battery Overvoltage Protection
Output overvoltage protection is used to protect phone from damage.
This function is also used to define the protection cutoff voltage for differ-
ent battery types (Li or Ni). The power switch is immediately turned OFF if
the voltage in VOUT rises above the selected limit VLIM1 or VLIM2.
Parameter Symbol LIM input Min Typ Max Unit
Output voltage cutoff limit
(during transmission or Li–
battery)
VLIM LOW 4.4 4.6 4.8 V

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The voltage limit (VLIM1 or VLIM2) is selected by logic LOW or logic
HIGH on the CHAPS (N101) VLIM input pin. In NSM–3 phones VLIM is
fixed low in HW.
When the switch in output overvoltage situation has once turned OFF, it
stays OFF until the the battery voltage falls below VLIM and PWM = LOW
is detected. The switch can be turned on again by setting PWM = HIGH.
PWM (1 Hz)
VOUT
VLIM
t
SWITCH ON OFF
VCH
t
VCH<VOUT
ON

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Battery Removal During Charging
Output overvoltage protection is also needed in case the main battery is
removed when charger connected or charger is connected before the bat-
tery is connected to the phone.
With a charger connected, if VOUT exceeds VLIM, CHAPS turns switch
OFF until the charger input has sunken below Vpor (nominal 3.0V, maxi-
mum 3.4V). MCU software will stop the charging (turn off PWM) when it
detects that battery has been removed. The CHAPS remains in protection
state as long as PWM stays HIGH after the output overvoltage situation
has occured.
PWM
t
VOUT
t
4V
VLIM
”1”
”0”
SWITCH
t
ON
OFF 2
1.
1
Battery removed, (standard) charger connected, VOUT rises (follows charger voltage)
2. VOUT exceeds limit VLIM(X), switch is turned immediately OFF
3.
3
VOUT falls (because no battery) , also VCH<Vpor (standard chargers full–rectified
output). When VCH > Vpor and VOUT < VLIM(X) –> switch turned on again (also PWM
is still HIGH) and VOUT again exceeds VLIM(X).
4
4. Software sets PWM = LOW –> CHAPS does not enter PWM mode
Vstart
5
5. PWM low –> Startup mode, startup current flows until Vstart limit reached
VCH
(Standard
Charger)
Vpor
Vstarthys
Droop depends on load
Istart off due to VCH<Vpor
& C in phone
6
6. VOUT exceeds limit Vstart, Istart is turned off
7. VCH falls below Vpor
7

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PWM
When a charger is used, the power switch is turned ON and OFF by the
PWM input. PWM rate is 1Hz. When PWM is HIGH, the switch is ON and
the output current Iout = charger current – CHAPS supply current. When
PWM is LOW, the switch is OFF and the output current Iout = 0. To pre-
vent the switching transients inducing noise in audio circuitry of the phone
soft switching is used.
Battery Identification
Different battery types are identified by a pulldown resistor inside the bat-
tery pack. The BSI line inside transceiver has a 100k pullup to VBB. The
MCU can identify the battery by reading the BSI line DC–voltage level
with a CCONT (N100) A/D–converter.
Name Min Typ Max Unit Notes
BSI 0 2.8 V Battery size indication
100k pullup resistor to VBB in phone
SIM Card removal detection
(Treshold is 2.4V@VBB=2.8V)
67 68 69 kohm Indication of a BLB–2 battery (650 mAh Li–Ion)
0 1 kohm Indication resistor for a service battery
SIMCardDetX MAD
BSI CCONT
2.8V TRANSCEIVER
Rs
BATTERY
BSI
BGND
BTEMP
VBATT
10k
10n
100k
The battery identification line is used also for battery removal detection.
The BSI line is connected to a SIMCardDetX line of MAD2. SIMCardDetX
is a threshold detector with a nominal input switching level 0.85xVcc for a
rising edge and 0.55xVcc for a falling edge. The battery removal detection
is used as a trigger to power down the SIM card before the power is lost.
The BSI contact in the battery contact disconnects before the other con-
tacts so that there is a delay between battery removal detection and sup-
ply power off.

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0.550.05 Vcc
0.850.05 Vcc
Vcc
GND SIGOUT
SIMCARDDETX
Battery Temperature
The battery temperature is measured with a NTC inside the battery pack.
The BTEMP line inside transceiver has a 100k pullup to VREF. The MCU
can calculate the battery temperature by reading the BTEMP line DC–
voltage level with a CCONT (N100) A/D–converter.
Pin Name Min Typ Max Unit Notes
3 BTEMP 0 1.4 V Battery temperature indication
100k pullup resistor to VREF in phone
Battery package has NTC pull down resis-
tor:
47k +/–5%@+25C , B=4050+/–3%
2.1
5 10 3 20 V ms Phone power up by battery (input) Power up pulse width
1.9
90 100 2.8 200 V ms Battery power up by phone (output) Power up pulse width
–5 5 % 100k pullup resistor tolerance
100k
VREF
TRANSCEIVER
R
T
BATTERY
BTEMP
BGND
BSI
VBATT
NTC
BTEMP CCONT
10k

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Supply Voltage Regulators
The heart of the power distrubution is the CCONT. It includes all the volt-
age regulators and feeds the power to the whole system. The baseband
digital parts are powered from the VBB regulator which provides 2.8V
baseband supply. The baseband regulator is active always when the
phone is powered on. The VBB baseband regulator feeds MAD and me-
mories, COBBA digital parts and the LCD driver in the UI section. There is
a separate regulator for a SIM card. The regulator is selectable between
3V and 5V and controlled by the SIMPwr line from MAD to CCONT. The
COBBA analog parts are powered from a dedicated 2.8V supply VCOB-
BA. The CCONT supplies also 5V for RF and for flash VPP. The CCONT
contains a real time clock function, which is powered from a RTC backup
when the main battery is disconnected. The RTC backup is rechargable
polyacene battery. The battery is charged from the main battery voltage
by the CHAPS when the main battery voltage is over 3.2V.
Operating mode Vref RF REG VCOBBA VBB VSIM SIMIF
Power off Off Off Off Off Off Pull
down
Power on On On/Off On On On On/Off
Reset On Off
VR1 On On On Off Pull down
Sleep On Off Off On On On/Off
NOTE: COBBA regulator is off in SLEEP mode. Its output pin may be fed
from VBB in SLEEP mode by setting bit RFReg(5) to ’1’ (default).
CCONT includes also five additional 2.8V regulators providing power to
the RF section. These regulators can be controlled either by the direct
control signals from MAD or by the RF regulator control register in
CCONT which MAD can update. Below are the listed the MAD control
lines and the regulators they are controlling.
– TxPwr controls VTX regulator (VR5)
– RxPwr controls VRX regulator (VR2)
– SynthPwr controls all the rf regulators except VR1
– VCXOPwr controls VXO regulator (VR1)
In additon to the above mentioned signals MAD includes also TXP control
signal which goes to HAGAR power control block. The transmitter power
control TXC is led from COBBA to HAGAR.