Nokia RH-27 Series Guide

CCS Technical Documentation
RH-27 Series Transceivers
Issue 1 11/2003 Confidential ©2003 Nokia Corporation
System Module

RH-27
System Module CCS Technical Documentation
Page 2 ©2003 Nokia Corporation Confidential Issue 1 11/2003
Contents
Page No
Introduction.................................................................................................................... 4
BB Hardware Characteristics ......................................................................................4
Technical Summary .....................................................................................................4
Functional Description .................................................................................................5
Modes of Operation................................................................................................... 5
RH-27 BB Functional Blocks ......................................................................................6
UEM and UPP........................................................................................................... 7
Battery....................................................................................................................... 7
Charger Detection ................................................................................................... 10
Charger Interface Protection ................................................................................... 10
LED Driver Circuit.................................................................................................. 11
LCD Display ........................................................................................................... 12
RF Interface Block.................................................................................................. 13
Combo Memory Module......................................................................................... 13
Combo Memory Interface....................................................................................... 13
SRAM Memory Description................................................................................... 13
Flash Memory Description...................................................................................... 13
Flash Architecture................................................................................................... 14
Keyboard (UI Module)............................................................................................ 14
Keyboard ESD Protection....................................................................................... 14
Internal Audio ......................................................................................................... 14
External Audio Connector....................................................................................... 16
External Microphone Connection ........................................................................... 17
External Earphone Connection................................................................................ 17
IrDa Interface .......................................................................................................... 18
Vibra........................................................................................................................ 18
FM Radio................................................................................................................. 18
System Connector (Tomahawk).............................................................................. 19
PWB Strategy ............................................................................................................20
PWB Construction................................................................................................... 20
PWB Immunity ....................................................................................................... 21
Keyboard................................................................................................................. 21
Audio Lines............................................................................................................. 21
Microphone Lines ................................................................................................... 21
EAR Lines............................................................................................................... 22
Charger Lines.......................................................................................................... 22
HEADINT............................................................................................................... 22
Battery Supply Filtering.......................................................................................... 22
System Connector ................................................................................................... 22
Mechanical Shielding.............................................................................................. 22
EMC Strategy ............................................................................................................22
Test Interfaces ............................................................................................................23
Production / After Sales Interface........................................................................... 23
Flash Interface......................................................................................................... 24
FBUS Interface........................................................................................................ 24
BB_RF Interface Connections ...................................................................................25

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RF Functional Description .........................................................................................27
Circuit Diagrams and PWB Layout ........................................................................ 28
Receiver................................................................................................................... 28
Frequency Synthesizers........................................................................................... 28
Transmitter.............................................................................................................. 29
Antenna ................................................................................................................... 31
Software Compensations ...........................................................................................32
RF Frequency Plan.................................................................................................. 32
DC Characteristics................................................................................................... 33

RH-27
System Module CCS Technical Documentation
Page 4 ©2003 Nokia Corporation Confidential Issue 1 11/2003
Introduction
This document describes the system module for the RH-27 transceiver. The baseband
module includes the baseband engine chipset, the UI components, and the acoustic com-
ponents. RH-27 is a hand-portable dual band CDMA 850/1900 with AMPS. It has been
designed using DCT4 generation baseband (UEM/UPP) and RF module. The baseband
module has been developed as part of the DCT4 common Baseband. RH-27 contains
some baseband features that are new to the America's CDMA market. These features
include stereo FM receiver (offered as an accessory) and a MIDI (polyphonic ringing
tones). The battery for RH-27 is the BLD-3 with a nominal capacity of 780 mAh.
BB Hardware Characteristics
• Hi-Resolution (128x128) illuminated color display
• Active LCD pixel area: width 27.6mm X height 27.6mm
• ESD-proof keymat, with five individual keys for multiple key pressing
• Support for internal semi-fixed battery (Janette type BLD-3)
• Audio amplifier and SALT speaker for MIDI support
• Ringing volume 100dB @ 5cm (MIDI tones through SALT speaker)
• Stereo FM receiver as an accessory
• IrDa port/interface
• Internal vibra
• Supports voice dial activation via headset button
• Six white LEDs for keymat on UI board and two for LCD backlight in LCD module
• 6-layer PWB, SMD with components on both sides of PWB
Technical Summary
The baseband module is implemented using two main ASICs — the Universal Energy
Management (UEM) and the Universal Phone Processor (UPP). The baseband module also
contains an audio amplifier for MIDI support and a 64-Mbit Flash/ 4-Mbit SRAM combo
IC. EMC shielding is implemented using a metallized plastic frame. On the other side, the
engine is shielded with PWB ground openings. Heat generated by the circuitry is con-
ducted out via the PWB ground planes. The RH-27 transceiver module is implemented on
six layer FR-4 material PWB.

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Functional Description
Modes of Operation
The RH-27 baseband engine has five different operating modes:
1 No supply
2ActingDead
3Active
4 Sleep
5 Charging
No Supply Mode
In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to the discon-
nection of the main battery or a low battery voltage level. The phone exits from
NO_SUPPLY mode when a sufficient battery voltage level is detected. The battery voltage
can rise either by connecting a new battery with VBAT > VMSTR+, or by connecting a
charger and charging the battery voltage to above VMSTR+.
Acting DEAD Mode
If the phone powered off when the charger is connected, the phone is powered on and
enters a state called Acting Dead. In this mode, no RF circuitry is powered up. To the user,
the phone acts as if it is switched off. The phone issues a battery-charging alert and/or
shows a battery charging indication on the display to acknowledge to the user that the
battery is charging.
Active Mode
In active mode, the phone is in normal operation, scanning for channels, listening to a
base station, transmitting, and processing information. There are several sub-states in
the active mode depending on if the phone is in burst reception, burst transmission, etc.
In active mode, SW controls the RF regulators by writing the correct values into the UEM
control registers. VR1A/B and VR2 can be enabled or disabled. VR4 - VR7 can be
enabled, disabled, or forced into low quiescent current mode. VR3 is always enabled in
active mode.
Sleep Mode
The phone enters Sleep mode when both the MCU and the DSP are in stand-by mode.
Both processors control sleep. When the SLEEPX low signal is detected, the UEM enters
SLEEP mode. In this mode, the VCORE, VIO and VFLASH1 regulators are put into low qui-
escent current mode. All RF regulators — with the exception of VR2 and VR3 — are dis-
abled in sleep mode. When the SLEEPX is set high and is detected by the UEM, the phone
enters ACTIVE mode and all functions are activated. Sleep mode is exited either by the
expiration of a sleep clock counter in the UEM, or by some external interrupt generated
by a charger connection, key press, or headset connection among other things. While in

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sleep mode, the main oscillator is shut down and the baseband section uses the 32 kHz
sleep clock oscillator as its reference.
Charging Mode
Charging can be performed in parallel with any other operating mode. The Battery Size
Indicator (BSI) resistor inside the battery pack indicates the battery type/size. The resistor
value corresponds to a specific battery capacity and technology. The UEM's AD convert-
ers, under UPP software control, measure the battery voltage, temperature, size, and cur-
rent. The charging control circuitry (CHACON) inside the UEM controls the charging
current delivered from the charger to the battery. The battery voltage rise is limited by
turning the UEM switch off when the battery voltage has reached VBATLim (programma-
ble charging cut-off limits 3.6V / 5.0V / 5.25V). Measuring the voltage drop across a
0.22Ohm resistor monitors charging current.
RH-27 BB Functional Blocks
RH-27 BB functional blocks are listed below:
• UEM and UPP
• Battery
• LED Driver
• LCD Display
• RF IF Block
• Memory Module
• Keyboard (UI module)
• External Audio Connector
• IrDa Interface
• Vibra
• FM Radio
• System Connector (Tomahawk)
• PWB Strategy
• EMC Strategy
• Test Interface

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UEM and UPP
The UEM contains a series of voltage regulators to supply both the baseband module and
the RF module. Both the RF and Baseband modules are supplied with regulated voltages
of 2.78 V and 1.8 V. The UEM contains six linear LDO (low drop-out) regulators for Base-
band and seven regulators for RF circuitry. RF regulator VR1 uses two LDOs and a charge
pump. VR1 regulator is used by RF module. The core of the UPP is supplied with a pro-
grammable voltage of 1.0 V, 1.3 V, 1.5 V, or 1.8 V. Note that with UEMK, VCORE supply
voltage is set to 1.5 V. UEMC will support VCORE voltage below 1.5V.
The UPP operates from a 19.44MHz clock generated in the RF ASIC. The DSP and MCU
both contain phase locked loop (PLL) clock multipliers, which can multiply the system
frequency by factors from 0.25 to 31. The actual execution speed is limited by the mem-
ory configuration and process size (Max. DSP speed for C035 is ~ 200MHz).
The UEM contains a real-time clock, sliced down from the 32768 Hz crystal oscillator.
The 32768 Hz clock is used by UPP as the sleep clock.
The communication between the UEM and the UPP is done via the bi-directional serial
busses, CBUS and DBus. The CBUS is controlled by the MCU and operates at a speed of
1.08 MHz. The DBus is controlled by the DSP and operates at a speed of 13 MHz. Both
processors are located in the UPP.
The interface between baseband and RF is implemented in the UEM and UPP ASIC. The
UEM provides A/D and D/A conversion of the in-phase and quadrature receive and trans-
mit signal paths. It also provides A/D and D/A conversions of received and transmitted
audio signals to and from the user interface. The UEM supplies the analog signals to the
RF section according to the UPP DSP digital control. The RF ASIC is controlled via the UPP
RFBUS serial interface. There are also separate signals for PDM coded audio. Digital
speech processing is handled by the DSP inside the UPP ASIC. The UEM is a dual voltage
circuit with the digital parts running from the baseband supply (1.8V) and the analog
parts running from the analog supply of 2.78V. The input battery voltage (VBAT) is also
used directly by some UEM blocks.
The baseband supports both internal and external microphone inputs as well as speaker
outputs. Input and output signal source selection and gain control is done by the UEM
according to control messages from the UPP. Keypad tones, DTMF, and other audio tones
are generated and encoded by the UPP and transmitted to the UEM for decoding. RH-27
has two external serial control interfaces: FBUS and MBUS provided by UEM. These bus-
ses can be accessed only through production test patterns.
RH-27 uses UPP8Mv2.4 and UEMK, with provision to use UEMC and future releases of
UPP as it becomes necessary. UEMC requires some software changes.
Battery
BLD-3 Li-ion (inbox battery) is used as the main power source for RH-27. No other bat-
tery packs are planned to be used. BLD-3 has the capacity of 780 mAh.

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Figure 1: Battery pack contacts
The BSI fixed resistor value indicates type and default capacity of a battery. NTC-resistor
measures the battery temperature.
Temperature and capacity information is needed for charge control. These resistors are
connected to the BSI and BTEMP pins of the battery connector. Phone has 100 kW pull-
up resistors for these lines so that they can be read by A/D inputs in the phone. For safety
Table 1: BLD-3 characteristics
Description Value
Nominal discharge cut-off voltage 3.1V
Nominal battery voltage 3.7V
Nominal charging voltage 4.2V
Maximum charger output current 850mA
Minimum charger output current 200mA
Cell pack impedance -20 ... 0 oC180mΩmax
Cell pack impedance 0 ... +20 oC150mΩmax
Cell pack impedance +20 ...+60 oC130mΩmax
Cell pack impedance +60 ...+80 oC250mΩmax
Table 2: Pin numbering of battery pack
Signal name Pin number Function
VBAT 1 Positive battery terminal
BSI 2 Battery capacity measurement (fixed resistor inside the
battery pack)
BTEMP 3 Battery temperature measurement (measured by ntc
resistor inside pack)
GND 4 Negative/common battery terminal
Charge
GND
2(BSI) 3(BTEMP) 4(GND)

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reasons, the phone software will shut the phone off if it senses a temperature of 38oC or
higher on BTEMP line.
Figure 2: Interconnection diagram
Supply Voltage Regulation
The UEM ASIC controls supply voltage regulation. There are six separate regulators used
by the baseband block. For a more detailed description about the regulator parameters,
see the document UEM ASIC Specification.
Charging
RH-27 baseband supports the NMP charger interface specified in the document Janette
Charger interface, SW control is specified in EM SW Specification, ISA EM Core SW
Project. The UEM ASIC controls charging, and external components are used to provide
EMC, reverse polarity, and transient protection of the charger input to the baseband
module. The charger connection is through the system connector interface. Both 2- and
3-wire type chargers are supported. The operation of the charging circuit has been spec-
ified to limit the power dissipation across the charge switch and to ensure safe operation
in all modes.
Table 3: BSI resistor values
Parameter Min Typ Max Unit Notes
Battery size indicator resistor BSI 75 kΩBattery size indicator (BLD-3)
Tolerance “1%
NTC thermistor BTEMP 47
4000
kΩ
K
Battery temperature indica-
tor (NTC pulldown) 47kΩ“5%
@ 25 oC
Beta value (B).
Tolerance “5%, 25 oC / 85 oC
Overcharge /
Overdischarge
protection
VBATT
BSI
BTEMP
EMC
Li-Ion

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System Module CCS Technical Documentation
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Figure 3: UEM charging circuitry
Charger Detection
Connecting a charger creates voltage on the VCHAR input to the UEM. When the VCHAR
input voltage level rises above the VCHDET+ threshold, the UEM starts the charging pro-
cess. VCHARDET signal is generated to indicate the presence of the charger for the SW.
Energy Management (EM) SW controls the charger identification and acceptance.
The charger recognition is initiated when the EM SW receives a "charger connected"
interrupt. The algorithm basically consists of the following three steps:
1 Check that the charger output (voltage and current) is within safety limits.
2 Identify the charger.
3 Check that the charger is within the charger window.
If the charger is identified and accepted, the appropriate charging algorithm is initiated.
Charger Interface Protection
In order to ensure safe operation with all chargers and in mis-use situations, charger
+
-VBATTlim
Comp
Switch
Driver
Ctrl
Logic
Over
Temp.
Detection
VCHARin VCHARout VBATT
V
CHAR
VBATT
UEM
Current
Sensing/
Limit
Vmstr
WatchDog

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interface is protected using a transient voltage suppressor (TVS) and a 1.5A fuse. The TVS
device used in RH-27 is rated for 16V@175W.
Figure 4: Charger interface TVS characteristics
Breakdown voltage (VBR) 17.8Vmin (at IT 1.0mA)
Reverse standoff voltage (VR) 1 6V
Max reverse leakage current at VR (IR)5uA
Max peak impulse current (Ipp) 7A (at Ta=25*C, current waveform: 10/1000us)
Max clamping voltage at Ipp (Vc) 26V
LED Driver Circuit
In RH-27, white LEDs are used for LCD and keypad lighting. Two LEDs are used for LCD
lighting and six are used for the keyboard. A step-up DC-DC converter (TK11851) is used
as the white LED driver.
The display LEDs are driven in serial mode to achieve stable backlight quality. This means
that constant current flows through LCD LEDs. Serial resistance Rlcd is used to define the
proper current. The feedback signal, FB, is used to control the current. Driver increases or
decreases the output voltage for LEDs to keep the current stable.
Keyboard LEDs are driven in 2-serial/3 parallel modes. Serial resistance R is used to limit
the current through LEDs. The feedback signal, FB, is not used to control the current.
Driver is controlled by the UEM via DLIGHT output. This signal is connected to driver EN-
pin (on/off). It is possible to control the LED brightness by PWM to achieve smooth on/off
operation.

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Figure 5: Shared LED driver circuit for LCD and keyboard backlight
LCD Backlight
LCD Backlight consists of two white LEDs, which are integrated with the LCD module.
Keyboard Illumination
The keyboard light consists of six white LEDs on the UI board. They are placed under the
keyboard for proper illumination of the keypad.
LCD Display
The LCD is a CSTN 130 x 130, ful-dot matrix display with 12bit (4096 colors) color reso-
lution and a single pixel border area around the content area, which makes the total
active area 128 x 128 pixels.
Table 4: LCD general specifications
LCD parameter Value
Glass size, width x height x thickness 33.98 mm x 37.95 mm x 1.71 mm
Glass thickness 0.50 mm
Viewing area (width x height) 30.29 mm x 30.29 mm
Active pixel area (width x height) 27.29 mm x 27.29 mm
Number of pixels 130 x 130 pixels
Technology CSTN (color super twisted nematic)
Operating temperature range -25 oC to +70 oC
Main viewing direction 6 o’clock
Illumination mode transflective
Color tone
Background: Neutral/Black
LED Driver FB
V in
Gnd
Cx
En
Is Ext Vovp
Rlcd R
Schottky
Coil
Cosc
Keyboard Illumination
LCD Illumination
VBAT
DLIGHT
Cout
Cin

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Figure 6: Color LCD module
RF Interface Block
The interface between the baseband and the RF module can be divided into two catego-
ries, the digital interface and the analog interface. The digital interface is between the
UPP and the RF chip. The serial digital interface is used to control the operation of the
different blocks in the RF chip. The analog interface is between the UEM and the RF. The
entire BB-RF interface is discussed in RF-BB Interface Specification RH-27.
Combo Memory Module
The RH-27 baseband memory module consists of a combo Flash/SRAM chip. It has
64Mbit burst-type flash memory and 4-Mbit of SRAM. In addition, the UPP has 8Mbit of
internal RAM. The UPP RAM is part of the UPP and is not covered here.
Combo Memory Interface
The memory interface consists of multiplexed address/data bus MEMADDA [23:0], the
MEMCONT[9:0] memory control bus, and GENIO[23] — which is used for memory control.
The purpose of the memory interface is to reduce the amount of interconnections by
multiplexing the address and data signals on the same bus. Because the required flash
address space is more than 16-bits, the MEMADDA[15:0] are multiplexed address/data
lines and MEMADDA[21:16] are only address lines, which in total allow for 4M addresses
(MEMADDA[21:0]). The multiplexed data/address lines require the memory to store the
address during the first cycle in the read/write access. Data access to the flash is per-
formed as a 16-bit access (MEMADDA[15:0]) in order to improve the data rate on the
bus. The memory interface supports asynchronous read, burst mode synchronous read,
and simultaneous read-while-write/erase — all controlled by the UPP.
SRAM Memory Description
The combo memory chip used in RH-27 has 4 Mbit of SRAM, 16-bits wide running at
1.8V. It uses a multiplexed address and data bus to minimize the pin count of the device.
Control signals are used to allow byte access to the device.
Flash Memory Description
The 64 Mbit density flash with 16-bit data access operates in both asynchronous random
A
ctive area
128x128
Driver
C 0 C 128
R 0
R 128
Top View
CCC

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access and synchronous burst access (with crossing partition boundaries) and has various
data protection features. Upon power up or reset, the device defaults to asynchronous
read configuration. Synchronous burst read is indicated to the device by writing to the
flash configuration register and can be terminated by deactivating the device.
The device supports reads and in-system erase and program operations at Vcc=1.8 V
(Voltage range 1.7-1.9 V). Flashing at production is supported at Vpp=12 V (for limited
exposure length only).
Flash Architecture
The datasheet of RH-27 combo memory contains detailed information about Flash archi-
tecture.
Keyboard (UI Module)
RH-27 consists of separate UI board and includes contacts for the keypad domes and
LEDs for keypad lighting. The UI board is connected to the main PWB through a 16 pole
board-to-board connector with springs. A 5x4-matrix keyboard is used in RH-27. Key
pressing is detected by a scanning procedure. Keypad signals are connected via the UPP
keyboard interface.
When no key is pressed, row inputs are high due to UPP internal pull-up resistors. The
columns are written zero. When a key is pressed, one row is pulled down and an interrupt
is generated to the MCU. After receiving the interrupt, the MCU starts the scanning pro-
cedure. All columns are first written high and then one column at a time is written down.
All columns, except the column that is written down, are set as inputs. Rows are read
while column at the time is written down. If a row is down, it indicates that key, which is
at the cross point of the selected column and row that was pressed. After detecting the
pressed key, all registers inside the UPP are reset and columns are written back to zero.
Keyboard ESD Protection
SMD chips LEDs on UI board have 2kV ESD protection. In case the A-cover is removed,
there is a potential risk of damaging LEDs with electrostatic discharge. Ground openings
are made around LEDs to catch ESD sparks. For additional protection, dome sheet is
made of conductive metallized tape and grounded to display shield.
Internal Audio
Internal Microphone
The internal microphone capsule is mounted to in the UI frame. Microphone is omni
directional and it's connected to the UEM microphone input MIC1P/N. The microphone
input is asymmetric and the UEM (MICB1) provides bias voltage. The microphone input
on the UEM is ESD protected. Spring contacts are used to connect the microphone to the
main PWB.

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Figure 7: Internal microphone connection
Internal Speaker
The internal earpiece is a dynamic earpiece with impedance of 32 ohms. The earpiece is
low impedance one since the sound pressure is to be generated using current and not
voltage as the supply voltage is restricted to 2.7V. The earpiece is driven directly by the
UEM and the earpiece driver (EARP and EARN outputs) is a fully differential bridge
amplifier with 6 dB gain. In RH-27, 8mm leak tolerant PICO earpiece is used.
Figure 8: Speaker connection
IHF Speaker and Stereo Audio Amplifier
Integrated Hands Free Speaker (16mm MALT) is used to generate speech audio, ringing
and warning tones in RH-27. Audio amplifier is controlled by the UPP. Speaker capsule is
mounted in the C-cover. Spring contacts are used to connect the IHF Speaker contacts to
the main PWB.
UEM
MIC1N
MIC1P EMC
Microphone
Charge
Common mode
choke
EARP
EARN
UEM

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Figure 9: Digital interface of audio amplifer
Figure 10: Block diagram of audio amplifer
The LM4855 features a 32-step digital volume control and eight distinct output modes.
The digital volume control and output modes are accessed through a 3-wire interface,
controlled by UPP. Digital volume control is needed when FM radio is activated; there is
no amplifier block in FM radio module. Output modes are needed when routing audios to
different locations; Headset or IHF.
External Audio Connector
RH-27 is designed to support fully differential external audio accessory connection by
using Tomahawk system connector. Tomahawk connector has serial data bus called (ACI)
Accessory Control Interface (ACI) for accessory insertion and removal detection and
identification and authentication. ACI line is also used for accessory control purposes.
• 4-wire fully differential stereo audio (used also FM-radio antenna connection)
• 2-wire differential mic input
UPP8M LM4855
Enable
Clock
Data DATA
CLK
EN
GenIO(14)
GenIO(16)
GenIO(15)
Output
Mode
Select
Digital
Volu me
Control
SPI
Bias
By pass
Ri n
Li n
EN CL K DAT A
Lout -
Lout +
Rout -
Rout +
out -
out +
VB AT
GN D
Phone
audio
Cs
=
1uF
Radio audio
IH F Speaker
Radio audio
Stereo Headset
Amplifier
Amplifier
Amplifier
Amplif ier
Amplifier
Amplifier
LM4855

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External Microphone Connection
The external microphone input is fully differential and lines are connected to the UEM
microphone input MIC2P/N. The UEM (MICB2) provides bias voltage. Microphone input
lines are ESD protected.
Creating a short circuit between the headset microphone signals generates the hook sig-
nal. When the accessory is not connected, the UEM resistor pulls up the HookInt signal.
When the accessory is inserted and the microphone path is biased the HookInt signal
decreases to 1.8V due to the microphone bias current flowing through the resistor. When
the button is pressed the microphone signals are connected together, and the HookInt
input will get half of micbias dc value 1.1 V. This change in DC level will cause the Hook-
Int comparator output to change state, in this case from 0 to 1. The button can be used
for answering incoming calls but not to initiate outgoing calls.
Figure 11: External microphone connection
External Earphone Connection
Headset implementation uses separate microphone and earpiece signals. The accessory is
detected by the HeadInt signal when the plug is inserted.
Figure 12: External earphone and IHF connections
UEM
MICB2
MIC2P
MIC2N
HookInt
EMC/ESD XMICP
XMICN
UEM
XEAR
MIC3P
MIC3N
EMC/ESD
Ct
Rout+
Rout-
Lout+
Lout-
SPKRout+
SPKRout-
PhoneIN (IHF)
Rin
Lin
A
udio Amplifier
VAFR
VAFL
FM Radio
PhoneIN (HS) IHF Speaker

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IrDa Interface
The IrDa interface when using transceiver with 1.8V I/O is designed into the UPP. The IR
link supports speeds from 9600 bit/s to 1.152 MBit/s up to distance of 80 cm. Transmis-
sion over the IR if half-duplex.
The length of the transmitted IR pulse depends on the speed of the transmission. When
230.4 kbit/s or less is used as a transmission speed, pulse length is maximum 1.63ms. If
transmission speed is set to 1.152Mbit/s, the pulse length is 154ns.
IR transceiver can be set into SIR or MIR modes. In SIR mode transceiver is capable of
transmission speed up to 115.2kbit/s. In MIR mode faster transmission speeds are used.
The maximum speed is 1.152Mbit/s. IR transceiver can be set into shutdown mode by
setting SD pin to logic '1' for current saving reasons.
Vibra
A vibra alerting device is used to generate a vibration signal for an incoming call. Vibra is
located in the bottom end of the phone and connection is done with spring contacts.
Vibra interface is the same like other DCT4 projects. The vibra is controlled by a PWM
signal from the UEM. Frequency can be set to 64, 129, 258, or 520 Hz and duty cycle can
vary between 3% - 97%. To ensure compatibility with different version of UEM, RH-27
uses 40.5% duty cycle of the vibra PWM signal.
FM Radio
FM radio circuitry is implemented by using highly integrated radio IC, TEA5767. TEA5767
is a single-chip, electronically tuned FM stereo radio with fully integrated IF selectivity
and demodulation. The IF-frequency is 225 kHz. The radio is completely adjustment-free
and does only require a minimum of small and low-cost external components. It has sig-
nal-dependent mono/stereo blend [Stereo Noise Cancelling (SNC)]. The radio can tune
the European, US, and Japan FM bands.
Channel tuning and other controls are controlled through serial bus interface by the
MCUSW. Reference clock, 32kHz, is generated by the UPP CTSI block (routed from sleep
clock).
Figure 13: FM radio digital interface connections
UPP8M TEA5767
FMClk
FMCtrlDa
FMCtrlClk
FMWrEn
VIO
W/R
SCL
SDA
XTAL2
GenIO(3)
GenIO(12)
GenIO(8)
GenIO(11)

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System Connector (Tomahawk)
The 14-pin Tomahawk bottom connector consists of charging plug socket and Tomahawk
System Connector. Tomahawk system connector includes signals for the following:
Figure 14: Tomahawk bottom connector (charger plug socket and Tomahawk system connector)
Accessory Control Interface (ACI)
ACI is point-to-point, bi-directional serial bus. It has three main features:
1 The insertion and removal detection of an accessory device
2 Acting as a data bus, intended mainly for control purposes
3 The identification and authentication of accessory type which is connected
The accessories are detected by the HeadInt signal when the plug is inserted. Normally
when accessory is not present, the pull-up resistor 100k pulls up the HeadInt signal to
VFLASH1. If the accessory is inserted, the external resistor (located to accessory) works
as voltage divider and decreases the voltage level below the threshold of Vhead. Thereby
the comparator output will be changed to high state causing an interrupt.
If the accessory is removed, the voltage level of HeadInt increases again to VFLASH1.This
Table 5: Tomahawk system connector signals
Function Notes
Charging Pads for 2-wire charging in cradles
Audio 4-wire fully differential stereo audio output
2-wire differential microphone input
FM radio antenna connection
Power supply for accessories 2.78V/70mA output to accessories
ACI (Accessory Control Interface) Accessory detection/removal and controlling
FBUS Standard FBUS
DKU-5 (similar to USB) (optional) Power in 5V in from DKU-5 cable
XMIC N XMIC P
ACI
Charge GND
Fbus TX
Fbus RX
DATA GND
Shielding GND
HSEAR_L_P
HSEAR_L_N
N
Shielding GND
Charge
Vout
HSEAR_R_N HSEAR_R_P

RH-27
System Module CCS Technical Documentation
Page 20 ©2003 Nokia Corporation Confidential Issue 1 11/2003
voltage level is higher than the threshold of the comparator and thereby its output will
be changed to low. This changes is leading to an interrupt. These HeadInt interrupts are
initiated the accessory detection or removal sequence.
External Accessory Regulator
An external LDO Regulator is needed for accessory power supply purposes. All ACI-acces-
sories will require this power supply. Regulator input is connected to battery voltage
VBAT and output is connected to Vout pin in Tomahawk connector. Regulator ON/OFF
function is controlled via UPP.
The pull-down resistor on the enable input of the regulator is needed because in the
switch-off mode of the phone, the output level of the Genio(0) is not defined. If Genio(0)
is floating, the regulator may be enabled when it shouldn't be.
Figure 15: Accessory power supply diagram
PWB Strategy
PWB Construction
The PWB in RH-27 consists of a 6-layer board made up of FR4.
Via types are through hole, laser, buried, and blind vias.
The PWB build up is shown below:
Tomahawk btm conn
Voltage
regulator
LP
3985
UPP
GenIO(0)
VBAT
VOUT
En