OPTO-EDU A63.7069 User manual

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To ensure the safety and obtain satisfactory performance, please study
this instruction manual thoroughly before start to use your instrument.
A63.706 9
Tungsten Filament
Scanning Electron Microscope,
SED+BSDE+CCD, 8x~300000x
Instruction Manual

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1. Getting Started.................................................................................................................................4
1.1. General Description.........................................................................................................4
1.1.1. Features of A63.7069 Scanning Electron Microscope.............................................4
1.1.2. Main Purpose and Scope of Application .................................................................4
1.1.3. Product Name& Model ............................................................错误!未定义书签。
1.1.4. Using Condition.......................................................................................................5
1.1.5. Influence on Environment and Energy Sources ......................................................6
1.1.6. Safety.......................................................................................................................6
1.2. Structure Feature and OperatingPrinciple .....................................................................7
1.2.1. General Structure....................................................................................................7
1.2.2. Electron Optics Column...........................................................................................7
1.2.3. Specimen Chamber and Specimen Stage................................................................9
1.2.4. Automatic Vacuum System......................................................................................9
1.2.5. Electronics and Display Console............................................................................11
1.3. Technical index..............................................................................................................12
2. Operation Procedure .....................................................................................................................13
2.1. Start up Procedures.......................................................................................................13
2.2. Operation of Acquire an image .....................................................................................14
2.3. Specimen Changing Procedures....................................................................................16
2.4. Filament changing procedures......................................................................................17
2.5. SEM Shutdown Procedures...........................................................................................18
3. Scanning Control Window of A63.7069 ........................................................................................19
3.1. Title Bar .........................................................................................................................19
3.2. Menu Bar.......................................................................................................................19
3.3. Shortcut Toolbar............................................................................................................19
3.4. Control Panel.................................................................................................................20
3.4.1. Vacuum and HV .....................................................................................................21
3.4.2. High Voltage control..............................................................................................21
3.4.3. Bias control............................................................................................................22
3.4.4. Filament control ....................................................................................................22
3.4.5. Brightness and Contrast ........................................................................................23
3.4.6. Condenser Lens.....................................................................................................23
3.4.7. Condenser Lens Reversal switch ...........................................................................23
3.4.8. Objective Lens.......................................................................................................24
3.4.9. Objective Lens Reversal Switch.............................................................................24
3.4.10.Magnification..........................................................................................................24
3.4.11. Scan Shift...............................................................................................................25
3.4.12. Beam Alignment....................................................................................................25
3.4.13. Stigmator...............................................................................................................26
3.4.14.Scan Rotation ..........................................................................................................26
3.5. Thumb Panel .................................................................................................................27
3.6. Log Panel.......................................................................................................................27
3.7. Scanning operation .......................................................................................................28
3.7.1. Freezing.................................................................................................................28
3.7.2. Normal Scanning ...................................................................................................28
3.7.3. Active Area Scanning.............................................................................................28

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3.7.4. Line Scanning.........................................................................................................28
3.7.5. Spot Scanning........................................................................................................28
3.7.6. Multi Channels ......................................................................................................29
3.7.7. Scanning Speed .....................................................................................................29
3.7.8. Scanning Resolution ..............................................................................................29
3.7.9. Snapshot................................................................................................................29
3.7.10. Synchronous Record..............................................................................................29
3.7.11. Photo Preview .......................................................................................................30
3.7.12. Parameter Setting .................................................................................................30
3.8. Auto Function Operation...............................................................................................30
3.8.1. Auto Brightness/Contrast......................................................................................30
3.8.2. Auto Focus.............................................................................................................31
3.8.3. Auto Stigmation.....................................................................................................31
3.8.4. Auto Filament........................................................................................................31
3.8.5. Fast Condenser......................................................................................................31
3.9. Image Operation ...........................................................................................................31
3.9.1. Zoom in..................................................................................................................31
3.9.2. Zoom out...............................................................................................................31
3.9.3. Actual Size of Image ..............................................................................................32
3.9.4. Fit Window ............................................................................................................32
3.9.5. Character Edit........................................................................................................32
3.9.6. Label ......................................................................................................................32
3.9.7. Date.......................................................................................................................32
3.9.8. U-Scale...................................................................................................................32
3.9.9. Oscillograph...........................................................................................................33
3.9.10. Standard Rectangle ...............................................................................................33
3.10. Document/Window Operation .....................................................................................33
3.10.1. File… ......................................................................................................................33
3.10.2. View...................................................................................................................... 33
3.10.3. Language and Other parameter............................................................................34
3.10.4. Debug ....................................................................................................................34
4. Digital Image Processing Window..................................................................................................35
4.1. Mirror............................................................................................................................35
4.2. Flip.................................................................................................................................35
4.3. Negative ........................................................................................................................36
4.4. Filters.............................................................................................................................36
4.4.1. Set Threshold.........................................................................................................36
4.4.2. Colorize..................................................................................................................36
4.4.3. Lighten...................................................................................................................36
4.4.4. Darken...................................................................................................................36
4.4.5. Contrast.................................................................................................................37
4.4.6. Erode .....................................................................................................................37
4.4.7. Dilate .....................................................................................................................37
4.4.8. Blur ......................................................................................................................37
4.4.9. Soften ....................................................................................................................38
4.4.10. Sharpen .................................................................................................................38

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4.4.11. Edge ......................................................................................................................38
4.4.12. Emboss ..................................................................................................................38
4.5. Rotate Left and right .....................................................................................................39
4.6. Set Rotation...................................................................................................................39
4.7. Re-sample: Image Magnification ..................................................................................39
4.8. Alpha Channel ...............................................................................................................39
4.8.1. Opacity ..................................................................................................................39
4.8.2. Remove..................................................................................................................39
4.9. Gray Scale......................................................................................................................39
4.10. Dither ............................................................................................................................40
4.11. Increase Bpp and Decrease Bpp....................................................................................41
4.12. Split Channels................................................................................................................41
4.12.1. Split to RGB............................................................................................................41
4.12.2. Split to YUV............................................................................................................41
4.12.3. Split to HSL ............................................................................................................41
4.12.4. Pseudo Colors........................................................................................................42
4.13. Options..........................................................................................................................42
5. Operating Rules..............................................................................................................................43
5.1. Precautions....................................................................................................................43
5.2. Vacuum operation in Manual mode..............................................................................43
5.3. Final Aperture Alignment and Selection........................................................................44
5.3.1. Check the Alignment of Final aperture .................................................................44
5.3.2. Final Aperture Alignment ......................................................................................44
5.3.3. Final Aperture Selection........................................................................................46
5.4. Astigmatism Correction.................................................................................................48
5.5. Operation of the Specimen Stage .................................................................................49
5.5.1. Precautions............................................................................................................49
5.5.2. Operation of specimen stage (standard specimen stage).....................................49
5.5.3. Specimen Grounding Alarm ..................................................................................50
6. Accessories.....................................................................................................................................51
6.1. CCD................................................................................................................................51
6.2. Backscatter detector.....................................................................................................51
7. Maintenance ..................................................................................................................................53
7.1. Replacing Filament and Alignment of Mechanical Correction ......................................53
7.2. Replacement of Scintillator of SE Detector...................................................................55
6.3. Check level of oil in the mechanical pump....................................................................56
6.4. Check the air desiccator ................................................................................................57
6.5. Cleaning of Final Aperture Assembly ............................................................................57
6.6. Stop use SEM for long term...........................................................................................58

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1. Getting Started
1.1. General Description
1.1.1. Features of A63.7069 Scanning Electron Microscope
A63.7069 Scanning Electron Microscope (A63.7069 for short) is alarge-scale, high precise electron
optics instrument used to research microscopic structures of objectives. It receives the stimulated
electron signals and forms images by focused electron beam scanning on the specimen surface spot
by spot. A63.7069 has following features:
1. It has large depth of field, which is applicable to the analysis and observation of rough
surface and fracture; the images are stereoscopic and realistic, and easy to be identified and
explained.
2. It can be used to observe the surface structures of large-scale solid specimens; the diameter
of specimen can be up to 15mm ; the sample preparation and pretreatment are simple.
3. The resolution can be reach to 4.5nm.
4. The range of magnification is large; for multiphase and multi-composition nonhomogeneous
material, it is convenient for general observation at low magnification and precisely analyzed
at high magnification.
5. The operation is simple: Users can master it after receiving a short-termtraining.
6. Electronics and computer science can be used to properly improve the quality ofimage.
7. More image observation modes: E.g. Multi Channels can help users observe images from
different detectors simultaneously.
8. According to the purpose of observation, users can carry out dynamic tests by changing
different stages such as high temperature stage, low temperature stage and pulling stage to
observe phase transition and transformation under different conditions.
9. The extensiveness of the instrument is good; users can carry out multi-function analysis by
adding different signal detecting devices, e.g. X-ray energy spectrometer can be used to do
micro-area components analysis, or qualitative and quantitative analysis of components in
different micro-areas of specimen.
10. Windows operating system; the operation interface is friendly, succinct, and easy to master;
the image is displayed on the same screen, and can be zoomed out orzoomed in; the maximum
image resolution is 4096*4096*24; USB2.0 standard communication interface for the
peripheral equipment and supports hot plug.
11. The pre-installed image processing software supports multiple universal image formats and
the conversion between different image formats; the optional image processing software
strengthens a series of image processing functions, such as particle analysis.
1.1.2. Main Purpose and Scope of Application
Scanning Electron Microscope (SEM) can be used for ceramic material analysis and metallic
material failure analysis. SEM can also be widely used in other fields such as petroleum, geology,
mineral, electron, semiconductor, medicine, biology, chemical industry, macromolecular material,
criminology, agriculture and forestry, etc.
SEM can be used for microstructure analysis, and normal micro-area analysis, including
quantitative and qualitative analysis of components. For microstructure analysis, spatial resolution
can reach to submicron grade. State measurement of grain boundary, phase identification of

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crystal/crystal grain, and crystallographic orientations measurement can also be carried out by use
of SEM. When making micro-area components analysis, element distribution measurement can be
carried out by rapid multi-element mapping and line scan.
In modern industrial production and scientific research, SEM becomes one of the necessary
methods of material analysis, industrial and agricultural process control, quality control and safety
production. Meanwhile, the application of SEM are changing rapidly in the fields of human survival
and development, such as biology, environmental protection and medicine.
1.1.3. Product Name & Model
Product name: Scanning ElectronMicroscope
Product model: A63.7069
1.1.4. Using Condition
1.1.4.1. Environmental Condition
Temperature 16℃-25℃Temperature change ≤1℃/h
Relative humidity ≤70％(25℃)
Floor load ≥246Kg/m2
1.1.4.2. Working Condition
❖ Power Supply
Single-phase 220V±22V, 50±1Hz, 16A power supply
Stability of power supply ±5％
Independent ground
Groundingresistance ≤4Ω
Caution: it is suggested to equip one set of 3KVA AC voltage stabilizer to avoid the strong
disturbance of powernetwork.
❖ Other Working Conditions
Vibration ≤3μm
Space magnetic field ≤ 3m Gauss

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1.1.4.3. InstallationCondition
Laboratory Floorplan
Electrical Outlet (16A)
1.1.5. Influence on Environment and Energy Sources
❖ The X-ray radiations conform to the national standard and will not influence
environment and energy sources.
1.1.6. Safety
❖ The safety of A63.7069 conforms to the requirements of the national safety standards
of instruments.

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1.2. Structure Feature and Operating Principle
1.2.1. General Structure
The interaction of between a certain energy electron beam and sample, will produce various
physical signals. The SE detector collects and amplifies secondary electronic signal, then transmit
the signal to electrics console, converts to digital signal. Finally, the computer receives the signal
and form an image. The main structure of A63.7069 are electron optics column, chamber,
automatic vacuum system, electronics and display console, etc.
1.2.2. Electron Optics Column
A63.7069 electron optics column can produce and focus electron beam to form a fine spot on
specimen. The electron optics column consists of electron gun, electromagnetic beam alignment
system, dual condenser lenses, column isolation valve (V1), objective lens, scanning coil assembly,
stigmator and electron detector. The system has one set of electromagnetic shielding column
outside the optical path, which can eliminate the electromagnetic interference from the
environment.
1.2.2.1. Electron Gun
❖ Electron gun is a high brightness electron source, which is a self-biased triple structure. The
filament tip, wehnelt cap hole center and anode hole center are coaxial for the result of
highest brightness. The distance between anode and wehnelt cap is adjustable for high or
low accelerating voltage. Three screws above electron gun are used to adjust the position of
electron gun in order to realize filament alignment (mechanical alignment).
1.2.2.2. Electromagnetic Beam Alignment System
❖ In daily work, the mechanical alignment can not ensure strict alignment of electron beam,
so electromagnetic beam alignment system is also adopted to ensure coincidence of electron
beam and the optical axes. The control of electromagnetic beam alignment system can be
adjusted by software. (Refer to Section 3.4.12. Control Panel of Basic Function for Beam
Alignment.)
1.2.2.3. Dual Condenser Lenses
❖ Electron optics column includes two same condenser lenses. The pole pieces of the two
condenser lenses are installed on the two ends of one cylinder and share one coil. For the
reasons of convenient cleaning and vacuum sealing, a metal liner is set in the middle of
condenser lens. When working normally, inside the liner is vacuum state, outside the liner is

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atmosphere. Thus, when cleaning electron optics path, there is no need to disassemble the
condenser lens; but only take out the liner for cleaning, and then replace the aperture which
is installed under the bottom of the liner. When cleaning, the liner should be drawn out from
the top of optical path.
1.2.2.4. Column Isolation Valve (V1)
❖ Column V1 is a manually operated vacuum valve, which is installed between condenser lens
and objective lens. This valve separates column from chamber. So, when replacing specimen,
the chamber is in atmosphere, the column can still keep in vacuum state. When opening V1
valve, the high voltage interlock function is started at the same time.
1.2.2.5. Objective Lens
❖ Objective lens is asymmetrical, with long working distance, low spherical aberration and small
magnetic leakage. The bottom pole piece of objective lens can be dismounted without any
influence on original state of scanning coil.
❖ The final apertures are installed between top and bottom pole piece of objective lens. Three
apertures can be installed in the final aperture holder, diameter of aperture is usually 100μm
or 200μm (customers can choose other diameters according to actual needs). The X-direction
and Y-direction adjusting devices of final aperture are installed on right front of the chamber.
The adjusting device can help users to select final aperture according to actual needs and align
it with electron beam. The final aperture influences depth of focus, resolution and electron
beam current.
1.2.2.6. Scanning Coil Assembly
❖ Scanning coil assembly is installed inside of objective lens to make the electron beam deflect
on the surface of specimen along X direction and Y direction.
❖ When observing images at high magnification, the operator usually needs to move the ROI
(region of interest) image. This can be completed by scan shift, which is realized by
changing DC level on scanning coil X and Y.
1.2.2.7. Stigmator
❖ The stigmator is installed inside of the scanning coil assembly and can correct astigmatism
quickly.
❖ The adjustment of stigmator is realized by the software.
1.2.2.8. Electron Detector
❖ Electron detector of can collect low-energy secondary electrons (SE). A positive voltage
biased on the collect grid which is mounted in front of detector, can attract low-energy SE to
detector. A positive 12KV potential biased on the scintillator accelerates SE. The photon
produced by scintillator enters into the window of photomultiplier, and output video signal.
1.2.2.9. Accessories
❖ Standard accessories which can be installed on A63.7069 are X-Ray Energy Dispersive
spectrometer (EDS), X-ray wave dispersive spectrometer, Cathodoluminescence
spectrometer, etc. Currently, EDS is the most popular accessory of SEM.
❖ EDS consists of detector and analysis system, which can realize the identification and
quantification of the specimen.

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1.2.3. Specimen Chamber and Specimen Stage
❖ The specimen chamber is mounted to the vibration isolated frame. Vacuum system is installed
under chamber, which electron optics column is installedabove chamber. The specimen stage
is installed in the front of chamber. Vent of chamber will not influence vacuum status of
other parts. The chamber provides a big working area for specimen. Meanwhile, it is
convenient for accessory installation.
1.2.3.1. Specimen Chamber
❖ The inner diameter of standard specimen chamber is Φ156mm; inlet diameter of the
chamber is Φ153mm; the height of the chamber is 284mm.
❖ The chamber can be equipped with various stages and detectors, such as X-ray wave
dispersive spectrometer, X-ray energy dispersive spectrometer, Cathodoluminescence
spectrometer, backscattered electrons detector, SE detector and other experimental
instrument.
1.2.3.2. Standard Specimen Stage
The standard specimen stage is applied to standard chamber. The range of movement is as
follows:
❖ Horizontal: X = Y =50mm;
❖ Vertical: Z =25mm;
❖ Tilt= -5° ~ +90°
❖ Rotation = 360°continuously
For the needs of reduce vibration, specimen stage can be locked with specimen chamber by the
interlock device.
1.2.3.3. Accessories of Standard Chamber
❖ High temperature stage, low temperature stage and tensile stage can be installed in standard
chamber for observing the state changes of specimen in different conditions.
1.2.4. Automatic Vacuum System
The electron optical column and chamber must work on certain vacuum state. The realization
and control of vacuum state can be completed by vacuum system. The automatic vacuum system
is installed under chamber, and directly connected with column through vacuum pipeline, which
is shown below:

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The automatic vacuum system mainly includes Turbo Molecular Pump, Mechanical Pump, Cold
Cathode Gauge, connecting pipeline, damping device, various valves, and various gauges etc.
More details are asfollows:
❖ Turbo Molecular Pump is used to acquire high vacuum for the system.
❖ Mechanical pump is used to acquire low vacuum for the system and foreline vacuum for
Turbo Molecular Pump.
❖ Connecting pipeline is used for the connections between vacuum components.
❖ Various valves are used for vacuum control. e.g., V1 and V3 can separate electron gun from
chamber; when the chamber is venting, the electron gun can keep in vacuum state; V2 is
used to acquire low vacuum in chamber and TMP. When V3 is open, it can also acquire low
vacuum of electron gun at the same time.
❖ Cold Cathode Gauge (CCG) measure vacuum in real time and assist valves to realize vacuum
control.
❖ Air compressor supplies power to each pneumatic valve.
The vacuum control part is installed on the rear of main frame. The whole process from low
vacuum to high vacuum is fully automatically controlled by software. The system can realize the
vacuum real-time measurement and can be displayed on the software interface.
Operations of vacuum system are very simple: the operators only need to press buttons on the
software interface, the vacuum system can work automatically. The system can also be operated
in manual mode while beingmaintained.
High voltage interlock is realized by opening and closing V1 and TMP in order to avoid damage of
instrument by high voltage discharge when the vacuum is low.
Caution: When using LaB6 electron gun, ion pump must be installed on the pipeline through
vacuum system to the column. The vacuum of electron gun can reach 1.0*10-10 Torr in normal
working
condition, which can ensure the high brightness and long lifetime of LaB6 electron source.

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1.2.5. Electronics and Display Console
Electronics and display console consists of electronics console, computer system , which is used
to control various functions of A63.7069, observe image of specimen and take photos, etc.
The main switch on the control console is the switch of the vacuum system. The switch on the
main frame is the switch of Electronics Console. Turn off the main switch will cut off the power
supply of Electronics Console and vacuum system.
1.2.5.1. Electronics Console
❖ Electronics console includes circuit boards with various functions and power supplies. It is
controlled by software manually; Details are shown in 3.4 ControlPanel.
❖ The power supply of computer is AC 220V.
1.2.5.2. Computer System
❖ Computer operating system of A63.7069 is Windows system. The system use USB2.0
communication interface and supports hot plug.
❖ The operating software have been installed in computer and supports multi-language, which
is simple, kindly and easy to use, with low system resources occupancy and high stability.
❖ The image control system supports same screen display, combined image display with SEM
control, which are convenient to users. The scanning area can be zoomed according to
different scales to fully satisfy the requirements of observation.
❖ The default image pixel is 1024*768*24, and support various modes to choose. The scale
and format of image is fully compatible with popular style. Support outputting or printing,
and conversion between different image formats. The software has been pre-installed
universal image processing functions, which is convenient to use.
❖ In addition, the SEM operation software also provides automatic control functions, including
auto focus, auto stigmator correction, and auto brightness/ contrast. Especially after adopting
new algorithm, the accuracy, precision, adaptability and reliability, are improved greatly.
❖ In the condition of low signal-to-noise ratio, auto functions still can worknormally.
❖ Image processing software (optional software) can supply more image processing function. It
supports the processing of various universal image format and conversions between different
image formats. The software supplies and improves some new functions of image processing,
such as particle analysis etc.

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1.3. Technical index
Note: The detailed configuration subject to the contract
❖ Resolution: 3nm@30KV (SE);
❖ Secondary Electron Image
❖ Magnification: 8x -300,000x;
❖ Acceleratingvoltage: 0～30KV
❖ Electron gun: Self-biased triode tungsten cathode
❖ Lens system: 3 stage lenses
❖ Objective lens aperture: 3 selectable
❖ Vacuumsystem: Turbo Molecular Pump
❖ Specimen stage
Horizontal X = 70mm, Y=50mm,
Vertical Z=45mm ,
Tilt= -5°~ +90°
Rotation =360°continuously
❖ Image acquisition mode: Various resolution selectable, Active selection scan, Line scan, Spot
scan, Dual channels.
❖ Image scanning speed: 500ns~80μs
❖ Image output: Support various image format output and printer output, BMP, JPG, TIFF, TGA,
PNG. (*.sem, special format, can be used in Image processing software.)
❖ Auto function: auto-focus, auto-brightness/contrast, auto-stigmator, auto-filament.
❖ High performance computer, Windows system, USB2.0 communication interface. A63.7069
SEM control software, SemIamge (optional).
❖ Main frame size: 800*800*1380(mm)
❖ Electron console size: 600*800*1600(mm)
❖ Total Weight: 550Kg

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2. Operation Procedure
2.1. Start up Procedures
❖ Turn on Mechanical pump and Air compressor (make sure V1 is closed). The pressure of
compressor should over 4kgf/cm2 (0.4MPa).
❖ Turn on Main switch and Main frame switch.
❖ Switch “AUTO/MAN” to “AUTO” at the vacuum control panel which has been installed in the
rear part of Main frame.
❖ Turn on Computer, run the software of SEM.
❖ The password of windows operation system is “sem”.
❖ Click the [Start] button, the color of Start button will turn red, the vacuum system will come
into the working status (V2 will be turned on)
❖ After the indicator lamp of V2 V3 TMP went on, vacuum system come into the high vacuum
working status. About 5 mins the vacuum indication turns green, the system can begin to
work. At this moment, the display of vacuum will reach over 3.0*10-5 Torr.

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2.2. Operation of Acquire an image
❖ Open V1, indicator lamp is on.
❖ After V1 is on, the Contrast scrollbar turns into adjustable status. About 2s later, HV, Bias and
Filament turn into adjustable status.
❖ Adjust HV slowly, especially over 10KV. Generally, for the sample which has good electrical
conductivity, HV can be adjust to the range of 20-30KV; for the sample which has low
electrical conductivity, HV should be adjust to the range of 10-20KV.
❖ Adjust Contrast, until some “small white point” display on the screen, or adjust the
contrast value to approximately 50.

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❖ Adjust Filament current
The range of filament current is 0 –3A. User can drag the slider to adjust the filament current.
When the current value increased to about 2A, the display of Beam Current begin to increase
slowly. When the current over 2.3A, please increase the filament current slowly, and pay
attention to observe the image at the same time. If the luminance of image does not change, that
means filament current is saturated, and it is no need to increase again. The recommended value
of saturation value of filament current is among 2.4-2.6A. When finish the work, the filament
current should be adjusted to 0A.
We suggest that: at the range of 0A to 2A, the speed of filament adjustment should be controlled
lower than 0.25A/s; at the range of 2A to saturated point, the speed of filament adjustment should
be controlled lower than 0.1A/s.
Generally, Beam Current should be about 200 and can be controlled by Bias adjustment. If Beam
current is too high, it is necessary to adjust the Bias value. If is too low, it is needs to readjust the
installed position of filament. We provide two kinds of shims (its thickness are 0.3mm and 0.1mm)
for the filament position adjustment. The position of filament is 0mm without shim. The suggestion
position is between 0.4 –0.7mm. The user can mount the shim to adjust the filament position.
❖ Adjust Beam Alignment
Drag the slider in X and Y direction, to make sure image is brightest.
❖ Image focus
Adjust Objective Lens, can make the image focus clearly. According to actual requirements,
system provide three level adjustment, Coarse, Fine and Tiny.

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2.3. Specimen Changing Procedures
❖ Click the [OFF] button, the value of HV, Bias, Filament and Contrast will return to zero.
❖ Close V1, click the [Chamber] button, the color of button will change to YELLOW, V4 will be
opened. About 3-5 minutes later, pull out sample stage, change a sample, push the stage in,
click the [Chamber] button again, the color of Chamber button will change to grey, system will
pump the low vacuum, and the vacuum value will displayed on control panel.
 NOTE: Before pumping, check the O-ring.
❖ After pumping the low vacuum, V3 and TMP will be opened, system will pump the high
vacuum automatically. When the color of vacuum changes to GREEN, SEM can begin to
work. It is recommended to start working after vacuum degree is better than 5.0*10-5Torr,
otherwise the filament life will be affected.

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2.4. Filament changing procedures
❖ If the screen turn to black suddenly and the indicator of filament value return to zero, that
means filament is broken, it’s time to change a new filament.
❖ Click the [OFF] button, the value of HV, Bias, Filament and Contrast will return tozero.
❖ Close V1, click the [Gun] button, the color of button will change to YELLOW, V3 and V4 will
be opened.
❖ About 3-5 minutes later, open the Gun chamber and take out the Wehnelt Cap, dismantle the
filament, change a new one. Then, install the Gun cap, click the [Gun] button again, the color
of Gun button will change to grey, V2 and V3 is opened, system will pump the low vacuum.
When TMP is opened, system will pump the high vacuum, until the color of vacuum turns to
GREEN, SEM can begin to work. It is recommended to start working after vacuum degree is
better than 5.0*10-5Torr, otherwise the filament life will be affected.
 NOTE: After changing filament, please readjust the GUN Tilt (the mechanical position of
electron gun).
 NOTE: Before pumping, check the O-ring.

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2.5. SEM Shutdown Procedures
❖ Click the [OFF] button, the value of HV, Bias, Filament and Contrast will return tozero.
❖ Close V1.
❖ Click the [Start] button, the color of Start will turn Grey.
❖ Close the software and shutdown the computer.
❖ Turn off the main frame switch (the switch of electronics console).
❖ Turn off the Main Switch.
❖ Turn off the power supply of Mechanical Pump and Air Compressor.
 NOTE: Before turn off the main frame switch, the software should be closed.

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3. Scanning Control Window of A63.7069
❖ Double click the icon on the desktop, will start the software.
❖
The scanning window mainly includes title bar, menu bar, shortcut toolbar and three areas:
Scanning Area, Thumb and log Area, Control Panel Area.
3.1. Title Bar
❖ The title bar is at the top of window. The contents from left to right are as follow: program
icon, program name and window name. The window name of scanning window is SemScan.
3.2. Menu Bar
❖ Items of all menu bar are shown as follows, comply with the Windows operating system
application rules.The menu includes all operations of software, commonly used functions can
be found in the shortcut toolbar.
3.3. Shortcut Toolbar
❖ Each shortcut button on shortcut toolbar has corresponding to menu item. Click the
“menu >view”can display or hide the shortcut toolbar.