Panasonic DMR-E53EG, DMR-E55EB, DMR-E55E User manual

Service Manual
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ORDER NO.DSD0403001C8
DVD Video Recorder
●DMR-E53EG
DMR-E55EB
DMR-E55EG
DMR-E55EBL
DMR-E55EP
Colour
(K).......................Black Type
(S).......................Silver Type

© 2004 Matsushita Electric Industrial CO., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
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Table Of Contents
COVER
1 Safety precautions
1.1 General guidelines
1.1.1 Leakage current cold check
1.1.2 Leakage current hot check (See Figure 1 .)
2 Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices
3 Precaution of Laser Diode
4 Handling the Lead-free Solder
4.1 About lead free solder (PbF)
5 Each Buttons
6 Taking out the Disc from RAM-Drive Unit when the Disc cannot be ejected by OPEN / CLOSE
button
6.1 Forcible Disc Eject
6.1.1 When the power can be turned off.
6.1.2 When the power can not be turned off.
6.2 When the Forcible Disc Eject can not be done.
7 Service Explorer
8 Self-Diagnosis and Special Mode Setting

8.1 Self-Diagnosis Functions
8.2 Special Modes Setting
8.3 Service Modes
9 Assembling and Disassembling
9.1 Disassembly Flow Chart
9.2 P.C.B. Positions
9.3 Top Case
9.4 Digital P.C.B.
9.5 Front Panel
9.6 Front (R) P.C.B.
9.7 DVD-RAM Drive
9.8 Rear Panel
9.8.1 Only Fan Motor
9.9 Main P.C.B.
9.10 Power P.C.B.
9.11 The Scart P.C.B.
9.12 VIF Decoder P.C.B. and Nicam Decoder P.C.B.
10 Service Fixture and Tools
11 Service Positions

11.1 Checking and Repairing of Power P.C.B.
11.2 Checking and Repairing of Main P.C.B.
11.3 Checking and Repairing of Digital P.C.B.
11.4 Checking and Repairing of DVD-RAM Drive
12 Adjustment Procedures
12.1 After replacing the RAM Drive with new one
12.2 When the unit does not operate normally after replacing the Timer Microprocessor with new one
13 Standard Inspection Specifications after Making Repairs
14 Voltage and Waveform Chart
14.1 Power P.C.B.
14.2 Main P.C.B.
14.3 Nicam Decoder P.C.B.
14.4 Scart P.C.B.
14.5 Front (R) P.C.B.
14.6 P9001 Connector
14.7 Waveform Chart
15 Abbreviations
16 Block Diagram
16.1 Power Supply Block Diagram

16.2 Analog Video Block Diagram
16.3 Analog Audio Block Diagram
16.4 Timer Block Diagram
16.5 Digital Block Diagram
16.6 Digital Block IC Pin Terminal Chart (TC1-18)
17 Schematic Diagram
17.1 Interconnection Schematic Diagram
17.2 Main Power Supply Schematic Diagram
17.3 Sub Power Supply Section (Main P.C.B. (1 / 5)) Schematic Diagram (P)
17.4 Main Net Section (Main P.C.B. (2 / 5)) Schematic Diagram (M)
17.5 Video I / O Section (Main P.C.B. (3 / 5)) Schematic Diagram (V)
17.6 Audio Main Section (Main P.C.B. (4 / 5)) Schematic Diagram (A)
17.7 Timer Section (Main P.C.B. (5 / 5)) Schematic Diagram (T)
17.8 Glue Net Section (Digital P.C.B. (1 / 4)) Schematic Diagram (GN)
17.9 AV Encoder / Real Time Stream Control (RTSC) Section (Digital P.C.B. (2 / 4)) Schematic
Diagram (EN)
17.10 AV Decoder / Main CPU Section (Digital P.C.B. (3 / 4)) Schematic Diagram (MC)
17.11 Audio I / O Section (Digital P.C.B. (4 / 4)) Schematic Diagram (AI)
17.12 VIF Decoder Schematic Diagram (For DMR-E55EB / EBL / EP)
17.13 VIF Decoder Schematic Diagram (For DMR-E53EG and DMR-E55EG)

17.14 Nicam Decoder Schematic Diagram
17.15 Scart Schematic Diagram
17.16 Front (R) Schematic Diagram
18 Print Circuit Board
18.1 Power P.C.B.
18.2 Main P.C.B.
18.2.1 Main P.C.B. (1 / 4 Section)
18.2.2 Main P.C.B. (2 / 4 Section)
18.2.3 Main P.C.B. (3 / 4 Section)
18.2.4 Main P.C.B. (4 / 4 Section)
18.2.5 Main P.C.B. Address Information
18.3 Digital P.C.B.
18.3.1 Digital P.C.B. (Component Side)
18.3.2 Digital P.C.B. (Foil Side)
18.3.3 Digital P.C.B. Address Information
18.4 VIF Decoder P.C.B. (For DMR-E55EB / EBL / EP)
18.5 VIF Decoder P.C.B. (For DMR-E53EG and DMR-E55EG)
18.6 Nicam Decoder P.C.B.
18.7 Scart P.C.B.

18.7.1 Scart P.C.B. (Section 1 / 2)
18.7.2 Scart P.C.B. (Section 2 / 2)
18.8 Front (R) P.C.B.
19 Exploded Views
19.1 Casing Parts & Mechanism Section 1
19.2 Casing Parts & Mechanism Section 2
19.3 Packing & Accessories Section
20 Replacement Parts List
21 Schematic Diagram for printing with A4
PV

1 Safety precautions
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1.1 General guidelines
1.1.1 Leakage current cold check
1.1.2 Leakage current hot check (See Figure 1 .)
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1.1 General guidelines
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1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which
have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation
papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being
exposed to shock hazards.
1.1.1 Leakage current cold check
1.1.2 Leakage current hot check (See Figure 1 .)
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1.1.1 Leakage current cold check
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1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each
exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts,
etc. When the exposed metallic part has a return path to thechassis, the reading should be
between 1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
.
Figure 1
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1.1.2 Leakage current hot check
(See Figure 1 .)
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1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15μF capacitors, between each exposed
metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across
the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson
Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed
1/2 milliampere. In case a measurement isoutside of the limits specified, there is a possibility of a
shock hazard, and the equipment should be repaired and rechecked before it is returned to the
customer.
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2 Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices
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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistor-sandsemiconductor "chip" components. The following
techniques should be used to help reduce the incidence of component damage caused by electrostatic
discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped
assembly, drain off any ESD on your body by touching a known earth ground. Alternatively,
obtain and wear a commercially available discharging ESD wrist strap, whichshould be removed
for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a
conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of
the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as
"anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage
ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you
are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted
together by conductive foam, aluminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise
hamless motion such as the brushing together of your clothes fabric or the lifting of your foot
from a carpeted floor can generate static electricity sufficientto damage an ES device).
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3 Precaution of Laser Diode
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4 Handling the Lead-free Solder
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4.1 About lead free solder (PbF)
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4.1 About lead free solder (PbF)
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Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
●Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 -
70°F (30 - 40°C) higher. Please use a high temperature soldering iron. In case of the soldering
iron with temperature control,please set it to 700 ± 20°F (370 ± 10°C).
●Pb free solder will tend to splash when heated too high (about 1100°F/600°C).
●When soldering or unsoldering, please completely remove all of the solder on the pins or solder
area, and be sure to heat the soldering points with the Pb free solder until it melts enough.
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5 Each Buttons
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6 Taking out the Disc from RAM-Drive Unit when
the Disc cannot be ejected by OPEN/ CLOSE
button
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6.1 Forcible Disc Eject
6.1.1 When the power can be turned off.
6.1.2 When the power can not be turned off.
6.2 When the Forcible Disc Eject can not be done.
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