Panasonic KX-TS3MXB User manual

© 2001 Kyushu Matsushita Electric Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TS3MXB
KX-TS3MXF
KX-TS3MXP
KX-TS3MXR
KX-TS3MXW
Integrated Telephone System
Black Version
Skeleton Blue Version
Skeleton Pink Version
Red Version
White Version
(for Asia, Middle Near East and Other areas)
Telephone Equipment
ORDER NO. KM40103772C3

1 LOCATION OF CONTROLS 3
2 CONNECTION 4
3 OPERATIONS 5
3.1. Making Calls 5
3.2. Answering Calls 5
4 SPECIAL FEATURES 5
4.1. For Call Waiting Service Users 5
4.2. Temporary Tone Dialing (For Rotary or Pulse Service
Users) 5
5 DISASSEMBLY INSTRUCTIONS 6
6 HOW TO REPLACE FLAT PACKAGE IC 7
6.1. Preparation 7
6.2. Procedure 7
6.3. Modification Procedure of Bridge 7
7 CPU DATA 8
8 TERMINAL GUIDE OF IC’S TRANSISTORS AND DIODES 9
9 IC BLOCK DIAGRAM 10
10 OPTION JUMPER TABLE 10
10.1. Dialing Mode SW 10
10.2. Flash Key 10
11 BLOCK DIAGRAM (IC2) 10
12 CIRCUIT OPERATIONS 11
12.1. Telephone Line Interface and Pulse Dial Circuit 11
12.2. Tone Dial Circuit 11
12.3. Ringer Circuit 12
12.4. Power Circuit and Redial Back-up Circuit 12
12.5. Sending Circuit (Tx) 12
12.6. Receiving Circuit (Rx) 12
13 TROUBLE SHOOTING GUIDE 13
13.1. Service Hints 13
13.2. Pulse Dialing Problems 13
13.3. Problems With the Handset 14
13.4. Tone Dialing Problems 14
13.5. Problems With Ringer 15
13.6. How to Check the IC1 (Scanning to the key) 15
14 CABINET AND ELECTRICAL PARTS LOCATION 16
15 ACCESSORY AND PACKING MATERIALS 17
16 REPLACEMENT PARTS LIST 18
16.1. Base Unit 18
16.2. ACCESSORIES AND PACKING MATERIALS 19
17 FOR SCHEMATIC DIAGRAM (SCHEMATIC DIAGRAM) 20
18 CIRCUIT BOARD AND WIRING CONNECTION DIAGRAM 21
18.1. Component View 21
18.2. Flow Solder Side View 22
19 SCHEMATIC DIAGRAM 23
CONTENTS
Page Page
2
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW

1 LOCATION OF CONTROLS
3
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW

2 CONNECTION
4
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW

3 OPERATIONS
3.1. Making Calls
3.1.1. To redial the last number dialed
3.2. Answering Calls
4 SPECIAL FEATURES
4.1. For Call Waiting Service Users
4.2. Temporary Tone Dialing (For Rotary or Pulse Service Users)
5
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW

5 DISASSEMBLY INSTRUCTIONS
Ref. No. Procedure Shown in Fig —. To remove —. Remove —.
1 1 1 Lower Cabinet Screws (2.6 × 10) . . . . . . . . . ....(A)×5
21~2 2 Printed Circuit Board Remove the P.C.Board
6
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW

6 HOW TO REPLACE FLAT PACKAGE IC
6.1. Preparation
• • SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
•
• Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ±50°F (350 ± 10°C)
(An expert may handle between 60 ~ 80 W iron, but beginner might damage foil by overheating.)
•
• Flux
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
6.2. Procedure
1.Temporary fix FLAT PACKAGE IC by soldering on two marked 2 pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil.
2.Apply flux for all pins of FLAT PACKAGE IC.
3.Solder employing specified solder to direction of arrow, as sliding the soldering iron.
6.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2.Remove remained solder along pins employing soldering iron as shown in below figure.
7
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW

7 CPU DATA
8
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW

8 TERMINAL GUIDE OF IC’S TRANSISTORS AND DIODES
9
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW

10.2. Flash Key
9 IC BLOCK DIAGRAM
10 OPTION JUMPER TABLE
10.1. Dialing Mode SW
IC1
SW Position
Pin 13 LOW →Tone dialing
Pin 13 High →Pulse dialing 10 pps
Flash time Option
100 ms JP 4
600 ms JP 5 default
11 BLOCK DIAGRAM (IC2)
10
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW