Panasonic KX-TS600MXB User manual

© 2005 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TS600MXB
KX-TS600MXW
Integrated Telephone System
White Version
(for Asia, Middle Near East and other areas)
Telephone Equipment
ORDER NO. KM40509874CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 3
1.1. Suggested PbF Solder 3
1.2. How to recognize that Pb Free solder is used 4
2 FOR SERVICE TECHNICIANS 4
3 CAUTION 4
4 OPERATING INSTRUCTIONS 5
4.1. Battery 5
4.2. Location of Controls 7
4.3. Display 8
4.4. Connection 9
4.5. Dial Lock 11
4.6. Troubleshooting 12
5 DISASSEMBLY INSTRUCTIONS 14
6 TROUBLESHOOTING GUIDE 15
6.1. Service Hints 15
6.2. Pulse Dialing Problems 15
6.3. Tone Dialing Problems (Handset) 16
6.4. No Ringing Sound When Ring Signal is Input 16
7 BLOCK DIAGRAM 17
8 CIRCUIT OPERATION 18
8.1. Bell Detector Circuit 18
8.2. Line Interface 18
8.3. MODULE BLOCK DIAGRAM 18
8.4. Caller ID Detect Circuit 21
9 BLOCK DIAGRAM 22
9.1. IC903 22
9.2. CPU DATA (IC903) 23
9.3. RINGER IC (IC1) 25
9.4. EEPROM (IC802) 26
9.5. Speakerphone IC Data (IC601) 27
10 MODULE BLOCK DIAGRAM 28
10.1. LCD MODULE BLOCK 28
10.2. CONNECTOR PIN ASSIGNMENT 28
11 HOW TO REPLACE THE FLAT PACKAGE IC 29
11.1. PREPARATION 29
11.2. FLAT PACKAGE IC REMOVAL PROCEDURE 29
11.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 30
11.4. BRIDGE MODIFICATION PROCEDURE 30
12 CABINET AND ELECTRICAL PARTS 31
13 ACCESSORIES AND PACKING MATERIALS 32
14 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
33
15 REPLACEMENT PARTS LIST 34
15.1. Base Unit 34
16 FOR SCHEMATIC DIAGRAM 39
17 SCHEMATIC DIAGRAM (MAIN) 40
18 SCHEMATIC DIAGRAM (OPERATION) 42
19 CIRCUIT BOARD (MAIN) 43
19.1. Component View 43
19.2. Flow Solder Side View 44
20 CIRCUIT BOARD (OPERATION) 45
20.1. Component View 45
20.2. Flow Solder Side View 46
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page Page
2
KX-TS600MXB / KX-TS600MXW

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
3
KX-TS600MXB / KX-TS600MXW

1.2. How to recognize that Pb Free solder is used
(Example: Operation P.C.B.)
CN801
MIC
17
18
1
2
PQUP11371Z
A
PbF
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1.Cover the plastic parts boxes with aluminum foil.
2.Ground the soldering irons.
3.Use a conductive mat on the worktable.
4.Do not touch IC or LSI pins with bare fingers.
3 CAUTION
1.Danger of explosion if battery is incorrectly replaced.
2.Replace only with the same or equivalent type recommended by the manufacturer.
3.Dispose of used batteries according to the manufacture’s Instructions.
4
KX-TS600MXB / KX-TS600MXW

4 OPERATING INSTRUCTIONS
4.1. Battery
4.1.1. Installing the Batteries
5
KX-TS600MXB / KX-TS600MXW

4.1.2. Battery Replacement
6
KX-TS600MXB / KX-TS600MXW

4.2. Location of Controls
7
KX-TS600MXB / KX-TS600MXW

4.3. Display
8
KX-TS600MXB / KX-TS600MXW

4.4. Connection
4.4.1. Connecting the Handset/Telephone Line Cord
9
KX-TS600MXB / KX-TS600MXW

4.4.2. Connecting a Communication Device
10
KX-TS600MXB / KX-TS600MXW