Peak PCAN-Chip USB User manual

PCAN-Chip USB
Stamp Module for the Implementation
of CAN FD to USB Connections
User Manual
Document version 1.3.0 (2020-03-24)

PCAN-Chip USB – User Manual
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Relevant products
Product Name Part number
PCAN-Chip USB IPEH-004025
PCAN-Chip USB Eval IPEH-004025-EVAL
The cover picture shows the stamp module PCAN-Chip USB (two times) and the
affiliated evaluation board.
CANopen®and CiA®are registered community trade marks of CAN in Automation
e.V.
All other product names mentioned in this document may be the trademarks or
registered trademarks of their respective companies. They are not explicitly marked
by “™” and “®”.
© 2020 PEAK-System Technik GmbH
Duplication (copying, printing, or other forms) and the electronic distribution of this
document is only allowed with explicit permission of PEAK-System Technik GmbH.
PEAK-System Technik GmbH reserves the right to change technical data without
prior announcement. The general business conditions and the regulations of the
license agreement apply. All rights are reserved.
PEAK-System Technik GmbH
Otto-Roehm-Strasse 69
64293 Darmstadt
Germany
Phone: [phone]
Fax: [phone]
www.peak-system.com
[e-mail]
Document version 1.3.0 (2020-03-24)

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Contents
1 Introduction 5
1.1 Properties of the PCAN-Chip USB at a Glance 5
1.2 Properties of the PCAN-Chip USB Evaluation
Board at a Glance 6
1.3 System Requirements for the Operation of the
Evaluation Board 7
1.4 Scope of Supply PCAN-Chip USB 7
1.5 Scope of Supply PCAN-Chip USB Eval 8
2 External Circuits Stamp Module 9
2.1 Connectors 9
2.2 Synchronization of Several Stamp Modules 12
2.3 CAN Transceiver Type Detection 13
2.4 Additional Notes 13
3 Stamp Module Mounting 15
3.1 Dimensions and Contacts Stamp Module 15
3.2 Layout on the Target System 16
3.3 Handling and Soldering 20
4 Installing Software and Starting the Hardware 21
5 Components of the Evaluation Board 23
5.1 USB (Supply Voltage) 23
5.2 Status LEDs 24
5.3 CAN Connector 26
5.4 Internal Termination of the High-speed CAN
Bus 27
5.5 Connector for Time Stamp Synchronization 28
5.6 Prototyping Area 29

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5.7 Reset Button 30
5.8 Mounting Holes (Dimension Drawing) 31
6 Software and API 32
6.1 Monitoring Software PCAN-View 32
6.1.1 Receive/Transmit Tab 35
6.1.2 Trace Tab 37
6.1.3 PCAN-CHIP USB Tab 38
6.1.4 Bus Load Tab 39
6.1.5 Error Generator Tab 40
6.1.6 Status Bar 42
6.2 Linking Own Programs with PCAN-Basic (Version
4 or Higher) 43
6.2.1 Features of PCAN-Basic 44
6.2.2 Principle Description of the API 45
6.2.3 Notes about the License 46
7 Technical Specifications 47
7.1 Stamp Module 47
7.2 Evaluation Board 48
Appendix A Dimension Drawing Cut Tape 50
Appendix B Schematic of the Evaluation Board 51
B.1 Overview 52
B.2 CAN 53

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1 Introduction
For custom hardware designs a CAN connection can be imple-
mented with the stamp module which communicates via USB 2.0
with the hardware. The integrated CAN controller supports the
protocols CAN 2.0 A/B as well as CAN FD. The physical CAN
connection is determined by external wiring. The stamp module
with its single-sided mounting and plated half-holes is suitable for
automatic assembly.
The optional PCAN-Chip USB Eval board simplifies the develop-
ment of a custom board based on the stamp module. The board is
equipped with the CAN transceiver NXP TJA1044GT.
In addition to the documentation for the integration of the stamp
module, the scope of supply of the PCAN-Chip USB includes licen-
ses for the Windows and Linux device drivers, for the CAN monitor
PCAN-View, and for the PCAN-Basic API.
Note: This user manual refers to the PCAN-Chip USB and the
optional developer board PCAN-Chip USB Eval.
1.1 Properties of the PCAN-Chip USB at a
Glance
High-Speed-USB 2.0 (compatible with USB 1.1 and 3.0)
FPGA implementation of the CAN FD controller
Complies with CAN specifications 2.0 A/B and FD
CAN FD support for ISO and Non-ISO standard switchable
Measurement of bus load including error frames and overload
frames on the physical bus

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Induced error generation for incoming and outgoing CAN
messages
100-percent compatible with the USB device drivers and the
software from PEAK-System
Connections for 2 status LEDs
Voltage supply 3.3 V DC
Firmware update via USB
Dimensions: 25 x 20 mm
Extended operating temperature range of -40 to +85 °C
(-40 to +185 °F)
1.2 Properties of the PCAN-Chip USB
Evaluation Board at a Glance
CAN bus connection via D-Sub, 9-pin (in accordance with
CiA®303-1)
CAN transceiver NXP TJA1044GT
USB connector type B, standard ESD protection
Dual-color LED for CAN status and power supply
Power supply via USB
Extended operating temperature range of -40 to 85 °C
(-40 to 185 °F)

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1.3 System Requirements for the Operation
of the Evaluation Board
A free USB port (USB 1.1, USB 2.0, or USB 3.0) on the computer
or on a self-powered USB hub connected to the computer
Operating system Windows 10, 8.1 , 7 (32/64-bit)
or Linux (32/64-bit)
1.4 Scope of Supply PCAN-Chip USB
Stamp module PCAN-Chip USB; delivery, depending on
quantity, as cut tape or reel for automatic placement machines
Documentation about the external circuits and the integration of
the module incl. example schematic
One license per stamp module for:
 Device driver for Windows 10, 8.1, 7 and Linux (32/64-bit)
 CAN monitor PCAN-View for Windows
 Programming interface PCAN-Basic for the development of
applications with CAN connection
 Programming interfaces for standardized protocols from
the automotive sector
The license fees for CAN to Robert Bosch GmbH are included.

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1.5 Scope of Supply PCAN-Chip USB Eval
PCAN-Chip USB Evaluation Board
4 distance pieces
PCAN-Chip USB incl. scope of supply, stamp module soldered
on the evaluation board
USB 2.0 connection cable with ferrite core

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2 External Circuits Stamp
Module
This chapter describes the functions of each port (contact) on the
stamp module and contains instructions for external circuits. The
schematic in Appendix A on page 50 provides further criteria for
external circuits.
2.1 Connectors
Figure 1: Block diagram PCAN-Chip USB

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Figure 2: Signal assignment at the contacts on the stamp module
(some contacts are not used)

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Contact no. Signal1Comment
1 Not used
2 CAN-LED-green Dual LED together with contact 4
recommended
3 Reserved
4 CAN-LED-red Dual LED together with contact 2
recommended
5 UART-RxD Used for support purposes
6 UART-TxD Used for support purposes
11 3V3 Power supply 3.3 V ±0.15 V
13 GND Reference level
18 CAN-TxD CAN data, output (to the CAN transceiver)
19 CAN-RxD CAN data, input (from the CAN transceiver)
21 CAN-EN-M1 Enable signal for the CAN transceiver
22 Reserved
26 Not used
27 Not used
28 CAN-STB-M0 Standby signal CAN transceiver TJA1044GT
29 GND Reference level
30 3V3-Out 3.3 Volts output for status
34 GND Reference level
36 Reset-In Module reset
37 UART-ISP-N Boot source UART
38 AIn3 Measuring range 3.3 V
39 AIn2/CLK-Mode Measuring range 3.3 V
(see section 2.2 on page 12)
40 Not used
41 AIn0/PHY1 CAN transceiver type detection
(see section 2.3 on page 13)
42 SYN-CLK Synchronization clock I/O (using several
modules)
43 Not used
44 Not used
1All signals are based on a 3.3-Volts supply. 5-Volts tolerance is not given.

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Contact no. Signal1Comment
46 Reserved
47 Not used
48 Not used
49 Not used
50 GND Reference level
51 USB-DM USB data, negative
52 USB-DP USB data, positive
56 TRST
57 TMS
58 TDO
59 TCK
60 TDI
JTAG
Table 1
2.2 Synchronization of Several Stamp
Modules
When using several stamp modules, a synchronization of the time
stamps for the CAN messages can be done. This happens by
connecting the SYN-CLK port (42) of all stamp modules.
The analog input AIn2/CLK-Mode (39) is used to configure the
synchronization. One stamp module is the master, all others are
slaves.
Mode Voltage at
AIn2/CLK-Mode (39)
Circuit recommendation
Stand-alone 0 V (GND) Pull-down resistor 4.7 k
Slave (Clk in) 3.3 V (supply) Pull-up resistor 4.7 k
Master (Clk out) 1.65 V Voltage divider with pull-up and pull-
down resistors, each 4.7 k

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2.3 CAN Transceiver Type Detection
Depending on the detected CAN transceiver type, the firmware of
the PCAN-Chip USB adapts its use of the control signals to the CAN
transceiver
The CAN transceiver type is detected by the stamp module with the
proportion of the input voltage at the analog input AIn0/PHY1 (41) to
3.3 V. Recommended is a voltage divider with a resistor of 1 k
against 3.3 V and a resistor against ground, according to the
following table.
Transceiver type Voltage proportion at
AIn0/PHY1 (41)
Resistor
against ground
TH8056
Single-wire CAN SAE J2411 20 % 270 
TJA1055
Low-speed CAN ISO 11898-3 40 % 680 
TJA1044GT
High-speed CAN FD ISO 11898-2 70 % 2400 
82C251
High-speed CAN ISO 11898-2 80 % 3900 
TJA1041
High-speed CAN ISO 11898-2 90 % 9100 
If you implement another CAN transceiver, compare its properties
with the ones of the CAN transceivers listed here in order to select
the appropriate voltage proportion.
2.4 Additional Notes
Supplied with 3.3 V DC, core supply is generated within the
PCAN-Chip USB
Stamp module without protection circuits; implement protective
measures in the environment if required

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CAN transmission mode (OSI layer 1) is determined by the
external CAN transceiver, connections for control and status
lines are available
Status indication with two external LEDs (series resistors
required)
Firmware update possible via USB

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3 Stamp Module Mounting
The stamp module with its single-sided mounting and plated half-
holes is suitable for automatic assembly.
Attention! Electrostatic discharge (ESD) can damage or destroy
components on the stamp module. Take precautions to avoid
ESD when handling the stamp module.
3.1 Dimensions and Contacts Stamp Module
Figure 3: Dimensions of the stamp module
(figure not in original size)

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Contact positions in 50 mil (1.27 mm) grid
Numbering system for contacts: start is on the right to the
corner marking, raising numbers counterclockwise, 17 contact
positions on the long edge, 13 on the short one (results in
contact positions 1 to 60), not all positions with contacts (see
Figure 3 and Table 1 above)
Contacts: half holes with metallization on the board edge,
extended on the bottom side of the board as pads
3.2 Layout on the Target System
Figure 4: Footprint of the stamp module on the target system
(crosshair: zero point of coordinates, red circles: keep-out areas)
The footprint of the stamp module is also available as file in
different types:
CAD data
Library for Altium Designer

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Connection Pads
We recommend the following properties for the pads on the target
system in order to connect the stamp module:
Rectangular, 0.9 x 1.8 mm
Masking lacquer +0.102 mm (4 mil)
Paste -0.2 mm
The coordinates of the connection points of the stamp module are
given in the following table related to the center of module:
Coordinates [mm]
Connection
point X Y
1 -9.96 -9.32
2 -8.69 -9.32
3 -7.42 -9.32
4 -6.15 -9.32
5 -4.88 -9.32
6 -3.61 -9.32
11 2.74 -9.32
13 5.28 -9.32
18 11.82 -7.47
19 11.82 -6.20
21 11.82 -3.66
22 11.82 -2.39
26 11.82 2.70
27 11.82 3.97
28 11.82 5.24
29 11.82 6.51
30 11.82 7.78
34 6.55 9.32
36 4.01 9.32
37 2.74 9.32
38 1.47 9.32

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Coordinates [mm]
Connection
point X Y
39 0.20 9.32
40 -1.07 9.32
41 -2.34 9.32
42 -3.61 9.32
43 -4.88 9.32
44 -6.15 9.32
46 -8.69 9.32
47 -9.96 9.32
48 -11.82 7.78
49 -11.82 6.51
50 -11.82 5.24
51 -11.82 3.97
52 -11.82 2.70
56 -11.82 -2.38
57 -11.82 -3.65
58 -11.82 -4.92
59 -11.82 -6.19
60 -11.82 -7.46
Table 2
Keep-out areas
The stamp module lies flat on the target system and has several
bare areas on its bottom side (test points). Therefore, the top layer
of the target system must not have traces or vias in several keep-out
areas beneath the stamp module.
In Figure 4 above the keep-out areas are indicated by circles
(diameter 1.27 mm = 50 mil). The following table contains the center
point coordinates of the keep-out areas related to the center of the
stamp module.

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Coordinates [mm]Keep-out area
(test point) X Y
TP1 -2.85 5.25
TP2 9.34 -3.90
TP3 7.83 7.27
TP4 1.21 -4.41
TP5 1.41 6.55
TP6 -3.36 -4.41
TP7 6.29 5.24
TP8 -1.32 -4.41
TP9 -5.90 -2.88
TP10 2.57 5.23
TP11 -7.41 -4.41
TP12 -8.44 -2.88
TP13 -4.37 -6.44
TP14 -6.40 -6.44
TP15 -9.46 3.20
TP16 -8.44 5.24
TP17 -3.11 7.51
TP18 -4.68 6.53
TP19 -9.45 6.76
TP20 8.32 -2.38
TP21 8.83 2.70
TP22 8.84 -7.47
TP23 -8.94 -6.44
TP24 4.26 5.74
TP25 -0.88 5.98
TP26 0.12 4.54
Table 3

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3.3 Handling and Soldering
An MSL (Moisture Sensitivity Level) of 3 applies to the module. This
value refers to the moisture sensitivity during packaging, storage
and assembly.
Note the following during the soldering process:
The module PCAN-USB-Chip may be soldered max. once on the
target hardware
Maximum soldering temperature of 260 °C (+0/-5 °C) for
maximum 10 to 30 seconds