Pickering 40-592A User manual

pickeringtest.com
Issue 4.6 February 2020
40-592A User Manual
PXI BRIC™ High Density FIBO Matrix Module

Page (II) BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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Page (II) REED RELAY MODULE 40-110/115/120/125
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© COPYRIGHT (2020) PICKERING INTERFACES. ALL RIGHTS RESERVED.
No part of this publication may be reproduced, transmitted, transcribed, translated or stored in any form, or by
any means without the written permission of Pickering Interfaces.
Technical details contained within this publication are subject to change without notice.
ISO 9001
Reg No. FM38792

Page (III)
BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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Page (III)
REED RELAY MODULE 40-110/115/120/125
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TECHNICAL SUPPORT
For Technical Support please contact Pickering Interfaces either by phone, the website or via e-mail.
WARRANTY
All products manufactured by Pickering Interfaces are warranted against defective materials and workmanship for a period of
three years, excluding programmable power supplies, from the date of delivery to the original purchaser. Any product found to be
defective within this period will, at the discretion of Pickering Interfaces be repaired or replaced.
Products serviced and repaired outside of the warranty period are warranted for ninety days.
Extended warranty and service are available. Please contact Pickering Interfaces by phone, the website or via e-mail.
ENVIRONMENTAL POLICY
Pickering Interfaces operates under an environmental management system similar to ISO 14001.
Pickering Interfaces strives to full all relevant environmental laws and regulations and reduce wastes and releases to the
environment. Pickering Interfaces aims to design and operate products in a way that protects the environment and the health and
safety of its employees, customers and the public. Pickering Interfaces endeavours to develop and manufacture products that can
be produced, distributed, used and recycled, or disposed of, in a safe and environmentally friendly manner.
Worldwide Technical Support and Product Information
pickeringtest.com
Germany
Tel: [phone]
E-mail: [email protected]
Sweden
Tel: [phone]
E-mail: [email protected]
USA
Tel: (West) [phone]
Tel: (East) [phone]
E-mail: [email protected]
Czech Republic
Tel: [phone]
E-mail: [email protected]
France
Tel [phone]
E-mail [email protected]
Pickering Interfaces Headquarters
Stephenson Road Clacton-on-Sea CO15 4NL United Kingdom
Tel: [phone]
E-Mail: [email protected]
China
Tel: [phone]
E-mail: [email protected]

Page (IV) BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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Page (IV) REED RELAY MODULE 40-110/115/120/125
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MEANING / DESCRIPTION SYMBOL
PROTECTIVE EARTH (GROUND)
To identify any terminal which is intended for connection to an external conductor for
protection against electric shock in case of a fault, or the terminal of a protective earth
(ground) electrode.
DANGEROUS VOLTAGE
To indicate hazards arising from dangerous voltages.
WARNING / CAUTION
An appropriate safety instruction should be followed or caution to a potential hazard
exists.
Refer to the relevant instructions detailed within the product manual.
HEAVY
If this product is heavy reference should be made to the safety instructions for
provisions of lifting and moving.
STATIC SENSITIVE
To indicate that static sensitive devices are present and handling precautions should
be followed.
!
kg
SAFETY SYMBOLS
PRODUCT SAFETY
The following safety symbols may be used on the product and throughout the product documentation.

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BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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Copyright Statement ...................................................................II
Technical Support and Warranty................................................III
Product Safety .............................................................................IV
Contents (this page)....................................................................V
Warnings and Cautions ..............................................................VII
Section 1
Technical Specication...............................................................1.1
Section 2
Technical Description .................................................................2.1
Mechanical Description ........................................................2.1
Functional Description .........................................................2.2
Fault Insertion Examples Using The FIBO Matrix ..............2.4
Section 3
Installation....................................................................................3.1
Pre Operation Checks...........................................................3.1
Hardware Installation ............................................................3.2
Software Installation .............................................................3.2
Testing Operation ..................................................................3.3
Section 4
Programming Guide....................................................................4.1
Programming Options for PXI Modules ..............................4.1
Module Architecture..............................................................4.2
Using The Module Under IVI.................................................4.4
Using Direct I/O Driver or VISA Driver.................................4.9
Programming The Module ....................................................4.9
Using Pickering Drivers in LabVIEW ...................................4.12
Section 5
Connector Information................................................................5.1
Section 6
Trouble Shooting.........................................................................6.1
Section 7
Maintenance Information............................................................7.1
Switching System Test Tools ...............................................7.1
Fuse ........................................................................................7.1
Relay Look-Up Tables ...........................................................7.1
PCB Layout Diagrams...........................................................7.27
Card Removal From BRIC.....................................................7.30
Card Replacement.................................................................7.32
CONTENTS

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Page (VII)
BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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Page (VII)
2 AMP 1-POLE UHD MATRIX MODULES 40-575 / 576 / 577 / 578 / 579
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WARNINGS AND CAUTIONS
WARNING - HAZARDOUS ENVIRONMENTS SYMBOL
This product is not specically designed for use in hazardous environments, for example in explosive
atmospheres. If the product is to be used in hazardous environments we recommend that the user
ensures suitable protective measures are taken.
!
WARNING - DANGER OF ELECTRIC SHOCK SYMBOL
This module may contain hazardous voltages. Before removing the module from the rack remove all
supplies and disconnect user I/O signals.
Unused slots in the host chassis are populated with blanking plates to prevent access to user I/O
signals that may be present. Blanking panels are available to order from Pickering in a variety of
slot widths. If the product is not used in this manner for example by using an extender card then
additional care must be taken to avoid contact with exposed signals.
Not to be used in safety critical circuits, refer to the Pickering Interfaces’ terms & conditions of sale.
This module must not be used for the switching of Mains Circuits. For the switching of voltages up
to the module’s full specication, Secondary Circuit power supplies and the Device Under Test must
be fully isolated from the Mains Circuit and the safety earth.
The host chassis must be correctly installed and be connected to mains or factory safety ground,
please refer to your chassis installation manual.
Diagram Showing Separation Between The Mains Circuit and Secondary Circuit / DUT
For the purposes of this document, a Mains Circuit is an installation classied as Overvoltage
Category II up to 300V. Separation between the Secondary Circuit and Mains Circuit is achieved
by a transformer in which the primary windings are separated from the secondary windings by
reinforced insulation, double insulation, or a screen connected to the protective conductor terminal.
CAUTION - HANDLING OF ELECTROSTATIC-SENSITIVE DEVICES SYMBOL
Certain semiconductor devices used in this equipment are liable to damage due to static voltage.
Observe the following precautions when handling these devices in their unterminated state, or
sub-assemblies containing these devices:
1. Persons removing sub-assemblies from equipment using these devices must be earthed by a
wrist strap and a resistor at the point provided on the equipment.
2. Soldering irons used during the repair operations must be low voltage types with earthed tips and
isolated from the mains voltage by a double insulated transformer.
3. Outer clothing worn must be unable to generate static charges.
4. Printed Circuit Boards (PCBs) tted with these devices must be stored and transported in
anti-static bags.
PXI Switching
Module
Device
Under Test
Power
Supply
Power
Supply
Host Chassis
Secondary Circuit
Mains
Circuit
Mains
Circuit
Mains/Factory
Safety Ground

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Page (VIII) 2 AMP 1-POLE UHD MATRIX MODULES 40-575 / 576 / 577 / 578 / 579
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CAUTION - PRODUCT DOCUMENTATION SYMBOL
Suitably qualied & trained users should ensure that the accompanying documentation is fully read
and understood before attempting to install or operate the product.
!
SAFETY INSTRUCTIONS
SAFETY INSTRUCTIONS
All cleaning and servicing requires the equipment to be isolated and disconnected from the power source and user I/O
signals (refer to the Maintenance Section).
• Appropriate manual handling procedures should be followed as dictated by the weight of the individual module or
the combined weight of the modules & chassis.
• Should a fault occur with the module or chassis, immediately isolate and disconnect the incoming power to the
chassis and the user I/O signals.
• Ensure the equipment is installed, operated and maintained by trained and authorised personnel.
• For suitably equipped products in the event of an emergency press the red “emergency stop” button situated on
the front of the unit.

Page 1.1
BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
pickering SECTION 1 - TECHNICAL SPECIFICATION
SECTION 1 - TECHNICAL SPECIFICATION
pickeringtest.com
PXI BRIC™ High Density FIBO Matrix 40-592A
ISSUE 5.0 MAY 2018
Schematic of the 40-592A-104 Dual 80x4 FIBO High
Density Matrix Module with 3-pin breakout (switches are
shown in their default state)
Schematic of the 40-592A-118 Dual 248x8 FIBO
High Density FIBO Matrix Module with 2-pin
breakout (switches are shown in their default state)
Y1
Y2
Y3
Y4
80x4 Fault Matrix
Y5
Y6
Y7
Y8
80x4 Fault Matrix
X1.1
X2.1
X80.1
X1.2
X1.3
X2.2
X2.3
X80.2
X80.3
BA
BREAKOUT BREAKOUT
Y1
Y2
Y3
Y4
248x4 Fault Matrix
Y5
Y6
Y7
Y8
248x4 Fault Matrix
X1.1
X2.1
X248.1
X1.2
X2.2
X248.2
BA
BREAKOUT BREAKOUT
The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module
is a large-scale high density switching matrix based on the
Pickering BRIC™ format.
Fault insertion BRICs are designed for applications requiring
the simulation of a variety of faults in complex, high pin count,
applications involving sensors and control units. Typical faults
that can be simulated are open-circuits, short-circuits to
ground or battery, or short-circuits between input/output lines.
Applications are in automotive and aerospace industries which
involve safety or mission critical systems that have to behave
predictably when cabling or sensor faults occur.
The FIBO Matrix Module is available as either a BRIC4
containing up to 4 daughter cards or a BRIC8 containing up
to 8 daughter cards. This allows the X-bus of the matrix to be
expanded in multiples of 31 for the 2-pin breakout version or
multiples of 20 for the 3-pin breakout version.
The programmable matrix designed to aid the simulation of
faults. It allows measurement controllers and management
systems to be automated, ensuring that the test can be
performed quickly and reliably.
The fault insertion BRIC uses ruthenium reed relays to ensure
a long and trouble free service life.
The backplane interface of the fault insertion BRIC uses a high
speed buffered interface that ensure low latency on the the
bus, ideal for operation with real time operating systems.
Supported by eBIRST
eBIRST switching system test tools simplify switching
system fault-nding by quickly testing the system and
graphically identifying the faulty relay.
For more information go to: pickeringtest.com/ebirst
• Integrated PXI Matrix Module With Built In High
Performance Screened 8-Channel Analog Bus
• 2 or 3-Pin Breakout Configurations For Fault
Simulation and Specialist Test Applications
• Very high Density With a Dual 248x4 Matrix in
an 8-slot Module (Including 2-Pin Breakout)
• Load Just The Number of Daughter Switch Cards
You Need For Your Application
• Uses High Reliability Ruthenium Reed Relays
for Maximum Performance
• Switches up to 150V, 1A, 20W
• VISA, IVI & Kernel Drivers Supplied for Windows
• Supported by PXI or LXI Chassis
• Supported by
eBIRST ™
• 3 Year Warranty

Page 1.2 BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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SECTION 1 - TECHNICAL SPECIFICATION
BRIC High Density FIBO Matrix – 40-592A
pickeringtest.com
Specifications
Switching Specification
Switch Type: Ruthenium Reed
Max Switching Voltage: 150VDC/100VAC*
Max Power:
Max Switch Current:
Max Carry Current:
20W
1.0A
1.2A
Initial Path Resistance (2-pin breakout)
On path through matrix:
On path through breakout:
Off path resistance:
<750mΩ
<200mΩ
>109Ω
Initial Path Resistance (3-pin breakout)
On path through matrix:
On path through breakout:
Off path resistance:
<750mΩ
<300mΩ
>109Ω
Thermal Offset: <30µV
Operate Times
Ganged BREAKOUT 1.2 /
BREAKOUT 1.3 operation:
BREAKOUT 1.1 to BREAKOUT 1.2 /
BREAKOUT 1.3 isolation/thru connection:
Matrix crosspoints:
1ms
0.5ms
0.5ms
Expected Life, low power load:
Expected Life, full power load:
>1x109operations
>1x106 operations
* For full voltage rating, signal sources to be switched must be fully
isolated from mains supply and safety earth.
Power Requirements
+3.3V +5V +12V -12V
0 4A (1A typical) 0 0
Operating/Storage Conditions
Operating Conditions
Operating Temperature:
Humidity:
Altitude:
0°C to +55°C
Up to 90% non-condensing
5000m
Storage and Transport Conditions
Storage Temperature:
Humidity:
Altitude:
-20°C to +75°C
Up to 90% non-condensing
15000m
PXI & CompactPCI Compliance
The module is compliant with the PXI Specication 2.2. Local Bus,
Trigger Bus and Star Trigger are not implemented.
Uses a 33MHz 32-bit backplane interface.
Safety & CE Compliance
All modules are fully CE compliant and meet applicable EU
directives: Low-voltage safety EN61010-1:2010, EMC Immunity
EN61326-1:2013, Emissions EN55011:2009+A1:2010.
Width and Dimensions
Four or eight slot 3U PXI module (CompactPCI).
3D models for these modules in a variety of popular le formats are
available on request.
Module Weight
Empty BRIC Fully Loaded BRIC
BRIC4 0.9Kg 2.1Kg
BRIC8 1.6Kg 4.0Kg
BRIC daughter card 0.3Kg
Connectors
PXI bus via 32-bit P1/J1 backplane connector.
Signals via multiple front panel connectors:
• 40-592A-1XX Up to 8 x 78-pin male D-type connectors
• 40-592A-0XX Up to 4 x 78-pin male D-type connectors
For pin outs please refer to the operating manual.
Relay Type
The 40-592A is tted with high performance instrumentation
grade ruthenium sputtered reed relays. These offer very long life
with good low level switching performance and excellent contact
resistance stability.

Page 1.3
BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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BRIC High Density FIBO Matrix – 40-592A
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Ordering Information
Special Versions
BRIC modules can be built in special versions, for example
where an exact matrix size is required then partly populated
daughtercards may be ordered.
Upgrading With Daughtercards
BRIC modules can be upgraded to larger matrix sizes using
daughter-cards, please consult your local sales ofce for further
information.
Product Customization
Pickering PXI modules are designed and manufactured on our own
exible manufacturing lines, giving complete product control and
enabling simple customization to meet very specic requirements.
Customization can include:
• Alternative relay types
• Mixture of relay types
• Alternative number of relays
• Different performance specications
All customized products are given a unique part number, fully
documented and may be ordered at any time in the future. Please
contact your local sales ofce to discuss.
Product Order Codes
For the expansion of an existing BRIC matrix or replacement of
faulty BRIC daughter cards please contact your local sales ofce.
3-Pin Breakout FIBO Matrix Order Codes
BRIC4 BRIC8
Dual 20x4 matrix 40-592A-001 40-592A-101
Dual 40x4 matrix 40-592A-002 40-592A-102
Dual 60x4 matrix 40-592A-003 40-592A-103
Dual 80x4 matrix 40-592A-004 40-592A-104
Dual 100x4 matrix 40-592A-105
Dual 120x4 matrix 40-592A-106
Dual 140x4 matrix 40-592A-107
Dual 160x4 matrix 40-592A-108
2-Pin Breakout FIBO Matrix Order Codes
BRIC4 BRIC8
Dual 31x4 matrix 40-592A-011 40-592A-111
Dual 62x4 matrix 40-592A-012 40-592A-112
Dual 93x4 matrix 40-592A-013 40-592A-113
Dual 124x4 matrix 40-592A-014 40-592A-114
Dual 155x4 matrix 40-592A-115
Dual 186x4 matrix 40-592A-116
Dual 217x4 matrix 40-592A-117
Dual 248x4 matrix 40-592A-118
Support Products
eBIRST Switching System Test Tool
This product is supported by the eBIRST test tools which simplify
the identication of failed relays, the required eBIRST tools are
below. This product requires master slave testing and two sets of
tools are required together with the master slave cable
93-970-301. For more information go to: pickeringtest.com/ebirst
Product Test Tool Adaptor
40-592A 93-006-001 Not Required
Spare Relay Kits
Kits of replacement relays are available for the majority of
Pickering’s PXI switching products, simplifying servicing and
reducing down-time.
Product Relay Kit
40-592A 91-100-030
For further assistance, please contact your local Pickering sales
ofce.
Mating Connectors & Cabling
For connection accessories for the 40-592A range please refer
to the 90-006D 78-pin D-type Connector Accessories data sheet
where a complete list and documentation can be found for
accessories, or refer to the Connection Solutions catalog.
High Density
FIBO Matrix
Module in
BRIC8 Format

Page 1.4 BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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SECTION 1 - TECHNICAL SPECIFICATION
BRIC High Density FIBO Matrix – 40-592A
pickeringtest.com
Supporting Products & Software
We also offer customized cabling and have a free online Cable Design Tool that can be
used to create custom cable solutions for many applications.
Visit: pickeringtest.com/cdt to start your design.
Mass Interconnect
We recommend the use of a mass interconnect solution when an Interchangeable Test
Adapter (ITA) is required for a PXI or LXI based test system. Our modules are fully
supported by both Virginia Panel and MacPanel.
Pickering Reed Relays
We are the only switch provider with in-house reed relay manufacturing capability via
our sister company, Pickering Electronics. These instrument grade reed relays feature
SoftCenter® technology, ensuring long service life and repeatable contact performance.
To learn more, please go to: pickeringrelay.com
Chassis Compatibility
This PXI module must be used in a suitable chassis. It is compatible with the following chassis types:
• All chassis conforming to the 3U PXI and 3U Compact PCI (cPCI) specication
• Legacy and Hybrid Peripheral slots in a 3U PXI Express (PXIe) chassis
• Pickering Interfaces LXI or LXI/USB Modular Chassis
Chassis Selection Guide
Standard PXI or hybrid PXIe Chassis from any Vendor:
• Mix our 1000+ PXI switching & simulation modules with any
vendor’s PXI instrumentation
• Embedded or remote Windows PC control
• Real-time Operating System Support
• High data bandwidths, especially with PXI Express
• Integrated module timing and synchronization
Pickering LXI or LXI/USB Modular Chassis—only accept
our 1000+ PXI Switching & Simulation Modules:
• Ethernet or USB control enables remote operation
• Low-cost control from practically any controller
• LXI provides manual control via Web browsers
• Driverless software support
• Power sequencing immunity
• Ethernet provides chassis/controller voltage isolation
• Independence from Windows operating system
Connectivity Solutions
We provide a full range of supporting cable and connector solutions for all our switching products—20 connector families with 1200+
products. We offer everything from simple mating connectors to complex cables assemblies and terminal blocks. All assemblies are
manufactured by Pickering and are guaranteed to mechanically and electrically mate to our modules.
Connectors & Backshells Multiway Cable Assemblies RF Cable Assemblies Connector Blocks

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BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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BRIC High Density FIBO Matrix – 40-592A
pickeringtest.com
Supporting Products & Software
© Copyright (2020) Pickering Interfaces. All Rights Reserved Pickering Interfaces maintains a commitment to continuous product development, consequently we reserve the right to vary from the description given in this data sheet.
Programming
Pickering provide kernel, IVI and VISA (NI & Keysight) drivers which are compatible with all Microsoft supported versions of Windows and
popular older versions. For a list of all supporting operating systems, please see: pickeringtest.com/os
The VISA driver is also compatible with Real-Time Operating Systems such as LabVIEW RT. For other RTOS support contact Pickering.
These drivers may be used with a variety of programming environments and applications including:
• Pickering Interfaces Switch Path Manager
• National Instruments products (LabVIEW, LabWindows/CVI, Switch Executive, MAX, TestStand, VeriStand, etc.)
• Microsoft Visual Studio products (Visual Basic, Visual C+)
• Keysight VEE and OpenTAP
• Mathworks Matlab
• Marvin ATEasy
• MTQ Testsolutions Tecap Test & Measurement Suite
Drivers for popular Linux distributions are available, other environments are also supported, please contact Pickering with specic enquiries.
We provide Soft Front Panels (SFPs) for our products for familiarity and manual control, as well as comprehensive documentation and
example programs to help you develop test routines with ease.
To learn more about software drivers and development environments, please go to:
pickeringtest.com/software
Signal Routing Software
Our signal routing software, Switch Path Manager, automatically selects and energizes switch
paths through Pickering switching systems. Signal routing is performed by simply dening test
system endpoints to be connected together, greatly accelerating Test System software
development. To learn more, please go to: pickeringtest.com/spm
Diagnostic Relay Test Tools
eBIRST Switching System Test Tools are designed specically for our PXI, PCI or LXI
products, these tools simplify switching system fault-nding by quickly testing the system
and graphically identifying the faulty relay.
To learn more, please go to: pickeringtest.com/ebirst
Three Year Warranty & Guaranteed Long-Term Support
All standard products manufactured by Pickering Interfaces are warranted against defective materials and workmanship for a period of three
years from the date of delivery to the original purchaser. Extended warranty and service agreements are available for all our modules and
systems with various levels to suit your requirements. Although we offer a 3-year warranty as standard, we also include guaranteed long-
term support—with a history of supporting our products for typically 15-20 years. To learn more, please go to: pickeringtest.com/support
Available Product Resources
We have a large library of product resources including success stories, product and support videos, articles, as well as complete product
catalogs and product reference maps to assist when looking for the switching, simulation and cable and connector solutions you need.
We have also published handy reference books on Switching Technology and for the PXI and LXI standards.
To view, download or request any of our product resources, please visit: pickeringtest.com/resources

Page 1.6 BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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SECTION 1 - TECHNICAL SPECIFICATION
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Page 2.1
BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
pickering SECTION 2 - TECHNICAL DESCRIPTION
SECTION 2 - TECHNICAL DESCRIPTION
MECHANICAL DESCRIPTION
Figure 2.1 - 40-592A BRIC4 Chassis Architecture
The BRIC Module comprises an alloy chassis, either 4 slot (4 Daughter Cards) or 8 slot (8 Daughter Cards) width,
with an integral backplane and a number of High Density Matrix Daughter Cards. The chassis is provided with
cooling slots, top and bottom. The backplane provides mounting for the 50-pin connectors (into which the Matrix
Daughter Cards plug) and Control logic.

Page 2.2 BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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SECTION 2 - TECHNICAL DESCRIPTION
FUNCTIONAL DESCRIPTION
A functional block diagram is provided in Figure 2.2. The BRIC Module is powered by a +5V input via Compact PCI
connector J1 mounted on the Backplane. The interface to the user test equipment is via the front panel mounted
78-pin D-type connectors, mounted on the Matrix Daughter card assemblies. Each daughtercard assembly comprises
a daughtercard and a mezzanine daughtercard.
Each Matrix Daughter Card comprises a PCB populated with Relay Drivers and single pole relays congured as a
dual 20x8 matrix with 3-pin breakout, or 31x8 matrix with 2-pin breakout. The matrix daughter cards are connected
to each other via connectors mounted on the backplane. Connectors J2 to J5 (J2 to J9 BRIC 8) are connected to
an Analog Bus, which comprises control lines, Y Bus and power. The Matrix Daughter Cards are programmed as a
whole matrix. The overall size of the matrix may be increased or decreased by adding or removing daughter cards.
The matrix relays are energised via control signals from the relay drivers, which are addressed by the PCI bridge
U2 and FGPA U4 mounted on the Backplane, to output the required signal. The PCI Bridge U1 is congured by
EEPROM U1 and the FGPA by U6.

Page 2.3
BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
pickering SECTION 2 - TECHNICAL DESCRIPTION
Figure 2.2 - 40-592A BRIC High Density FIBO Module: Functional Block Diagram
PCI
BRIDGE
U2
PCI BRIDGE
CONFIGURATION
U1
TERMINATING
RESISTORS
COMPACT PCI BUS CONNECTOR J1
+5V
0V
BACKPLANE
J2
J3
CONTROL BUS
J4
J5
FPGA
CONFIGURATION
U6
ANALOG BUS
FPGA
U4
78-PIN D-TYPE PLUG
DAUGHTER BOARD 1
EEPROM
U11
J1 X BUS
CONTROL
RELAY
DRIVERS
U1 TO U10
RELAY
COILS MATRIX
BREAKOUT RELAYS
Y BUS
CONTROL
RELAY
DRIVERS
U1 TO U10
RELAY
COILS MATRIX
INTER-PCB CONNECTION
MEZZANINE BOARD
The 8-Slot Backplane is fitted with 8 connectors J2 to J9
8 Matrix Daughtercard assemblies are
fitted to the 8-Slot Backplane
78-PIN D-TYPE PLUG
DAUGHTER BOARD 2
EEPROM
U11
J1 X BUS
CONTROL
RELAY
DRIVERS
U1 TO U10
RELAY
COILS MATRIX
BREAKOUT RELAYS
Y BUS
CONTROL
RELAY
DRIVERS
U1 TO U10
RELAY
COILS MATRIX
INTER-PCB CONNECTION
MEZZANINE BOARD
78-PIN D-TYPE PLUG
DAUGHTER BOARD 3
EEPROM
U11
J1 X BUS
CONTROL
RELAY
DRIVERS
U1 TO U10
RELAY
COILS MATRIX
BREAKOUT RELAYS
Y BUS
CONTROL
RELAY
DRIVERS
U1 TO U10
RELAY
COILS MATRIX
INTER-PCB CONNECTION
MEZZANINE BOARD
78-PIN D-TYPE PLUG
DAUGHTER BOARD 4
EEPROM
U11
J1 X BUS
CONTROL
RELAY
DRIVERS
U1 TO U10
RELAY
COILS MATRIX
BREAKOUT RELAYS
Y BUS
CONTROL
RELAY
DRIVERS
U1 TO U10
RELAY
COILS MATRIX
INTER-PCB CONNECTION
MEZZANINE BOARD

Page 2.4 BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
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SECTION 2 - TECHNICAL DESCRIPTION
FAULT INSERTION EXAMPLES USING THE FIBO MATRIX
In a typical fault insertion example the X breakout connections are used to connect either a simulated sensor or
a real sensor output to the device under test. The isolation switch can be used to disconnect the sensor source
and faults can be inserted on either the sensor side or the device side of the isolation switch. Fault networks are
connected to the Y axis connections to simulate shorts to ground or to power, or to simulate the effect of leakage
paths. High resistance paths can also be simulated either in series with the signal or as a leakage between signal
paths.
Y1
Y2
Y3
Y4
80x4 Fault Matrix
Y5
Y6
Y7
Y8
80x4 Fault Matrix
X1.1
X2.1
X80.1
UUT
Simulator A
Simulator B
X1.2
X1.3
X2.2
X2.3
X80.2
X80.3
1
2
80
1 2 80
1 2 80
Fault Insertion Break-Out Module 40-592A-004/104
Fault Insertion Example: Open Circuit on Break-Out 2
Fault Insertion Example 1: Open Circuit on Breakout 2 of a Dual 80x4
FIBO High Density Matrix Module With 3-pin Breakout

Page 2.5
BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
pickering SECTION 2 - TECHNICAL DESCRIPTION
Y1
Y2
Y3
Y4
80x4 Fault Matrix
Y5
Y6
Y7
Y8
80x4 Fault Matrix
X1.1
X2.1
X80.1
UUT
Simulator A
Simulator B
X1.2
X1.3
X2.2
X2.3
X80.2
X80.3
1
2
80
1 2 80
1 2 80
Fault Insertion Break-Out Module 40-592A-004/104
Fault Insertion Example: Short Between Break-Out 1 & 2 With Breakout 2 Connection Open
Fault Insertion Example 2: Short Circuit Between Breakout 1 & 2 With Breakout 2 Connection Open
Using a Dual 80x4 FIBO High Density Matrix Module With 3-pin Breakout
Y1
Y2
Y3
Y4
248x4 Fault Matrix
Y5
Y6
Y7
Y8
248x4 Fault Matrix
X1.1
X2.1
X248.1
UUT
X1.2
X2.2
X248.2
1
2
248
Fault Insertion Break-Out Module 40-592A-118
Fault Insertion Example: Signal Short to Ground Using Y2 With Breakout 2 Connection Open
Simulator
1
2
248
Fault Insertion Example 3: Signal Short to Ground Using Y2 With Breakout 2 Connection Open
Using a Dual 248x4 FIBO High Density Matrix Module With 2-pin Breakout

Page 2.6 BRIC HIGH DENSITY FIBO MATRIX MODULE (40-592A)
pickering
SECTION 2 - TECHNICAL DESCRIPTION
Y1
Y2
Y3
Y4
80x4 Fault Matrix
Y5
Y6
Y7
Y8
80x4 Fault Matrix
X1.1
X2.1
X80.1
UUT
Simulator A
Simulator B
X1.2
X1.3
X2.2
X2.3
X80.2
X80.3
1
2
80
1 2 80
1 2 80
Fault Insertion Break-Out Module 40-592A-004/104
Fault Insertion Example: Signal on Break-Out 1 Routed to Alternative Simulator
Y1
Y2
Y3
Y4
80x4 Fault Matrix
Y5
Y6
Y7
Y8
80x4 Fault Matrix
X1.1
X2.1
X80.1
Simulator
UUT 1
UUT 2
X1.2
X1.3
X2.2
X2.3
X80.2
X80.3
1
2
80
1 2 80
1 2 80
Fault Insertion Break-Out Module 40-592A-004/104
Fault Insertion Example: Routing Signals To Two UUTs For Comparison
Fault Insertion Example 4: Signal on Breakout 1 Routed to Alternative Simulator
Using a Dual 80x4 FIBO High Density Matrix Module With 3-pin Breakout
Fault Insertion Example 5: Routing Signals to Two UUTs For Comparison
Using a Dual 80x4 FIBO High Density Matrix Module With 3-pin Breakout