Quectel SC200R Series Supplement

SC200R&SC262R Series
Hardware Design
Smart Module Series
Version: 1.2
Date: 2022-05-23
Status: Released

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Quectel offers the information as a service to its customers. The information provided is based upon
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accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the
information.All information supplied herein is subject to change without prior notice.
Disclaimer
While Quectel has made efforts to ensure that the functions and features under development are free
from errors, it is possible that these functions and features could contain errors, inaccuracies and
omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind,
implied or express, with respect to the use of features and functions under development. To the maximum
extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with
the use of the functions and features under development, regardless of whether such loss or damage
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Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should send the following safety information to users and operating personnel, and incorporate these
guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’
failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergent help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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About the Document
Revision History
Version
Date
Author
Description
1.0
2019-12-30
Arsene TONG
Initial
1.1
2020-09-09
Jasper LAI/
Jamie SHI
1. Updated SC200R-EM frequency bands (Chapter
2.1/6.1):
Added B4 in LTE-FDD
Deleted B39 in LTE-TDD
Added B4 in WCDMA
2. Added Galileo in supported GNSS (Chapter
2.1/2.2/5/6.3).
3. Added a note for the wakeup of LDO6_1V8 during
sleep mode (Chapter 3.3).
4. Updated Wi-Fi output power and added Wi-Fi
receiving sensitivity (Chapter 4.1.1).
5. Added BT transmitting and receiving performance
(Chapter 4.2.1).
6. Added GNSS performance data (Chapter 5.1).
7. Added current consumption of SC200R-CE/-NA
(Chapter 7.4).
8. Added RF output power of SC200R-NA (Chapter
7.5).
9. Added RF receiving sensitivity of SC200R-CE/-NA
(Chapter 7.6).
10. Updated the maintenance clearance between the
module and other components to at least 5 mm
(Chapter 8.2).
11. Updated general description of storage,
manufacturing and soldering (Chapter 9.1/9.2).
12. Added package weight of the module (Chapter 9.3).
1.2
2021-06-02
Kevin ZHOU/
Jamie SHI
1. Chapter 4.1.1: Updated Wi-Fi receiving sensitivity.
2. Chapter 7.4: Updated current consumption of

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SC200R-CE/-EM/-NA.
3. Chapter 7.5: Added RF output power of
SC200R-EM.
4. Chapter 7.6: Updated RF receiving sensitivity of
SC200R-CE/-EM/-NA.
5. Chapter 9.1: Updated notes for the storage
conditions.
6. Chapter 9.2: Updated the recommended reflow
soldering thermal profile parameters.
1.3
2022-5-23
Winston
1. Add SC262R-WF

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Contents
Safety Information.......................................................................................................................................2
About the Document...................................................................................................................................3
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................8
Figure Index...............................................................................................................................................10
1Introduction........................................................................................................................................12
1.1. Special Mark............................................................................................................................16
2Product Concept................................................................................................................................17
2.1. General Description.................................................................................................................17
2.2. Key Features ...........................................................................................................................20
2.3. Functional Diagram .................................................................................................................23
2.4. Evaluation Board .....................................................................................................................23
3Application Interfaces .......................................................................................................................24
3.1. General Description.................................................................................................................24
3.2. Pin Assignment........................................................................................................................25
3.3. Pin Description.........................................................................................................................26
3.4. Power Supply...........................................................................................................................40
3.4.1. Power Supply Pins.........................................................................................................40
3.4.2. Decrease Voltage Drop..................................................................................................40
3.4.3. Reference Design for Power Supply..............................................................................41
3.5. Turn on and off Scenarios .......................................................................................................42
3.5.1. Turn on the Module Using PWRKEY.............................................................................42
3.5.2. Turn off the Module........................................................................................................44
3.6. VRTC Interface........................................................................................................................44
3.7. Power Output...........................................................................................................................45
3.8. Battery Charging and Management........................................................................................46
3.9. USB Interface ..........................................................................................................................48
3.10. UART Interfaces......................................................................................................................50
3.11. (U)SIM Interfaces.....................................................................................................................51
3.12. SD Card Interface....................................................................................................................54
3.13. GPIO Interfaces.......................................................................................................................56
3.14. I2C Interfaces ..........................................................................................................................59
3.15. SPI Interfaces..........................................................................................................................59
3.16. ADC Interface..........................................................................................................................60
3.17. Motor Drive Interface...............................................................................................................60
3.18. LCM Interface..........................................................................................................................61
3.19. Touch Panel Interface..............................................................................................................63
3.20. Camera Interfaces...................................................................................................................65
3.20.1. Design Considerations...................................................................................................68
3.21. Sensor Interfaces.....................................................................................................................70

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3.22. Audio Interfaces.......................................................................................................................70
3.22.1. Reference Circuit Design for Microphone Interfaces.....................................................71
3.22.2. Reference Circuit Design for Earpiece Interface...........................................................72
3.22.3. Reference Circuit Design for Headset Interface............................................................73
3.22.4. Reference Circuit Design for Loudspeaker Interface.....................................................73
3.22.5. Design Considerations forAudio Interfaces ..................................................................73
3.23. Emergency Download Interface..............................................................................................74
4Wi-Fi and Bluetooth...........................................................................................................................75
4.1. Wi-Fi Overview ........................................................................................................................75
4.1.1. Wi-Fi Performance.........................................................................................................75
4.2. Bluetooth Overview .................................................................................................................77
4.2.1. Bluetooth Performance ..................................................................................................78
5GNSS...................................................................................................................................................79
5.1. GNSS Performance.................................................................................................................79
5.2. GNSS RF Design Guidelines ..................................................................................................80
6Antenna Interfaces.............................................................................................................................81
6.1. Main/Rx-diversity Antenna Interfaces......................................................................................81
6.1.1. Operating Frequencies...................................................................................................81
6.1.2. Reference Design for Main and Rx-diversity Antenna Interfaces..................................84
6.2. Wi-Fi/Bluetooth Antenna Interface...........................................................................................85
6.3. GNSS Antenna Interface.........................................................................................................86
6.3.1. Recommended Circuit for Passive Antenna..................................................................87
6.3.2. Recommended Circuit for Active Antenna.....................................................................87
6.4. Reference Design for RF Layout.............................................................................................88
6.5. Antenna Installation.................................................................................................................90
6.5.1. Antenna Requirements..................................................................................................90
6.5.2. Recommended RF Connector for Antenna Installation.................................................91
7Electrical, Reliability and Radio Characteristics............................................................................93
7.1. Absolute Maximum Ratings.....................................................................................................93
7.2. Power Supply Ratings.............................................................................................................93
7.3. Operating and Storage Temperatures.....................................................................................94
7.4. Current Consumption ..............................................................................................................94
7.5. RF Output Power...................................................................................................................103
7.6. RF Receiving Sensitivity........................................................................................................106
7.7. Electrostatic Discharge.......................................................................................................... 110
8Mechanical Dimensions..................................................................................................................111
8.1. Mechanical Dimensions of the Module...................................................................................111
8.2. Recommended Footprint.......................................................................................................113
8.3. Top and Bottom Views of the Module....................................................................................114
9Storage, Manufacturing and Packaging........................................................................................115
9.1. Storage ..................................................................................................................................115

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9.2. Manufacturing and Soldering ................................................................................................116
9.3. Packaging..............................................................................................................................118
10 Appendix References......................................................................................................................120

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Table Index
Table 1: Special Mark.................................................................................................................................16
Table 2: SC200R-CE Frequency Bands ....................................................................................................17
Table 3: SC200R-EM Frequency Bands....................................................................................................18
Table 4: SC200R-NA Frequency Bands.....................................................................................................18
Table 5: SC200R-JP* Frequency Bands.................................................................................................... 19
Table 6: SC200R-WF Frequency Bands.................................................................................................... 19
Table 7: Key Features................................................................................................................................ 20
Table 8: I/O Parameters Definition.............................................................................................................26
Table 9: Pin Description .............................................................................................................................26
Table 10: Power Description ......................................................................................................................45
Table 11: Pin Definition of Charging Interface............................................................................................ 46
Table 12: Pin Definition of USB Interface................................................................................................... 48
Table 13: USB Trace Length Inside the Module........................................................................................ 49
Table 14: Pin Definition of UART Interfaces...............................................................................................50
Table 15: Pin Definition of (U)SIM Interfaces............................................................................................. 51
Table 16: Pin Definition of SD Card Interface............................................................................................54
Table 17: SD Card Trace Length Inside the Module..................................................................................55
Table 18: Pin Definition of GPIO Interfaces...............................................................................................56
Table 19: Pin Definition of I2C Interfaces................................................................................................... 59
Table 20: Pin Definition of SPI Interfaces ..................................................................................................59
Table 21: Pin Definition ofADC Interface...................................................................................................60
Table 22: Pin Definition of Motor Drive Interface ....................................................................................... 60
Table 23: Pin Definition of LCM Interface ..................................................................................................61
Table 24: Pin Definition of Touch Panel Interface......................................................................................63
Table 25: Pin Definition of Camera Interface............................................................................................. 65
Table 26: MIPI Trace Length Inside the Module ........................................................................................ 68
Table 27: Pin Definition of Sensor Interfaces............................................................................................. 70
Table 28: Pin Definition ofAudio Interfaces............................................................................................... 70
Table 29: Wi-Fi Transmitting Performance.................................................................................................75
Table 30: Wi-Fi Receiving Performance..................................................................................................... 76
Table 31: Bluetooth Data Rate and Version...............................................................................................77
Table 32: Bluetooth Transmitting and Receiving Performance.................................................................. 78
Table 33: GNSS Performance....................................................................................................................79
Table 34: Pin Definition of Main/Rx-diversityAntenna Interfaces.............................................................. 81
Table 35: SC200R-CE Operating Frequencies.......................................................................................... 81
Table 36: SC200R-EM Operating Frequencies .........................................................................................82
Table 37: SC200R-NA Operating Frequencies..........................................................................................83
Table 38: SC200R-JP* Operating Frequencies.........................................................................................84
Table 39: Pin Definition of Wi-Fi/BluetoothAntenna Interface...................................................................85
Table 40: Wi-Fi/Bluetooth Frequency......................................................................................................... 85
Table 41: Pin Definition of GNSS Antenna Interface .................................................................................86

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Table 42: GNSS Frequency .......................................................................................................................86
Table 43: Antenna Requirements...............................................................................................................90
Table 44:Absolute Maximum Ratings........................................................................................................ 93
Table 45: Power Supply Ratings................................................................................................................ 93
Table 46: Operating and Storage Temperatures........................................................................................ 94
Table 47: SC200R-CE Current Consumption............................................................................................94
Table 48: SC200R-EM Current Consumption............................................................................................97
Table 49: SC200R-NA Current Consumption .......................................................................................... 100
Table 50: SC200R-JP* Current Consumption.......................................................................................... 102
Table 51: SC200R-CE RF Output Power.................................................................................................103
Table 52: SC200R-EM RF Output Power................................................................................................104
Table 53: SC200R-NA RF Output Power.................................................................................................105
Table 54: SC200R-JP* RF Output Power................................................................................................106
Table 55: SC200R-CE RF Receiving Sensitivity......................................................................................107
Table 56: SC200R-EM RF Receiving Sensitivity.....................................................................................107
Table 57: SC200R-NA RF Receiving Sensitivity......................................................................................108
Table 58: SC200R-JP* RF Receiving Sensitivity..................................................................................... 109
Table 59: ESD Characteristics (Temperature: 25 ºC, Humidity: 45 %).................................................... 110
Table 60: Recommended Thermal Profile Parameters............................................................................ 117
Table 61: Reel Packaging ........................................................................................................................ 119
Table 62: Related Documents..................................................................................................................120
Table 63: Terms and Abbreviations..........................................................................................................120

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Figure Index
Figure 1: Functional Diagram..................................................................................................................... 23
Figure 2: PinAssignment (Top View)......................................................................................................... 25
Figure 3: Voltage Drop Sample..................................................................................................................40
Figure 4: Star Structure of the Power Supply............................................................................................ 41
Figure 5: Reference Circuit of Power Supply............................................................................................. 41
Figure 6: Turn on the Module Using Driving Circuit................................................................................... 42
Figure 7: Turn on the Module Using Keystroke ......................................................................................... 43
Figure 8: Timing of Turning on the Module................................................................................................43
Figure 9: Timing of Turning off the Module ................................................................................................44
Figure 10: RTC Powered by Coin Cell.......................................................................................................45
Figure 11: Reference Design for Battery Charging Circuit ........................................................................ 47
Figure 12: USB Interface Reference Design (OTG Not Supported).......................................................... 48
Figure 13: USB Interface Reference Design (OTG Supported)................................................................49
Figure 14: Reference Circuit with Level Translator Chip (for UART5)....................................................... 50
Figure 15: RS-232 Level Match Circuit (for UART5) .................................................................................51
Figure 16: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector........................52
Figure 17: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector.......................... 53
Figure 18: Reference Circuit for SD Card Interface................................................................................... 54
Figure 19: Reference Circuit for Motor Connection................................................................................... 61
Figure 20: Reference Circuit Design for LCM Interface............................................................................. 62
Figure 21: Reference Design for External Backlight Driving Circuit..........................................................63
Figure 22: Reference Circuit Design for TP Interface................................................................................ 64
Figure 23: Reference Circuit Design for 3-CameraApplications...............................................................67
Figure 24: Reference Circuit Design for ECM Microphone Interface........................................................ 71
Figure 25: Reference Circuit Design for MEMS Microphone Interface..................................................... 72
Figure 26: Reference Circuit Design for Earpiece Interface......................................................................72
Figure 27: Reference Circuit Design for Headphone Interface .................................................................73
Figure 28: Reference Circuit Design for Loudspeaker Interface...............................................................73
Figure 29: Reference Circuit Design for Emergency Download Interface................................................. 74
Figure 30: Reference Circuit Design for Main and Rx-diversityAntenna Interfaces.................................85
Figure 31: Reference Circuit Design for Wi-Fi/BluetoothAntenna............................................................ 86
Figure 32: Reference Circuit Design for GNSS PassiveAntenna.............................................................87
Figure 33: Reference Circuit Design for GNSS ActiveAntenna................................................................ 87
Figure 34: Microstrip Design on a 2-layer PCB .........................................................................................88
Figure 35: Coplanar Waveguide Design on a 2-layer PCB.......................................................................88
Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).................... 89
Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).................... 89
Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm)............................................................91
Figure 39: Mechanicals of U.FL-LP Connectors........................................................................................ 92
Figure 40: Space Factor of Mated Connectors (Unit: mm)........................................................................92
Figure 41: Top and Side Dimensions........................................................................................................111

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Figure 42: Bottom Dimensions (Bottom View)......................................................................................... 112
Figure 43: Recommended Footprint (Top View)...................................................................................... 113
Figure 44: Top and Bottom Views of the Module..................................................................................... 114
Figure 45: Recommended Reflow Soldering Thermal Profile ................................................................. 117
Figure 46: Tape Dimensions (Unit: mm) .................................................................................................. 118
Figure 47: Reel Dimensions (Unit: mm)................................................................................................... 119

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1Introduction
This document, describing SC200R series module and its air and hardware interfaces connected to your
applications, informs you of the interface specifications, electrical and mechanical details, as well as other
related information of the module.
With the application notes and user guides provided separately, you can easily use the module to design
and set up mobile applications.
This equipmenthas been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, ifnot installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation.
If this equipmentdoes cause harmful interference to radio or television reception, which can be determined
by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help.
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to
avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna
shall not be less than 20cm (8 inches) during normal operation.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations

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4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the
transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). Thehost manufacturer must verify that there are no additional unintentional emissions other than
what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as
described by the instructions, require that the host product manufacturer must notify to Quectel Wireless
Solutions Co., Ltd that they wish to change the antenna trace design. In this case, a Class II permissive
change application is required to be filed by the USI, or the host manufacturer can take responsibility through
the change in FCC ID (new application) procedure followed by a Class II permissive change application.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window
on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
secondlabel must beplaced on the outside of the final device that contains the following text: “Contains FCC
ID: XMR2022SC262RWF”
The FCC ID can be used only when all FCC compliance requirements are met.
Antenna Installation
(1) The antenna mustbe installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) Only antennas of the same type and with equal or less gains as shown below may be used with this
module. Other types of antennas and/or higher gain antennas may require additional authorization for
operation.
(4) The max allowed antenna gain for 2.4G Hz is 0.47 dBi with external antenna. The max allowed
antenna gain for 5GHz is 1.28 dBi with external antenna.
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC
authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
This device complies with ISED’s licence-exempt RSSs. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.

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Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage
préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de
provoquer un fonctionnement indésirable.
Radiation Exposure Statement:
This equipmentcomplies with ISED radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un
environnement non contrôlé. Cet équipement doit être installéet utiliséavec un minimum de 20 cm de
distance entre la source de rayonnement et votre corps.
This device is intended only for OEM integrators under the following conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation
de dispositif module)
1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne etles
utilisateurs, et
2) Le module émetteur peut ne pas être coïmplantéavec un autre émetteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEMest toujours responsable des essais sur son produit final pour
toutes exigences de conformitésupplémentaires requis pour ce module installé.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co- location
with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not
be used on the final product. In these circumstances,the OEM integratorwill be responsible for re-evaluating
the end product (including the transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est
plus considérécomme valide et l'ID IC ne peut pas être utilisésur le produit final. Dans ces circonstances,

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l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une
autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains IC: 10224A-2022SC262R”.
Plaque signalétique du produit final
Ce module émetteur est autoriséuniquement pour une utilisation dans un dispositif oùl'antenne peut être installée de telle
sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiquetédans
un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-2022SG865W ".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product which integrates this module. The end user manual shall include all
required regulatory information/warning as show in this manual.
Manuel d'information àl'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations àl'utilisateur final quant àla façon d'installer ou de
supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme
indiquédans ce manuel.
RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz)
The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure.
Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where
required by the technology.
Caution:
i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful
interference to co-channel mobile satellite systems;
ii) where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with
the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated.
L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations àtransmettre ou de panne
opérationnelle. Notez que ceci n'est pas destinéàinterdire la transmission d'informations de contrôle ou de signalisation ou
l'utilisation de codes répétitifs lorsque cela est requis par la technologie.
Avertissement:
i) Le dispositif utilisédans la bande 5150-5250 MHz est réservéàune utilisation en intérieur afin de réduire le risque de
brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal;
ii) lorsqu’il y a lieu, les types d’antennes (s’il y en a plusieurs), les numéros de modèle de l’antenne et les pires angles

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d’inclinaison nécessaires pour rester conforme à l’exigence de la
p.i.r.e. applicable au masque d’élévation, énoncée àla section 6.2.2.3, doivent être clairement indiqués.
i. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands
5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit
ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the
band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;
and
iii. where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to
remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly
indicated.
1.1. Special Mark
Table 1: Special Mark
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface,
pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT
command, or argument is under development and currently not supported; and the asterisk
(*) after a model indicates that the sample of such model is currently unavailable.

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2Product Concept
2.1. General Description
SC200R is a series of 4G Smart LTE module based on Android operating system, and provides industrial
grade performance. Its general features are listed below:
⚫Supports worldwide LTE-FDD, LTE-TDD, DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA,
EVDO/CDMA, EDGE and GPRS coverage.
⚫Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n and Bluetooth 4.2 LE.
⚫Integrates GPS/GLONASS/BeiDou or GPS/Galileo/Beidou satellite positioning systems.
⚫Supports multiple audio and video codecs.
⚫Built-in high performance AdrenoTM 308 graphics processing unit.
⚫Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces.
SC200R series module is available in below variants: SC200R-CE, SC200R-EM, SC200R-NA,
SC200R-JP*, SC200R-WF, SC262RWF. The following tables show the supported frequency bands and
network standards of SC200R series modules.
Table 2: SC200R-CE Frequency Bands
Mode
Frequency
LTE-FDD
B1/B3/B5/B8
LTE-TDD
B34/B38/B39/B40/B41
WCDMA
B1/B8
EVDO/CDMA
BC0
GSM
900/1800 MHz
Wi-Fi 802.11a/b/g/n
2412–2472 MHz
5180–5825 MHz
Bluetooth 4.2 LE
2402–2480 MHz

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Table 3: SC200R-EM Frequency Bands
Table 4: SC200R-NA Frequency Bands
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Galileo: 1575.42 ±1.023 MHz
Mode
Frequency
LTE-FDD
B1/B2/B3/B4/B5/B7/B8/B20/B28
LTE-TDD
B38/B40/B41
WCDMA
B1/B2/B4/B5/B8
GSM
850/900/1800/1900 MHz
Wi-Fi 802.11a/b/g/n
2412–2472 MHz
5180–5825 MHz
Bluetooth 4.2 LE
2402–2480 MHz
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Galileo: 1575.42 ±1.023 MHz
Mode
Frequency
LTE-FDD
B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71
LTE-TDD
B41
WCDMA
B2/B4/B5
Wi-Fi 802.11a/b/g/n
2412–2472 MHz
5180–5825 MHz
Bluetooth 4.2 LE
2402–2480 MHz
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Galileo: 1575.42 ±1.023 MHz

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Table 5: SC200R-JP*Frequency Bands
Table 6: SC200R-WF Frequency Bands
Table 7: SC262R-WF Frequency Bands
SC200R-JP supports 802.11b channel 14.
Mode
Frequency
LTE-FDD
B1/B3/B5/B8/B11/B18/B19/B21/B26/B28
LTE-TDD
B41
WCDMA
B1/B6/B8/B19
Wi-Fi 802.11a/b/g/n
2402–2482 MHz
5180–5825 MHz
Bluetooth 4.2 LE
2402–2480 MHz
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Galileo: 1575.42 ±1.023 MHz
Mode
Frequency
Wi-Fi 802.11a/b/g/n
2412–2472 MHz
5180–5825 MHz
Bluetooth 4.2 LE
2402–2480 MHz
GNSS
-
Mode
Frequency
Wi-Fi 802.11a/b/g/n/ac
2412–2462 MHz
5180–5825 MHz
Bluetooth 4.2 LE
2402–2480 MHz
GNSS
-
NOTE