Quectel FGM842D Supplement

FGM842D
Hardware Design
Wi-Fi&Bluetooth Module
Version: 1.0.0
Date: 2023-10-26
Status: Preliminary

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To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
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Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage,
service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure
to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the terminal or mobile before boarding an aircraft. The operation of
wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Terminals or mobiles operating over radio signal and cellular network cannot be
guaranteed to connect in certain conditions, such as when the mobile bill is unpaid
or the (U)SIM card is invalid. When emergency help is needed in such conditions,
use emergency call if the device supports it. In order to make or receive a call, the
terminal or mobile must be switched on in a service area with adequate cellular
signal strength. In an emergency, the device with emergency call function cannot
be used as the only contact method considering network connection cannot be
guaranteed under all circumstances.
The terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to
TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other terminals. Areas
with explosive or potentially explosive atmospheres include fueling areas, below
decks on boats, fuel or chemical transfer or storage facilities, and areas where the
air contains chemicals or particles such as grain, dust or metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2023-10-26
Wain ZHAO/Neil CHENG
Creation of the document
1.0.0
2023-10-26
Wain ZHAO/Neil CHENG
Preliminary

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Contents
Safety Information...................................................................................................................................... 3
About the Document.................................................................................................................................. 4
Contents...................................................................................................................................................... 5
Table Index.................................................................................................................................................. 7
Figure Index................................................................................................................................................ 8
1 Introduction............................................................................................................................................. 9
1.1. Special Mark .................................................................................................................................. 9
2 Product Overview................................................................................................................................. 11
2.1. Key Features................................................................................................................................ 12
3 Application Interfaces.......................................................................................................................... 13
3.1. Pin Assignment............................................................................................................................ 13
3.2. Pin Description............................................................................................................................. 14
3.3. GPIO Multiplexing........................................................................................................................ 16
3.4. Application Interfaces................................................................................................................... 17
3.4.1. UARTs ............................................................................................................................... 17
3.4.2. SPI..................................................................................................................................... 18
3.4.3. I2C Interface...................................................................................................................... 20
3.4.4. PWM Interfaces................................................................................................................. 20
3.4.5. ADC Interfaces .................................................................................................................. 21
4 Operating Characteristics.................................................................................................................... 22
4.1. Power Supply............................................................................................................................... 22
4.1.1. Reference Design for Power Supply................................................................................. 22
4.2. Turn On........................................................................................................................................ 23
4.3. Reset............................................................................................................................................ 24
5 RF Performances.................................................................................................................................. 26
5.1. Wi-Fi Performances..................................................................................................................... 26
5.2. Bluetooth Performances.............................................................................................................. 27
5.3. Antenna/Antenna Interfaces........................................................................................................ 28
5.3.1.1. Antenna Design Requirements............................................................................... 28
5.3.2. FGM842D RF Coaxial Connector ..................................................................................... 28
5.3.2.1. Receptacle Specifications....................................................................................... 28
5.3.2.2. Antenna Connector Installation............................................................................... 29
5.3.2.3. Recommended RF Connector Installation.............................................................. 30
5.3.2.4. Recommended Manufacturers of RF Connector and Cable.................................. 32
6 Electrical Characteristics & Reliability............................................................................................... 33
6.1. Absolute Maximum Ratings......................................................................................................... 33

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6.2. Power Supply Ratings.................................................................................................................. 33
6.3. Power Consumption..................................................................................................................... 34
6.3.1. Wi-Fi Power Consumption................................................................................................. 34
6.3.2. Bluetooth Power Consumption.......................................................................................... 34
6.4. Digital I/O Characteristics ............................................................................................................ 35
6.5. ESD Protection ............................................................................................................................ 35
7 Mechanical Information ....................................................................................................................... 36
7.1. Mechanical Dimensions............................................................................................................... 36
7.2. Top and Bottom Views................................................................................................................. 38
8 Storage, Manufacturing & Packaging................................................................................................. 39
8.1. Storage Conditions ...................................................................................................................... 39
8.2. Manufacturing and Soldering....................................................................................................... 40
8.3. Packaging Specification............................................................................................................... 42
8.3.1. Carrier Tape....................................................................................................................... 42
8.3.2. Plastic Reel........................................................................................................................ 43
8.3.3. Mounting Direction............................................................................................................. 43
8.3.4. Packaging Process............................................................................................................ 44
9 Appendix References........................................................................................................................... 45

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Table Index
Table 1 : Special Mark................................................................................................................................ 10
Table 2 : Basic Information ........................................................................................................................ 11
Table 3 : Key Features............................................................................................................................... 12
Table 4 : Parameter Description ................................................................................................................ 14
Table 5 : Pin Description............................................................................................................................ 14
Table 6 : GPIO Multiplexing....................................................................................................................... 16
Table 7 : Pin Definition of UARTs .............................................................................................................. 17
Table 8 : Pin Definition of SPI.................................................................................................................... 19
Table 9 : Pin Definition of I2C Interface..................................................................................................... 20
Table 10 : Pin Definition of PWM Interfaces.............................................................................................. 20
Table 11 : Pin Definition of ADC Interfaces ............................................................................................... 21
Table 12 : ADC Features ........................................................................................................................... 21
Table 13 : Pin Definition of Power Supply and GND Pins......................................................................... 22
Table 14 : Pin Definition of CHIP_EN........................................................................................................ 23
Table 15 : Wi-Fi Performances .................................................................................................................. 26
Table 16 : Bluetooth Performances ........................................................................................................... 27
Table 18 : Antenna Design Requirements................................................................................................. 28
Table 19 : Major Specifications of the RF Connector................................................................................ 29
Table 21 : Absolute Maximum Ratings (Unit: V)........................................................................................ 33
Table 22 : Module Power Supply Ratings (Unit: V) ................................................................................... 33
Table 23 : Power Consumption in Non-signaling Mode (Unit: mA)........................................................... 34
Table 24 : Power Consumption in Non-signaling Mode (Unit: mA)........................................................... 34
Table 25 : VBAT I/O Requirements (Unit: V)............................................................................................. 35
Table 26 : ESD Characteristics (Unit: kV).................................................................................................. 35
Table 27 : Recommended Thermal Profile Parameters ............................................................................ 41
Table 28 : FGM842D Carrier Tape Dimension Table (Unit: mm).............................................................. 42
Table 29 : FGM842D-P Carrier Tape Dimension Table (Unit: mm).......................................................... 42
Table 30 : Plastic Reel Dimension Table (Unit: mm)................................................................................. 43
Table 31 : Reference Documents.............................................................................................................. 45
Table 32 : Terms and Abbreviations.......................................................................................................... 45

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Figure Index
Figure 2 :FGM842D Pin Assignment (Top View)....................................................................................... 13
Figure 4 : UART1 Connection.................................................................................................................... 18
Figure 5 : UART2 Reference Design......................................................................................................... 18
Figure 6 : SPI Connection (Master Mode) ................................................................................................. 19
Figure 7 : SPI Connection (Slave Mode) ................................................................................................... 19
Figure 8 : Reference Circuit of Power Supply............................................................................................ 23
Figure 9 : Turn-on Timing........................................................................................................................... 23
Figure 10 : Reference Circuit of CHIP_EN by Using a Driving Circuit ...................................................... 24
Figure 11 : Reference Circuit of RESET with a Button.............................................................................. 24
Figure 12 : Reset Timing............................................................................................................................ 25
Figure 18 : Dimensions of the Receptacle (Unit: mm)............................................................................... 29
Figure 19 : Space Factor of the Mated Connectors (Unit: mm)................................................................. 30
Figure 20 : Plug in a Coaxial Cable Plug................................................................................................... 31
Figure 21 : Pull out a Coaxial Cable Plug.................................................................................................. 31
Figure 22 : Install the Coaxial Cable Plug with Jig..................................................................................... 32
Figure 24 :FGM842D Top and Side Dimensions....................................................................................... 36
Figure 25 :FGM842D Bottom Dimensions (Bottom View)......................................................................... 37
Figure 29 : FGM842D Top and Bottom Views........................................................................................... 38
Figure 31 : Recommended Reflow Soldering Thermal Profile .................................................................. 40
Figure 32 : Carrier Tape Dimension Drawing (Unit: mm).......................................................................... 42
Figure 33 : Plastic Reel Dimension Drawing ............................................................................................. 43
Figure 34 : Mounting Direction................................................................................................................... 43
Figure 35 : Packaging Process.................................................................................................................. 44

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1Introduction
QuecOpen®is a solution where the module acts as the main processor. Constant transition and evolution
of both the communication technology and the market highlight its merits. It can help you to:
⚫Realize embedded applications’ quick development and shorten product R&D cycle
⚫Simplify circuit and hardware structure design to reduce engineering costs
⚫Miniaturize products
⚫Reduce product power consumption
⚫Apply OTA technology
⚫Enhance product competitiveness and price-performance ratio
This document defines FGM842D in QuecOpen®solution and describes its air interfaces and hardware
interfaces, which are connected with your applications. The document provides a quick insight into
interface specifications, RF performance, electrical and mechanical specifications, as well as other
related information of the module.
Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type FGM842D is in
compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com/support/technical.htm
1.1. Special Mark