Quectel QuecOpen AG525R-GL Supplement

AG525R-GL QuecOpen
Hardware Design
Automotive Module Series
Version: 1.0.0
Date: 2020-10-13
Status: Preliminary
www.quectel.com

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Hardware Design
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Copyright
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Transmitting, reproducing, disseminating and editing this document as well as using the content without
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Copyright © Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved.

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About the Document
Revision History
Version Date Author Description
- 2020-04-04
Leon HUANG/
Alex ZHANG/
Evan SHEN/
Creation of the document
1.0 2020-10-13
Leon HUANG/
Alex ZHANG/
Evan SHEN/
Thomas ZHANG
Preliminary

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Contents
About the Document................................................................................................................................ 3
Contents.................................................................................................................................................... 4
Table Index ............................................................................................................................................... 6
Figure Index.............................................................................................................................................. 8
1Introduction..................................................................................................................................... 10
1.1.Safety Information .................................................................................................................. 13
2Product Concept ............................................................................................................................. 14
2.1.General Description................................................................................................................ 14
2.2.Key Features .......................................................................................................................... 17
2.3.Functional Diagram ................................................................................................................ 19
2.4.Evaluation Board .................................................................................................................... 20
3Application Interfaces..................................................................................................................... 21
3.1.General Description................................................................................................................ 21
3.2.Pin Assignment....................................................................................................................... 22
3.3.Pin Description ....................................................................................................................... 23
3.4.Operating Modes.................................................................................................................... 39
3.5.Power Saving ......................................................................................................................... 39
3.5.1.Sleep Mode.................................................................................................................. 39
3.5.1.1.USB Application with USB Remote Wakeup Function ...................................... 40
3.5.1.2.USB Application without USB Remote Wakeup Function ................................. 41
3.5.1.3.USB Application without USB Suspend Function.............................................. 41
3.5.2.Airplane Mode.............................................................................................................. 42
3.6.Power Supply ......................................................................................................................... 42
3.6.1.Power Supply Pins....................................................................................................... 42
3.6.2.Decrease Voltage Drop................................................................................................ 43
3.6.3.Reference Design for Power Supply............................................................................ 44
3.6.4.Monitor the Power Supply............................................................................................ 45
3.7.Power on and off Scenarios ................................................................................................... 45
3.7.1.Turn on Module with PWRKEY.................................................................................... 45
3.7.2.Turn on Module with PON_1........................................................................................ 47
3.7.3.Turn off Module............................................................................................................ 47
3.7.3.1.Turn off Module Using PWRKEY ...................................................................... 47
3.7.3.2.Turn off Module Using API Interface ................................................................. 48
3.8.Reset the Module ................................................................................................................... 48
3.9.(U)SIM Interfaces ................................................................................................................... 50
3.10.USB Interfaces ....................................................................................................................... 52
3.11.UART Interfaces ..................................................................................................................... 54
3.12.I2S and I2C Interfaces............................................................................................................ 57

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3.13.SDIO Interface........................................................................................................................ 58
3.14.SPI Interfaces......................................................................................................................... 60
3.15.RGMII Interface ...................................................................................................................... 61
3.16.WLAN and BT Interfaces* ...................................................................................................... 64
3.17.ADC Interfaces ....................................................................................................................... 67
3.18.USB_BOOT Interface ............................................................................................................. 68
3.19.GPIO Interfaces...................................................................................................................... 69
4Antenna Interfaces.......................................................................................................................... 70
4.1.Main/Rx-diversity Antenna Interface....................................................................................... 70
4.1.1.Pin Definition................................................................................................................ 70
4.1.2.Operating Frequency ................................................................................................... 70
4.1.3.Reference Design of RF Antenna Interfaces ............................................................... 72
4.1.4.Reference Design of RF Layout................................................................................... 73
4.2.Antenna Installation ................................................................................................................ 75
4.2.1.Antenna Requirements ................................................................................................ 75
4.2.2.Recommended RF Connector for Antenna Installation................................................ 76
5Reliability, Radio and Electrical Characteristics .......................................................................... 77
5.1.Absolute Maximum Ratings.................................................................................................... 77
5.2.Power Supply Ratings ............................................................................................................ 78
5.3.Operation and Storage Temperatures..................................................................................... 78
5.4.Current Consumption ............................................................................................................. 79
5.5.RF Output Power.................................................................................................................... 84
5.6.RF Receiving Sensitivity......................................................................................................... 86
5.7.Electrostatic Discharge........................................................................................................... 88
5.8.Thermal Consideration ........................................................................................................... 89
6Mechanical Dimensions.................................................................................................................. 91
6.1.Mechanical Dimensions.......................................................................................................... 91
6.2.Recommended Footprint ........................................................................................................ 93
6.3.Top and Bottom Views............................................................................................................ 94
7Storage, Manufacturing and Packaging........................................................................................ 95
7.1.Storage ................................................................................................................................... 95
7.2.Manufacturing and Soldering.................................................................................................. 96
7.3.Packaging............................................................................................................................... 97
8Appendix A References.................................................................................................................. 99
9Appendix B GPRS Coding Schemes........................................................................................... 103
10Appendix C GPRS Multi-slot Classes.......................................................................................... 104
11Appendix D EDGE Modulation and Coding Schemes................................................................ 106

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Table Index
Table 1: Frequency Bands of AG525R-GL QuecOpen®Module.............................................................. 14
Table 2: Key Features ............................................................................................................................. 17
Table 3: I/O Parameters Definition........................................................................................................... 23
Table 4: Pin Description........................................................................................................................... 24
Table 5: Alternate Functions of Multiplexing Pins .................................................................................... 35
Table 6: Overview of Operating Modes ................................................................................................... 39
Table 7: VBAT and GND Pins.................................................................................................................. 43
Table 8: PWRKEY Pin Description .......................................................................................................... 45
Table 9: PON_1 Pin Description .............................................................................................................. 47
Table 10: RESET Pin Description............................................................................................................ 49
Table 11: Pin Definition of (U)SIM Interface............................................................................................. 50
Table 12: Pin Description of USB Interface ............................................................................................. 52
Table 13: Pin Definition of UART1 Interface ............................................................................................ 55
Table 14: Pin Definition of BT UART Interface......................................................................................... 55
Table 15: Pin Definition of Debug UART Interface................................................................................... 55
Table 16: Logic Levels of Digital I/O ........................................................................................................ 55
Table 17: Pin Definition of I2S Interface .................................................................................................. 57
Table 18: Pin Definition of I2C Interface .................................................................................................. 57
Table 19: Pin Definition of SDIO Interface ............................................................................................... 58
Table 20: Pin Definition of SPI Interfaces ................................................................................................ 60
Table 21: Parameters of SPI Interface Timing ......................................................................................... 61
Table 22: Pin Definition of RGMII Interface ............................................................................................. 61
Table 23: Pin Definition of WLAN and BT Interfaces ............................................................................... 64
Table 24: Pin Definition of ADC Interfaces............................................................................................... 67
Table 25: Characteristic of ADC Interface................................................................................................ 67
Table 26: Pin Definition of USB_BOOT Interface .................................................................................... 68
Table 27: Pin Definition of GPIOs............................................................................................................ 69
Table 28: Pin Definition of Main/Rx-diversity Antenna Interfaces ............................................................ 70
Table 29: Module Operating Frequencies................................................................................................ 70
Table 30: Antenna Requirements ............................................................................................................ 75
Table 31: Absolute Maximum Ratings ..................................................................................................... 77
Table 32: Power Supply Ratings.............................................................................................................. 78
Table 33: Operation and Storage Temperatures ...................................................................................... 78
Table 34: Module Current Consumption (25 °C, 3.8 V Power Supply) .................................................... 79
Table 35: RF Output Power ..................................................................................................................... 84
Table 36: RF Receiving Sensitivity (Unit: dBm) ....................................................................................... 86
Table 37: Electrostatic Discharge Characteristics.................................................................................... 88
Table 38: Recommended Thermal Profile Parameters............................................................................ 97
Table 39: Related Documents ................................................................................................................. 99
Table 40: Terms and Abbreviations.......................................................................................................... 99
Table 41: Description of Different Coding Schemes .............................................................................. 103

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Table 42: GPRS Multi-slot Classes........................................................................................................ 104
Table 43: EDGE Modulation and Coding Schemes ............................................................................... 106

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Figure Index
Figure 1: Functional Diagram for AG525R-GL QuecOpen®..................................................................... 20
Figure 2: Pin Assignment (Top View)....................................................................................................... 22
Figure 3: Sleep Mode Current Consumption Diagram............................................................................. 40
Figure 4: Sleep Mode Application with USB Remote Wakeup................................................................. 40
Figure 5: Sleep Mode Application without USB Remote Wakeup............................................................ 41
Figure 6: Sleep Mode Application without Suspend Function.................................................................. 42
Figure 7: Power Supply Limits during Burst Transmission ...................................................................... 43
Figure 8: VBAT Reference Design .......................................................................................................... 44
Figure 9: 12/24 V Power Supply System Reference Design ................................................................... 44
Figure 10: Turn on the Module Using Driving Circuit ............................................................................... 45
Figure 11: Turn on the Module Using Keystroke...................................................................................... 46
Figure 12: Power-on Timing .................................................................................................................... 46
Figure 13: Turn on the Module using PON_1 .......................................................................................... 47
Figure 14: Power-off Timing .................................................................................................................... 48
Figure 15: Reference Circuit of RESET by Using Driving Circuit............................................................. 49
Figure 16: Reference Circuit of RESET by Using Button ........................................................................ 49
Figure 17: Timing of Resetting Module.................................................................................................... 50
Figure 18: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector ........................ 51
Figure 19: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector .......................... 51
Figure 20: Reference Circuit of USB 2.0 Application ............................................................................... 53
Figure 21: Reference Circuit of USB 3.0 Application ............................................................................... 53
Figure 22: Reference Circuit with Translator Chip................................................................................... 56
Figure 23: Reference Circuit with Transistor Circuit ................................................................................ 56
Figure 24: Reference Circuit of I2S and I2C Application with Audio Codec............................................. 57
Figure 25: Reference Design of SDIO Interface for eMMC Application ................................................... 59
Figure 26: SPI Timing.............................................................................................................................. 60
Figure 27: Simplified Block Diagram for Ethernet Application ................................................................. 62
Figure 28: Reference Circuit of RGMII Interface with PHY Application ................................................... 63
Figure 29: Reference Circuit for Connection with WLAN&BT PHY ......................................................... 66
Figure 30: Reference Circuit of USB_BOOT Interface ............................................................................ 68
Figure 31: Reference Circuit of RF Antenna Interfaces ........................................................................... 72
Figure 32: Microstrip Design on a 2-layer PCB ....................................................................................... 73
Figure 33: Coplanar Waveguide Design on a 2-layer PCB...................................................................... 73
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 74
Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 74
Figure 36: Description of the HFM Connector ......................................................................................... 76
Figure 37: Referenced Heatsink Design (Heatsink at the Top of the Module) ......................................... 89
Figure 38: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)........................ 90
Figure 39: Module Top and Side Dimensions .......................................................................................... 91
Figure 40: Module Bottom Dimensions (Top View).................................................................................. 92
Figure 41: Recommended Footprint (Top View) ...................................................................................... 93

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Figure 42: Top View of the Module .......................................................................................................... 94
Figure 43: Bottom View of the Module .................................................................................................... 94
Figure 44: Recommended Reflow Soldering Thermal Profile.................................................................. 96
Figure 45: Tape Specifications................................................................................................................. 98
Figure 46: Reel Specifications................................................................................................................. 98

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1Introduction
QuecOpen®is an application solution where the module acts as a main processor. With the development
of communication technology and the ever-changing market demands, more and more customers have
realized the advantages of QuecOpen®solution. Especially, its advantage in reducing the product cost is
greatly valued by customers. With QuecOpen® solution, development flow for wireless application and
hardware design will be simplified. Main features of QuecOpen® solution are listed below:
Simplifies the development of embedded applications, and shortens product development cycle
Simplifies circuit design, and reduces product cost
Decreases the size of terminal products
Reduces power consumption
Supports remote upgrade of firmware over the air
Improves products’ cost-performance ratio, and enhances products’ competitiveness
This document, describing AG525R-GL QuecOpen®module and its air interface and hardware interfaces
connected to your applications, informs you of the interface specifications, electrical and mechanical
details, as well as other related information of the module.
With the application notes and user guides provided separately, you can easily use the module to design
and set up mobile applications.
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based time-
averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements
of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body
and must not transmit simultaneously with any other antenna or transmitter.
3.A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR2020AG525RGL.
4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
❒GSM850:≤8.446dBi
❒GSM1900:≤10.030dBi
❒WCDMA II/ LTE Band 2/7/25/38/41:≤8.000dBi

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❒WCDMA IV/ LTE Band 4/66:≤5.000dBi
❒WCDMA V/ LTE Band 5:≤9.416dBi
❒LTE Band 12:≤8.734dBi
❒LTE Band 13:≤9.173dBi
❒LTE Band 26:≤9.337dBi
❒LTE Band 71:≤8.447dBi
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products. Please
refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining
to the OEM the labeling requirements, options and OEM user manual instructions that are required (see
next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC
ID: XMR2020AG525RGL” or “Contains FCC ID: XMR2020AG525RGL” must be used. The host OEM
user manual must also contain clear instructions on how end users can find and/or access the module
and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user
that changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment. In cases where the manual is provided only in a form other
than paper, such as on a computer disk or over the Internet, the information required by this section may
be included in the manual in that alternative form, provided the user can reasonably be expected to have
the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
1.1. IC Statement

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IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions: (1) This device may not cause interference; and (2) This device must accept any
interference, including interference that may cause undesired operation of the device." or "Le présent
appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF
The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body
and must not transmit simultaneously with any other antenna or transmitter.
L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm
de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre
antenne ou un autre émetteur.
To comply with IC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
❒GSM850:≤8.446dBi
❒GSM1900:≤10.030dBi
❒WCDMA II/ LTE Band 2/7/25/38/41:≤8.000dBi
❒WCDMA IV/ LTE Band 4/66:≤5.000dBi
❒WCDMA V/ LTE Band 5:≤9.416dBi
❒LTE Band 12:≤8.734dBi
❒LTE Band 13:≤9.173dBi
❒LTE Band 26:≤9.337dBi
❒LTE Band 71:≤8.447dBi
The host product shall be properly labelled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host product; otherwise, the host product must be labeled
to display the Innovation, Science and Economic Development Canada certification number for the
module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-2020AG525RGL” or “where: 10224A-2020AG525RGL is the module’s
certification number”.
Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module
doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte
doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement
économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la
même signification, comme suit:"Contient IC: 10224A-2020AG525RGL " ou "où:
10224A-2020AG525RGL est le numéro de certification du module.

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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes distraction
and can lead to an accident. Please comply with laws and regulations restricting the
use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation of
wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use of
wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please
be aware of the restrictions on the use of wireless devices when in hospitals, clinics or
other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network cannot
be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid
or the (U)SIM card is invalid. When emergent help is needed in such conditions, use
emergency call if the device supports it. In order to make or receive a call, the cellular
terminal or mobile must be switched on in a service area with adequate cellular signal
strength. In an emergency, the device with emergency call function cannot be used as
the only contact method considering network connection cannot be guaranteed under
all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to TV
sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs
and turn off wireless devices such as mobile phone or other cellular terminals. Areas
with explosive or potentially explosive atmospheres include fuelling areas, below
decks on boats, fuel or chemical transfer or storage facilities, and areas where the air
contains chemicals or particles such as grain, dust or metal powders.

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2Product Concept
2.1. General Description
AG525R-GL QuecOpen module is a baseband processor platform based on ARM Cortex A7 kernel. The
maximum dominant frequency is up to 1.497 GHz.
AG525R-GL QuecOpen module is a series of automotive-grade LTE-FDD/LTE-TDD/WCDMA/GSM
wireless communication modules with receive diversity. It provides data connectivity on LTE-FDD,
LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides
GNSS function (optional) and audio function to meet specific application demands.
AG525R-GL QuecOpen contains global main bands to meet varied market demands.
Engineered to meet the demanding requirements in automotive applications and other harsh operating
conditions, the module offers a premium solution for high performance automotive and intelligent
transportation system (ITS) applications, such as fleet management, onboard vehicle telematics, in-car
entertainment systems, emergency calling, and roadside assistance.
With a compact profile of 38.0 mm × 42.0 mm × 2.65 mm, the module can meet almost all requirements
for automobile applications. It is an SMD type module which can be embedded into applications through
its 400 LGA pins.
Table 1: Frequency Bands of AG525R-GL QuecOpen®Module
Network Type AG525R-GL QuecOpen Module
LTE-FDD
(with Rx-diversity)
B1/B2/B3/B4/B5/B7/B8/B9/B11/B12/B13/B18/B19/B20/B21/B25/B26/
B28/B29 1)/B30 1)/B32 1)/B66/B71
LTE-TDD
(with Rx-diversity) B34/B38/B39/B40/B41
2CA (DL)
B12+B12/B25/B30/B66
B13+B66
B19+B21
B1+B18/B19/B1/B20/B28/B38/B3/B40/B41/B5/B7/B8
B20+B32/B38/B40

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B21+B28
B25+B25/B26
B28+B38/B40/B41/B28
B29+B30/B66
B2+B12/B13/B29/B2/B30/B4/B5/B66/B71/B7
B30+B66
B34+B41
B38+B38
B39+B41/B39
B3+B18/B19/B20/B28/B38/B3/B40/B41/B5/B7/B8
B40+B40
B41+B41
B4+B12/B13/B29/B30/B4/B5/B71/B7
B5+B25/B30/B38/B40/B41/B5/B66/B7
B66+B66/B71
B7+B12/B20/B28/B32/B66/B7/B8
B8+B11/B32/B38/B39/B40/B41/B8
3CA (DL)
B12+B66+B66
B12+B12+B66
B13+B66+B66
B1+B1+B28/B3/B5/B7/B41/B8
B1+B3+B18/B19/B20/B28/B38/B3/B40/B41/B5/B7/B8
B1+B40+B40
B1+B41+B41
B1+B5+B40/B7
B1+B7+B20/B28/B7/B8
B1+B8+B38/B40
B20+B38+B38
B20+B40+B40
B25+B25+B25/B2
B28+B40+B40
B28+B41+B41
B29+B30+B66
B29+B66+B66
B2+B12+B12/B30/B66
B2+B13+B66
B2+B29+B30/B66
B2+B2+B12/B13/B29/B30/B4/B5/B66/B71/B7
B2+B30+B66
B2+B4+B12/B13/B29/B30/B4/B5/B71/B7
B2+B5+B30/B66/B7/B5
B2+B66+B66/B71
B2+B7+B12/B66/B7
B30+B66+B66

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1) LTE-FDD B29, B30 and B32 support Rx only.
B39+B41+B4
B39+B39+B41
B3+B28+B40/B41
B3+B3+B20/B28/B41/B7/B8/B38/B40/B5
B3+B40+B40
B3+B41+B41
B3+B5+B40/B7
B3+B7+B20/B28/B7/B8
B3+B8+B38/B40
B40+B40+B40
B41+B41+B41
B4+B12+B12/B30
B4+B29+B30
B4+B4+B12/B13/B29/B30/B5/B71/B7
B4+B5+B30/B5
B4+B7+B12/B7
B5+B30+B66
B5+B40+B40
B5+B5+B66/B30
B5+B66+B66
B5+B7+B7
B66+B66+B66/B71
B7+B12+B66/B12
B7+B20+B32
B7+B66+B66
B7+B7+B8/B28/B20/B66
B8+B39+B39
B8+B40+B40
B8+B41+B41
B8+B8+B39/B41
WCDMA
(with Rx-diversity) B1/B2/B3/B4/B5/B8/B19
GSM 850/900/1800/1900 MHz
GNSS Optional
NOTE

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2.2. Key Features
The following table describes detailed features of the module.
Table 2: Key Features
Feature Details
Power Supply
VBAT_BB/VBAT_RF:
Supply voltage: 3.3–4.3 V
Typical supply voltage: 3.8 V
Transmitting Power
Class 4 (33 dBm ±2 dB) for GSM850/EGSM900
Class 1 (30 dBm ±2 dB) for DCS1800/PCS1900
Class E2 (27 dBm ±3 dB) for GSM850/EGSM900 8-PSK
Class E2 (26 dBm ±3 dB) for DCS1800/PCS1900 8-PSK
Class 3 (24dBm +1/-3 dB) for WCDMA bands
Class 3 (23 dBm ±2 dB) for LTE-FDD bands
Class 3 (23 dBm ±2 dB) for LTE-TDD bands
LTE Features
Support up to 3 × CA Cat 12 LTE FDD and TDD
Support 1.4/3/5/10/15/20 MHz RF bandwidth
Support 2 × 2 MIMO in DL direction
LTE-FDD: Max. 600 Mbps (DL)/75 Mbps (UL)
LTE-TDD: Max. 467 Mbps (DL)/45 Mbps (UL)
UMTS Features
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42 Mbps (DL)
HSUPA: Max 5.76 Mbps (UL)
WCDMA: Max 384 kbps (DL)/384 kbps (UL)
GSM Features
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107 kbps (DL)/85.6 kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296 kbps (DL)/236.8 kbps (UL)
Internet Protocol Features
Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS/
MMS/FTPS/SSL protocols
Support PAP and CHAP used for PPP connections

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SMS
Text and PDU modes
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interfaces Support USIM/SIM card: 1.8/3.0 V
Audio Features
Provide one digital audio interface: I2S interface
GSM: HR/FR/EFR/AMR/AMR-WB
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
I2S Interface Used for external codec function
PCM Interface
Used for external BT function
Support 16-bit linear data format
Support long frame sync and short frame sync
Support master and slave modes, but must be the master in long
frame sync
USB Interfaces
USB 3.0 and 2.0 interfaces (slave mode by default; support USB
master mode), with maximum transmission rates up to 5 Gbps on
USB 3.0 and 480 Mbps on USB 2.0
Used for AT command communication, data transmission, firmware
upgrade, software debugging, and voice over USB*
Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6~5.4,
and Android 4.x/5.x/6.x/7.x/8.x/9.x
UART Interfaces
UART1:
Baud rate reach up to 921600 bps, 115200 bps by default
Support RTS and CTS hardware flow control
BT UART:
Baud rate reach up to 921600 bps, 115200 bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output, 115200 bps baud rate
SDIO Interface Support eMMC 4.5.1
SPI Interfaces
Support master mode only
Maximum clock frequency rate: 50 MHz
I2C Interface
Compliant with I2C specification version 3.0
Multi-master is not supported
Used for codec configuration by default
RGMII Interface Support 10/100/1000 Mbps
Wireless Connectivity
Interface*
PCIe (Gen2) interface for WLAN
UART & PCM interfaces for Bluetooth*

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Rx-diversity Support LTE/WCDMA Rx-diversity
Antenna Interfaces
Main antenna interface (ANT_MAIN)
Rx-diversity antenna interface (ANT_DIV)
Physical Characteristics
Dimensions: (38.0 ±0.2) mm × (42.0 ±0.2) mm × (2.65 ±0.2) mm
Weight: approx. 9.23 g
Temperature Range
Operation temperature range: -35 °C to +75 °C 1)
Extended temperature range: -40 °C to +85 °C 2)
eCall temperature range: -40 °C to +90 °C 3)
Storage temperature range: -40 °C to +95 °C
Firmware Upgrade
USB 2.0 interface
DFOTA
RoHS All hardware components are fully compliant with EU RoHS directive
1. 1) Within operation temperature range, the module is 3GPP compliant, and emergency call can be
dialed out with a maximum power and data rate.
2. 2) Within extended temperature range, the module remains fully functional and retains the ability to
establish and maintain functions such as voice, SMS, data transmission and emergency call, without
any unrecoverable malfunction. Radio spectrum and radio network will not be influenced, while one
or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified
tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the
module will meet 3GPP specifications again.
3. 3) Within eCall temperature range, the emergency call function must be functional until the module is
broken. When the ambient temperature is between 75 °C and 90 °C and the module temperature has
reached the threshold value, the module will trigger protective measures (such as reduce power,
decrease throughput and unregister the device) to ensure the full function of emergency call.
4. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of the module and illustrates the major functional parts.
Power management
Baseband
LPDDR4X + NAND flash
Radio frequency
Peripheral interfaces
NOTES