Quectel SC200L-EM Supplement

SC200L-EM
Hardware Design
Smart module series
Rev:1.0
Date: 2020-9-21
Status：Controlled Documents
www.quectel.com

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About the Document
Revision History
Revision Date Author Description
1.0 2020-9-21 Jeffrey/Andy Initial

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Contents
About the Document................................................................................................................................ 3
Contents.................................................................................................................................................... 4
1Introduction....................................................................................................................................... 6
1.1.Safety Information .................................................................................................................... 6
2Product Concept ............................................................................................................................... 8
2.1.General Description.................................................................................................................. 8
2.2.Evaluation Board ...................................................................................................................... 9
3Application Interfaces..................................................................................................................... 10
3.1.General Description................................................................................................................ 10
3.2.Pin Assignment........................................................................................................................11
3.3.Pin Description ....................................................................................................................... 12
3.4.Power Supply ......................................................................................................................... 23
3.4.1.Decrease Voltage Drop................................................................................................ 23
3.4.2.Decrease Voltage Drop................................................................................................ 23
3.4.3.Reference Design for Power Supply............................................................................ 25
3.5.Turn on and off Scenarios ...................................................................................................... 26
3.5.1.Turn on Module Using the PWRKEY ........................................................................... 26
3.5.2.Turn off Module............................................................................................................ 28
3.6.Power Output ......................................................................................................................... 28
3.7.Battery Charge and Management .......................................................................................... 29
3.8.USB Interface ......................................................................................................................... 30
3.9.UART Interfaces ..................................................................................................................... 33
3.10.(U)SIM Interface ..................................................................................................................... 34
3.11.SD Card Interface................................................................................................................... 36
3.12.GPIO Interfaces...................................................................................................................... 38
3.13.I2C Interfaces ......................................................................................................................... 40
3.14.SPI Interfaces......................................................................................................................... 40
3.15.ADC Interface......................................................................................................................... 41
3.16.LCM Interface......................................................................................................................... 42
3.17.Touch Panel Interface............................................................................................................. 44
3.18.Camera Interface.................................................................................................................... 45
3.19.Sensor Interfaces ................................................................................................................... 49
3.20.Audio Interface ....................................................................................................................... 50
3.20.1 Microphone interface reference circuit ............................................................................ 51
3.20.2 Handset interface reference circuit.................................................................................. 52
3.20.3 Headphone interface reference circuit ............................................................................ 52
3.20.4 Speaker interface reference circuit.................................................................................. 53
3.20.5 Audio signal design considerations ................................................................................. 53
3.21.Emergency Download Interface ............................................................................................. 54

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4Wi-Fi and BT................................................................................................................................... 55
4.1.Wi-Fi Overview ....................................................................................................................... 55
4.1.1Wi-Fi Performance....................................................................................................... 55
4.2BT Overview........................................................................................................................... 56
4.2.1BT Performance........................................................................................................... 57
5GNSS................................................................................................................................................ 58
5.1GNSS Performance................................................................................................................ 58
5.2GNSS RF Design Guidelines ................................................................................................. 59
6Antenna Interfaces.......................................................................................................................... 60
6.1Main/Rx-diversity Antenna Interfaces ..................................................................................... 60
6.1.1Main and Rx-diversity Antenna Interfaces Reference Design...................................... 62
6.1.2 Reference Design of RF Layout..................................................................................... 62
6.2Wi-Fi/BT Antenna Interface .................................................................................................... 64
6.3GNSS Antenna Interface ........................................................................................................ 65
6.3.1Recommended Circuit for Passive Antenna ................................................................ 66
6.3.2Recommended Circuit for Active Antenna ................................................................... 66
6.4Antenna Installation ................................................................................................................ 67
6.4.1Antenna Requirements ................................................................................................ 67
6.4.2Recommended RF Connector for Antenna Installation................................................ 68
6Electrical, Reliability and Radio Characteristics.......................................................................... 70
7.1Absolute Maximum Ratings.................................................................................................... 70
7.2Power Supply Ratings ............................................................................................................ 70
7.3Operation and Storage Temperatures..................................................................................... 71
7.4Current Consumption ............................................................................................................. 71
7.5RF Output Power.................................................................................................................... 74
7.6RF Receiving Sensitivity......................................................................................................... 76
7.7Electrostatic Discharge........................................................................................................... 77
7Mechanical Dimensions.................................................................................................................. 78
8.1Mechanical Dimensions of the Module ................................................................................... 78
8.2Recommended Footprint ........................................................................................................ 80
8.3Top and Bottom Views of the Module ..................................................................................... 81
8Storage, Manufacturing and Packaging........................................................................................ 82
8.1Storage ................................................................................................................................... 82
9.2Manufacturing and Soldering.................................................................................................. 82
9.3Packaging............................................................................................................................... 84
9Appendix A References.................................................................................................................. 86
10Appendix B GPRS Coding Schemes............................................................................................. 91
11Appendix C GPRS Multi-slot Classes............................................................................................ 92
12Appendix D EDGE Modulation and Coding Schemes.................................................................. 94

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1Introduction
This document defines the SC200L module and its air interfaces and hardware interfaces which are
connected with customers’ application.
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating SC200L module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.

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The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2Product Concept
2.1. General Description
SC200L is a series of 4G Smart LTE module based on UNISOC platform and Android operating system,
and provides industrial grade performance. Its general features are listed below:
Support LTE-FDD, LTE-TDD, WCDMA, EDGE, GSM and GPRS coverage.
Support short-range wireless communication via Wi-Fi 802.11a/b/g/n and BT4.2 LE.
Integrate GPS/GLONASS/BeiDou satellite positioning systems.
Support multiple audio and video codecs.
Built-in high performance Mail-T820 graphics processing unit.
Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces.
SC200L module is available in three variants: SC200L-CE, SC200L-EM, SC200L-WF.
Table 1：SC200L-EM frequency bands
Mode Frequency band
LTE-FDD B1/B2/B3/B5/B7/B8/B20/B28
LTE-TDD B38/B39/B40/B41(200 MHz)
WCDMA B1/B2/B5/B8
GSM 850/900/1800/1900 MHz
Wi-Fi 802.11b/g/n CE: 2412-2472 MHz
FCC: 2412-2462 MHz
BT 4.2 LE 2402~2480 MHz
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5~1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz

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2.2. Evaluation Board
To help customers design and test applications with Quectel SC200L modules, Quectel supplies an
evaluation kit, which includes an evaluation board, a USB to RS232 converter cable, a USB T data cable,
a power adapter, an earphone and antennas. For details, please refer the document [1]

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3Application Interfaces
3.1. General Description
SC200L is an SMD type module with 146 LCC pins and 128 LGA pins. The following chapters provide the
detailed description of pins/interfaces listed below.
Power supply
USB interface
UART interfaces
(U)SIM interfaces
GPIO interfaces
I2C interface
SPI interfaces
ADC interfaces
LCM interfaces
Touch panel interface
Camera interfaces
Sensor interfaces
Audio interfaces
Emergency download interface

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3.2. Pin Assignment
The following figure shows the pin assignment of SC200Lmodule.
Figure 1: Pin Assignment (Top View)

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3.3. Pin Description
The following tables show the SC200L’s pin definition.
Table 4: I/O Parameters Definition
The following tables show the SC200L’s pin definition and electrical characteristics.
Table 5: Pin Description
Type Description
AI Analog input
AO Analog output
DI Digital input
DO Digital output
IO Bidirectional
OD Open drain
PI Power input
PO Power output
Power supply
Pin Name Pin No. I/O Description DC
Characteristics Comment
VBAT_BB 1, 2
PI/P
O
Power supply for
module’s baseband
part
Vmax=4.2V
Vmin=3.55V
Vnorm=3.8V
It must be provided
with sufficient current
up to 3.0A.
It is suggested to use
a TVS for external
circuit.
VBAT_RF 145, 146 PI
Power supply for
module’s RF part.
Vmax = 4.20 V
Vmin = 3.50 V
Vnorm = 3.80 V
LDO1_1V85 111 PO
1.85V output power
supply
Vnorm=1.85V
IOmax=100mA
Power supply for
external GPIO’s pull
up circuits and level
shift circuit.

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LDO2_1V8 125 PO
1.8V output power
supply
Vnorm = 1.80 V
IOmax = 500 mA
Power supply for
sensors, cameras,
and I2C pull-up
circuits.
LDO4_2V8 156 PO
2.80V output power
supply
Vnorm = 2.80 V
IOmax = 200 mA
Power supply for
LCD, touch screen
and sensors
LDO3_2V8 129 PO
输出 2.80 V Vnorm = 2.80 V
IOmax = 150 mA
Power supply for
camera AVDD and
AFVDD。
GND
Pin Name Pin No.
GND
3、7、12、15、27、51、62、69、76、78、85、86、88、89、120、122、130、132、
135、140、143、144、162、171、172、176、187、188、189、190、191、202、
203、204、206、207、208、209、210、211、212、213、214、215、216、217、
218、219、220、221、222、223、224、226、227、228、229、230、231、233、
234、235、236、237、238、240、241、243、244、245、247、248、250、251、
255、256、258、259、261、266、268、269、271、272、273、274
Audio Interfaces
Pin Name Pin No. I/O Description DC
Characteristics Comment
MIC1_P 4AI Microphone input for
channel 1 (+)
MIC1_N 5AI Microphone input for
channel 1 (-)
MIC2_P 6 AI icrophone input for
headset (+)
MIC2_N 148 AI
icrophone input for
headset (-)
EAR_P 8AO Earpiece output (+)
EAR_N 9AO Earpiece output (-)
SPK_P 10 AO Speaker output (+)
SPK_N 11 AO Speaker output (-)
HPH_R 136 AO Headphone right
channel output
HPH_REF 137 AO Headphone
reference ground No need to be
grounded.

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HPH_L 138 AO Headphone left
channel output
HS_DET 139 AI Headset insertion
detection The default is high.
HPMIC_DET 150 AI
Headphone
microphone
detection
MIC_BIAS1 147 PO
Microphone bias1
voltage
VO= 2.20~3.00 V
Vnorm = 2.50 V
MIC3_P 152 AI
Microphone input for
secondary
microphone (+)
MIC3_N 151 AI
Microphone input for
secondary
microphone (-)
MIC_BIAS2 149 PO
Microphone bias2
voltage
VO= 2.20~3.00 V
Vnorm = 2.80 V
USB Interface
Pin Name Pin No. I/O Description DC
Characteristics Comment
USB_VBUS 141、142 PI USB power supply
Vmax=9.2V
Vmin=4.5V
Vnorm=5.00V
Used for USB 5V
power input and USB
detection.
USB_DM 13 AI/A
O
USB differential data
bus (-) USB 2.0 standard
compliant.
90Ωdifferential
impedance.
USB_DP 14 AI/A
O
USB differential data
bus (+)
USB_ID 16 DI USB ID detection of
the input High level by default.
(U)SIM Interface
Pin Name Pin No. I/O Description DC
Characteristics Comment
USIM2_DET 17 DI (U)SIM2 card plug
detection
VILmax=0.48V
VIHmin=1.39V
Active low.
If it is not used, keep
it open. This function
is turned on by
default.
It can be used as
ordinary GPIO.

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USIM2_RST 18 DO
(U)SIM2 card reset
signal
VOLmax =
0.1 × USIM2_VDD
VOHmin =
0.9 × USIM2_VDD
It cannot be
multiplexed into a
Generic GPIOs.
USIM2_CLK 19 DO
(U)SIM2 card clock
signal
VOLmax =
0.1 × USIM2_VDD
VOHmin =
0.9 × USIM2_VDD
It cannot be
multiplexed into a
Generic GPIOs.
USIM2_DATA 20 IO
(U)SIM2 card data
signal
VILmax =
0.3 × USIM2_VDD
VIHmin =
0.7 × USIM2_VDD
VOLmax =
0.1 × USIM2_VDD
VOHmin =
0.9 × USIM2_VDD
It cannot be
multiplexed into a
Generic GPIOs.
USIM2_VDD 21 PO (U)SIM2 card power
supply
1.80 V (U)SIM:
Vmax = 1.85 V
Vmin = 1.75 V
2.95 V (U)SIM:
Vmax = 3.1 V
Vmin = 2.90 V
Either 1.8V or 2.95V
(U)SIM card is
supported.
USIM1_DET 22 DI
U)SIM1 card plug
detection
VILmax = 0.48 V
VIHmin = 1.39 V
Active low.
If it is not used, keep
it open. This function
is turned on by
default.
It can be used as
ordinary GPIO.
USIM1_RST 23 DO
(U)SIM1 card reset
signal
VOLmax =
0.1 × USIM1_VDD
VOHmin =
0.9 × USIM1_VDD
It cannot be
multiplexed into a
Generic GPIOs.
USIM1_CLK 24 DO
(U)SIM1 card clock
signal
VOLmax =
0.1 × USIM1_VDD
VOHmin =
0.9 × USIM1_VDD
It cannot be
multiplexed into a
Generic GPIOs.

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USIM1_DATA 25 IO
(U)SIM1 card data
signal
VILmax =
0.3 × USIM1_VDD
VIHmin =
0.7 × USIM1_VDD
VOLmax =
0.1 × USIM1_VDD
VOHmin =
0.9 × USIM1_VDD
It cannot be
multiplexed into a
Generic GPIOs.
USIM1_VDD 26 PO
(U)SIM1 card power
supply
1.80 V (U)SIM:
Vmax = 1.85 V
Vmin = 1.75 V
2.95 V (U)SIM:
Vmax = 3.1 V
Vmin = 2.90 V
Either 1.8V or 2.95V
(U)SIM card is
supported 。
UART Interfaces
Pin Name Pin No. I/O Description DC
Characteristics Comment
UART0_TXD 34 DO
UART0 transmit
data
VOLmax = 0.20 V
VOHmin = 1.46 V
1.85V power domain,
If it is not used, keep
it open.
UART0_RXD 35 DI UART0 receive data VILmax = 0.48 V
VIHmin = 1.39 V
UART0_CTS 36 DI
UART0 clear to
send
VILmax = 0.48 V
VIHmin = 1.39 V
UART0_RTS 37 DO
UART0 request to
send
VOLmax = 0.20 V
VOHmin = 1.46 V
DBG_RXD 93 DI
UART1 receive
data.Debug port by
default.
VILmax = 0.48 V
VIHmin = 1.39 V
DBG_TXD 94 DO
UART1 transmit
data.Debug port by
default.
VOLmax = 0.20 V
VOHmin = 1.46 V
SD Card Interface
Pin Name Pin No. I/O Description DC
Characteristics Comment
SD_VDD 38 PO 3.00V output power
supply
Vnorm = 3.00 V
IOmax = 400 mA Power supply for SD.
SD_CLK 39 DO
1.8V/2.95V output
power supply
1.8 V SD card：
VOLmax = 0.19 V
VOHmin = 1.58 V
3.0 V SD card：
VOLmax = 0.31 V
VOHmin = 2.61V
50 Ωsingle-ended
impedance.

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SD_CMD 40 IO
Command signal of
SD card
1.8 V SD card：
VILmax = 0.53 V
VIHmin = 1.30 V
VOLmax = 0.19 V
VOHmin = 1.58 V
3.0 V SD card：
VILmax = 0.87 V
VIHmin = 2.17 V
VOLmax = 0.31 V
VOHmin = 2.61 V
SD_DATA0 41 IO
High speed
bidirectional digital
signal lines of SD
card
1.8 V SD card：
VILmax = 0.53 V
VIHmin = 1.30 V
VOLmax = 0.19 V
VOHmin = 1.58 V
3.0 V SD card：
VILmax = 0.87 V
VIHmin = 2.17 V
VOLmax = 0.31 V
VOHmin = 2.61 V
SD_DATA1 42 IO
SD_DATA2 43 IO
SD_DATA3 44 IO
SD_DET 45 DI
SD card insertion
detection
VILmax = 0.48 V
VIHmin = 1.39 V
SD card insert
detection signal.
Active low.
Touch Panel (TP) Interface
Pin Name Pin No. I/O Description DC
Characteristics Comment
TP_INT 30 DI Interrupt signal of
TP
VILmax = 0.48 V
VIHmin = 1.39 V
1.85V power domain
Can be used as
ordinary GPIO.
TP_RST 31 DO Reset signal of TP VOLmax = 0.20 V
VOHmin = 1.46 V
1.85V power domain
Active low, Can be
used as ordinary
GPIO.
TP_I2C_SCL 47 OD I2C clock signal of
TP 1.85V power domain,
Can be used as
ordinary GPIO.
TP_I2C_SDA 48 OD I2C data signal of
TP
LCM Interface
Pin Name Pin No. I/O Description DC
Characteristics Comment

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PWM 29 DO
Adjust the backlight
brightness.
PWM control signal.
VOLmax = 0.20 V
VOHmin = 1.46 V
1.85V power domain.
Can be used as
ordinary GPIO.
LCD_RST 49 DO LCD reset signal VOLmax = 0.20 V
VOHmin = 1.46 V
1.85V power domain.
Can be used as
ordinary GPIO.
LCD_TE 50 DI
LCD tearing effect
signal
VILmax = 0.48 V
VIHmin = 1.39 V
1.85V power domain.
Can be used as
ordinary GPIO.
DSI_CLK_N 52 AO
MIPI DSI clock
signal (-)
DSI_CLK_P 53 AO
MIPI DSI clock
signal (+)
DSI_LN0_N 54 AO
MIPI DSI data 0
signal (-)
DSI_LN0_P 55 AO
MIPI DSI data 0
signal (+)
DSI_LN1_N 56 AO
MIPI DSI data 1
signal (-)
DSI_LN1_P 57 AO
MIPI DSI data 1
signal (+)
DSI_LN2_N 58 AO
MIPI DSI data 2
signal (-)
DSI_LN2_P 59 AO
MIPI DSI data 2
signal (+)
DSI_LN3_N 60 AO
MIPI DSI data 3
signal (-)
DSI_LN3_P 61 AO
MIPI DSI data 3
signal (+)
Camera Interfaces
Pin Name Pin No. I/O Description DC
Characteristics Comment
CSI1_CLK_N 63 AI
CAMERA MIPI
clock signal (-)
CSI1_CLK_P 64 AI
CAMERA MIPI clock
signal (+)
CSI1_LN0_N 65 AI
CAMERA MIPI data
0 signal (-)
CSI1_LN0_P 66 AI
CAMERA MIPI data
0 signal (+)
CSI1_LN1_N 67 AI
CAMERA MIPI data
1 signal (-)

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CSI1_LN1_P 68 AI
CAMERA MIPI data
1 signal (+)
CSI0_CLK_N 70 AI
CAMERA MIPI
clock signal (-)
CSI0_CLK_P 71 AI
CAMERA MIPI clock
signal (+)
CSI0_LN0_N 72 AI
CAMERA MIPI data
0 signal (-)
CSI0_LN0_P 73 AI
CAMERA MIPI data
0 signal (+)
MCAM_MCLK 74 DO Clock signal of
camera
VOLmax = 0.20 V
VOHmin = 1.46 V 1.85V power domain
SCAM_MCLK 75 DO
Clock signal of
camera
VOLmax = 0.20 V
VOHmin = 1.46 V
1.85V power domain
Can be used as
ordinary GPIO.
MCAM_RST 79 DO
Reset signal of
camera
VOLmax = 0.20 V
VOHmin = 1.46 V
MCAM_PWDN 80 DO
Power down signal
of camera
VOLmax = 0.20 V
VOHmin = 1.46 V
SCAM_RST 81 DO
Reset signal of
camera
VOLmax = 0.20 V
VOHmin = 1.46 V
SCAM_PWDN 82 DO
Power down signal
of camera
VOLmax = 0.20 V
VOHmin = 1.46 V
CAM_I2C_SCL 83 OD
I2C clock signal of
camera
CAM_I2C_SDA 84 OD I2C data signal of
camera
Keypad Interfaces
Pin Name Pin No. I/O Description DC
Characteristics Comment
PWRKEY 114 DI
Turn on/off the
module
VILmax = 0.60 V
VIHmin = 1.30 V
Pull-up to VBAT
internally.Active low.
RESET_N 225 DI Reset the module VILmax = 0.60 V
VIHmin = 1.30 V
Off by default and
can be enabled via
software
configuration.
VOL_UP 95 DI Volume up VILmax = 0.48 V
VIHmin = 1.39 V
If it is not used, keep
it open.Cannot be
pull up. 1.85V power
domain
VOL_DOWN 96 DI Volume down VILmax = 0.48 V
VIHmin = 1.39 V
If it is not used, keep
it open.1.85V power
domain

SC200L Hardware Design
SC200L_Hardware_Design 20 / 103
RGB LED light interface
RGB_B 249 AI
LED control
negative
Connect to the
negative pole of LED,
the maximum current
is 27.7 mA.
RGB_R 252 AI
LED control
negative
Connect to the
negative pole of LED,
the maximum current
is 27.7 mA.
RGB_G 253 AI
LED control
negative
Connect to the
negative pole of LED,
the maximum current
is 27.7 mA.
SENSOR_I2C Interfaces
Pin Name Pin No. I/O Description DC
Characteristics Comment
SENSOR_I2C_
SCL 91 OD
I2C clock signal for
external sensor 1.85V power
domain,Can be used
as ordinary GPIO.
SENSOR_I2C_
SDA 92 OD
I2C data signal for
external sensor
Universal I2C interface
I2C4_SDA 167 OD
General peripheral
I2C data signal 1.85V power domain.
I2C4_SCL 168 OD
General peripheral
I2C clock signal 1.85V power domain.
ADC interface
Pin Name Pin No. I/O Description DC
Characteristics Comment
ADC 128 AI
General ADC
interface Maximum input
voltage 1.2 V 。
Charge Interface
Pin Name Pin No. I/O Description DC
Characteristics Comment
BAT_SNS 133 AI
Battery voltage
detection Maximum input
voltage is 4.2V.
CS_M 183 AI
Fuel gauge
detection negative
Connect the fuel
gauge to ground
when not in use.