Quectel SG560D Series Supplement

SG560D Series
Hardware Design
Smart Module Series
Version: 1.1
Date: 2023-02-10
Status: Released

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Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2022-05-13
Xiaomeng GUO/
Chris ZHANG
Creation of the document
1.0
2022-06-22
Xiaomeng GUO/
Chris ZHANG
First official release
1.1
2023-02-10
Waller GUO/
Jamie SHI
Xiaomeng GUO
1. Added n3, n5, and n8 for SG560D-CN
(Table 3, Table 6, Table 36, Table38, Table 42
and Table 56).
2. Updated the video decode speed (Table 4).
3. Updated the NSA and SAmaximum
transmission rate of the 5G NR features
(Table 4)
4. Updated the TBD data of the Rx sensitivity
(Table 41 and Table 42).
5. Updated the TBD data of GNSS performance
(Table 46).
6. Updated GNSS antenna design requirement:
changed from VSWR: < 2 to VSWR: ≤2
(Table 52).
7. Updated the TBD data of the power
consumption (Table 55 and Table 56).
8. Updated the recommended reflow soldering
thermal profile, the recommended thermal
profile parameters and related notes
(Chapter 8.2).
9. Updated UART multiplexing relationship
(Chapter 4.5 & 4.9).

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Contents
Safety Information.................................................................................................................................... 3
About the Document................................................................................................................................ 4
Contents.................................................................................................................................................... 5
Table Index ............................................................................................................................................... 8
Figure Index............................................................................................................................................ 10
1Introduction..................................................................................................................................... 12
1.1. Special Mark.........................................................................................................................16
2Product Overview............................................................................................................................ 17
2.1. Frequency Bands and Functions.......................................................................................... 17
2.2. Key Features........................................................................................................................18
2.3. Functional Diagram............................................................................................................... 22
2.4. Pin Assignment.....................................................................................................................24
2.5. Pin Description ..................................................................................................................... 25
2.6. EVB Kit.................................................................................................................................43
3Operating Characteristics .............................................................................................................. 44
3.1. Power Supply ....................................................................................................................... 44
3.1.1. Power Supply Pins.......................................................................................................44
3.1.2. Battery Charge and Management................................................................................ 44
3.1.3. Reference Design for Power Supply............................................................................46
3.1.4. Requirements for Voltage Stability............................................................................... 47
3.2. Turn On.................................................................................................................................48
3.3. Turn Off/Restart.................................................................................................................... 50
3.4. VRTC....................................................................................................................................50
3.5. Power Output........................................................................................................................ 51
4Application Interfaces..................................................................................................................... 54
4.1. USB Interfaces ..................................................................................................................... 54
4.1.1. USB0 Interface ............................................................................................................54
4.1.1.1. USB Type-C Mode........................................................................................ 56
4.1.1.2. Micro USB Mode .......................................................................................... 56
4.1.1.3. DisplayPort Mode......................................................................................... 57
4.1.2. USB1 Interface ............................................................................................................58
4.1.3. Design Principles for USB Interfaces...........................................................................59
4.2. (U)SIM Interfaces..................................................................................................................60
4.3. SD Card Interface.................................................................................................................63
4.4. GPIO Interfaces....................................................................................................................65
4.5. UART Interfaces...................................................................................................................67
4.6. I2C Interfaces....................................................................................................................... 68
4.7. SPI Interface.........................................................................................................................69
4.8. I2S Interfaces ....................................................................................................................... 70

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4.9. UART/SPI/I2C/I2S Multiplexing Relationship........................................................................71
4.10. ADC Interfaces .....................................................................................................................74
4.11. LCM Interface.......................................................................................................................75
4.12. Touch Panel Interface........................................................................................................... 77
4.13. Camera Interfaces................................................................................................................ 78
4.13.1. MIPI Design Considerations................................................................................. 83
4.14. Sensor Interfaces .................................................................................................................87
4.15. Emergency Download Interface............................................................................................ 87
4.16. PCIe Interface....................................................................................................................... 88
4.17. NFC Interface*......................................................................................................................89
5RF Specifications............................................................................................................................ 90
5.1. Cellular Network ...................................................................................................................90
5.1.1. Antenna Interfaces & Frequency Bands......................................................................90
5.1.2. Transmitting Power...................................................................................................... 92
5.1.3. Rx Sensitivity...............................................................................................................93
5.1.4. Reference Design of Cellular Antenna Interfaces........................................................96
5.2. GNSS ...................................................................................................................................96
5.2.1. Antenna Interface & Frequency Bands........................................................................96
5.2.2. GNSS Performance.....................................................................................................97
5.2.3. Reference Design........................................................................................................98
5.2.3.1. Reference Design for GNSS Passive Antenna............................................. 98
5.2.3.2. Reference Design for GNSS Active Antenna................................................ 98
5.2.3.3. GNSS RF Design Guidelines ....................................................................... 99
5.3. Wi-Fi/Bluetooth..................................................................................................................... 99
5.3.1. Antenna Interface & Frequency Bands......................................................................100
5.3.2. Wi-Fi Overview .......................................................................................................... 100
5.3.3. Bluetooth Overview.................................................................................................... 107
5.3.4. Reference Design......................................................................................................108
5.4. Reference Design of RF Routing........................................................................................ 109
5.5. Antenna Installation.............................................................................................................111
5.5.1. Antenna Design Requirement.....................................................................................111
5.5.2. RF Connector Recommendation ................................................................................112
6Electrical Characteristics and Reliability.................................................................................... 114
6.1. Absolute Maximum Ratings.................................................................................................114
6.2. Power Supply Ratings .........................................................................................................114
6.3. Power Consumption ............................................................................................................115
6.4. Digital I/O Characteristic.....................................................................................................121
6.5. ESD Protection................................................................................................................... 123
6.6. Operating and Storage Temperatures................................................................................. 123
7Mechanical Information................................................................................................................ 124
7.1. Mechanical Dimensions...................................................................................................... 124
7.2. Recommended Footprint.................................................................................................... 126
7.3. Top and Bottom Views........................................................................................................ 127

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8Storage, Manufacturing and Packaging...................................................................................... 128
8.1. Storage Conditions............................................................................................................. 128
8.2. Manufacturing and Soldering..............................................................................................129
8.3. Packaging Specification...................................................................................................... 131
8.3.1. Injection Tray ............................................................................................................. 131
8.3.2. Packaging Process....................................................................................................132
9Appendix References ................................................................................................................... 133

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Table Index
Table 1: Special Marks............................................................................................................................ 16
Table 2: Brief Introduction of the Module................................................................................................. 17
Table 3: Wireless Network Type.............................................................................................................. 17
Table 4: Key Features ............................................................................................................................. 18
Table 5: I/O Parameters Definition........................................................................................................... 25
Table 6: Pin Description........................................................................................................................... 25
Table 7: VBAT Pins.................................................................................................................................. 44
Table 8: Pin Definition of Charging Interface........................................................................................... 45
Table 9: Pin Definition of PWRKEY......................................................................................................... 48
Table 10: Pin Definition of Power Suppy Interface................................................................................... 51
Table 11: Pin Definition of USB0.............................................................................................................. 54
Table 12: USB Type-C Mode and DisplayPort Mode Pin Mapping.......................................................... 57
Table 13: Pin Description of USB1 Interface ........................................................................................... 58
Table 14: USB Trace Length Inside the Module ...................................................................................... 59
Table 15: Pin Definition of (U)SIM Interfaces........................................................................................... 60
Table 16: Pin Definition of SD Card Interface.......................................................................................... 63
Table 17: SD Card Signal Trace Length Inside the Module..................................................................... 64
Table 18: Pin Definition of GPIO Interfaces............................................................................................. 65
Table 19: Pin Definition of UART Interfaces ............................................................................................ 67
Table 20: Pin Definition of I2C Interfaces ................................................................................................ 68
Table 21: Pin Definition of SPI Interface.................................................................................................. 69
Table 22: Pin Definition of I2S Interfaces................................................................................................. 70
Table 23: UART/SPI/I2C Multiplex Relationship...................................................................................... 71
Table 24: I2S Multiplex Relationship Table.............................................................................................. 73
Table 25: Pin Definition of ADC Interfaces............................................................................................... 74
Table 26: Pin Definition of LCM Interface................................................................................................ 75
Table 27: Pin Definition of Touch Panel Interface.................................................................................... 77
Table 28: Pin Definition of Camera Interfaces ......................................................................................... 78
Table 29: Relationship Between CSI Rate and Line Length (D-PHY)...................................................... 83
Table 30: Relationship Between DSI Rate and Line Length (D-PHY)...................................................... 84
Table 31: Trace Length of MIPI Differential Pairs Inside the Module....................................................... 84
Table 32: Pin Definition of Sensor Interfaces........................................................................................... 87
Table 33: Pin Definition of PCIe Interface................................................................................................ 88
Table 34: Trace Length of Differential Pairs Inside the Module................................................................ 88
Table 35: Pin Definition of NFC Interface ................................................................................................ 89
Table 36: Pin Definition of Cellular Network Interfaces of SG560D-CN................................................... 90
Table 37: Pin Definition of Cellular Network Interfaces of SG560D-EU................................................... 90
Table 38: Operating Frequency of SG560D-CN...................................................................................... 91
Table 39: Operating Frequency of SG560D-EU ...................................................................................... 92
Table 40: Tx Power of SG560D-CN......................................................................................................... 92
Table 41: Tx Power of SG560D-EU......................................................................................................... 93

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Table 42: Conducted RF Rx Sensitivity of SG560D-CN.......................................................................... 93
Table 43: Conducted RF Rx Sensitivity of SG560D-EU (Unit:dBm) ........................................................ 94
Table 44: Pin Definition of GNSS Antenna Interface................................................................................ 97
Table 45: Operating Frequency............................................................................................................... 97
Table 46: GNSS Performance................................................................................................................. 97
Table 47: Pin Definition of Wi-Fi/Bluetooth Interfaces............................................................................ 100
Table 48: Wi-Fi/Bluetooth Frequency .................................................................................................... 100
Table 49: Wi-Fi Transmitting Performance ............................................................................................ 101
Table 50: Wi-Fi Receiving Performance................................................................................................ 104
Table 51: Bluetooth Data Rate and Version........................................................................................... 107
Table 52: Bluetooth Transmitting and Receiving Performance.............................................................. 108
Table 53: Antenna Design Requiremets.................................................................................................111
Table 54: Absolute Maximum Ratings ....................................................................................................114
Table 55: Power Supply Ratings.............................................................................................................114
Table 56: Power Consumption of SG560D-CN ......................................................................................115
Table 57: Power Consumption of SG560D-EU.......................................................................................117
Table 58: 1.8 V I/O Requirements ......................................................................................................... 121
Table 59: (U)SIM 1.8 V I/O Requirements............................................................................................. 121
Table 60: (U)SIM 2.95 V I/O Requirements........................................................................................... 122
Table 61: SD card 1.8 V I/O Requirements ........................................................................................... 122
Table 62: SD card 2.95 V I/O Requirements ......................................................................................... 122
Table 63: Electrostatics Discharge Characteristics (Temperature: 25–30 °C, Humidity: 40 ±5 % ) ........ 123
Table 64: Operating and Storage Temperatures.................................................................................... 123
Table 65: Recommended Thermal Profile Parameters.......................................................................... 130
Table 66: Related Documents ............................................................................................................... 133
Table 67: Terms and Abbreviations........................................................................................................ 133

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Figure Index
Figure 1: Functional Diagram.................................................................................................................. 18
Figure 2: Application Block Diagram........................................................................................................ 18
Figure 3: Pin Assignment ........................................................................................................................ 24
Figure 4: Reference Circuit for Battery Charging Circuit ......................................................................... 46
Figure 5: Reference Circuit of Power Supply .......................................................................................... 47
Figure 6: Power Supply Limits During Burst Transmission...................................................................... 47
Figure 7: Structure of Power Supply........................................................................................................ 48
Figure 8: Turn On the Module Using Driving Circuit................................................................................ 48
Figure 9: Turn On the Module Using Button............................................................................................ 49
Figure 10: Turn-on Timing....................................................................................................................... 49
Figure 11: Restart Timing........................................................................................................................ 50
Figure 12: RTC Powered by a Rechargeable Cell Battery ...................................................................... 50
Figure 13: RTC Powered by Capacitor.................................................................................................... 51
Figure 14: USB Type-C Reference Circuit of USB0 ................................................................................ 56
Figure 15: Micro USB Reference Circuit of USB0................................................................................... 56
Figure 16: DisplayPort Mode Reference Circuit ...................................................................................... 58
Figure 17: Reference Circuit of (U)SIM Interface with 8-Pin (U)SIM Card Connector............................. 62
Figure 18: Reference Circuit of (U)SIM Interface with 6-Pin (U)SIM Card Connector............................. 62
Figure 19: Reference Circuit for SD Card Interface................................................................................. 64
Figure 20: Reference Circuit with Level-Shifting Chip (for UART)........................................................... 67
Figure 21: Reference Circuit with RS232 Level-Shifting Chip (for UART)............................................... 68
Figure 22: Reference Circuit for LCM Interface....................................................................................... 76
Figure 23: LCM External Backlight Driver Reference Circuit................................................................... 77
Figure 24: Reference Circuit for TP Interface.......................................................................................... 78
Figure 25: Reference Circuit for Dual-CameraApplications.................................................................... 81
Figure 26: Reference Circuit for Three-Camera Applications.................................................................. 82
Figure 27: Reference Circuit for Emergency Download Interface ........................................................... 87
Figure 28: Reference Circuit for RF Antenna Interfaces.......................................................................... 96
Figure 29: Reference Circuit for GNSS PassiveAntenna........................................................................ 98
Figure 30: Reference Circuit for GNSS Active Antenna........................................................................... 99
Figure 31: Reference Circuit for Wi-Fi/Bluetooth Antenna..................................................................... 108
Figure 32: Reference Circuit for Wi-Fi MIMO Antenna.......................................................................... 108
Figure 33: Microstrip Design on a 2-layer PCB ..................................................................................... 109
Figure 34: Coplanar Waveguide Design on a 2-layer PCB.................................................................... 109
Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)................. 109
Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)..................110
Figure 37: Dimensions of the Receptacle (Unit: mm).............................................................................112
Figure 38: Specifications of Mated Plugs (Unit: mm)..............................................................................112
Figure 39: Space Factor of Mated Connectors (Unit: mm).....................................................................113
Figure 40: Module Top and Side Dimensions........................................................................................ 124
Figure 41: Module Bottom Dimensions (Bottom View).......................................................................... 125

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Figure 42: Recommended Footprint...................................................................................................... 126
Figure 43: Top & Bottom Views of the Module....................................................................................... 127
Figure 44: Recommended Reflow Soldering Thermal Profile................................................................ 129
Figure 45: Injection Tray Dimension Drawing........................................................................................ 131
Figure 46: Packaging Process............................................................................................................... 132

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1Introduction
This document defines the SG560D series module and describes its air interfaces and hardware
interfaces which are connected to your applications.
With this document, you can quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. The document, coupled with
application notes and user guides, makes it easy to design and set up mobile applications with the
module.
Modifications:
Any changes or modifications not expressly approved by Quectel or the party responsible for
compliance could void the user’s authority to operate the equipment and invalidate the regulatory
approval.
Host manufacturer must follow KDB Publication 996369 D04 Modulen Integration Guide.
Host manufacturer is responsible for regression tests to show compliance to the applicable standards
due to the following actions:
1.any modification done to the module.
2.Integration of the module into a host device
Host product manufacturer is responsible for compliance to any other FCC rules that apply to the host
not covered by the modular transmitter grant of certification.
Final host product is required to show compliance to Part 15 Subpart B with the modular transmitter
installed
Product Marketing Name：Quectel SG560D-WF
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based
timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion
Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
body and must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product:
This device contains FCC ID: XMR2023SG560DWF
FCC/ISED Regulations restrict operation of this device to Indoor Use Only
4. Antenna Requirements:

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•The following antennae were approved with the modules:
Operating
Band
Frequency
(MHz)
Antenna Type
Antenna P/N
Antenna Gain (dBi)
Bluetooth
2400~2483.5
Dipole
SAA31578A
0.47 dBi
2.4G WiFi
0.47 dBi
5G WiFi
5150~5850
5150~5250 MHz: -0.67 dBi
5250~5350 MHz: -0.19 dBi
5470~5725 MHz: 1.28 dBi
5725~5850 MHz：1.10 dBi
6E WiFi
5925~7125
5925~6425 MHz: 3.76dBi
6425~6525 MHz: 3.62dBi
6525~6875 MHz: 3.62dBi
6875~7125 MHz: 2.20dBi
•The product is provided with an approved antenna. Use only supplied or approved antenna by
Quectel. Any changes or modifications to the Antenna may void the regulatory approvals obtained for
the product.
•Host device must comply with FCC Part 15 antenna requirements
•The OEM must design the host so that the antenna will be installed as an integrated antenna for the
host containing the SG560D-WF and the end user shall not be able to access, remove or replace the
antenna.
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining
to the OEM the labeling requirements, options and OEM user manual instructions that are required (see
next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC
ID: XMR2023SG560DWF” or “Contains FCC ID: XMR2023SG560DWF”must be used. The host OEM
user manual must also contain clear instructions on how end users can find and/or access the module

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and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user
that changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment. In cases where the manual is provided only in a form other
than paper, such as on a computer disk or over the Internet, the information required by this section may
be included in the manual in that alternative form, provided the user can reasonably be expected to have
the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without
a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring
that the after the module is installed and operational the host continues to be compliant with the Part 15B
unintentional radiator requirements.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
5.925-7.125 GHz Radio Transmitters
• General
➢Refer to KDB publication 987594 D01, Operation of these devices in the 5.925-7.125 GHz band is
prohibited on oil platforms, cars, trains, boats, and aircraft, except that operation of this device
is permitted in large aircraft while flying above 10,000 feet.
1. Operation of these devices in the 5.925-7.125 GHz band is prohibited for control of or
communications with unmanned aircraft systems.
2. Any changes or modifications not expressly approved by the party responsible for compliance
could void the user’s authority to operate the equipment.
3. In the 5.925-7.125 GHz band, devices containing client device must operate under the control of a
device containing the SG560D-WF which is an indoor access point. In all cases, an exception
exists for transmitting brief messages to an access point when attempting to join its network after
detecting a signal that confirms that an access point is operating on a particular channel. Access
points may connect to other access points. Client devices are prohibited from connecting directly
to another client device.
IC Statement
IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following

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two conditions: (1) This device may not cause interference; and (2) This device must accept any
interference, including interference that may cause undesired operation of the device." or "Le présent
appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF
L'autre utilisé pour l'émetteur doit être i nstallépour fournir une distance de séparation d'au moins 20 cm
de toutes les personnes et ne doit pas être colocaliséou fonctionner conjointement avec une autre
antenne ou un autre émetteur.
The host product shall be properly labeled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host product; otherwise, the host product must be labeled
to display the Innovation, Science and Economic Development Canada certification number for the
module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-23SG560DWF” or “where: 10224A-23SG560DWF is the module’s certification
number”.
Le produit hôte doit être correctement étiquetépour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développ ement économique Canada d'un module
doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte
doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement
économique Canada pour le module, préc édédu mot «Contient»ou d'un libe llésemblable exprimant la
même signification, comme suit:
"Contient IC: 10224A-23SG560DWF" ou "où: 10224A-23SG560DWF est le numéro de certification du
module".
i. the device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential
for harmful interference to co-channel mobile satellite systems;
ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the
bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p.
limit;
iii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the
band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;
iv. Omnidirectional antenna is recommended
This device complies with RSS-248 of the Industry Canada Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation of the device.
Ce dispositif est conforme àla norme CNR-248 d'Industrie Canada applicable aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas
produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en compromettre le fonctionnement.
Caution:
Operation shall be limited to indoor use only;
Operation on oil platforms, cars, trains, boats and aircraft shall be prohibited except for on large aircraft

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flying above 10,000 ft.
Avertissement:
Utilisation limitée àl’intérieur seulement;
Utilisation interdite àbord de plateformes de forage pétrolier, de voitures, de trains, de bateaux et
d’aéronefs, sauf à bord d’un gros aéronef volant à plus de 10 000 pieds d’altitude
Enclosure Requirements: Host devices containing the SG560D-WF module and operating in the
5.925-7.125 GHz is prohibited from having a weatherized enclosure.
Usage Requirements:
• Host devices containing the SG560D-WF module and operating in the 5.925-7.125 GHz must be
powered by wired connection such as AC adapter (battery use is not allowed).
• SG560D-WF do not have a battery backup.
• If host devices containing SG560D-WF module are designed to have a battery backup, the use of
the backup battery should only be allowed during power outages and for indoor use.
• Host devices containing SG560D-WF are prohibited from direct connection to the internet.
1.1. Special Mark
Table 1: Special Marks
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface,
pin name, AT command, or argument, it indicates that the function, feature, interface, pin,
AT command, or argument is under development and currently not supported; and the
asterisk (*) after a model indicates that the sample of such model is currently unavailable.
[…]
Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same
type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0,
SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

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2Product Overview
SG560D is a series of smart 5G modules based on Android operating system, and provides industrial
grade performance. It supports up to 4K video encoding/decoding, DMIC, built-in high performance
Adreno™643 GPU, abundant GPIO interfaces as well as external audio codec. With these, the module is
engineered to meet the demanding requirements in M2M applications, such as smart gateway, CPE, MiFi,
MID, PND, POS, router, multimedia terminal, smart phone, digital signage, industrial PDA. Related
information and details are listed in the table below:
Table 2: Brief Introduction of the Module
2.1. Frequency Bands and Functions
Table 3: Wireless Network Type
1
GSM/EDGE bands are supported only on SG560D-EU.
SG560D Series
Packaging
LGA
Pin Number
636
Dimensions
(42.5 ±0.2) mm × (56.5 ±0.2) mm × (2.95 ±0.2) mm
Weight
Approx. 17.5 g
Wireless Network Functions 1
5G NR, LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA,
WCDMA, GSM, EDGE
Variants
SG560D-CN, SG560D-EU,SG560D-WF
Wireless Network Type
SG560D-CN
SG560D-EU
SG560D-WF
5G NR NSA
n41/n78/n79
n1/n3/n5/n7/n8/n20/n28/n38/n40/
n41/n77/n78
5G NR SA
n1/n3/n5/n8/n28/n41/n78/n79
n1/n3/n5/n7/n8/n20/n28/n38/n40/

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2.2. Key Features
Table 4: Key Features
n41/n77/n78
LTE-FDD
B1/B3/B5/B8
B1/B3/B5/B7/B8/B20/B28/B32
LTE-TDD
B34/B38/B39/B40/B41
B38/B39/B40/B41/B42
WCDMA
B1/B5/B8
B1/B5/B8
GSM/EDGE
-
EGSM900/DCS1800
GNSS
GPS/GLONASS/BDS/Galileo/Nav
IC/SBAS/QZSS; L1 + L5
GPS/GLONASS/BDS/Galileo/NavI
C/SBAS/QZSS; L1 + L5
Wi-Fi
802.11a/b/g/n/ac/ax
802.11a/b/g/n/ac/ax
802.11a/b/g/n/ac/ax
Bluetooth
Bluetooth 5.2 (BR/EDR + BLE)
Bluetooth 5.2 (BR/EDR + BLE)
Bluetooth 5.2
(BR/EDR + BLE)
Parameter
Details
Application Processor
Customized octa-core 64-bit ARMv8-compliant Kryo 670 CPU with 2 MB
L3 cache
⚫1 × Kryo Gold Plus (high performance) core @ 2.7 GHz with 256 KB
L2 cache
⚫3 × Kryo Gold (high performance) cores @ 2.4 GHz with 256 KB L2
cache
⚫4 × Kryo Silver (low power) cores @ 1.9 GHz with 128 KB L2 cache
Modem system
⚫5G NR: 3GPP Rel-15
⚫LTE: 3GPP Rel-15
GPU
Adreno™ 643, up to 812 MHz
Memory
4 GB LPDDR4X + 64 GB UFS (default)
SG560D-CN
6 GB LPDDR4X + 128 GB UFS (Optional)
8 GB LPDDR4X + 128 GB UFS (Optional)
8 GB LPDDR4X + 256 GB UFS (Optional)
SG560D-WF
6 GB LPDDR4X + 128 GB UFS(Optional)
8 GB LPDDR4X + 128 GB UFS(Optional)

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2
Audio codec and video codec listed in this table are dedicated for codec inside the CPU.
3
An external codec should be added via I2S interface when audio output function is needed.
Operating System
Android 12
Power Supply
⚫Supply voltage: 3.55–4.4 V
⚫Typical supply voltage: 4.0 V
SMS
⚫Text and PDU mode
⚫Point-to-point MO and MT
⚫SMS cell broadcast
⚫SMS storage: ME by default
LCM Interface
⚫Supports one group of 4-lane MIPI_DSI, up to 2.5 Gbps/lane
⚫FHD + (1200 ×2520) @144 fps based on MIPI standard
⚫Supports Wi-Fi miracast 4K @ 60 fps
Camera Interfaces
⚫Supports four groups of 4-lane MIPI_CSI, up to 2.5 Gbps/lane
⚫Supports up to 4 cameras
⚫3 ×ISP: up to 3 × 27 MP @ 24 fps or 3 × 22 MP @ 30 fps; 36 MP +
27 MP @ 24 fps or 36 MP + 22 MP @ 30 fps; 36 MP @ 30 fps
Video Codec 2
⚫Video decode: up to 4K @ 60 fps for H.264/H.265/VP9
⚫Video encode: up to 4K @ 30 fps for H.264/H.265
⚫Video decode and encode: 1080P @ 60 fps decode +
1080P @ 60 fps encode or 4K @ 30 fps decode + 1080P @ 30 fps
encode
Audio Codec 2
⚫EVRC, EVRC-B, EVRC-WB, G.711, G.729, PCM, EVS
⚫GSM-FR, GSM-EFR, GSM-HR
⚫AMR-NB, AMR-WB, QCELP
Audio Interfaces 3
Three digital microphone inputs
(U)SIM Interfaces
⚫Two (U)SIM interfaces
⚫Supports 1.8/2.95 V (U)SIM card
⚫Supports Dual SIM Dual Standby by default
ADC Interfaces
⚫Four general-purpose ADC interfaces
⚫Supports up to 15-bit resolution
Real Time Clock
Supported
USB Interfaces
Supports two USB interfaces: USB0 and USB1
USB0 function:
⚫Compliant with USB 3.1 Gen 1 and USB 2.0 specifications, with
transmission rates up to 5 Gbps on USB 3.1 and 480 Mbps on USB
2.0
⚫Supports USB OTG
⚫Used for AT command communication, data transmission, software
debugging, firmware upgrade and voice over USB
USB1 function:
⚫Compliant with USB 2.0 specifications, with transmission rate up to