Quectel FCM561D-P Supplement

FCM561D-P
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-10-27
Status: Preliminary

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Trademarks
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To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
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a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
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information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or
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websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage,
service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure
to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the terminal or mobile before boarding an aircraft. The operation of
wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Terminals or mobiles operating over radio signal and cellular network cannot be
guaranteed to connect in certain conditions, such as when the mobile bill is unpaid
or the (U)SIM card is invalid. When emergency help is needed in such conditions,
use emergency call if the device supports it. In order to make or receive a call, the
terminal or mobile must be switched on in a service area with adequate cellular
signal strength. In an emergency, the device with emergency call function cannot
be used as the only contact method considering network connection cannot be
guaranteed under all circumstances.
The terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to
TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other terminals. Areas
with explosive or potentially explosive atmospheres include fueling areas, below
decks on boats, fuel or chemical transfer or storage facilities, and areas where the
air contains chemicals or particles such as grain, dust or metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2023-08-24
Luke FU
Creation of the document
1.0.0
2023-10-27
Roshan WENG/Jay DONG
Preliminary

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Contents
Safety Information...................................................................................................................................... 3
About the Document.................................................................................................................................. 4
Contents...................................................................................................................................................... 5
Table Index.................................................................................................................................................. 7
Figure Index................................................................................................................................................ 8
1 Introduction............................................................................................................................................. 9
1.1. Special Marks............................................................................................................................... 10
2 Product Overview................................................................................................................................. 11
2.1. Key Features................................................................................................................................ 12
3 Application Interfaces.......................................................................................................................... 13
3.1. Pin Assignment............................................................................................................................ 13
3.2. Pin Description............................................................................................................................. 14
3.3. GPIO Multiplexing........................................................................................................................ 19
3.4. Application Interfaces................................................................................................................... 23
3.4.1. SPIs ................................................................................................................................... 23
3.4.2. QSPI .................................................................................................................................. 24
3.4.3. UARTs ............................................................................................................................... 24
3.4.4. SDIO Interface................................................................................................................... 25
3.4.5. I2C Interfaces .................................................................................................................... 27
3.4.6. USB Interface .................................................................................................................... 27
3.4.7. CAN Interface*................................................................................................................... 28
3.4.8. LCM Interface.................................................................................................................... 28
3.4.9. Camera Interface............................................................................................................... 30
3.4.10. PWM Interfaces............................................................................................................... 31
3.4.11. I2S Interface .................................................................................................................... 31
3.4.12. Analog Audio Interface.................................................................................................... 32
3.4.13. SAR ADC Interface.......................................................................................................... 32
3.4.14. Touch Sensor Interfaces ................................................................................................. 33
4 Operating Characteristics.................................................................................................................... 35
4.1. Power Supply............................................................................................................................... 35
4.1.1. Reference Design for Power Supply................................................................................. 35
4.2. Turn On........................................................................................................................................ 36
4.3. Reset............................................................................................................................................ 36
5 RF Performances.................................................................................................................................. 38
5.1. Wi-Fi Performances..................................................................................................................... 38
5.2. Bluetooth Performances.............................................................................................................. 39
5.3. Antenna Interface......................................................................................................................... 39

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5.3.1. Pin Antenna Interface (ANT_WIFI/BT) ............................................................................ 40
5.3.1.1. Reference Design.................................................................................................... 40
5.3.1.2. Antenna Design Requirements............................................................................... 40
5.3.1.3. RF Routing Guidelines............................................................................................ 41
5.3.2. FCM561D-P PCB Antenna .............................................................................................. 43
6 Electrical Characteristics & Reliability............................................................................................... 45
6.1. Absolute Maximum Ratings......................................................................................................... 45
6.2. Power Supply Ratings.................................................................................................................. 45
6.3. Power Consumption..................................................................................................................... 46
6.3.1. Wi-Fi Power Consumption................................................................................................. 46
6.3.2. Bluetooth Power Consumption.......................................................................................... 46
6.4. Digital I/O Characteristics ............................................................................................................ 47
6.5. ESD Protection ............................................................................................................................ 47
7 Mechanical Information ....................................................................................................................... 48
7.1. Mechanical Dimensions............................................................................................................... 48
7.2. Recommended Footprint............................................................................................................. 50
7.3. Top and Bottom Views................................................................................................................. 51
8 Storage, Manufacturing & Packaging................................................................................................. 52
8.1. Storage Conditions ...................................................................................................................... 52
8.2. Manufacturing and Soldering....................................................................................................... 53
8.3. Packaging Specifications............................................................................................................. 55
8.3.1. Carrier Tape....................................................................................................................... 55
8.3.2. Plastic Reel........................................................................................................................ 56
8.3.3. Mounting Direction............................................................................................................. 56
8.3.4. Packaging Process............................................................................................................ 57
9 Appendix References........................................................................................................................... 58

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Table Index
Table 1 : Special Marks.............................................................................................................................. 10
Table 2 : Basic Information ........................................................................................................................ 11
Table 3 : Key Features............................................................................................................................... 12
Table 4 : Parameter Description ................................................................................................................ 14
Table 5 : Pin Description............................................................................................................................ 14
Table 6 : GPIO Multiplexing....................................................................................................................... 19
Table 7 : Pin Definition of SPIs.................................................................................................................. 23
Table 8 : Pin Definition of QSPI................................................................................................................. 24
Table 9 : Pin Definition of UARTs .............................................................................................................. 25
Table 10 : Pin Definition of SDIO Interface................................................................................................ 26
Table 11 : Pin Definition of I2C Interfaces................................................................................................. 27
Table 12 : Pin Definition of USB Interface ................................................................................................. 27
Table 13 : Pin Definition of CAN Interface................................................................................................. 28
Table 14 : Pin Definition of LCM_RGB Interface....................................................................................... 28
Table 15 : Pin Definition of LCM_I8080 Interface...................................................................................... 29
Table 16 : Pin Definition of Camera DVP Interface ................................................................................... 30
Table 17 : Pin Definition of PWM Interfaces.............................................................................................. 31
Table 18 ：Pin Definition of I2S Interface................................................................................................. 32
Table 19 : Pin Definition of Analog Audio Interfaces................................................................................. 32
Table 20 : Pin Definition of SAR ADC Interfaces....................................................................................... 33
Table 21 : SAR ADC Features................................................................................................................... 33
Table 22 : Pin Definition of Touch Sensor Interfaces................................................................................ 34
Table 23 : Pin Definition of Power Supply and GND Pins......................................................................... 35
Table 24 : Pin Definition of CHIP_EN........................................................................................................ 36
Table 25 : Wi-Fi Performances .................................................................................................................. 38
Table 26 : Bluetooth Performances ........................................................................................................... 39
Table 27 : ANT_WIFI/BT Pin Definition ..................................................................................................... 40
Table 28 : Antenna Design Requirements................................................................................................. 40
Table 29 : PCB Antenna Specifications..................................................................................................... 43
Table 30 : Absolute Maximum Ratings (Unit: V)........................................................................................ 45
Table 31 : Module Power Supply Ratings (Unit: V) ................................................................................... 45
Table 32 : Power Consumption in Non-signaling Modes (Unit: mA)......................................................... 46
Table 33 : Power Consumption in Non-signaling Modes (Unit: mA)......................................................... 46
Table 34 : VBAT I/O Characteristics (Unit: V)............................................................................................ 47
Table 35 : ESD Characteristics (Unit: kV).................................................................................................. 47
Table 36 : Recommended Thermal Profile Parameters ............................................................................ 54
Table 37 : FCM561D Carrier Tape Dimension Table (Unit: mm).............................................................. 55
Table 38 : Plastic Reel Dimension Table (Unit: mm)................................................................................. 56
Table 39 : Reference Documents.............................................................................................................. 58
Table 40 : Terms and Abbreviations.......................................................................................................... 58

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Figure Index
Figure 1 : Pin Assignment (Top View) ....................................................................................................... 13
Figure 2 : SPI Connection.......................................................................................................................... 23
Figure 3 : QSPI Connection....................................................................................................................... 24
Figure 4 : UART1 Connection.................................................................................................................... 25
Figure 5 : SDIO Interface Connection........................................................................................................ 26
Figure 6 : VBAT Reference Circuit............................................................................................................. 35
Figure 7 : Turn-on Timing........................................................................................................................... 36
Figure 8 : Reference Circuit of CHIP_EN by Using A Driving Circuit........................................................ 37
Figure 9 : Reference Circuit of RESET with A Button ............................................................................... 37
Figure 10 : Reset Timing............................................................................................................................ 37
Figure 11 : RF Antenna Reference Design................................................................................................ 40
Figure 12 : Microstrip Design on a 2-layer PCB ........................................................................................ 41
Figure 13 : Coplanar Waveguide Design on a 2-layer PCB...................................................................... 41
Figure 14 : Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)................... 42
Figure 15 : Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)................... 42
Figure 16 : Keepout Area on Motherboard ................................................................................................ 43
Figure 17 : Prohibited Area for Routing ..................................................................................................... 44
Figure 18 : FCM561D-P Top and Side Dimensions.................................................................................. 48
Figure 19 : FCM561D-P Bottom Dimensions (Bottom View)..................................................................... 49
Figure 20 : FCM561D-P Recommended Footprint.................................................................................... 50
Figure 21 : FCM561D-P Top and Bottom Views (PCB Antenna Interface)............................................... 51
Figure 22 : Recommended Reflow Soldering Thermal Profile .................................................................. 53
Figure 23 : Tape Specifications.................................................................................................................. 55
Figure 24 : Plastic Reel Dimension Drawing ............................................................................................. 56
Figure 25 : Mounting Direction................................................................................................................... 56
Figure 26 : Packaging Process.................................................................................................................. 57

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1Introduction
QuecOpen®is a solution where the module acts as the main processor. Constant transition and evolution
of both the communication technology and the market highlight its merits. It can help you to:
⚫Realize embedded applications’ quick development and shorten product R&D cycle
⚫Simplify circuit and hardware structure design to reduce engineering costs
⚫Miniaturize products
⚫Reduce product power consumption
⚫Apply OTA technology
⚫Enhance product competitiveness and price-performance ratio
⚫Apply anti-copy encryption technology to enhance product safety
This document defines FCM561D-P in QuecOpen®solution and describes its air interfaces and hardware
interfaces, which are connected with your applications. The document provides a quick insight into
interface specifications, RF performance, electrical and mechanical specifications, as well as other
related information of the module.
Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type FCM561D-P is in
compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com/support/technical.htm