Quectel FCM561D-P Supplement

FCM561D-P
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-10-27
Status: Preliminary

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At Quectel, our aim is to provide timely and comprehensive services to our customers. If you
require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,
Shanghai 200233, China
Tel: [phone]
Email: [e-mail]
Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm.
Or email us at: [email protected]om.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we
make every effort to ensure its quality. You agree that you are responsible for using independent
analysis and evaluation in designing intended products, and we provide reference designs for illustrative
purposes only. Before using any hardware, software or service guided by this document, please read this
notice carefully. Even though we employ commercially reasonable efforts to provide the best possible
experience, you hereby acknowledge and agree that this document and related services hereunder are
provided to you on an “as available” basis. We may revise or restate this document from time to time at
our sole discretion without any prior notice to you.
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noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of
the material.

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Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights
to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel
or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties
(“third-party materials”). Use of such third-party materials shall be governed by all restrictions and
obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials,
including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular
purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any
third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein
constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell,
offer for sale, or otherwise maintain production of any our products or any other hardware, software,
device, tool, information, or product. We moreover disclaim any and all warranties arising from the course
of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the
relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the
purpose of performing the service only or as permitted by applicable laws. Before data interaction with
third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or
express, and exclude all liability for any loss or damage suffered in connection with the use of
features and functions under development, to the maximum extent permitted by law, regardless of
whether such loss or damage may have been foreseeable.
d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness
of information, advertising, commercial offers, products, services, and materials on third-party
websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage,
service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure
to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the terminal or mobile before boarding an aircraft. The operation of
wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Terminals or mobiles operating over radio signal and cellular network cannot be
guaranteed to connect in certain conditions, such as when the mobile bill is unpaid
or the (U)SIM card is invalid. When emergency help is needed in such conditions,
use emergency call if the device supports it. In order to make or receive a call, the
terminal or mobile must be switched on in a service area with adequate cellular
signal strength. In an emergency, the device with emergency call function cannot
be used as the only contact method considering network connection cannot be
guaranteed under all circumstances.
The terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to
TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other terminals. Areas
with explosive or potentially explosive atmospheres include fueling areas, below
decks on boats, fuel or chemical transfer or storage facilities, and areas where the
air contains chemicals or particles such as grain, dust or metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2023-08-24
Luke FU
Creation of the document
1.0.0
2023-10-27
Roshan WENG/Jay DONG
Preliminary

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Contents
Safety Information...................................................................................................................................... 3
About the Document.................................................................................................................................. 4
Contents...................................................................................................................................................... 5
Table Index.................................................................................................................................................. 7
Figure Index................................................................................................................................................ 8
1 Introduction............................................................................................................................................. 9
1.1. Special Marks............................................................................................................................... 10
2 Product Overview................................................................................................................................. 11
2.1. Key Features................................................................................................................................ 12
3 Application Interfaces.......................................................................................................................... 13
3.1. Pin Assignment............................................................................................................................ 13
3.2. Pin Description............................................................................................................................. 14
3.3. GPIO Multiplexing........................................................................................................................ 19
3.4. Application Interfaces................................................................................................................... 23
3.4.1. SPIs ................................................................................................................................... 23
3.4.2. QSPI .................................................................................................................................. 24
3.4.3. UARTs ............................................................................................................................... 24
3.4.4. SDIO Interface................................................................................................................... 25
3.4.5. I2C Interfaces .................................................................................................................... 27
3.4.6. USB Interface .................................................................................................................... 27
3.4.7. CAN Interface*................................................................................................................... 28
3.4.8. LCM Interface.................................................................................................................... 28
3.4.9. Camera Interface............................................................................................................... 30
3.4.10. PWM Interfaces............................................................................................................... 31
3.4.11. I2S Interface .................................................................................................................... 31
3.4.12. Analog Audio Interface.................................................................................................... 32
3.4.13. SAR ADC Interface.......................................................................................................... 32
3.4.14. Touch Sensor Interfaces ................................................................................................. 33
4 Operating Characteristics.................................................................................................................... 35
4.1. Power Supply............................................................................................................................... 35
4.1.1. Reference Design for Power Supply................................................................................. 35
4.2. Turn On........................................................................................................................................ 36
4.3. Reset............................................................................................................................................ 36
5 RF Performances.................................................................................................................................. 38
5.1. Wi-Fi Performances..................................................................................................................... 38
5.2. Bluetooth Performances.............................................................................................................. 39
5.3. Antenna Interface......................................................................................................................... 39

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5.3.1. Pin Antenna Interface (ANT_WIFI/BT) ............................................................................ 40
5.3.1.1. Reference Design.................................................................................................... 40
5.3.1.2. Antenna Design Requirements............................................................................... 40
5.3.1.3. RF Routing Guidelines............................................................................................ 41
5.3.2. FCM561D-P PCB Antenna .............................................................................................. 43
6 Electrical Characteristics & Reliability............................................................................................... 45
6.1. Absolute Maximum Ratings......................................................................................................... 45
6.2. Power Supply Ratings.................................................................................................................. 45
6.3. Power Consumption..................................................................................................................... 46
6.3.1. Wi-Fi Power Consumption................................................................................................. 46
6.3.2. Bluetooth Power Consumption.......................................................................................... 46
6.4. Digital I/O Characteristics ............................................................................................................ 47
6.5. ESD Protection ............................................................................................................................ 47
7 Mechanical Information ....................................................................................................................... 48
7.1. Mechanical Dimensions............................................................................................................... 48
7.2. Recommended Footprint............................................................................................................. 50
7.3. Top and Bottom Views................................................................................................................. 51
8 Storage, Manufacturing & Packaging................................................................................................. 52
8.1. Storage Conditions ...................................................................................................................... 52
8.2. Manufacturing and Soldering....................................................................................................... 53
8.3. Packaging Specifications............................................................................................................. 55
8.3.1. Carrier Tape....................................................................................................................... 55
8.3.2. Plastic Reel........................................................................................................................ 56
8.3.3. Mounting Direction............................................................................................................. 56
8.3.4. Packaging Process............................................................................................................ 57
9 Appendix References........................................................................................................................... 58

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Table Index
Table 1 : Special Marks.............................................................................................................................. 10
Table 2 : Basic Information ........................................................................................................................ 11
Table 3 : Key Features............................................................................................................................... 12
Table 4 : Parameter Description ................................................................................................................ 14
Table 5 : Pin Description............................................................................................................................ 14
Table 6 : GPIO Multiplexing....................................................................................................................... 19
Table 7 : Pin Definition of SPIs.................................................................................................................. 23
Table 8 : Pin Definition of QSPI................................................................................................................. 24
Table 9 : Pin Definition of UARTs .............................................................................................................. 25
Table 10 : Pin Definition of SDIO Interface................................................................................................ 26
Table 11 : Pin Definition of I2C Interfaces................................................................................................. 27
Table 12 : Pin Definition of USB Interface ................................................................................................. 27
Table 13 : Pin Definition of CAN Interface................................................................................................. 28
Table 14 : Pin Definition of LCM_RGB Interface....................................................................................... 28
Table 15 : Pin Definition of LCM_I8080 Interface...................................................................................... 29
Table 16 : Pin Definition of Camera DVP Interface ................................................................................... 30
Table 17 : Pin Definition of PWM Interfaces.............................................................................................. 31
Table 18 ：Pin Definition of I2S Interface................................................................................................. 32
Table 19 : Pin Definition of Analog Audio Interfaces................................................................................. 32
Table 20 : Pin Definition of SAR ADC Interfaces....................................................................................... 33
Table 21 : SAR ADC Features................................................................................................................... 33
Table 22 : Pin Definition of Touch Sensor Interfaces................................................................................ 34
Table 23 : Pin Definition of Power Supply and GND Pins......................................................................... 35
Table 24 : Pin Definition of CHIP_EN........................................................................................................ 36
Table 25 : Wi-Fi Performances .................................................................................................................. 38
Table 26 : Bluetooth Performances ........................................................................................................... 39
Table 27 : ANT_WIFI/BT Pin Definition ..................................................................................................... 40
Table 28 : Antenna Design Requirements................................................................................................. 40
Table 29 : PCB Antenna Specifications..................................................................................................... 43
Table 30 : Absolute Maximum Ratings (Unit: V)........................................................................................ 45
Table 31 : Module Power Supply Ratings (Unit: V) ................................................................................... 45
Table 32 : Power Consumption in Non-signaling Modes (Unit: mA)......................................................... 46
Table 33 : Power Consumption in Non-signaling Modes (Unit: mA)......................................................... 46
Table 34 : VBAT I/O Characteristics (Unit: V)............................................................................................ 47
Table 35 : ESD Characteristics (Unit: kV).................................................................................................. 47
Table 36 : Recommended Thermal Profile Parameters ............................................................................ 54
Table 37 : FCM561D Carrier Tape Dimension Table (Unit: mm).............................................................. 55
Table 38 : Plastic Reel Dimension Table (Unit: mm)................................................................................. 56
Table 39 : Reference Documents.............................................................................................................. 58
Table 40 : Terms and Abbreviations.......................................................................................................... 58

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Figure Index
Figure 1 : Pin Assignment (Top View) ....................................................................................................... 13
Figure 2 : SPI Connection.......................................................................................................................... 23
Figure 3 : QSPI Connection....................................................................................................................... 24
Figure 4 : UART1 Connection.................................................................................................................... 25
Figure 5 : SDIO Interface Connection........................................................................................................ 26
Figure 6 : VBAT Reference Circuit............................................................................................................. 35
Figure 7 : Turn-on Timing........................................................................................................................... 36
Figure 8 : Reference Circuit of CHIP_EN by Using A Driving Circuit........................................................ 37
Figure 9 : Reference Circuit of RESET with A Button ............................................................................... 37
Figure 10 : Reset Timing............................................................................................................................ 37
Figure 11 : RF Antenna Reference Design................................................................................................ 40
Figure 12 : Microstrip Design on a 2-layer PCB ........................................................................................ 41
Figure 13 : Coplanar Waveguide Design on a 2-layer PCB...................................................................... 41
Figure 14 : Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)................... 42
Figure 15 : Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)................... 42
Figure 16 : Keepout Area on Motherboard ................................................................................................ 43
Figure 17 : Prohibited Area for Routing ..................................................................................................... 44
Figure 18 : FCM561D-P Top and Side Dimensions.................................................................................. 48
Figure 19 : FCM561D-P Bottom Dimensions (Bottom View)..................................................................... 49
Figure 20 : FCM561D-P Recommended Footprint.................................................................................... 50
Figure 21 : FCM561D-P Top and Bottom Views (PCB Antenna Interface)............................................... 51
Figure 22 : Recommended Reflow Soldering Thermal Profile .................................................................. 53
Figure 23 : Tape Specifications.................................................................................................................. 55
Figure 24 : Plastic Reel Dimension Drawing ............................................................................................. 56
Figure 25 : Mounting Direction................................................................................................................... 56
Figure 26 : Packaging Process.................................................................................................................. 57

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1Introduction
QuecOpen®is a solution where the module acts as the main processor. Constant transition and evolution
of both the communication technology and the market highlight its merits. It can help you to:
⚫Realize embedded applications’ quick development and shorten product R&D cycle
⚫Simplify circuit and hardware structure design to reduce engineering costs
⚫Miniaturize products
⚫Reduce product power consumption
⚫Apply OTA technology
⚫Enhance product competitiveness and price-performance ratio
⚫Apply anti-copy encryption technology to enhance product safety
This document defines FCM561D-P in QuecOpen®solution and describes its air interfaces and hardware
interfaces, which are connected with your applications. The document provides a quick insight into
interface specifications, RF performance, electrical and mechanical specifications, as well as other
related information of the module.
Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type FCM561D-P is in
compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com/support/technical.htm

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1.1. Special Marks
Table 1: Special Marks
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin
name, AT command, argument, and so on, it indicates that the function, feature, interface, pin,
AT command, argument, and so on, is under development and currently not supported; and
the asterisk (*) after a model indicates that the sample of the model is currently unavailable.
[…]
Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same
type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0,
SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

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2Product Overview
FCM561D-P series is an MCU Wi-Fi 6 and Bluetooth module for smart-home and industrial IoT compliant
with IEEE 802.11b/g/n/ax and BLE 5.2 standards. It provides multiple interfaces including SPI, QSPI,
UART, SDIO, I2C, USB, CAN*, LCM, Camera, PWM and I2S for various applications.
FCM561D-P series is an SMD module with compact packaging. It includes:
⚫320 MHz RISC-V processor
⚫Built-in 64 KB ROM and 512 KB SRAM memory, 8 MB PSRAM and 4 MB Flash
⚫Support secondary development
Table 2: Basic Information
FCM561D
Packaging type
LCC + LGA
Pin counts
85
Dimensions
⚫FCM561D-P: (22 ±0.2) mm ×(18 ±0.2) mm ×(1.9 ±0.2) mm
Weight
⚫FCM561D-P: Approx 1.24 g

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2.1. Key Features
Table 3: Key Features
1
Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications.
2
For more details about the EVB, see document 错误 ! 未找到引用源。 and document 错误 ! 未找到引用源。 .
3
The module is provided with one of the two antenna interface designs. For more details, please contact Quectel
Technical Support.
4
For more details about the interfaces, see Chapter 3.3 and Chapter 3.4
Basic Information
Protocols and Standard
⚫Wi-Fi Protocols: IEEE 802.11b/g/n/ax
⚫Bluetooth protocol: BLE 5.2
⚫All hardware components are fully compliant with EU RoHS directive
Power Supply
VBAT Power Supply:
⚫3.0–3.6 V
⚫Typ.: 3.3 V
Temperature Ranges
⚫Operating temperature 1: -40 to +85 °C
⚫Storage temperature: -45 °C to +95 °C
EVB Kit
FCM561D-P-TE-B 2
Antenna Interface
Antenna Interfaces 3
⚫FCM561D-P: PCB antenna
⚫50 Ω characteristic impedance
Application Interface 4
Application Interfaces
SPI, QSPI, UART, SDIO, I2C, USB, CAN*, LCM, Camera, PWM, I2S, Analog
audio, SAR ADC, Touch sensor

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3Application Interfaces
3.1. Pin Assignment
1
GND
2
RESERVED
3
GND
4
CHIP_EN
5
GND
6
USB_DP
7
USB_DM
8
GND
9
VBAT
10
GPIO28
44
GND
43
GND
42
GND
41
GPIO8
40
GPIO0
39
GPIO1
38
UART1_TXD
37
UART1_RXD
36
GND
35
GPIO41
34
GPIO43
33
GPIO44
45
GND
46
GND
47
GND
48
GND
49
XTAL32K
50
GND
51
GND
32
GPIO45
31
GPIO19
30
GPIO20
29
GPIO21
28
GPIO22
27
GPIO23
26
MIC_P
24
SPK_P
23
SPK_N
67
GPIO46
66
GPIO47
65
GPIO18
64
GPIO17
63
GPIO15
62
GPIO16
61
GPIO14
76
GND
75
GND
74
GND
73
GPIO9
72
GPIO24
71
GPIO25
70
GPIO26
69
GPIO40
68
GPIO42
11
GPIO27
12
GPIO35
13
GPIO36
14
GPIO37
15
GPIO39
16
GPIO38
17
GND
18
GPIO5
19
GPIO4
20
GPIO3
21
GPIO2
22
GND
53
GPIO32
54
GPIO34
55
GPIO29
56
GPIO30
57
GPIO31
58
GND
59
GPIO7
60
GPIO6
77
GND 78
GND 79
GND
80
GND 81
GND 82
GND
83
GND 84
GND 85
GND
GND Pins with Different
Functions USB Power CLK
Audio UART
25
MIC_N
GPIO Control Signal
52
GPIO33
Figure 1: Pin Assignment (Top View)

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1. The RESERVED pin and unused pins need to be suspended.
2. All GND pins should be connected to ground.
3. The module provides 1 UART, 1 USB interface, 2 analog audio interfaces and 44 GPIO interfaces
by default. In the case of multiplexing, it supports up to 48 GPIO interfaces, 2 SPI, 1 QSPI, 3
UARTs, 1 SDIO interface, 2 I2C interfaces, 1 CAN interface*, 1 LCM interface, 12 PWM interfaces,
1 I2S interface, and 8 SAR ADC interfaces. For more details, see Chapter 3.3 and Chapter3.4
3.2. Pin Description
Table 4: Parameter Description
DC characteristics include power domain and rated current.
Table 5: Pin Description
Parameter
Description
AI
Analog Input
AO
Analog Output
AIO
Analog Input/Output
DI
Digital Input
DO
Digital Output
DIO
Digital Input/Output
PI
Power Input
Power Supply
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
VBAT
9
PI
Power supply for
the module
Vmax = 3.6 V
Vmin = 3.0 V
Vnom = 3.3 V
It must be provided with
sufficient current of at least
0.5 A.
NOTE

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GND
1, 3, 5, 8, 17, 22, 36, 42–48, 50, 51, 58, 74–85
Control Signal
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
CHIP_EN
4
DI
Enable the module
VBAT
Hardware enable.
Internally pulled up to 3.3 V.
Active high.
UART1
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
UART1_TXD
38
DO
UART1 transmit
VBAT
UART1_RXD
37
DI
UART1 receive
USB Interface
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
USB_DP
6
AIO
USB 2.0
differential data (+)
USB 2.0 compliant.
Requires 85–100 Ω
differential impedance;
recommended to be 90 Ω.
Test point must be
reserved.
USB_DM
7
AIO
USB 2.0
differential data (-)
RTC
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
XTAL32K
49
DI
32.768 kHz clock
input
RTC input.
If unused, keep it open.
GPIO Interfaces
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
GPIO0
40
DIO
General-purpose
input/output
VBAT
Interrupt wakeup.
GPIO1
39
DIO
General-purpose
input/output
GPIO2
21
DIO
General-purpose
input/output
GPIO3
20
DIO
General-purpose
input/output

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GPIO4
19
DIO
General-purpose
input/output
GPIO5
18
DIO
General-purpose
input/output
GPIO6
60
DIO
General-purpose
input/output
GPIO7
59
DIO
General-purpose
input/output
GPIO8
41
DIO
General-purpose
input/output
GPIO9
73
DIO
General-purpose
input/output
GPIO14
61
DIO
General-purpose
input/output
GPIO15
63
DIO
General-purpose
input/output
GPIO16
62
DIO
General-purpose
input/output
GPIO17
64
DIO
General-purpose
input/output
GPIO18
65
DIO
General-purpose
input/output
GPIO19
31
DIO
General-purpose
input/output
GPIO20
30
DIO
General-purpose
input/output
GPIO21
29
DIO
General-purpose
input/output
GPIO22
28
DIO
General-purpose
input/output
GPIO23
27
DIO
General-purpose
input/output
GPIO24
72
DIO
General-purpose
input/output
GPIO25
71
DIO
General-purpose
input/output
GPIO26
70
DIO
General-purpose
input/output
GPIO27
11
DIO
General-purpose
input/output
GPIO28
10
DIO
General-purpose
input/output

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GPIO29
55
DIO
General-purpose
input/output
GPIO30
56
DIO
General-purpose
input/output
GPIO31
57
DIO
General-purpose
input/output
GPIO32
53
DIO
General-purpose
input/output
GPIO33
52
DIO
General-purpose
input/output
GPIO34
54
DIO
General-purpose
input/output
GPIO35
12
DIO
General-purpose
input/output
GPIO36
13
DIO
General-purpose
input/output
GPIO37
14
DIO
General-purpose
input/output
GPIO38
16
DIO
General-purpose
input/output
GPIO39
15
DIO
General-purpose
input/output
GPIO40
69
DIO
General-purpose
input/output
GPIO41
35
DIO
General-purpose
input/output
GPIO42
68
DIO
General-purpose
input/output
GPIO43
34
DIO
General-purpose
input/output
GPIO44
33
DIO
General-purpose
input/output
GPIO45
32
DIO
General-purpose
input/output
GPIO46
67
DIO
General-purpose
input/output
GPIO47
66
DIO
General-purpose
input/output
Analog Audio Interfaces
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment

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MIC_P
26
AI
Microphone
analog input (+)
MIC_N
25
AI
Microphone
analog input (-)
SPK_P
24
AO
Analog audio
differential output
(+)
SPK_N
23
AO
Analog audio
differential output
(-)
RESERVED PIN
Pin Name
Pin No.
Comment
RESERVED
2
Not connected

Wi-Fi&Bluetooth Module Series
FCM561D-P_Hardware_Design 19 / 61
3.3. GPIO Multiplexing
The module provides 44 GPIOs by default, and has up to 48 GPIOs in the case of multiplexing. Pins are defined as follows:
Table 6: GPIO Multiplexing
Pin Name
Pin No.
Multiplexing Function 0
(GPIO No.)
Multiplexing
Function 1
Multiplexing
Function 2
Multiplexing
Function 3
Multiplexing
Function 4
Multiplexing
Function 5
GPIO0
40
GPIO0
UART2_TXD
I2C2_SCL
-
-
-
GPIO1
39
GPIO1
UART2_RXD
I2C2_SDA
-
-
-
GPIO2
21
GPIO2
SPI2_CLK
SDIO_CLK
-
-
-
GPIO3
20
GPIO3
SPI2_CS
SDIO_CMD
-
-
-
GPIO4
19
GPIO4
SPI2_MOSI
SDIO_DATA0
-
-
-
GPIO5
18
GPIO5
SPI2_MISO
SDIO_DATA1
-
-
-
GPIO6
60
GPIO6
CLK26M_OUT
PWM0
I2S_CLK
-
-
GPIO7
59
GPIO7
COEX_WIFI_
ACTIVE
PWM1
I2S_SYNC
-
-
GPIO8
41
GPIO8
COEX_BT_
ACTIVE
PWM2
I2S_DIN
-
-