Quectel M10 Supplement

M10
Quectel Cellular Engine
Hardware Design
M10_HD_V3.0

M10HardwareDesign
M10_HD_V3.0 -1-
Document Title M10 Hardware Design
Revision 3.0
Date 2012-03-02
Status Released
Document Control ID M10_HD_V3.0
General Notes
Quectel offers this information as a service to its customers, to support application and
engineering efforts that use the products designed by Quectel. The information provided is
based upon requirements specifically provided for customers of Quectel. Quectel has not
undertaken any independent search for additional information, relevant to any information
that may be in the customer’s possession. Furthermore, system validation of this product
designed by Quectel within a larger electronic system remains the responsibility of the
customer or the customer’s system integrator. All specifications supplied herein are subject to
change.
Copyright
This document contains proprietary technical information of Quectel Co., Ltd. Copying of
this document, distribution to others, and communication of the contents thereof, are
forbidden without permission.Offenders are liable to the payment of damages. All rights are
reserved in the event of a patent grant or registration of a utility model or design. All
specification supplied herein are subject to change without notice at any time.
Copyright © Quectel Wireless Solutions Co., Ltd. 2012

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Contents
Contents ............................................................................................................................................2
Table Index........................................................................................................................................4
Figure Index ......................................................................................................................................5
0. Revision history ............................................................................................................................7
1. Introduction...................................................................................................................................9
1.1. Related documents ..............................................................................................................9
1.2. Terms and abbreviations....................................................................................................10
1.3. Directives and standards....................................................................................................12
1.3.1. FCC Statement ........................................................................................................12
1.3.2. FCC Radiation exposure statement .........................................................................12
1.3.3. Industry Canada licence ..........................................................................................12
1.4. Safety cautions ..................................................................................................................13
2. Product concept...........................................................................................................................15
2.1. Key features ......................................................................................................................15
2.2. Functional diagram............................................................................................................17
2.3. Evaluation board ...............................................................................................................18
3. Application interface...................................................................................................................19
3.1. Pin of module ....................................................................................................................19
3.1.1. Pin assignment.........................................................................................................19
3.1.2. Pin description.........................................................................................................20
3.2. Operating modes ...............................................................................................................25
3.3. Power supply.....................................................................................................................26
3.3.1. Power supply pins....................................................................................................27
3.3.2. Minimizing supply voltage drop..............................................................................27
3.3.3. Monitor power supply .............................................................................................28
3.4. Power up and down scenarios ...........................................................................................28
3.4.1. Power on..................................................................................................................28
3.4.2. Power down.............................................................................................................31
3.4.3. Restart module using the PWRKEY pin..................................................................35
3.5. Power saving .....................................................................................................................36
3.5.1. Minimum functionality mode..................................................................................36
3.5.2. SLEEP mode (slow clock mode).............................................................................36
3.5.3. Wake up module from SLEEP mode ......................................................................37
3.6. Summary of state transitions (except SLEEP mode).........................................................37
3.7. RTC backup ......................................................................................................................37
3.8. Serial interfaces.................................................................................................................39
3.8.1. UART Port ..............................................................................................................40
3.8.2. Debug Port...............................................................................................................43
3.8.3. UART Port 3 ...........................................................................................................44
3.8.4. UART Application ..................................................................................................45
3.9. Audio interfaces.................................................................................................................46

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3.9.1. Decrease TDD noise and other noise ......................................................................47
3.9.2. Microphone interfaces configuration.......................................................................48
3.9.3. Receiver and speaker interface configuration..........................................................49
3.9.4. Earphone interface configuration ............................................................................51
3.10. SIM card interface...........................................................................................................52
3.10.1. SIM card application .............................................................................................52
3.10.2. Design considerations for SIM card holder...........................................................54
3.11. Keypad interface..............................................................................................................56
3.12. ADC.................................................................................................................................57
3.13. Behaviors of the RI .........................................................................................................58
3.14. Network status indication................................................................................................60
3.15. Operating status indication..............................................................................................61
3.16. General purpose input & output (GPIO) .........................................................................61
3.17. Open drain output (LIGHT_MOS)..................................................................................62
3.18. SD card interface.............................................................................................................63
4. Antenna interface ........................................................................................................................65
4.1. Antenna installation...........................................................................................................65
4.2. RF output power................................................................................................................66
4.3. RF receiving sensitivity.....................................................................................................66
4.4. Operating frequencies .......................................................................................................66
4.5. Recommendation of RF pad welding................................................................................66
5. Electrical, reliability and radio characteristics ............................................................................68
5.1. Absolute maximum ratings................................................................................................68
5.2. Operating temperature.......................................................................................................68
5.3. Power supply ratings .........................................................................................................69
5.4. Current consumption .........................................................................................................70
5.5. Electro-static discharge .....................................................................................................72
6. Mechanical dimensions...............................................................................................................73
6.1. Mechanical dimensions of module....................................................................................73
6.2. Footprint of recommendation............................................................................................75
6.3. Top view of the module ....................................................................................................77
6.4. Bottom view of the module...............................................................................................77
Appendix A: GPRS coding schemes...............................................................................................78
Appendix B: GPRS multi-slot classes.............................................................................................79

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Table Index
TABLE 1: RELATED DOCUMENTS .............................................................................................9
TABLE 2: TERMS AND ABBREVIATIONS................................................................................10
TABLE 3: MODULE KEY FEATURES ........................................................................................15
TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR
INTERFACE..................................................................................................................17
TABLE 5: PIN DESCRIPTION......................................................................................................20
TABLE 6: OVERVIEW OF OPERATING MODES......................................................................25
TABLE 7: AT COMMANDS USED IN ALARM MODE .............................................................31
TABLE 8: SUMMARY OF STATE TRANSITION .......................................................................37
TABLE 9: LOGIC LEVELS OF THE SERIAL INTERFACE.......................................................40
TABLE 10: PIN DEFINITION OF THE SERIAL INTERFACES.................................................40
TABLE 11: PIN DEFINITION OF AUDIO INTERFACE.............................................................47
TABLE 12: TYPICAL ELECTRET MICROPHONE CHARACTERISTIC .................................51
TABLE 13: TYPICAL SPEAKER CHARACTERISTIC...............................................................51
TABLE 14: PIN DEFINITION OF THE SIM INTERFACE..........................................................52
TABLE 15: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER..................................55
TABLE 16: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER .........................................55
TABLE 17: PIN DEFINITION OF THE KEYPAD INTERFACE.................................................56
TABLE 18: PIN DEFINITION OF THE ADC ...............................................................................57
TABLE 19: CHARACTERISTIC OF THE ADC ...........................................................................58
TABLE 20: BEHAVIORS OF THE RI...........................................................................................58
TABLE 21: WORKING STATE OF THE NETLIGHT..................................................................60
TABLE 22: PIN DEFINITION OF THE STATUS.........................................................................61
TABLE 23: PIN DEFINITION OF THE GPIO INTERFACE .......................................................62
TABLE 24: PIN DEFINITION OF THE LIGHT_MOS.................................................................62
TABLE 25: PIN DEFINITION OF THE SD CARD INTERFACE ...............................................63
TABLE 26: PIN NAME OF THE SD CARD AND T-FLASH(MICRO SD) CARD.....................64
TABLE 27: PIN DEFINITION OF THE RF_ANT ........................................................................65
TABLE 28: THE MODULE CONDUCTED RF OUTPUT POWER ............................................66
TABLE 29: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY ............................66
TABLE 30: THE MODULE OPERATING FREQUENCIES ........................................................66
TABLE 31: ABSOLUTE MAXIMUM RATINGS .........................................................................68
TABLE 32: OPERATING TEMPERATURE .................................................................................68
TABLE 33: THE MODULE POWER SUPPLY RATINGS ...........................................................69
TABLE 34: THE MODULE CURRENT CONSUMPTION ..........................................................70
TABLE 35: THE ESD ENDURANCE (TEMPERATURE:25℃,HUMIDITY:45 %)....................72
TABLE 36: DESCRIPTION OF DIFFERENT CODING SCHEMES...........................................78
TABLE 37: GPRS MULTI-SLOT CLASSES ................................................................................79

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Figure Index
FIGURE 1: MODULE FUNCTIONAL DIAGRAM......................................................................18
FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT.........................................................19
FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ...................26
FIGURE 4: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ...................27
FIGURE 5: REFERENCE CIRCUIT OF THE VBAT INPUT.......................................................28
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT.........................................29
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ...................................................29
FIGURE 8: TIMING OF TURN ON SYSTEM .............................................................................30
FIGURE 9: TIMING OF TURN OFF THE MODULE..................................................................32
FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT ....34
FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON ......................34
FIGURE 12: TIMING OF RESTART SYSTEM............................................................................35
FIGURE 13: TIMING OF RESTART SYSTEM AFTER EMERGENCY SHUTDOWN .............35
FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY........................................38
FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY ............................................38
FIGURE 16: RTC SUPPLY FROM CAPACITOR.........................................................................38
FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTIC .......................................39
FIGURE 18: CONNECTION OF ALL FUNCTIONAL UART PORT ..........................................42
FIGURE 19: CONNECTION OF THREE LINES UART PORT...................................................42
FIGURE 20: CONNECTION OF UART PORT WITH HARDWARE FLOW CONTROL..........43
FIGURE 21: CONNECTION OF SOFTWARE UPGRADE .........................................................43
FIGURE 22: CONNECTION OF SOFTWARE DEBUG ..............................................................44
FIGURE 23: CONNECTION OF AUXILIARY UART PORT ......................................................44
FIGURE 24: 3.3V LEVEL MATCH CIRCUIT..............................................................................45
FIGURE 25: 5V LEVEL MATCH CIRCUIT.................................................................................45
FIGURE 26: RS232 LEVEL MATCH CIRCUIT...........................................................................46
FIGURE 27: MICROPHONE INTERFACE CONFIGURATION OF AIN1&AIN2.....................48
FIGURE 28: SPEAKER INTERFACE CONFIGURATION OF AOUT1......................................49
FIGURE 29: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1.....49
FIGURE 30: SPEAKER INTERFACE CONFIGURATION OF AOUT2......................................50
FIGURE 31: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2.....50
FIGURE 32: EARPHONE INTERFACE CONFIGURATION......................................................51
FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD ............................................53
FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD ............................................53
FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER ......................................54
FIGURE 36: MOLEX 91228 SIM CARD HOLDER.....................................................................55
FIGURE 37: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE .....................................57
FIGURE 38: RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER....................................59
FIGURE 39: RI BEHAVIOUR OF DATA CALLING AS A RECEIVER......................................59
FIGURE 40: RI BEHAVIOUR AS A CALLER .............................................................................59
FIGURE 41: RI BEHAVIOUR OF URC OR SMS RECEIVED....................................................60

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FIGURE 42: REFERENCE CIRCUIT OF THE NETLIGHT ........................................................60
FIGURE 43: REFERENCE CIRCUIT OF THE STATUS .............................................................61
FIGURE 44: REFERENCE CIRCUIT OF THE LIGHT_MOS .....................................................62
FIGURE 45: REFERENCE CIRCUIT OF SD CARD ...................................................................63
FIGURE 46: REFERENCE CIRCUIT OF RF INTERFACE .........................................................65
FIGURE 47: RECOMMENDATION OF RF PAD WELDING .....................................................67
FIGURE 48: M10 TOP AND SIDE DIMENSIONS（UNIT: MM）............................................73
FIGURE 49: M10 BOTTOM DIMENSIONS（UNIT: MM）......................................................74
FIGURE 50: PAD BOTTOM DIMENSIONS（UNIT: MM）......................................................74
FIGURE 51: FOOTPRINT OF RECOMMENDATION（UNIT: MM）......................................76
FIGURE 52: TOP VIEW OF THE MODULE................................................................................77
FIGURE 53: BOTTOM VIEW OF THE MODULE ......................................................................77
FIGURE 54: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3....................................78
FIGURE 55: RADIO BLOCK STRUCTURE OF CS-4 ................................................................78

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0. Revision history
Revision Date Author Description of change
1.00 2009-06-27 Tracy ZHANG Initial
1.01 2009-09-18 Yong AN 1. Modified VRTC voltage inputting range.
2. Modified Figure 1.
3. Added Table 7 and Figure 4 with remark.
4. Modified ordering information content in
Chapter 6.
5. Added VCHG pin description.
6. Modified current consumption data in Table 36.
7. Added appendix A and B.
1.02 2009-11-12 Yong AN 1. Baud rate of the main UART port is set to
autobauding mode from former fixed baud rate
of 115200 in default configuration.
2. Modified contents about autobauding in
Chapter 3.8
3. Modified the SIM card detection function
through “AT+QSIMDET”.
1.03 2010-06-09 Yong AN 1. Added charging interface description.
2. Added Serial Port 3 interface description.
3. Added STATUS pin and its function description.
4. Added GPIO control by AT+QGPIO command.
5. Modified timing of powering on, powering
down and restarting the module.
6. Added ESD level of SIM card interface.
7. Modified function description of audio AOUT2
channel.
8. Disabled VDD_EXT pin as the indication of
power-on and power-down.
9. Both STATUS and AT+QGPIO functions are
supported at R05A05 release version and later,
while Serial Port 3 function will be supported at
R06AXX and later.
2.0 2010-07-30 DavidWEI 1. Added recommendation of RF pad welding.
3.0 2012-02-28 LayneYE 1. Modified the power supply range
2. Modified buzzer interface as RESERVED
3. Modified the display interface as SD interface
4. Modified the peak current in a transmitting burst
5. Modified the current consumption in GSM talk
mode and GPRS communication mode
6. Modified the RF receiving sensitivity

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7. Deleted the content of charging function.

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1. Introduction
This document defines the M10 module and describes the hardware interface of M10 module
which are connected with the customer application and the air interface.
This document can help customer quickly understand module interface specifications, electrical
and mechanical details. Associated with application notes and user guide, customer can use M10
module to design and set up mobile applications easily.
1.1. Related documents
Table 1: Related documents
SN Document name Remark
[ 1 ] M 1 0 _ AT C AT c o m ma n d s s e t
[2] ITU-T Draft new
recommendation V.25ter
Serial asynchronous automatic dialing and control
[3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT
command set for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
[5] GSM 07.05 Digital cellular telecommunications (Phase 2+); Use of
Data Terminal Equipment – Data Circuit terminating
Equipment (DTE – DCE) interface for Short Message
Service (SMS) and Cell Broadcast Service (CBS)
[6] GSM 11.14 Digital cellular telecommunications (Phase 2+);
Specification of the SIM Application Toolkit for the
Subscriber Identity module – Mobile Equipment (SIM –
ME) interface
[7] GSM 11.11 Digital cellular telecommunications (Phase 2+);
Specification of the Subscriber Identity module – Mobile
Equipment (SIM – ME) interface
[8] GSM 03.38 Digital cellular telecommunications (Phase 2+);
Alphabets and language-specific information
[9] GSM 11.10 Digital cellular telecommunications (Phase 2); Mobile
Station (MS) conformance specification; Part 1:
Conformance specification
[10] GSM_UART_AN UART port application notes
[11] M10_HD_AN01 M10 hardware design application notes
[12] GSM_FW_Upgrade_AN01 GSM Firmware upgrade application note
[13] M10_EVB_UGD M10 EVB user guide application notes