Rockwell Automation Allen-Bradley 1746-BTM User manual

BarrelTemperature
Control Module
1746-BTM
User Manual

Important User Information
Because of the variety of uses for the products described in this
publication, those responsible for the application and use of this
control equipment must satisfy themselves that all necessary steps
have been taken to assure that each application and use meets all
performance and safety requirements, including any applicable laws,
regulations, codes and standards.
The illustrations, charts, sample programs and layout examples shown
in this guide are intended solely for purposes of example. Since there
are many variables and requirements associated with any particular
installation, Allen-Bradley does not assume responsibility or liability
(to include intellectual property liability) for actual use based upon
the examples shown in this publication.
Allen-Bradley publication SGI-1.1, Safety Guidelines for the
Application, Installation and Maintenance of Solid-State Control
(available from your local Allen-Bradley office), describes some
important differences between solid-state equipment and
electromechanical devices that should be taken into consideration
when applying products such as those described in this publication.
Reproduction of the contents of this copyrighted publication, in whole
or part, without written permission of Rockwell Automation, is
prohibited.
Throughout this manual we use notes to make you aware of safety
considerations:
Attention statements help you to:
•identify a hazard
•avoid a hazard
•recognize the consequences
Allen-Bradley is a trademark of Rockwell Automation
ATTENTION Identifies information about practices or
circumstances that can lead to personal injury or
death, property damage or economic loss
IMPORTANT Identifies information that is critical for successful
application and understanding of the product.

European Communities (EC)
Directive Compliance
If this product has the CE mark it is approved for installation within
the European Union and EEA regions. It has been designed and
tested to meet the following directives.
EMC Directive
This product is tested to meet the Council Directive 89/336/EC
Electromagnetic Compatibility (EMC) by applying the following
standards, in whole or in part, documented in a technical
construction file:
•EN 50081-2 EMC — Generic Emission Standard, Part 2 —
Industrial Environment
•EN 50082-2 EMC — Generic Immunity Standard, Part 2 —
Industrial Environment
This product is intended for use in an industrial environment.
Low Voltage Directive
This product is tested to meet Council Directive 73/23/EEC Low
Voltage, by applying the safety requirements of EN 61131-2
Programmable Controllers, Part 2 - Equipment Requirements and
Tests. For specific information required by EN 61131-2, see the
appropriate sections in this publication, as well as the Allen-Bradley
publication Industrial Automation Wiring and Grounding Guidelines
For Noise Immunity, publication 1770-4.1.
This equipment is classified as open equipment and must be
mounted in an enclosure during operation to provide safety
protection.

1Publication 1746-6.10 - September 1999
Summary of Changes
This manual has been revised extensively. Major changes include:
•Ladder code addresses have been changed.
•The sample ladder code has been extensively changed. As a
result, Chapter 9 has been extensively changed.
•Examples outlining the mathematical relationships involved in
Startup Aggressiveness Factor and Ramp Rates have been
included in Chapter 3
•Appendixes A and B have been omitted. Module specifications
can be found in the BTM Installation Instructions, Publication
1746-5.20

Publication 1746-6.10 - September 1999
Summary of Changes 2

1Publication 1746-6.10 - September 1999
Preface
Using This Manual
This manual shows you how to use the Barrel Temperature Control
Module (cat. no. 1746-BTM) in an Allen-Bradley SLC system for barrel
temperature control and other injection molding or extrusion related
temperature control applications. The manual explains how to install,
program, calibrate, and troubleshoot the BTM module.
Audience
You must be able to program and operate an Allen-Bradley SLC
programmable controller to make efficient use of this module. In
particular, you must know how to configure M0 and M1 files. For
more information, see the appropriate SLC programming manual
before you generate a program for this module.
System Compatibility
System compatibility involves data table use as well as compatibility
with a local I/O chassis and SLC processor.
Data Table
Communication between the module and processor is bi-directional.
The processor transfers output data through the output image table to
the BTM module and transfers input data from the BTM module
through the input image table. The BTM module also requires M files
for configuration and calibration values.
I/O Chassis
You can use this module with 1746-A4, -A7, -A10, -or -A13 chassis,
provided there is an SLC controller in the chassis (local system). You
can place the BTM module in any I/O slot except for the first slot
which is reserved for the processor.
ATTENTION Use the 1746-BTM module in a local I/O chassis only
for barrel temperature control of injection molding
applications or extruders. Any other applications are
not supported.

Publication 1746-6.10 - September 1999
Preface 2
SLC Processor
The 1746-BTM module is compatible with any SLC processor that
supports M0/M1 files, such as the SLC 5/05, SLC 5/04, SLC 5/03, and
SLC 5/02 controllers.
Vocabulary
In this manual, we refer to:
•the barrel temperature control module at the “1746-BTM
module,” the “BTM module,” or as “the module”
•the programmable controller as the “SLC processor”, or “the
processor”
•a thermocouple as a “TC”
•a time-proportioned output as “TPO”
•the tuning-assisted processes as “TAP”
•proportional-integral-derivative as “PID”
•cold-junction compensation as “CJC”

iPublication 1746-6.10 - September 1999
Table of Contents
Chapter 1
Getting Started
Temperature Control Using a BTM Module in an SLC System 1-1
Features of the Temperature Control Module . . . . . . . . . . . 1-2
Module Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Current CV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
TPO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Module Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Response to Slot Disabling . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Input response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Output response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Chapter 2
Installing and Wiring
Avoiding Electrostatic Damage. . . . . . . . . . . . . . . . . . . . . . 2-1
European Communities (EC) Directive Compliance . . . . . . 2-2
EMC Directive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Low Voltage Directive . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Determining Power Requirements . . . . . . . . . . . . . . . . . . . 2-3
Choosing a Module Slot in a Local I/O Chassis. . . . . . . . . . 2-3
Installation considerations . . . . . . . . . . . . . . . . . . . . . . 2-3
Installing the Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Removing the terminal block . . . . . . . . . . . . . . . . . . . . 2-5
Wiring the Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Cold Junction Compensation (CJC) . . . . . . . . . . . . . . . . 2-6
Wiring considerations. . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Preparing and Wiring the Cables . . . . . . . . . . . . . . . . . 2-8
Chapter 3
Configuring the Module
Loop Operation Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Word 1, Bits 0 and 1 for Channel 1. . . . . . . . . . . . . . . . 3-1
Type of Loop Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Word 1, Bits 2-5 for Channel 1 . . . . . . . . . . . . . . . . . . . 3-1
Enable Loop Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Word 1, Bit 6 for Channel 1 . . . . . . . . . . . . . . . . . . . . . 3-2
TC Break Response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Word 1, Bits 7 and 8 for Channel 1. . . . . . . . . . . . . . . . 3-2
Loop Autotune Gains Level . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Word 1, Bits 10 and 11 for Channel 1 . . . . . . . . . . . . . . 3-2
Barrel/Non-barrel Control . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Word 1, Bit 12 for Channel 1 . . . . . . . . . . . . . . . . . . . . 3-3
Barrel Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Non–barrel control. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Switching the barrel control . . . . . . . . . . . . . . . . . . . . . 3-3
Inner/Outer Zone Selection . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Word 1, Bit 13 for Channel 1 . . . . . . . . . . . . . . . . . . . . 3-4

Publication 1746-6.10 - September 1999
Table of Contents ii
High/Low CV Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Words 2 and 3 for Channel 1 . . . . . . . . . . . . . . . . . . . . 3-5
TC Break Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Word 4 or O:e.8 for Channel1 . . . . . . . . . . . . . . . . . . . 3-5
Standby Setpoint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Word 5 for Channel 1 . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Heat/Cool Minimum On-times. . . . . . . . . . . . . . . . . . . . . . 3-5
Words 6 and 8 for channel 1 . . . . . . . . . . . . . . . . . . . . 3-5
Heat/Cool TPO Period . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Words 7 and 9 for Channel 1 . . . . . . . . . . . . . . . . . . . . 3-6
PV Rate and Associated Alarm . . . . . . . . . . . . . . . . . . . . . . 3-6
Word 10 and Alarm Bit I:e.4/05 for Channel 1. . . . . . . . 3-6
High/Low Temperature and Deviation Alarms . . . . . . . . . . 3-6
Words 11-14 for Channel 1. . . . . . . . . . . . . . . . . . . . . . 3-6
Alarm Dead Band . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Word 15 for Channel 1. . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Thermal Integrity Loss Detection . . . . . . . . . . . . . . . . . . . . 3-7
Words 16 and 17 for Channel 1 . . . . . . . . . . . . . . . . . . 3-7
Ramp Rates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
Words 18 for Channel 1 . . . . . . . . . . . . . . . . . . . . . . . . 3-8
Non-barrel Autotune Disturbance Size . . . . . . . . . . . . . . . . 3-8
Word 20 for Channel 1. . . . . . . . . . . . . . . . . . . . . . . . . 3-8
Implied Decimal Point . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
Configuration Block, M1 File, Loops 1-4 N10:0-100. . . . . . . 3-10
Startup Aggressiveness factor. . . . . . . . . . . . . . . . . . . . . . . 3-10
Ramp Rates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
Chapter 4
Setting Autotune and Gains Values
Sequence of Setting PID Gains . . . . . . . . . . . . . . . . . . . . . 4-1
Autotuning the Loops . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Fine-Tuning the Loops . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Using the PID Equation. . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Entering Autotune/Gains Values with Implied Decimal Point 4-5
Gains/Autotune Block, M0 File, for Loops 1–4 . . . . . . . 4-6
Chapter 5
Control and Autotune a Loop
Controlling a Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
M1 Configuration File. . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Output Image Table. . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Autotune a Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Requirements for Autotune. . . . . . . . . . . . . . . . . . . . . . 5-2
Items to check before autotune . . . . . . . . . . . . . . . . . . 5-4
Autotune barrel control applications . . . . . . . . . . . . . . . 5-4
Autotune non–barrel control applications . . . . . . . . . . . 5-7
Items to check if autotune was not successful . . . . . . . . 5-7

Publication 1746-6.10 - September 1999
Table of Contents iii
Using the Output Image Table. . . . . . . . . . . . . . . . . . . . . . 5-8
Operating Commands to Loops 1-4. . . . . . . . . . . . . . . . 5-8
Global Commands to All Loops . . . . . . . . . . . . . . . . . . 5-9
BTM Auto Tune . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
Chapter 6
Monitoring Status Data
Input Image Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Implied Decimal Point . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Chapter 7
Calibrating the Module
About the Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
Calibration Codes and Status . . . . . . . . . . . . . . . . . . . . 7-1
Calibration Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
Chapter 8
Troubleshooting the Module
Troublshooting with LED Indicators. . . . . . . . . . . . . . . . . . 8-1
Locating Error Code Information . . . . . . . . . . . . . . . . . . . . 8-2
Chapter 9
Sample Program
Obtaining the Sample Program from the Internet . . . . . . . . 9-1
To Access the Internet:. . . . . . . . . . . . . . . . . . . . . . . . . 9-1
RSLogix500 Version. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1
BTM Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1
Support for 5/03, 5/04, 5/04P, 5/05, and 5/05P Processors
Using BTM20.RSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2
BTM20.RSS Data Table Layout . . . . . . . . . . . . . . . . . . . 9-2
Download and Upload Settings . . . . . . . . . . . . . . . . . . 9-3
BTM20.RSS Programming Notes . . . . . . . . . . . . . . . . . . 9-5
Support for 5/02 Processors
Using BTM50220.RSS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
BTM50220.RSS Data table layout. . . . . . . . . . . . . . . . . . 9-7
Download and Upload Settings . . . . . . . . . . . . . . . . . . 9-8
General Notes For Programming The 1746-BTM. . . . . . . . . 9-10
Index

Publication 1746-6.10 - September 1999
Table of Contents iv

1Publication 1746-6.10 - September 1999
Chapter 1
Getting Started
This chapter gives you information on:
•the function of the temperature control module
•features of the temperature control module
•time–proportioned output (TPO)
•module addressing
•response to slot disabling
Temperature Control Using
a BTM Module in an SLC
System
The temperature control module is an intelligent I/O module that can
provide a maximum of 4 PID loops for temperature control. The
module has 4 analog thermocouple (TC) inputs. Each analog input
functions as the process variable (PV) for a PID loop. The PID
algorithm and tuning–assisted–process (TAP) algorithm are performed
on the module for each of the loops. The control–variable (CV)
output of each loop, either analog output or time–proportioned
output (TPO), is sent from the module to the SLC data table. Your
application ladder logic must access the CV value in the data table and
send the analog or TPO data to an output module to close the loop.
Figure 1.1
A 1746–BTM module with 4 PID logic channels, showing one complete PID loop
ATTENTION Use the 1746–BTM module only for barrel
temperature control for injection molding
applications or extruders in a local I/O chassis. Any
other applications are not supported.
SLC data table output module
analog or TPO
loop logic
loop logic
loop logic
loop logic
process to be
controlled
heater
TC
CV
CV
CV
CV
CV
CV
PV
PV
PV
PV
CV

Publication 1746-6.10 - September 1999
1-2 Getting Started
Features ofthe Temperature
Control Module
The 1746–BTM module provides:
•4 independent temperature control loops
•autotune PID loops (one loop or any combination of loops can
be autotuned while other loops are running)
•a unique start–up algorithm to minimize overshoot
•an isolated thermocouple (J and K) input for each PID loop
•16–bit analog–to–digital converter resolution (0.1° resolution)
•a heat CV signal (for each PID loop) as a numeric % value
•a cool CV signal (for each PID loop) as a numeric % value
•a heat CV signal (for each PID loop) as a TPO bit
•a cool CV signal (for each PID loop) as a TPO bit
•temperature values in °C or °F
•self–calibration (external reference required)
•user–selectable high and low alarms with dead band for
hysteresis
•input open–circuit detection
Module Outputs
The BTM module sends the control variable (CV) for heating and/or
cooling each loop to the SLC processor’s input image table as both of:
•numeric value (current CV)
•time–proportioned output (TPO)
Current CV
Your ladder logic should read the numeric value (current CV), scale it,
and send it to an analog output module to generate the control signal
to an analog temperature control actuator. If using the sample
program look for current CVs in N10:208–211 for loops 1–4. Refer to
the Sample Program chapter for details.
TPO
The module returns the heat TPO (bit 6) and cool TPO (bit 7) in input
image table words 8–11 for loops 1–4. The sample program sends
TPO signals to a digital output module to generate the control signal
to a digital temperature control actuator. Refer to the Sample Program
chapter for details.

Publication 1746-6.10 - September 1999
Getting Started 1-3
Figure 1.2 TPO timing diagram
The TPO duty cycle (Y) must be considerable shorter in time than
the system dead time. For additional information, Refer to Autotune
a Loop on page 5-2.
The following memory map shows you how the SLC processor’s
output and input image tables are defined for the module. Refer
to BTM20.RSS Data Table Layout on page 9-2.
TPO bit
On
Off
X
YCV% = (40%)
X = on time (2.0 sec)
Y = TPO period (5.00 sec)
data in parenthesis refers to
sample program values.
Bit 15 Bit 0 Address
Loop 1 configuration data word 0 O:e.0
Loop 2 configuration data word 1 O:e.1
Loop 3 configuration data word 2 O:e.2
Loop 4 configuration data word 3 O:e.3
Loop 1 run setpoint value word 4 O:e.4
Loop 2 run setpoint value word 5 O:e.5
Loop 3 run setpoint value word 6 O:e.6
Loop 4 run setpoint value word 7 O:e.7
Loop 1 manual output value word 8 O:e.8
Loop 2 manual output value word 9 O:e.9
Loop 3 manual output value word 10 O:e.10
Loop 4 manual output value word 11 O:e.11
miscellaneous control bits word 12 O:e.12
not used word 13 O:e.13
not used word 14 O:e.14
not used word 15 O:e.15
Loop 1 temperature word 0 I:e.0
Loop 2 temperature word 1 I:e.1
Loop 3 temperature word 2 I:e.2
Loop 4 temperature word 3 I:e.3
Loop 1 configuration status word 4 I:e.4
Loop 2 configuration status word 5 I:e.5
Loop 3 configuration status word 6 I:e.6
Loop 4 configuration status word 7 I:e.7
Loop 1 control status and TPO word 8 I:e.8
Loop 2 control status and TPO word 9 I:e.9
Loop 3 control status and TPO word 10 I:e.10
Loop 4 control status and TPO word 11 I:e.11
If using the sample program,
variables in words 12-15, including
current CVs, are multiplexed and
scanned into N10:200-243
word 12 I:e.12
word 13 I:e.13
word 14 I:e.14
word 15 I:e.15
BTM
Module
Output Image
Slot e
See Figure 1.3 on
page 1-4
Input Image
Slot e
See Figure 1.3 on
page 1-4
output image
16 words
input image
16 words
SLC 5/0x
I/O Image Table
Slot e portion of
SLC image table
for BTM module

Publication 1746-6.10 - September 1999
1-4 Getting Started
Module Addressing
When you enter the module ID in processor configuration (off-line),
the processor automatically reserves the required number of I/O
image table words. In the figure below, that section of the I/O image
table is designated by “slot e”. Its location in the I/O image table is
determined by the module’s slot location “e” in the I/O chassis. Slot
location “e” is a required addressing unit when referring to the
module in ladder logic. For the sample program’s data table layout,
Refer to BTM20.RSS Data Table Layout on page 9-2. See Figure 1.3 for
an explanation of the image table addresses
Figure 1.3 .
Response to Slot Disabling
By writing to the status file in your modular SLC processor you can
disable any chassis slot. See your SLC programming manual for the
slot disable/enable procedure.
Input response
When the slot for this module is disabled, the module continues to
update its inputs. However, the SLC processor does not read from a
module whose slot is disabled. Therefore, inputs appearing in the
processor image table remain in their last state, and the module’s
updated inputs are not read. When the processor re–enables the
module slot, the current state of module inputs are read by the
controller during the subsequent scan.
Input Image Table Address Output Image Table Address
I : e . 6 O : e . 6
file type file type
slot slot
word word
element
delimiter
element
delimiter
word
delimiter
word
delimiter
ATTENTION Always understand the implications of disabling the
module before using the slot disable feature.

Publication 1746-6.10 - September 1999
Getting Started 1-5
Output response
When the slot for this module is disabled, configuration words in the
SLC processor’s output image table are held in their last state and not
transferred to the module. When the slot is re–enabled, output image
table words are transferred to the module during the subsequent scan.

Publication 1746-6.10 - September 1999
1-6 Getting Started

1Publication 1746-6.10 - September 1999
Chapter 2
Installing and Wiring
This document gives you information about:
•avoiding electrostatic damage
•compliance with European Union directive
•determining the module’s chassis power requirement
•planning for sufficient enclosure depth
•choosing a module slot in a local I/O chassis
•installing the module
•wiring the module
Avoiding Electrostatic
Damage
Electrostatic discharge can damage semiconductor devices inside this
module if you touch backplane connector pins. Guard against
electrostatic damage by observing the following precautions:
•Touch a grounded object to rid yourself of charge before
handling.
•Wear an approved wrist strap when handling the module.
•Handle the module from the front, away from the backplane
connector. Do not touch backplane connector pins.
ATTENTION Electrostatic discharge can degrade performance or
cause permanent damage. Handle the module as
stated below.

Publication 1746-6.10 - September 1999
2-2 Installing and Wiring
European Communities (EC)
Directive Compliance
If this product has the CE mark it is approved for installation within
the European Union and EEA regions. It has been designed and tested
to meet the following directives.
EMC Directive
This product is tested to meet the Council Directive 89/336/EC
Electromagnetic Compatibility (EMC) by applying the following
standards, in whole or in part, documented in a technical construction
file:
•EN 50081-2 EMC — Generic Emission Standard, Part 2 —
Industrial Environment
•EN 5001082-2 EMC — Generic Immunity Standard, Part 2 —
Industrial Environment
This product is intended for use in an industrial environment.
Low Voltage Directive
This product is tested to meet Council Directive 73/23/EC Low
Voltage, by applying the safety requirements of EN 61131-2
Programmable Controllers, Part 2 - Equipment Requirements and
Tests. For specific information required by EN 61131-2, see the
appropriate sections in this publication, as well as the Allen-Bradley
publication Industrial Automation Wiring and Grounding Guidelines
For Noise Immunity, publication 1770-4.1.
This equipment is classified as open equipment and must be mounted
in an enclosure during operation to provide safety protection.

Publication 1746-6.10 - September 1999
Installing and Wiring 2-3
Determining Power
Requirements
When computing power supply requirements, add the values shown
in Table 2.A to the requirements of all other modules in the SLC
chassis to prevent overloading the chassis power supply.
Choosing a Module Slot in
a Local I/O Chassis
Place your module in any slot of an SLC500 modular, or modular
expansion chassis, except for the left–most slot (slot 0) reserved for
the SLC processor or adapter modules.
Installation considerations
Most thermocouple–type applications require an industrial enclosure
to reduce the effects of electrical interference. Thermocouple inputs
are highly susceptible to electrical noises due to the small signal
amplitudes (microvolt/°C). Isolate them from other input wiring and
modules that radiate electrical interference.
Group your modules within the I/O chassis to minimize adverse
effects from radiated electrical noise and heat. Consider the following
conditions when selecting a slot location. Position the module away
from modules that:
•connect to sources of electrical noise such as relays and ac
motor drives
•generate significant heat, such as 32–point I/O modules
Table 2.A
5V dc amps 24V dc amps
0.110 0.085
IMPORTANT For proper operation, use this module with a local
processor. The module is not designed to operate in
a remote chassis.