Samsung GT-C3750 User manual

GSM TELEPHONE
GT-C3750
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
7. Level 2Repair
8. Level 3Repair
9. Reference data
Notice :
All functionality, features, specifications and other
product information provided in this document inclu
ding, but not limited to, the benefits, design, pricing,
components, performance, availability, and capabiliti
-es of the product are subject to change without
notice or obligation. Samsung reserves the right to
make changes to this document and the product
described herein, at anytime, without obligation on
Samsung to provide notification of such change.
GSM TELEPHONE CONTENTS

This Service Manual is aproperty of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
Samsung Electronics Co.,Ltd.
2011. 04. Rev.1.0
ⓒ

2. Specification
2-1
2-1. GSM General Specification
GSM900 GSM850 DCS1800 PCS1900
Freq.
Band[MHz]
Uplink/Downlink
880~915
925~960
824.2~848.8
869.2~893.8
1710~1785
1805~1880
1850~1910
1930~1990
ARFCN range 0~124 &
975~1023 128~251 512~885 512~810
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot
Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~15
pcl 0pcl ~15 pcl
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMAMux8888
Cell Radius 35Km 35Km 2Km -

Speclflcation
2-2
TX Power
control level DCS1800 PCS1900
030±2
dBm 30±2 dBm
128±3
dBm 28±3 dBm
226±3
dBm 26±3 dBm
324±2
dBm 24±2 dBm
422±3
dBm 22±3 dBm
520±3
dBm 20±3 dBm
618±3
dBm 18±3 dBm
716±3
dBm 16±3 dBm
814±3
dBm 14±3 dBm
912±4
dBm 12±4 dBm
10 10±4 dBm 10±4 dBm
11 8±4dBm 8±4dBm
12 6±4 dBm 6±4 dBm
13 4±4 dBm 4±4 dBm
14 2±5 dBm 2±5 dBm
15 0±5 dBm 0±5 dBm
TX Power
control level GSM850 GSM900
533±2
dBm 33±2 dBm
631±3
dBm 31±3 dBm
729±2
dBm 29±2 dBm
827±3
dBm 27±3 dBm
925±3
dBm 25±3 dBm
10 23±3 dBm 23±3 dBm
11 21±3 dBm 21±3 dBm
12 19±3 dBm 19±3 dBm
13 17±3 dBm 17±3 dBm
14 15±3 dBm 15±3 dBm
15 13±3 dBm 13±3 dBm
16 11±5 dBm 11±5 dBm
17 9±5 dBm 9±5 dBm
18 7±5 dBm 7±5 dBm
19 5±5 dBm 5±5 dBm
2-2. GSM TX power class

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3. Operation Instruction and Installation
3-1
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Main Function
•GPRS Quad Band(850/900/1800/1900)
•EDGE DL only
•2.4”
QVGA LCD (65K color)
•3.2M
CMOS Camera
•BT v2.1+EDR, MicroUSB 2.0, Micro SD(Up to 16G)
•FM Radio Support
•MP3 Player
•3.5
pi Earjack Support
•SMS, MMS

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6. Level 1Repair
6-1
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6-1. Software Downloading
6-1-1. Pre-requisite for Downloading
•Downloader Program(FlashTool_E2_XMM2150)
•GT-C3750 Mobile Phone
•Data Cable
•JIG BOX (GH99-36900A)
•RF Test Cable (GH39-00985A)
•JIG Cable (GH39-01290A)
•Adapter (GH99-38251A)
•Binary files
Connect to Computer using data cable.

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Level 1Repair
6-2
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6-1-2. S/W Downloader Program
■Load the binary download program by executing the
"FlashTool_E2_XMM2150 "
1.Select the connected serial port and the rate of speed.

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Level 1Repair
6-3
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2.Select communication driver as Infineon USB driver.

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Level 1Repair
6-4
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3.Select the Binary in sequence of _psi, _slb, _BSY, _CDS, _CSC. (If you click
custom order, it can be reorder as in sequence)

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Level 1Repair
6-5
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4.P
ress the "Next" button.

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Level 1Repair
6-6
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5.Press Start USB1 and connect the Handset.
6.When downloading is complete, you can see green bar.
7. Confirm the downloaded version name and etc. :
*#1234#
Full Reset :
*2767*3855#

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9. Reference Abbreviate
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9-1
Reference Abbreviate
―AAC:Advanced Audio Coding.
―AVC :Advanced Video Coding.
―BER :Bit Error Rate
―BPSK:Binary Phase Shift Keying
―CA :Conditional Access
―CDM :Code Division Multiplexing
―C/I :Carrier to Interference
―DMB :Digital Multimedia Broadcasting
―EN :European Standard
―ES :Elementary Stream
―ETSI:European Telecommunications Standards Institute
―MPEG:Moving Picture Experts Group
―PN :Pseudo-random Noise
―PS :Pilot Symbol
―QPSK:Quadrature Phase Shift Keying
―RS :Reed-Solomon
―SI :Service Information
―TDM :Time Division Multiplexing
―TS :Transport Stream

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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

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4. Exploded View and Parts List
4-1
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4-1. Cellular phone Exploded View
QFU01
QAR01
QCR93
QCR12
QSP01
QCA01
QFL01
QCR12
QLC01
QMW01
QRE01
QCR67
QBC00
QBA01
QFR01
QKP01
QMP01
QAN02
QME01
QKP02
QPC01
QME02
QCK01
QRF06

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Exploded View and Parts List
4-2
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Design LOC Description SEC CODE
QAR01 AUDIO-RECEIVER 3009-001545
QCR12 SCREW-MACHINE 6001-001530
QCR12 SCREW-MACHINE 6001-001530
QCR67 SCREW-MACHINE 6001-002083
QCR93 SCREW-MACHINE 6001-002263
QAN02 INTENNA-GT-C3750 GH42-02922A
QBA01 INNER BATTERY PACK-800MAH,BLK,UNI,MAIN GH43-03241A
QCA01 CAMERA MODULE-3M LSI 1/5" 5CC SOCKET TYP GH59-10764A
QME01 DOME SHEET-GT-C3750 GH59-10799A
QME02 KEY FPCB-SUB KEY FPCB ASSY GH59-10809A
QPC01 ASSY ETC-SLIDE FPCB GH59-10810A
QSP01 MODULE-SPK +MOT GH59-10835A
QKP01 PMO KEY-MAIN KEYPAD GH72-63293A
QMP01 A/S ASSY-PBA MAIN (COMM) GH82-05749A
QLC01 ELA MODULE-GT_C3500 LCD GH96-04920A
QKP02 ASSY KEYPAD-SUB GH98-19713A
QFL01 ASSY COVER-SLIDE LOWER GH98-20032A
QFR01 ASSY COVER-FRONT GH98-20033A
QBC00 ASSY COVER-BATTERY GH98-20035A
QFU01 ASSY COVER-SLIDE UPPER GH98-20030A
QMW01 ASSY COVER-MAIN WINDOW GH98-20031A
QRE01 ASSY COVER-REAR GH98-20034A
QRF06 PMO COVER-USB GH72-63291A
QCK01 PMO KEY-CAMERA GH72-63292A
4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List
5-1
This Document can not be used without Samsung's authorization
SEC CODE Design LOC Description
0401-001141 D501 DIODE-SWITCHING
0403-001688 D300 DIODE-ZENER
0406-001286 ZD300,ZD302 DIODE-TVS
0406-001361 ZD500 DIODE-TVS
0406-001413 ZD501 DIODE-TVS
0406-001431 D400 DIODE-TVS
0406-001446 D302,ZD502,ZD503 DIODE-TVS
0406-001459 ZD402 DIODE-TVS
0601-002652 LED300,LED301,LED302 LED
0601-002652 LED303 LED
1001-001706 U403 IC
1009-001035 U201 IC
1108-000406 U200 MEMORY
1201-002944 U100 IC
1201-003025 PAM100 IC
1201-003111 U501 IC
1202-001068 U500 IC
1203-003643 U400 IC
1203-005574 U401 IC
1205-004116 U101 IC
1205-004215 UCP200 IC
1404-001224 TH200 THERMISTOR
1405-001298 D301 VARISTOR
2007-000137 R400 R-CHIP
2007-000138 R101,R102,R104,R105 R-CHIP
2007-000138 R331,R332,R333,R338 R-CHIP
2007-000138 R339,R502 R-CHIP
2007-000140 R103,R318,R412 R-CHIP
2007-000141 R210,R211 R-CHIP
2007-000143 R109,R312,R406 R-CHIP
2007-000148 R202,R324,R325,R326 R-CHIP
2007-000148 R327,R328,R401,R402 R-CHIP
2007-000148 R403 R-CHIP
2007-000149 R515,R516 R-CHIP
2007-000157 R213,R329,R500,R514 R-CHIP
2007-000162 R111,R417 R-CHIP

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Main Electrical Parts List
5-2
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SEC CODE Design LOC Description
2007-000166 R506 R-CHIP
2007-000170 R501 R-CHIP
2007-000172 R410,R411 R-CHIP
2007-000242 R404,R405,R508,R509 R-CHIP
2007-001119 R108,R507 R-CHIP
2007-001307 R110 R-CHIP
2007-003010 R334,R335,R336,R337 R-CHIP
2007-007142 R204 R-CHIP
2007-007190 R503,R504 R-CHIP
2007-008055 R208 R-CHIP
2007-008516 R205,R209,R418 R-CHIP
2007-009323 R419 R-CHIP
2203-000233 C101,C117,C416 C-CERAMIC,CHIP
2203-000254 C309 C-CERAMIC,CHIP
2203-000278 C105,C241,C242,C243 C-CERAMIC,CHIP
2203-000278 C244 C-CERAMIC,CHIP
2203-000386 C114,C524,U502 C-CERAMIC,CHIP
2203-000438 C120,C203,C211 C-CERAMIC,CHIP
2203-000550 C227,C228 C-CERAMIC,CHIP
2203-000585 C503,C504 C-CERAMIC,CHIP
2203-000679 C500 C-CERAMIC,CHIP
2203-000812 C107,C109,C302,C303 C-CERAMIC,CHIP
2203-000812 C304,C305,C511,C520 C-CERAMIC,CHIP
2203-000854 C125,C508 C-CERAMIC,CHIP
2203-000995 C233 C-CERAMIC,CHIP
2203-002443 C115,C119,C229 C-CERAMIC,CHIP
2203-002487 C214,C221 C-CERAMIC,CHIP
2203-002668 C230 C-CERAMIC,CHIP
2203-002709 C113,C219 C-CERAMIC,CHIP
2203-005057 C100,C102 C-CERAMIC,CHIP
2203-005234 C108 C-CERAMIC,CHIP
2203-005288 C104 C-CERAMIC,CHIP
2203-005480 C226 C-CERAMIC,CHIP
2203-005481 C123,C124,C205,C220 C-CERAMIC,CHIP
2203-005483 C513,C514 C-CERAMIC,CHIP
2203-006048 C200,C201,C202,C207 C-CERAMIC,CHIP

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Main Electrical Parts List
5-3
This Document can not be used without Samsung's authorization
SEC CODE Design LOC Description
2203-006048 C210,C222,C224,C236 C-CERAMIC,CHIP
2203-006048 C316,C317,C407,C408 C-CERAMIC,CHIP
2203-006048 C515,C517 C-CERAMIC,CHIP
2203-006190 C238 C-CERAMIC,CHIP
2203-006257 C111,C209,C215 C-CERAMIC,CHIP
2203-006260 C213,C235,C237 C-CERAMIC,CHIP
2203-006324 C217,C218 C-CERAMIC,CHIP
2203-006348 C400 C-CERAMIC,CHIP
2203-006399 C239 C-CERAMIC,CHIP
2203-006562 C206,C216,C223,C225 C-CERAMIC,CHIP
2203-006562 C314,C402,C405,C406 C-CERAMIC,CHIP
2203-006562 C409,C410,C510,C512 C-CERAMIC,CHIP
2203-006562 C519,C521,C522,U503 C-CERAMIC,CHIP
2203-006872 C110,C112,C116,C404 C-CERAMIC,CHIP
2203-006872 C414,C417 C-CERAMIC,CHIP
2203-006890 C507 C-CERAMIC,CHIP
2203-007210 C204 C-CERAMIC,CHIP
2203-007269 C231 C-CERAMIC,CHIP
2203-007271 C234,C401,C509,C516 C-CERAMIC,CHIP
2203-007271 C518 C-CERAMIC,CHIP
2203-007279 C103,C315,C411 C-CERAMIC,CHIP
2203-007342 C412,C413 C-CERAMIC,CHIP
2203-007385 C240 C-CERAMIC,CHIP
2203-007693 C415 C-CERAMIC,CHIP
2203-007701 C208 C-CERAMIC,CHIP
2703-000213 L120 INDUCTOR-SMD
2703-001733 L102 INDUCTOR-SMD
2703-001750 L110,L111 INDUCTOR-SMD
2703-002204 L100 INDUCTOR-SMD
2703-002208 L104,L106 INDUCTOR-SMD
2703-002268 L113,L118 INDUCTOR-SMD
2703-002269 L119 INDUCTOR-SMD
2703-002281 L105,L108,L117 INDUCTOR-SMD
2703-002365 L115,L116 INDUCTOR-SMD
2703-002367 L101,L121 INDUCTOR-SMD
2703-002369 L112 INDUCTOR-SMD

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Main Electrical Parts List
5-4
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SEC CODE Design LOC Description
2703-003781 L505 INDUCTOR-SMD
2703-003869 L201 INDUCTOR-SMD
2801-004896 OSC201 CRYSTAL-UNIT
2801-004909 OSC200 CRYSTAL-UNIT
2901-001435 F400,F401,F402 FILTER-EMI
2904-001884 F100 FILTER-SAW
2904-001946 F101 FILTER-SAW
2909-001337 F102 FILTER-DUPLEXER
3003-001138 MIC500 MIC-CONDENSOR
3301-001342 F200 CORE-FERRITE
3301-001729 L506,L507 CORE-FERRITE
3301-001885 L500,L501,L504 CORE-FERRITE
3301-001917 L508,L509 CORE-FERRITE
3301-002000 L200 CORE-FERRITE
3301-002065 L502,L503 CORE-FERRITE
3404-001410 SW300 SWITCH-TACT
3705-001731 RFS100 CONNECTOR-COAXIAL
3709-001645 SIM300 CONNECTOR-CARD
3709-001679 CN300 CONNECTOR-CARD
3710-003306 CN400 CONNECTOR-SOCKET
3711-005581 HEA400 CONNECTOR-HEADER
3711-007393 BTC300 CONNECTOR-HEADER
3712-001348 ANT100,ANT101,SPK401 CONNECTOR
3712-001348 U504,U505,U506 CONNECTOR
3722-003115 IFC400 JACK-PHONE
3722-003259 EAR1 JACK-PHONE
4202-001529 ANT102 ANTENNA-CHIP
GH62-00019A CON100,CON101 PCB-GASKET
GH70-03951A SC101,SC102 IPR SHIELD-CAN CLIP
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's part list.