Samsung GT-E1360M User manual

GSM TELEPHONE
GT-E1360M
1. Safety Precautions
2. Specification
3. Product Function
4. Array course control
5. Exploded View and Parts list
6. MAIN Electrical Parts List
7. Block Diagrams
8. PCB Diagrams
9. Chart of Troubleshooting
10. Reference data
11. Disassembly and Assembly
Instructions
GSM TELEPHONE CONTENTS

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1. Safety Precautions
1-1
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1-1. Repair Precaution
●Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
●Be careful to use akind of magnetic object or tool,
because performance of parts is damaged by the influence of manetic force.
●Surely use astandard screwdriver when you disassemble this product,
otherwise screw will be worn away.
●Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
●Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
●Take specially care of soldering, because Land of PCB is small and weak in heat.
●Surely tune on/off while using AC power plug, because arepair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
●Don't use as you pleases after change other material than replacement registered on SEC
System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easilly by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
●Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
●Use earthed soldering steel when you connect or disconnect ESD.
●Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by
static electricity.
●Don't unpack until you set up ESD on product. Because most of ESD are packed by box
and aluminum plate to have conductive power,they are prevented from static electricity.
●You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

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2. Specification
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2-1
EGSM 900 DCS1800
Freq. Band[MHz]
Uplink/Downlink
880~915
925~960
1710~1785
1805~1880
ARFCN range 0~124 & 975~1023 512~885
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
Power Class 4
(max +33dBm)
1
(max +30dBm)
Sensitivity -102dBm -100dBm
TDMA Mux 8 8
Cell Radius 35Km 2Km
2-1. GSM General Specification

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Specification
2-2
TX Power
control level GSM900
533±2
dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2-2. GSM TX power class

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3. Operation Instruction and Installation
3-1
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Main Function
•GSM Function Support
•ARM926EJ-S Core
•S20 Pin TA
•No Java
•Dual Band(900/1800MHz)
•40
Poly Ringtone (Midi,AMR,MP3)
•Non Camera
•Phonebook 500 entry
•FM Radio Support

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4. Array course control
4-1
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4-1. Software Adjustments
Test Cable (GH39-01160A)
Test Jig (GH99-36900A)
RF Test Cable (GH39-00985A) Adapter (GH99-38251A)

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Array course control
4-2
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4-2. Software Downloading
4-2-1. Downloading Binary Files
•2binary files for downloading E1360M.
–E1360MXExx.cla
–E1360MXExx.tfs
4-2-2. Pre-requsite for Downloading
•Downloader Program(Gaia_S_Downloader_for_SEC v04_Lite.exe)
•E1360M Mobile Phone
•JIG BOX
•Test Cable
•Serial Cable
•Binary files

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Array course control
4-3
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4-2-3. S/W Downloader Program
1. Load the binary download program by executing the “Gaia_S_Downloader_for_
SEC v04_Lite.exe”.
2. Select the Port, Baud Rate and Mode.

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Array course control
4-4
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3. Select the binary fileswhat you want to download

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Array course control
4-5
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4. Press the "Start" button and connect the Handset.
Then Press the "Download" button.

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5. Exploded View and Parts List
5-1
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5-1. Cellular phone Exploded View
QFL00
QMW02
QCR97
QCR67
QFU01
QMO01
QSP01
QLC01
QPC01
QCR72
QSC05
QRE01
QBA01
QBA00
QFR01
QKP01
QCR72
QME01
QMI01
QMP01
QSH01
QAN02
QKP02
QME02
QIF01
QFL01
QHI01
QHI02

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Exploded View and Parts List
5-2
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Design LOC Description SEC CODE
QAN02 INTENNA-GTE1360S GH42-01873A
QBA00 PMO COVER-BATTERY GH72-51698A
QBA01 INNER BATTERY PACK-800MAH,BLK,UNI,MAIN GH43-03241A
QCR67 SCREW-MACHINE 6001-002083
QCR72 SCREW-MACHINE 6001-002051
QCR97 SCREW-MACHINE 6001-002262
QFR01 ASSY CASE-FRONT GH98-11378A
QFU01 ASSY CASE-SLIDE UPPER GH98-11377A
QKP01 ASSY KEYPAD-MAIN(TK/XSER) GH98-12399A
QKP02 ASSY KEYPAD-NAVI(ZK/XEN) GH98-11383A
QLC01 ELA ETC-GTE1360S LCD HOT BAR SVC GH96-03828A
QME01 DOME SHEET-GTE1360S_MAIN GH59-06792A
QME02 DOME SHEET-GTE1360S_SUB GH59-06793A
QMI01 MICROPHONE-ASSY-GTE1360S GH30-00564A
QMO01 MOTOR DC-SGHT539 GH31-00328A
QMP01 ASSY PBA MAIN-GT_E1360M GH92-05572A
QMW02 PMO WINDOW-MAIN(SEA) GH72-51700A
QPC01 ASSY ETC-GT_E1360B SLIDE FPCB GH59-07499A
QSC05 TAPE-LOWER SCREW CAP GH74-43700A
QSH01 ASSY COVER-SHIELD CAN GH98-11385A
QSP01 SPEAKER 3001-002467
QFL00 ASSY HINGE-LOWER GH98-11380A
QFL01 ASSY CASE-SLIDE LOWER GH98-11381A
QHI01 ASSY HINGE-BASE GH98-11382A
QHI02 ASSY HINGE-PUSH ROD GH98-10706A
QRE01 ASSY CASE-REAR GH98-11379A
QIF01 PMO COVER-IF GH72-52313A
5-2. Cellular phone Parts list

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6. Main Electrical Parts List
6-1
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Design LOC SEC Code Description
R105,R134,R222,R332 0202-001602 PB-SHORT-1005
R333,R417 0202-001602 PB-SHORT-1005
D200,D201 0401-001110 DIODE-SWITCHING
ZD200,ZD300 0403-001547 DIODE-ZENER
ZD301,ZD400 0406-001223 DIODE-TVS
D302,D303 0406-001286 DIODE-TVS
D304,D305 0406-001288 DIODE-TVS
LED300,LED301,LED302 0601-002591 LED
LED303 0601-002591 LED
TR400 1003-001440 IC
U305 1009-001037 IC
UME300 1108-000220 MEMORY
PAM100 1201-002731 IC
U201 1203-005498 IC
U306 1203-005512 IC
U100 1204-002979 IC
UCP200 1205-003662 IC
TH200 1404-001221 THERMISTOR
VR300,VR301,VR400 1405-001082 VARISTOR
C137,C341,VR100 1405-001167 VARISTOR
R111 2007-000138 R-CHIP
R303 2007-000139 R-CHIP
R103 2007-000140 R-CHIP
R301,R311,R329,R330 2007-000141 R-CHIP
R215,R216 2007-000143 R-CHIP
R124,R125,R221,R321 2007-000148 R-CHIP
R106,R209 2007-000162 R-CHIP
R207,R309,R310,R312 2007-000172 R-CHIP
R313,R314,R315 2007-000172 R-CHIP
R306,R322 2007-000173 R-CHIP
R108 2007-001288 R-CHIP
R206 2007-001301 R-CHIP
R109,R110 2007-001313 R-CHIP
R414 2007-001333 R-CHIP
R400 2007-003025 R-CHIP
R203 2007-007698 R-CHIP

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Main Electrical Parts List
6-2
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Design LOC SEC Code Description
R210 2007-008500 R-CHIP
C336,C337 2203-000330 C-CERAMIC,CHIP
C327,C330,C332 2203-000386 C-CERAMIC,CHIP
C117,C338,C339,C340 2203-000425 C-CERAMIC,CHIP
C103,C203,C229 2203-000438 C-CERAMIC,CHIP
C215,C231,C307,C308 2203-000585 C-CERAMIC,CHIP
C309 2203-000585 C-CERAMIC,CHIP
C303,C305,C306 2203-000679 C-CERAMIC,CHIP
C111,C130,C131,C226 2203-000812 C-CERAMIC,CHIP
C400,C401,C404,C405 2203-000812 C-CERAMIC,CHIP
C406,C407,C408,C410 2203-000812 C-CERAMIC,CHIP
C411,C412,C414,C415 2203-000812 C-CERAMIC,CHIP
C416,C419,C420,C421 2203-000812 C-CERAMIC,CHIP
C422,C423,C424,C425 2203-000812 C-CERAMIC,CHIP
C426 2203-000812 C-CERAMIC,CHIP
C100,C300 2203-000995 C-CERAMIC,CHIP
C319,C320,C321,C322 2203-001153 C-CERAMIC,CHIP
C112,C113,C115,C116 2203-001385 C-CERAMIC,CHIP
C101,C102 2203-001432 C-CERAMIC,CHIP
C217 2203-002443 C-CERAMIC,CHIP
C202,C205,C213,C219 2203-002709 C-CERAMIC,CHIP
C228,C230,C314,C315 2203-002709 C-CERAMIC,CHIP
C326,C329,C333 2203-003054 C-CERAMIC,CHIP
C114 2203-005057 C-CERAMIC,CHIP
C107 2203-005344 C-CERAMIC,CHIP
C134 2203-005382 C-CERAMIC,CHIP
C302,C304,C328,C331 2203-005482 C-CERAMIC,CHIP
C109,C310,C403,C418 2203-006048 C-CERAMIC,CHIP
C427 2203-006048 C-CERAMIC,CHIP
C206,C221 2203-006137 C-CERAMIC,CHIP
C200,C214 2203-006208 C-CERAMIC,CHIP
C222,C313 2203-006348 C-CERAMIC,CHIP
C207,C209,C210,C211 2203-006399 C-CERAMIC,CHIP
C212,C317 2203-006399 C-CERAMIC,CHIP
C220,C316,C417 2203-006562 C-CERAMIC,CHIP
C110,C323 2203-006681 C-CERAMIC,CHIP
C201,C216 2203-006824 C-CERAMIC,CHIP

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Main Electrical Parts List
6-3
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Design LOC SEC Code Description
C204,C227 2404-001381 C-TA,CHIP
TA100 2404-001415 C-TA,CHIP
TA300 2404-001465 C-TA,CHIP
L107 2703-001178 INDUCTOR-SMD
L315,L316,L317,L318 2703-001723 INDUCTOR-SMD
L319 2703-001723 INDUCTOR-SMD
L300 2703-001851 INDUCTOR-SMD
L105 2703-002170 INDUCTOR-SMD;
L202 2703-002176 INDUCTOR-SMD
L400,L401 2703-002201 INDUCTOR-SMD
L104 2703-002203 INDUCTOR-SMD
L103 2703-002204 INDUCTOR-SMD
L310,L311,L313 2703-002313 INDUCTOR-SMD
L309,L312 2703-002365 INDUCTOR-SMD
L201 2703-003297 INDUCTOR-SMD
OSC200 2801-003856 CRYSTAL
OSC201 2801-004769 CRYSTAL
F100 2904-001792 FILTER-SAW
L200 3301-001158 CORE-FERRITE BEAD
L314 3301-001342 CORE-FERRITE BEAD
L402 3301-001534 CORE-FERRITE BEAD
L203,L301,L302,L303 3301-001756 CORE-FERRITE BEAD
L304,L305,L306 3301-001756 CORE-FERRITE BEAD
L307,L308 3301-001812 CORE-FERRITE BEAD
L102 3301-001912 CORE-FERRITE BEAD
RFS100 3705-001503 CONNECTOR-COAXIAL
SIM400 3709-001447 CONNECTOR-CARD EDGE
IFC300 3710-002683 CONNECTOR-SOCKET
HDC400 3711-005581 CONNECTOR-HEADER
BTC200 3711-006228 CONNECTOR-HEADER
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's part list.

7.Block Diagrams
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7-1
SLAVEON (mater)
SLAVEON
SLAVEON
MAP
11-43577YKS
XR
RETLIF
8039B
XT MSG
XT SCD
XR MSG
XR SCD
2094XNP
Memory
K5N2866ATB-AT80
128 X 64
F/I
NOC ’
OX zHM62
BS5223XC
OX zHK867.23
641-CM
revieceR MF
8074IS
SPK 13 X 18
DCL
]7:0[ataD
SC_DCL
NEO/NEW_PC
TSR_MEM//SR
MIS
YEK
KLC_MIS/OI_MIS/TSR_MIS/MISV
]2:0[OI_YEK / ]2:0[NI_YEK / ]3:1TUO_YEK
ROTOM
CIM
]42:0[sserdA
]51:0[ataD
SC_1MAR/MOR
NEO/NEW_PC
TSR_MEM
KLC_MS
P_XRSCD
N_XRSCD
P_XRMSGE
N_XRMSGE
L/R_MF TNA_MF
N_RAE
P_RAE
P/N_CIM_RAE
P/N_CIM
P/N_KPS
TUO_MCV

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7-1
SLAVEON (mater)
SLAVEON
SLAVEON
PNX4902
RF /IF
Tranceiver
PMU
IIC
Interface /RTC
Basic Charging
SIM Interface
Charging Controller
MEMORY
Nor/UtRAM
(K5N2866ATB-
AT80)
128/64
MB
LCD
1.77"
CSTN-LCD
Battery
800mA
KEY PAD
AUDIO MIC
---------------
Ear MIC
SPK&EARSPK

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8. PCB Diagrams
8-1
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8-1. Main Top
□

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PCB Diagrams
8-2
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8-2. Main Bottom