Samsung SGH-X670 User manual

GSM TELEPHONE
SGH-X670
GSM TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting
8. Exploded and assembling View

Samsung Electronics Co.,Ltd. April. 2006
Printed in Korea.
Code No.: GH68-09954A
BASIC.
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ

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1. Specification
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1-1
PCS1900
1850~1910
1930~1990
512~810
80MHz
270.833kbps
3.692us
576.9us
4.615ms
0.3GMSK
30dBm~0dBm
0pcl ~ 15pcl
-100dBm
8
-
GSM900
Phase 1
EGSM 900
Phase 2
DCS1800
Phase 1
Freq. Band[MHz]
Uplink/Downlink
890~915
935~960
880~915
925~960
1710~1785
1805~1880
ARFCN range 1~124 0~124 &
975~1023 512~885
Tx/Rx spacing 45MHz 45MHz 95MHz
Mod. Bit rate
/BitPeriod
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot Period
/ Frame Period
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~ 15pcl
Sensitivity -102dBm -102dBm -100dBm
TDMA Mux 8 8 8
Cell Radius 35Km 35Km 2Km
1-1. GSM General Specification

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Specification
1-2
TX Power
control level
PCS1900
0 30±2 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level
DCS1800
0 30±2 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level
GSM900
5 33±2 dBm
6 31±3 dBm
7 29±3 dBm
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
1-2. GSM TX power class

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Specification
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1-3
TX Power
control level
GSM900
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level
DCS1800
2 26 -4/+3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 12±3 dBm
9 10±3 dBm
10 14±3 dBm
11 12±4 dBm
12 10±4 dBm
13 8±4dBm
14 6±4 dBm
15 4±4 dBm
1-3. GSM EDGE TX power class
TX Power
control level
PCS1900
2 26 -4/+3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 12±3 dBm
9 10±3 dBm
10 14±3 dBm
11 12±4 dBm
12 10±4 dBm
13 8±4dBm
14 6±4 dBm
15 4±4 dBm

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Specification
1-4

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2. Circuit Description
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2-1
2-1. SGH-X670 RF Circuit Description
2-1-1. RX PART
- ANTENNA SWITCH (F101 Front End Module)
→Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic controlling.
- ANTENNA SWITCH Control Losic (F101) →Truth Table
VC1 VC2 VC3
Tx Mode (GSM900) H L L
Tx Mode (DCS1800/1900) L H L(H)
Rx Mode (GSM900) L L L
Rx Mode (DCS1800) L L L
Rx Mode (PCS1900) L L H
- TRANSCEIVER (U102)
This chip is fully integrated GSM GPRS tri-band transceiver with transmit baluns(balanced-unbalanced matching devices) ,
loop filters and most of the passive component in it.
And also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply
regulator. Semi integrated reference oscillator with integrated supply regulator.
RF Receiver front-end amplifies the E-GSM900, DCS1800 and PCS1900 aerial signal, convert the chosen channel
down to a low IF of 100kHz.
In IF section, further amplifies the wanted channel output level to the desired value and rejects DC.
-PAM(PAM101)
The module consists of two separated line-ups, one for low band(LB 850/900) and one for high band(HB,1800/1900) with
input and output matching and internal power detection function and power control loop in GSM mode.
in GSM mode, the internal power control circuit ensures a stable power output, set by the level of VDAC stabilsed to
compensate variations of supply voltage, input power and temperature, with a control range fully compaliant with ETSI
tome mask and power spectrum requirements
in EDGE mode the output power is controlled by the input power. The VREF signal is used to control the efficiency by
controlling the quiescent current of the final RF-statges of both line-ups.
2-1-2. TX PART
The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band
power up mixer. Gain is controlled by 6 dB via 3-wire serial bus programing. The fully integrated VCO and power
mixer achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification.
Output matching/balun components drive a standard 50 ohms single ended load.

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Circuit Description
2-2
2-2. Baseband Circuit description of SGH-X670
2-2-1. PCF50603 (U400)
- Power Management
Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,
while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions,
such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system
complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor
full control of the PCF50603 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a
fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
- Backlight Brightness Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) and FET to
modulate the intensity of a series of LEDs or to control a DC/DC converter that drives LCD backlight.
This phone (SGH-X670) use PWM control to contrast the backlight brightness.
- Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator
provides an accurate low clock frequency for the PCF50603 and other circuitry.
2-2-2. LCD Connector
LCD is consisted of main LCD(color 65K UFB LCD) and sub LCD(color 65K UFB LCD)
Chip select signals in the U305, LCD_MAIN_CS, LCD_SUB_CS can enable LCD. DIM-EN signal enables white LED of
main LCD. These signal is from U200.
16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. Data and commands use "RS" signal. If this signal
is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output
state to LCD, is required. But this system is not necessary this signal. So "L_WR" signal is used to write data or
commands to LCD. Power signals for LCD are "VDD_IO_HIGH".
2-2-3. BLUE TOOTH
This system uses Blue Tooth module, UGNZ6XG23A, ALPS. This has signals, "BT_INT"(Interrupt signal), "RXD2"(input
data) and "TXD2"(output data), PCM control signal(DCL[PCMCLK], DO[PCM_IN], DU[PCM_OUT], FSC[PCM_SYNC])
These signals are connected to PCF5213EL1EL1.

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Circuit Description
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2-3
2-2-4. Key
This is consisted of key interface pins KEY_ROW(0:4) and KEY_COL(0:4) in PCF5213EL1. These signals compose the
matrix. Result of matrix informs the key status to key interface in the PCF5213EL1. Power on/off key is seperated from
the matrix. So power on/off signal is connected with PCF50603 to enable PCF50603. Key LED is consisted of 12 LEDs.
key LED use the 3.3V LDO(U700) for a supply voltage. KEY_LED_ON signal enables eight white LED.
"FLIP" informs the status of slide (up or down) to the PCF5213EL1. This uses the hall effect IC, EM-1681-FT(U503).
A magnet under LCD enables EM-1681-FT.
2-2-5. EMI ESD Filter
This system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.
2-2-6. IF connetor(IFC500)
It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,
AUX_ON, EXT1, EXT2 and GND. They connected to power supply IC, microprocessor and signal processor IC.
2-2-7. Battery Charge Management
A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.
If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.
When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.
2-2-8. Audio
HFR_P and HFR_N from PCF5213EL1 are connected to the main speaker via analog switches. MIC_P and MIC_N
are connected to the main MIC as well. EAR1 is the source of External Speaker. YMU762 is a synthesizer LSI for
mobile phones. This LSI has a built-in speaker amplifier for outputting sounds that are used by mobile phones in addition
to game sounds and ringing melodies that are replayed by a synthesizer.
The synthesizer section adopts “stereophonic hybrid synthesizer system”that are given advantages of both FM
synthesizers and Wave Table synthesizers to allow simultaneous generation of up to 32 FM voices and 32 Wave
Table voices. It provides simultaneous generation of up to 40 tones by stereophonic hybrid synthesizer.
YMU762 has built a speaker amplifier of which maximum out is 580 mW at SPVDD=3.6V in this device.
There is Stereophonic analog output for Headphone.
2-2-9. Memory(UME303)
This system uses Samsung's memory, KAP17VG00M. The KAP17VG00M is a Multi Chip Package Memory which
combines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and 256Mbit NAND Flash and
128Mbit Synchronous Burst UtRAM.
It has 16 bit data line, HD[1~16] which is connected to PCF5213EL1 and MV3017SAQ, also has 24 bit address lines,
HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM.
In the Writing process, WEn is fallen to low and it enables writing process to operate. During reading process,
OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose
different memories.

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Circuit Description
2-4
2-2-10. PCF5213EL1(UCP200)
The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn
DSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits,
32k*16 XYRAM and 63k*16 XYROM in the DSP.
The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,
tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, a
memory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(Advanced
High-performance Bus) bus interface with a write buffer.
HD(0:15), data lines and HA(0:23), address lines are connected to KAP17SG00A (memory), MV3018B (image dsp)
and YMU762 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap
loader in the ARM core.
HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU762 to communicate.
MV3018B(Camera DSP Chip) controls the communication between ARM core and DSP core.
OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.
It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM
and DSP core.
ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.
2-2-11. TOH2600DGI4KRA (26MHz)(TCX101)
This system uses the 26MHz VCTCXO; TOH2600DGI4KRA. AFC control signal form PCF5213EL1 controls
frequency from 26MHz x-tal. It generates the clock frequency. This clock is connected to PCF5213EL1, YMU762 and
UAA3587C2.
2-2-12. Camera DSP(MV3017SAQ)(U305)
MV3018SAQ provides rich video functions up to 30-frame display with minimized tasks in the handset main processor
as well as hardware based real-time JPEG compression and decompression. MV3018SAQ directly transmits and
previews the RGB data to the LCD graphic memory by processing the sensor output data according to the
handset's command. It can save the raw RGB data up to VGA resoultion into its image buffer and allows the
host processor to download with scalable sized compressed data.
It utilizes 16 bit data bus for communication with the main processor, including bus interface types.
2-2-13. FM Radio (TEA5761UK)(U603)
The TEA5761 is a single chip electronically tuned FM stereo radio for low voltage application with fully integrated IF
selectivity and demodulation.
TEA5761UK provide FM mixer for conversion of the US/Europe (87.5 MHz to 108 MHz) and Japanese FM band (76
MHz to 90 MHz) to IF.Preset tuning to receive Japanese TV audio up to 108 MHz, raster 100 kHz. and is connected to
PCF5213EL1 of I2C.

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3-1
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3. Exploded View and Parts List
3-1. Exploded View
QWD02
QFU01
QLC01
QCA01
QMO01
QSP01
QAN05
QFL01
QSC01
QCR04
QMW02
QFR01
QMI03
QKP01
QME01
QCA02
QMI01
QRE01
QIF01
QCR06
QBA01
QAN02
QRF01
QCK01
QRF03
QVO01
QVK01
QMP01
QCR05

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Exploded view and Part List
3-2
This Document can not be used without Samsung's authorization
3-2. Parts List
Location NO. SEC CODE Description
QSP01 SPEAKER 3001-001912
QCR06 SCREW-MACHINE 6001-001155
QCR05 SCREW-MACHINE 6001-001478
QCR04 SCREW-MACHINE 6001-001479
QMI01 MICROPHONE-ASSY-SGHX670 GH30-00248A
QMO01 MOTOR DC-SGHX670 GH31-00154E
QAN02 INTENNA-SGHX670 GH42-00753A
QBA01 BATTERY-800MAH,SIL,ENG,M GH43-02348A
QME01 UNIT-METAL DOME GH59-02873A
QVK01 UNIT-VOLUME KEY GH59-02874A
QCA02 UNIT-CAMERA KEY GH59-02875A
QCA01 UNIT-CAMERA GH59-02876A
QRF03 PMO-COVER EAR GH72-27157A
QIF01 PMO-COVER IF GH72-27165A
QWD02 PCT-WINDOW SUB GH72-27169A
QMW02 PCT-WINDOW MAIN GH72-27171A
QRF01 MPR-SHEET RF GH74-21697A
QAN05 MEC-INTENNA CONTACT GH75-08168A
QFU01 MEC-CASE UPPER FOLDER GH75-08684A
QFL01 MEC-CASE LOWER FOLDER GH75-08685A
QRE01 MEC-CASE REAR GH75-08687A
QKP01 MEC-KEYPAD(XEF/SIL) GH75-09270A
QSC01 MEC-SCREW CAP GH75-09586A
QMP01 PBA MAIN-SGHX670 GH92-02512A
QLC01 MEA-LCD MODULE KIT(X670) GH97-05644A
QFR01 MEC-CASE FRONT GH75-08686A
QCK01 PMO-CAMERA KEY GH72-27155A
QMI03 RMO-MIC HOLDER GH73-06436A
QVO01 PMO-VOLUME KEY GH72-27156A

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Exploded view and Part List
3-3
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SEC CODE Description
BAG PE 6902-000634
ADAPTOR-TAD GH44-00482A
UNIT-EARPHONE(SIL) GH59-02472B
SPRING ETC-BATT LOCKER GH61-00120A
LABEL(P)-IMEI GH68-01335D
LABEL(P)-WATER SOAK GH68-02026A
LABEL(R)-MAIN(EU) GH68-09241A
MANUAL USERS-EU ITALIAN GH68-09437A
CUSHION-CASE(1~2) GH69-03629A
BOX(P)-SGHX670(EU) GH69-03630A
MPR-BOHO VINYL LCD CONN GH74-15350A
MPR-SHEET FILTER LCD FPCB GH74-21694A
MPR-VINYL BOHO UPPER GH74-21700A
MPR-VINYL BOHO MAIN LCD GH74-21701A
MPR-VINYL BOHO LOWER GH74-21702A
MPR-CUSHION LCD GH74-22342A
MPR-TAPE FOAM CAMERA GH74-22344A
MPR-TAPE INSULATION CAM CONN GH74-22611A
MPR-GASKET UPPER GH74-22612A
MPR-TAPE CONDUCTION DOME SHEET GH74-22613A
MPR-TAPE INSULATION HALL IC GH74-22614A
MPR-TAPE INSULATION J TAG GH74-22615A
MPR-VINYL BOHO SUB GH74-22719A
MEC-HANGER GH75-03673B

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Exploded view and Part List
3-4
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3-3. Test Jig (GH80-03306A)
3-3-2. RF Test Cable
(GH39-00283A)
3-3-3. Test Cable
(GH39-00337A)
3-3-5. Power Supply Cable 3-3-6. DATA CABLE
(GH39-00331A]
3-3-7. TA
(GH44-00482A)
3-3-1. USB JIG Cable
3-3-4. Serial Cable
(CSA LL64151-A)

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4. Electrical Parts List
4-1
This Document can not be used without Samsung's authorization
Ddsign LOC Discription SEC Code STATUS
ANT100 NPR-ANTENNA CONTACT GH71-05666A SNA
ANT101 NPR-ANTENNA CONTACT GH71-05666A SNA
ANT300 ANTENNA-CHIP 4202-001124 SA
BAT400 BATTERY-LI(2ND) 4302-001130 SA
BTC500 HEADER-BATTERY 3711-005897 SA
C101 C-CER,CHIP 2203-000278 SA
C105 C-CER,CHIP 2203-000278 SA
C106 C-CER,CHIP 2203-000812 SA
C109 C-CER,CHIP 2203-000278 SA
C112 C-CER,CHIP 2203-000812 SA
C113 C-CER,CHIP 2203-000233 SA
C114 C-CER,CHIP 2203-000233 SA
C115 C-CER,CHIP 2203-000812 SA
C116 C-CER,CHIP 2203-000233 SA
C117 C-CER,CHIP 2203-000812 SA
C118 C-CER,CHIP 2203-000233 SA
C119 C-CER,CHIP 2203-000812 SA
C123 C-CER,CHIP 2203-000278 SA
C124 C-CER,CHIP 2203-005281 SA
C125 C-CER,CHIP 2203-005281 SA
C126 C-CER,CHIP 2203-000233 SA
C130 C-CER,CHIP 2203-000854 SA
C131 C-CER,CHIP 2203-000854 SA
C132 C-CER,CHIP 2203-000254 SA
C134 C-CER,CHIP 2203-005444 SA
C136 C-CER,CHIP 2203-000530 SA
C137 C-CER,CHIP 2203-000233 SA
C142 C-CER,CHIP 2203-000278 SA
C143 C-CER,CHIP 2203-000278 SA
C144 C-CER,CHIP 2203-000812 SA
C200 C-CER,CHIP 2203-006562 SA
C201 C-CER,CHIP 2203-005482 SA
C202 C-CER,CHIP 2203-000254 SA
C203 C-CER,CHIP 2203-005482 SA
C204 C-CER,CHIP 2203-005482 SA
C205 C-CER,CHIP 2203-000812 SA
C206 C-CER,CHIP 2203-005482 SA
C207 C-CER,CHIP 2203-005482 SA
C208 C-CER,CHIP 2203-005482 SA
C209 C-CER,CHIP 2203-005482 SA
C210 C-CER,CHIP 2203-005482 SA
C211 C-CER,CHIP 2203-005482 SA
C212 C-CER,CHIP 2203-005482 SA
C213 C-CER,CHIP 2203-000812 SA
C214 C-CER,CHIP 2203-005482 SA
C217 C-CER,CHIP 2203-005482 SA
C222 C-CER,CHIP 2203-006260 SA
C223 C-CER,CHIP 2203-006260 SA
C300 C-CER,CHIP 2203-000679 SA
C301 C-CER,CHIP 2203-005482 SA
C302 C-CER,CHIP 2203-005482 SA
C303 C-CER,CHIP 2203-000438 SA
C304 C-CER,CHIP 2203-006348 SA
C305 C-CER,CHIP 2203-005482 SA
C306 C-CER,CHIP 2203-000438 SA
C307 C-CER,CHIP 2203-005993 SNA
C308 C-CER,CHIP 2203-005482 SA

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Electrical Parts List
4-2
This Document can not be used without Samsung's authorization
Ddsign LOC Discription SEC Code STATUS
C309 C-CER,CHIP 2203-005482 SA
C310 C-CER,CHIP 2203-005482 SA
C311 C-CER,CHIP 2203-006048 SA
C312 C-CER,CHIP 2203-000233 SA
C313 C-CER,CHIP 2203-000679 SA
C314 C-CER,CHIP 2203-005482 SA
C315 C-CER,CHIP 2203-005482 SA
C317 C-CER,CHIP 2203-006562 SA
C319 C-CER,CHIP 2203-005482 SA
C320 C-CER,CHIP 2203-006562 SA
C321 C-CER,CHIP 2203-006562 SA
C322 C-CER,CHIP 2203-005482 SA
C323 C-CER,CHIP 2203-005482 SA
C401 C-CER,CHIP 2203-006208 SA
C402 C-CER,CHIP 2203-006562 SA
C403 C-CER,CHIP 2203-006562 SA
C404 C-CER,CHIP 2203-006324 SA
C405 C-CER,CHIP 2203-000627 SNA
C406 C-CER,CHIP 2203-005482 SA
C407 C-CER,CHIP 2203-000627 SNA
C408 C-CER,CHIP 2203-006257 SA
C409 C-CER,CHIP 2203-000233 SA
C410 C-TA,CHIP 2404-001381 SA
C411 C-CER,CHIP 2203-000812 SA
C412 C-CER,CHIP 2203-006208 SA
C413 C-CER,CHIP 2203-006562 SA
C414 C-CER,CHIP 2203-006208 SA
C415 C-CER,CHIP 2203-006257 SA
C416 C-CER,CHIP 2203-006257 SA
C418 C-CER,CHIP 2203-006825 SA
C419 C-CER,CHIP 2203-005482 SA
C421 C-CER,CHIP 2203-001153 SA
C422 C-CER,CHIP 2203-006208 SA
C423 C-CER,CHIP 2203-006208 SA
C424 C-CER,CHIP 2203-006257 SA
C425 C-CER,CHIP 2203-006257 SA
C500 C-CER,CHIP 2203-002443 SA
C501 C-CER,CHIP 2203-006562 SA
C502 C-CER,CHIP 2203-005482 SA
C503 C-CER,CHIP 2203-005482 SA
C504 C-TA,CHIP 2404-001381 SA
C505 C-CER,CHIP 2203-005482 SA
C506 C-CER,CHIP 2203-006562 SA
C507 C-CER,CHIP 2203-000812 SA
C600 C-TA,CHIP 2404-001402 SA
C601 C-CER,CHIP 2203-000278 SA
C603 C-CER,CHIP 2203-005482 SA
C604 C-CER,CHIP 2203-001383 SA
C605 C-CER,CHIP 2203-005393 SA
C606 C-CER,CHIP 2203-005482 SA
C607 C-CER,CHIP 2203-000278 SA
C612 C-CER,CHIP 2203-005393 SA
C615 C-CER,CHIP 2203-000386 SA
C616 C-CER,CHIP 2203-005344 SA
C617 C-CER,CHIP 2203-000386 SA
C618 C-CER,CHIP 2203-006047 SA
C619 C-CER,CHIP 2203-000254 SA

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Ddsign LOC Discription SEC Code STATUS
C620 C-CER,CHIP 2203-000233 SA
C621 C-CER,CHIP 2203-006047 SA
C622 C-CER,CHIP 2203-006047 SA
C623 C-CER,CHIP 2203-000995 SA
C624 C-CER,CHIP 2203-000679 SA
C625 C-CER,CHIP 2203-006562 SA
C626 C-CER,CHIP 2203-005482 SA
C627 C-CER,CHIP 2203-006047 SA
C628 C-CER,CHIP 2203-006257 SA
C700 C-CER,CHIP 2203-006562 SA
C701 C-CER,CHIP 2203-006562 SA
C702 C-CER,CHIP 2203-006626 SA
C703 C-CER,CHIP 2203-005482 SA
C704 C-CER,CHIP 2203-005482 SA
C705 C-CER,CHIP 2203-000812 SA
C706 C-CER,CHIP 2203-000812 SA
C707 C-CER,CHIP 2203-001259 SA
C710 C-CER,CHIP 2203-005683 SA
C711 C-CER,CHIP 2203-005683 SA
C712 C-CER,CHIP 2203-005683 SA
C713 C-CER,CHIP 2203-005683 SA
C714 C-CER,CHIP 2203-005683 SA
C715 C-CER,CHIP 2203-005683 SA
C716 C-CER,CHIP 2203-005683 SA
C717 C-CER,CHIP 2203-005683 SA
C718 C-CER,CHIP 2203-005683 SA
C719 C-CER,CHIP 2203-005683 SA
C720 C-CER,CHIP 2203-005683 SA
C721 C-CER,CHIP 2203-005683 SA
C722 C-CER,CHIP 2203-005683 SA
C723 C-CER,CHIP 2203-005683 SA
D100 DIODE-TVS 0406-001231 SA
D600 DIODE-TVS 0406-001231 SA
D601 DIODE-TVS 0406-001231 SA
D602 DIODE-TVS 0406-001231 SA
D603 DIODE-TVS 0406-001231 SA
D700 DIODE-TVS 0406-001231 SA
D701 DIODE-TVS 0406-001231 SA
D702 DIODE-TVS 0406-001231 SA
D703 DIODE-TVS 0406-001231 SA
D704 DIODE-TVS 0406-001231 SA
D705 DIODE-TVS 0406-001231 SA
D706 DIODE-TVS 0406-001235 SA
D707 DIODE-TVS 0406-001235 SA
D708 DIODE-TVS 0406-001231 SA
D709 DIODE-TVS 0406-001231 SA
D710 DIODE-TVS 0406-001231 SA
D711 DIODE-TVS 0406-001235 SA
D712 DIODE-TVS 0406-001235 SA
D713 DIODE-TVS 0406-001231 SA
D714 DIODE-TVS 0406-001231 SA
D715 DIODE-TVS 0406-001231 SA
EAR600 JACK-PHONE [phone] SA
F101 DUPLEXER-ASM 2911-000018 SA
F102 FILTER-EMI SMD 2901-001254 SA
F103 FILTER-SAW 2904-001553 SA
F700 FILTER-EMI SMD 2901-001286 SA

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This Document can not be used without Samsung's authorization
Ddsign LOC Discription SEC Code STATUS
F701 FILTER-EMI SMD 2901-001286 SA
F702 FILTER-EMI SMD 2901-001286 SA
F703 FILTER-EMI SMD 2901-001286 SA
F704 FILTER-EMI SMD 2901-001286 SA
HDC700 HEADER-BOARD TO BOARD 3711-005918 SA
IFC500 CONNECTOR-INTERFACE 3710-001994 SA
L101 R-CHIP 2007-000171 SA
L102 INDUCTOR-SMD 2703-001747 SA
L104 R-CHIP 2007-000171 SA
L106 INDUCTOR-SMD 2703-002314 SA
L108 INDUCTOR-SMD 2703-002313 SA
L110 INDUCTOR-SMD 2703-002485 SA
L111 INDUCTOR-SMD 2703-001752 SA
L112 INDUCTOR-SMD 2703-002267 SA
L114 BEAD-SMD 3301-001729 SA
L115 INDUCTOR-SMD 2703-002268 SA
L116 INDUCTOR-SMD 2703-002199 SA
L117 INDUCTOR-SMD 2703-002268 SA
L200 BEAD-SMD 3301-001789 SA
L300 INDUCTOR-SMD 2703-001752 SA
L400 BEAD-SMD 3301-001120 SA
L401 INDUCTOR-SMD 2703-002840 SA
L500 BEAD-SMD 3301-001534 SA
L600 BEAD-SMD 3301-001438 SA
L601 BEAD-SMD 3301-001438 SA
L603 INDUCTOR-SMD 2703-001231 SA
L604 INDUCTOR-SMD 2703-001673 SA
L605 INDUCTOR-SMD 2703-002206 SA
L606 BEAD-SMD 3301-001756 SA
L607 BEAD-SMD 3301-001756 SA
L608 BEAD-SMD 3301-001756 SA
LED700 LED 0601-002055 SA
LED701 LED 0601-002055 SA
LED702 LED 0601-002055 SA
LED703 LED 0601-002055 SA
LED704 LED 0601-002055 SA
LED705 LED 0601-002055 SA
LED706 LED 0601-002055 SA
LED707 LED 0601-002055 SA
LED708 LED 0601-002055 SA
LED709 LED 0601-002055 SA
LED710 LED 0601-002055 SA
LED711 LED 0601-002055 SA
OSC400 CRYSTAL-SMD 2801-004373 SA
PAM101 IC-POWER AMP 1201-002280 SA
Q300 FET-SILICON 0505-001923 SA
Q500 TR-DIGITAL 0504-001151 SA
R107 R-CHIP 2007-000148 SA
R108 R-CHIP 2007-000172 SA
R109 R-CHIP 2007-000566 SA
R110 R-CHIP 2007-003001 SA
R111 R-CHIP 2007-000566 SA
R113 R-CHIP 2007-000932 SA
R114 R-CHIP 2007-000932 SA
R115 R-CHIP 2007-000171 SA
R116 R-CHIP 2007-000140 SA
R117 R-CHIP 2007-001288 SA

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Ddsign LOC Discription SEC Code STATUS
R118 R-CHIP 2007-001313 SA
R119 R-CHIP 2007-001313 SA
R120 R-CHIP 2007-000171 SA
R121 R-CHIP 2007-000171 SA
R122 R-CHIP 2007-000171 SA
R123 R-CHIP 2007-000171 SA
R124 R-CHIP 2007-000171 SA
R125 R-CHIP 2007-000171 SA
R200 R-CHIP 2007-000171 SA
R201 R-CHIP 2007-000148 SA
R203 R-CHIP 2007-000162 SA
R204 R-CHIP 2007-000171 SA
R205 R-CHIP 2007-000171 SA
R207 R-CHIP 2007-000171 SA
R208 R-CHIP 2007-000171 SA
R214 R-CHIP 2007-007137 SA
R215 R-CHIP 2007-007137 SA
R217 R-NET 2011-001394 SA
R218 R-CHIP 2007-000143 SA
R220 R-CHIP 2007-000171 SA
R300 R-CHIP 2007-001325 SA
R301 R-CHIP 2007-000162 SA
R302 R-CHIP 2007-000171 SA
R303 R-CHIP 2007-000155 SA
R304 R-CHIP 2007-000171 SA
R305 R-CHIP 2007-000137 SA
R306 R-CHIP 2007-001329 SA
R307 R-CHIP 2007-000162 SA
R308 R-CHIP 2007-000148 SA
R309 R-CHIP 2007-000162 SA
R310 R-CHIP 2007-000171 SA
R311 R-CHIP 2007-000141 SA
R312 R-CHIP 2007-000141 SA
R313 R-CHIP 2007-007014 SA
R314 R-CHIP 2007-001303 SA
R315 R-CHIP 2007-007014 SA
R316 R-CHIP 2007-000171 SA
R319 R-CHIP 2007-000171 SA
R320 R-CHIP 2007-000171 SA
R321 R-CHIP 2007-000171 SA
R401 R-CHIP 2007-000148 SA
R402 R-CHIP 2007-007100 SA
R403 R-CHIP 2007-000162 SA
R404 R-CHIP 2007-000171 SA
R405 R-CHIP 2007-000162 SA
R406 R-CHIP 2007-002796 SA
R500 R-CHIP 2007-000162 SA
R501 R-CHIP 2007-000758 SA
R502 R-CHIP 2007-000758 SA
R503 R-CHIP 2007-000162 SA
R504 R-CHIP 2007-000148 SA
R505 R-CHIP 2007-007334 SA
R506 R-CHIP 2007-000152 SA
R508 R-CHIP 2007-000170 SA
R509 R-CHIP 2007-000170 SA
R510 R-CHIP 2007-007573 SA
R511 R-CHIP 2007-000137 SA

SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
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This Document can not be used without Samsung's authorization
Ddsign LOC Discription SEC Code STATUS
R512 R-CHIP 2007-007334 SA
R513 R-CHIP 2007-000162 SA
R514 R-CHIP 2007-008275 SA
R515 R-CHIP 2007-007489 SA
R516 R-CHIP 2007-000172 SA
R517 R-CHIP 2007-000172 SA
R601 R-CHIP 2007-000242 SA
R602 R-CHIP 2007-000148 SA
R603 R-CHIP 2007-000242 SA
R604 R-CHIP 2007-002796 SA
R605 R-CHIP 2007-000831 SA
R606 R-CHIP 2007-000162 SA
R607 R-CHIP 2007-000171 SA
R608 R-CHIP 2007-000171 SA
R611 R-CHIP 2007-000162 SA
R612 R-CHIP 2007-001339 SA
R616 R-CHIP 2007-000138 SA
R617 R-CHIP 2007-000775 SA
R618 R-CHIP 2007-001325 SA
R619 R-CHIP 2007-000171 SA
R621 R-CHIP 2007-000162 SA
R624 R-CHIP 2007-000171 SA
R625 R-CHIP 2007-000140 SA
R700 R-CHIP 2007-007009 SA
R701 R-CHIP 2007-007009 SA
R702 R-CHIP 2007-007009 SA
R703 R-CHIP 2007-007009 SA
R704 R-CHIP 2007-007009 SA
R705 R-CHIP 2007-007009 SA
R706 R-CHIP 2007-007009 SA
R707 R-CHIP 2007-007009 SA
R708 R-CHIP 2007-007009 SA
R709 R-CHIP 2007-007009 SA
R710 R-CHIP 2007-007009 SA
R711 R-CHIP 2007-007009 SA
R713 R-CHIP 2007-000171 SA
R715 R-CHIP 2007-000170 SA
R716 R-CHIP 2007-000138 SA
R717 R-CHIP 2007-000138 SA
R718 R-CHIP 2007-000138 SA
R719 R-CHIP 2007-000138 SA
R720 R-CHIP 2007-000138 SA
RFS101 CONNECTOR-COAXIAL 3705-001358 SA
SIM400 CONNECTOR-CARD EDGE 3709-001229 SA
TA101 C-TA,CHIP 2404-001411 SA
TCX101 OSCILLATOR-VCTCXO 2809-001281 SA
U102 IC-TRANSCEIVER 1205-002817 SA
U300 IC-MELODY 1204-002161 SA
U301 BLUETOOTH MODULE 4709-001422 SA
U302 IC-CMOS LOGIC 0801-003025 SA
U304 IC-CMOS LOGIC 0801-003025 SA
U305 IC ASIC-SGHX670 GH13-00036A SA
U400 IC-POWER SUPERVISOR 1203-003882 SA
U401 IC-POSI.FIXED REG. 1203-003531 SA
U402 IC-DC/DC CONVERTER 1203-003974 SA
U500 DIODE-TVS 0406-001188 SA
U501 FILTER-EMI SMD 2901-001315 SA