Samsung GT-M3310 User manual

GSM TELEPHONE
GT-M3310
GSM TELEPHONE CONTENTS
1. Safety Precautions
2. Specification
3. Product Function
4. Array course control
5. Exploded View and Parts List
6. Main Electrical Parts List
7. Block Diagrams
8. PCB Diagrams
9. Flow Chart of Troubleshooting
10. Reference data
11. Disassembly and Assembly
instructions

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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

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2. Specification
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2-1
2-1. General CH and Freq. Table
GSM 850 EGSM 900 DCS1800 PCS1900
Freq.
Band[MHz]
Uplink/Downlink
824~849
869~894
880~915
925~960
1710~1785
1805~1880
1850~1910
1930~1990
ARFCN range 128~251 0~124 &
975~1023 512~885 512~810
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot
Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 4
(max +33dBm)
4
(max +33dBm)
1
(max +30dBm)
1
(max +30dBm)
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMA Mux 8 8 8 8
Cell Radius 35Km 35Km 2Km 2Km

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Specification
2-2
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2-2. GSM General Specification
TX Power
control level PCS1900
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level
GSM850
GSM900
533±2
dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3 dBm
18 7±3 dBm
19 5±3 dBm
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm

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3. Product Function
3-1
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Main Function
-EDGE
-3.2Mega Pixel (CMOS) Camera
-GSM 850/900/1800/1900
-Music player
-Bluetooth
-FM Radio
-Motion Control (G-sensor)
-MicroSD Card Support
-Automatic EQ &DNSe 2.0

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4. Array course control
4-1
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4-1. Software Adjustments
Test Jig (GH99-36900A)
RF Test Cable (GH39-00985A) Adapter (GH99-38251A)
Test Cable (GH39-01290A)

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Array course control
4-2
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4-2. Software Downloading
4-2-1. Pre-requisite for Downloading
•Downloader Program(OneNAND Downloader v1.6 For PNX6517(tfs4 v1.6&3disk&CS3).exe)
•GT-M3318C Mobile Phone
•Data Cable
•Binary file, TFS file,CSC file
4-2-2. S/W Downloader Program
■Load the binary download program by executing the
“OneNAND Downloader v1.6 For PNX6517(tfs4 v1.6&3disk&CS3).exe”
1.Select the connected serial port and the rate of speed
2.Select the check box, the mode you want to download.
-if the binary file wanted, check only 'BIN'
-if the tfs file wanted, check only 'TFS'
-if the csc file wanted, check only 'Common CSC ONLY'
-if all the files wanted, check 'BIN+TFS' and 'with common CSC'
3. Select the file(s) what you want to download

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Array course control
4-3
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4/5. Choose the binary/tfs/csc file then click open button.

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Array course control
4-4
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6. After you select the binary/tfs/csc file you want to download, then click 'START' button. Then connect aphone
with test cable. If connection has no problem, the downloader will start pre-downloading.

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Array course control
4-5
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7. Finished the pre-downloading, click 'confirm'(7) button.

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Array course control
4-6
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9. Finally, click 'DOWNLOAD'(8) button. It will start main downloading.
4-3. Memory Full reset
:You should take following procedures in order.
Memory Full reset
- *2767*3855#

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5. Exploded View and Parts List
5-1
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5-1. Cellular phone Exploded View
QFU01
QAR01
QLC01
QPC01
QCR72
QSP01
QCA01
QCR93
QFL01
QKP01
QCR05
QFR01
QMP01
QME01
QMI01
QSH01
QKP02
QME02
QRE01
QBA01
QCR67
QBC00
QVO01
QAN02
QCR05
QRF06
QCK01

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Exploded View and Parts List
5-2
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Design LOC Description SEC CODE
QAR01 MODULE-GT_M3310 RCV+MOT GH59-07944A
QBA01 INNER BATTERY PACK-960MAH,BLK,UNI,MAIN GH43-03216A
QBC00 PMO COVER-BATTERY GH72-55415A
QCA01 ASSY CAMERA-GT_M3310 3M GH96-03955A
QCR05 SCREW-MACHINE 6001-001478
QCR67 SCREW-MACHINE 6001-002083
QCR72 SCREW-MACHINE 6001-002051
QCR93 SCREW-MACHINE 6001-002263
QFL01 ASSY CASE-SLIDE LOWER GH98-14128A
QFU01 ASSY CASE-UPPER GH98-14197A
QKP01 ASSY KEYPAD-MAIN(JR/SER) GH98-14957A
QKP02 ASSY KEYPAD-SUB(JR/XEN) GH98-14131A
QLC01 ASSY LCD-GT_M3310 2.1" TN QVGA GH96-04096A
QME01 DOME SHEET-GT_M3310 GH59-07926A
QME02 DOME SHEET-GT_M3310 SUB GH59-08452A
QMI01 MICROPHONE-ASSY-GT_M3310 GH30-00604A
QMP01 A/S ASSY-GT_M3310 PBA MAIN GH82-04090A
QPC01 ASSY ETC-GT_M3310 SLIDE FPCB GH59-07927A
QSH01 ASSY BRACKET-SHIELD CAN GH98-14132A
QSP01 MODULE-GT_M3310 SPK GH59-08186A
QFR01 ASSY CASE-FRONT GH98-14126A
QVO01 PMO KEY-VOLUME GH72-55426A
QCK01 PMO KEY-CAMERA GH72-55428A
QRF06 PMO COVER-USB GH72-55655A
QRE01 ASSY CASE-REAR GH98-14127A
QCR05 SCREW-MACHINE 6001-001478
QAN02 INTENNA-GT_M3310 GH42-02125A
5-2. Cellular phone Parts list

6. Main Electrical Parts List
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6-1
SEC CODE Design LOC Discription
0403-001547 ZD300 DIODE-ZENER
0406-001288 ZD501,C440,C441 DIODE-TVS
0406-001305 F500 DIODE-TVS
0406-001361 ZD500,ZD600 DIODE-TVS
0505-001325 Q500 FET-SILICON
0601-002268 LED600,LED601 LED
0801-002345 U403 IC
1001-001447 U402 IC
1201-002773 PAM100 IC
1201-002886 U401 IC
1203-005521 U602 IC
1203-005566 PM300 IC
1204-003020 U101 IC
1205-003517 U100 IC
1205-003696 U102 IC
1209-001817 U300 IC
1404-001221 VR500 THERMISTOR
1405-001082 V400,V401,V402,V403 VARISTOR
2007-000137 R409,R411,R412 R-CHIP
2007-000138 R430,R609,R610,R611 R-CHIP
2007-000138 R612,R613 R-CHIP
2007-000140 R204 R-CHIP
2007-000141 R306 R-CHIP
2007-000148 R402,R403,R428,R503 R-CHIP
2007-000149 R433 R-CHIP
2007-000152 R504,R507 R-CHIP
2007-000157 R309,R310,R312,R313 R-CHIP
2007-000157 R316 R-CHIP
2007-000162 R101,R238,R414,R606 R-CHIP
2007-000164 R423 R-CHIP
2007-000168 R400 R-CHIP
2007-000170 R506,R512,R524 R-CHIP
2007-000172 R102 R-CHIP
2007-000173 R614 R-CHIP
2007-001292 R424,R425,R600,R601 R-CHIP
2007-001298 R431,R432 R-CHIP
2007-001319 R213,R214,R215,R216 R-CHIP
2007-001333 R304,R500,R502,R516 R-CHIP
2007-001333 R527,R608 R-CHIP
2007-003015 R100 R-CHIP
2007-007132 R305 R-CHIP
2007-007156 L115 R-CHIP
2007-007309 R221 R-CHIP
2007-007573 R300 R-CHIP

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6-2
Main Electrical Parts List
SEC CODE Design LOC Discription
2007-007589 R501 R-CHIP
2007-008354 R301,R505 R-CHIP
2203-000233 C120,C158,C315,C502 C-CERAMIC,CHIP
2203-000254 C110 C-CERAMIC,CHIP
2203-000278 C415,C416 C-CERAMIC,CHIP
2203-000311 C604,C605,C606,C607 C-CERAMIC,CHIP
2203-000311 C608 C-CERAMIC,CHIP
2203-000330 C157 C-CERAMIC,CHIP
2203-000386 C103,C414,C429 C-CERAMIC,CHIP
2203-000438 C142,C200,C211 C-CERAMIC,CHIP
2203-000627 C143,C317,C321 C-CERAMIC,CHIP
2203-000679 C209,C228,C400,C404 C-CERAMIC,CHIP
2203-000679 C409,C413,C633,C634 C-CERAMIC,CHIP
2203-000812 C109,C436,C501 C-CERAMIC,CHIP
2203-000854 C334,C335,C421,C424 C-CERAMIC,CHIP
2203-000854 C426,C428,C437 C-CERAMIC,CHIP
2203-000870 C111 C-CERAMIC,CHIP
2203-001221 C140 C-CERAMIC,CHIP
2203-001385 C126,C127,C128,C131 C-CERAMIC,CHIP
2203-002668 C105 C-CERAMIC,CHIP
2203-002709 C207,C213,C230 C-CERAMIC,CHIP
2203-005053 C102,C124,C125 C-CERAMIC,CHIP
2203-005054 C139 C-CERAMIC,CHIP
2203-005234 C133,C134 C-CERAMIC,CHIP
2203-005288 C153,L116 C-CERAMIC,CHIP
2203-005446 C121,C122 C-CERAMIC,CHIP
2203-005450 C218 C-CERAMIC,CHIP
2203-005481 C438,C439 C-CERAMIC,CHIP
2203-005482 C216,C325,C425,C427 C-CERAMIC,CHIP
2203-006048 C161,C162,C202,C208 C-CERAMIC,CHIP
2203-006048 C210,C212,C214,C215 C-CERAMIC,CHIP
2203-006048 C217,C220,C221,C432 C-CERAMIC,CHIP
2203-006048 C433,C434,C435,C450 C-CERAMIC,CHIP
2203-006048 C506,C602,C603 C-CERAMIC,CHIP
2203-006090 C327,C332 C-CERAMIC,CHIP
2203-006137 C108,C137,C407,C408 C-CERAMIC,CHIP
2203-006208 C304 C-CERAMIC,CHIP
2203-006257 C145,C147,C159,C160 C-CERAMIC,CHIP
2203-006257 C303,C310,C311,C316 C-CERAMIC,CHIP
2203-006257 C324 C-CERAMIC,CHIP
2203-006260 C231,C301 C-CERAMIC,CHIP
2203-006324 C203,C204 C-CERAMIC,CHIP
2203-006348 C500 C-CERAMIC,CHIP
2203-006361 C300,C330 C-CERAMIC,CHIP

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6-3
Main Electrical Parts List
SEC CODE Design LOC Discription
2203-006399 C141,C146,C148,C201 C-CERAMIC,CHIP
2203-006399 C227,C229,C302,C305 C-CERAMIC,CHIP
2203-006399 C309,C312,C313,C314 C-CERAMIC,CHIP
2203-006399 C328,C331,C601,C621 C-CERAMIC,CHIP
2203-006399 C630,C639 C-CERAMIC,CHIP
2203-006562 C205,C206,C323,C401 C-CERAMIC,CHIP
2203-006562 C403,C405,C451,C632 C-CERAMIC,CHIP
2203-006562 C635,C637 C-CERAMIC,CHIP
2203-006681 C504 C-CERAMIC,CHIP
2203-006838 C326 C-CERAMIC,CHIP
2203-006841 C319,C322,C402,C406 C-CERAMIC,CHIP
2203-006841 C411,C412 C-CERAMIC,CHIP
2203-006872 C101,C329 C-CERAMIC,CHIP
2203-006890 C417 C-CERAMIC,CHIP
2203-007279 C100 C-CERAMIC,CHIP
2404-001377 TA400,TA401 C-TA,CHIP
2404-001508 C452,C453 C-TA,CHIP
2703-001726 L117 INDUCTOR-SMD
2703-002200 L106 INDUCTOR-SMD
2703-002201 L112 INDUCTOR-SMD
2703-002203 L107 INDUCTOR-SMD
2703-002207 L101 INDUCTOR-SMD
2703-002267 L108,L110 INDUCTOR-SMD
2703-002281 L109 INDUCTOR-SMD
2703-002314 L105 INDUCTOR-SMD
2703-002320 L500 INDUCTOR-SMD
2703-002365 L400,L401,L402,L403 INDUCTOR-SMD
2703-002593 L111 INDUCTOR-SMD
2703-003498 L300,L301 INDUCTOR-SMD
2801-004373 OSC300 CRYSTAL-UNIT
2801-004683 OSC100 CRYSTAL-UNIT
2901-001540 F601,F602,F603,F605 FILTER-EMI SMD
2901-001540 F606 FILTER-EMI SMD
2901-001544 F604,F607 FILTER-EMI SMD
2911-000116 F101 FILTER
3301-001534 L404,L408 CORE-FERRITE BEAD
3301-001729 L406,L407,L503,L504 CORE-FERRITE BEAD
3301-001917 L501,L502 CORE-FERRITE BEAD
3301-001970 L121 CORE-FERRITE BEAD
3404-001303 TAC_DN,TAC_MOD1 SWITCH-TACT
3404-001303 TAC_UP SWITCH-TACT
3705-001503 RFS100 CONNECTOR-COAXIAL
3709-001394 CD500 CONNECTOR-CARD EDGE
3709-001447 SIM300 CONNECTOR-CARD EDGE

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6-4
Main Electrical Parts List
SEC CODE Design LOC Discription
3711-005954 HDC601 CONNECTOR-HEADER
3711-006141 HDC600 CONNECTOR-HEADER
3711-006808 BTC500 CONNECTOR-HEADER
3722-002871 IF500 JACK-PHONE
3722-002898 EAR500 JACK-PHONE
4302-001180 BAT300 BATTERY
GH71-08426A ANT100,ANT101 NPR-CONTACT ANT
Please consuit the GSPN website(Samsung Portal) for the most recent version of the product's part list.

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7. Block Diagrams
7-1
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7-1. RF Solution Block Diagram

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Block Diagrams
7-2
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7-2. Base Band Solution Block Diagram
Main IC
PNX6517EL1
GSM/GPRS/EDGE(Rx)
ARM946
Saturn DSP core
Multimedia
SIM
RF Interface
RF Block
QS1001(RF IC)
SKY77344(PAM)
HWXR876
Crystal
Intenna
BT Block
BC6(BT IC)
BT Antenna
Memory
NOR(256M)
NAND(1G)
UTRAM(256M)
External I/O
Interface
Micro USB
SIM Card
Power
PCF50615(PMU)
Ear Phone
3.5 Pi
Audio IC
AIT502G
Key Pad
MIC
LCD
LCD Panel
LCD Back Light Unit
Speaker
Receiver
Motor
Slide FPCB
PCB
Audio Amp
MAX9879