Samsung OfficeServ 12 User manual

GANA-000029
Ed. 001
OfficeServ 12
Service Manual

COPYRIGHT
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No information contained herein may be copied, translated, transcribed or duplicated for any commercial
purposes or disclosed to third parties in any form without the prior written consent of SAMSUNG Electronics
Co., Ltd.
TRADEMARKS
is the trademark of SAMSUNG Electronics Co., Ltd.
Product names mentioned in this document may be trademarks and/or registered trademarks of their
respective companies.
This manual should be read and used as a guideline for properly installing and operating the product.
This manual may be changed for the system improvement, standardization and other technical reasons without prior
notice.
If you need updated manuals or have any questions concerning the contents of the manuals, contact our Document
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Address: Document Center 2nd Floor IT Center. Dong-Suwon P.O. Box 105, 416, Maetan-3dong Yeongtong-gu,
Suwon-si, Gyeonggi-do, Korea 442-600
Homepage: http://www.samsungdocs.com
©2004 SAMSUNG Electronics Co., Ltd. All rights reserved.

OfficeServ 12
© SAMSUNG Electronics Co., Ltd. I
INTRODUCTION
Purpose
This manual provides service information such as specifications, disassembly and
reassembly, troubleshooting, exploded view, parts list, H/W block diagram, schematic
description, and PCB Diagram of the OfficeServ 12 system.
Document Content and Organization
This manual is composed of 5 chapters and annex and abbreviation as follows.
CHAPTER 1. System Specifications
This chapter introduces the hardware and specifications of the OfficeServ 12 system.
CHAPTER 2. Disassembly and Reassembly
This chapter describes how to disassemble the OfficeServ 12 system.
CHAPTER 3. Troubleshooting
This chapter describes problems that may occur while using the OfficeServ 12 system and
the solutions to such problems.
CHAPTER 4. H/W Block Diagrams and Schematic Description
This chapter describes the hardware block diagrams and provides a schematic description
of the OfficeServ 12 system.
CHAPTER 5. Exploded View and Parts List
This chapter describes the exploded view and parts list of the OfficeServ 12 system.
ANNEX A. PCB Component Layout
This annex describes the solder side and component side layout of the OfficeServ 12 system.
ABBRIVATION
Describes the acronyms used in this manual.

© SAMSUNG Electronics Co., Ltd. II
Conventions
The following types of paragraphs contain special information that must be carefully read
and thoroughly understood. Such information may or may not be enclosed in a rectangular
box, separating it from the main text, but is always preceded by an icon and/or a bold title.
WARNING
Provides information or instructions that the reader should follow in order to avoid
personal injury or fatality.
CAUTION
Provides information or instructions that the reader should follow in order to avoid
a service failure or damage to the system.
CHECKPOINT
Provides the operator with checkpoints for stable system operation.
NOTE
Indicates additional information as a reference.
Reference
OfficeServ 12 Intallation Guide
This guide is an installer’s guide containing information on system specification, how to
install and set up the OfficeServ 12 system and how to connect the additional equipment.
Revision History
EDITION DATE OF ISSUE REMARKS
00 10. 2004. First Edition
01 05. 2005. The information about 4TRK Board is added.

OfficeServ 12
© SAMSUNG Electronics Co., Ltd. III
SAFETY CONCERNS
For product safety and correct operation, the following information must be given to the
operator/user and shall be read before the installation and operation.
Symbols
Caution
Indication of a general caution
Restriction
Indication for prohibiting an action for a product
Instruction
Indication for commanding a specifically required action

© SAMSUNG Electronics Co., Ltd. IV
Warning
Precautions for connecting door phone
- Do not directly connect the LOCK port of DPIM(Door Phone Interface Module)
to a commercial AC power supply to prevent fire and immediate breakdown of
the OfficeServ 12 system.
- Connect a DPIM to a DLI port only after connecting a door phone to the DPIM.
- The LOCK port of DPIM is standardized so that it is used only for controlling
a low voltage relay. Standard values are 5 VDC and 40 mA.
Do not install the system in a location near a heat source such as a heater.
This is to prevent fire.
Precaution for cleaning
Do not spray directly on the unit, and do not clean the unit with benzene, thinner
or alcohol to prevent fire and electric shock.
Do not wire the system during a lightning storm.
This is to prevent electric shocks caused by lightning.
Do not directly connect the external paging equipment or a common bell to
a commercial AC power supply.
This is to prevent fire and immediate breakdown of the OfficeServ 12 system.
Check whether the power is on before connecting a cable for battery connection.
Connecting the battery while the power is off may cause sparks, which can be
very dangerous.
Unplug the AC power cable before grounding the system.
Grounding the system while the AC power cable is plugged in may cause high
voltage, which can result in critical damage.
WARNING

© SAMSUNG Electronics Co., Ltd. V
Cautions when repairing the product
- Unplug the power cable before repairing the product.
- Use standard parts for replacements.
- Do not turn off the power during program upgrades.
Follow the instructions below before disassembling the OfficeServ 12 system.
- Unplug theAC power cable and turn off the OfficeServ 12 system power.
- Remove the cables of external devices such as phone and external battery from
the OfficeServ 12 system.
- Wear wrist straps and ground the straps before handling boards or parts of the
OfficeServ 12 system.

© SAMSUNG Electronics Co., Ltd. VI
Caution
Caution for using battery
DC 48 V(6~40 AH) batteries should be used for OfficeServ 12. If the capacity of
the battery is too great, system malfunction may occur. If the capacity is too small,
the system may not operate properly during a power failure.
Precaution for wall mounting
- If the wall is made of plaster or brick, or if the building is a prefabricated one,
you should place a 2 cm thick wood plate on the wall to prevent damaging the
wall.
- It may be difficult to drive a screw directly into a concrete wall. In such cases,
make a hole using an electric drill and insert a bushing into the hole first, and
then insert the screw into the bushing. This is to prevent the system from falling
and breaking.
Do not install the system places subject to moisture or wetness.
Do not install the system near a bathtub, wash-bowl, kitchen sink, and laundry
tub, in a damp basement or near a swimming pool. Doing so may cause a
malfunction or shorten the life span of parts.
Do not disassemble, repair or modify at your discretion.
Contact your service center when repair is required.
Use only the power cable and battery indicated by this manual.
Use of an alternative power cable and battery may result in serious damage,
which will not be covered by the product warranty.
Connect the OfficeServ 12 system to an independent AC outlet.
SharingAC power with other devices can cause noise or malfunction due to
voltage drop.
CAUTION

OfficeServ 12
© SAMSUNG Electronics Co., Ltd. VII
TABLE OF CONTENTS
INTRODUCTION I
Purpose.......................................................................................................................................................I
Document Content and Organization........................................................................................................I
Conventions...............................................................................................................................................II
Reference...................................................................................................................................................II
Revision History.........................................................................................................................................II
SAFETY CONCERNS III
Symbols.....................................................................................................................................................III
Warning.....................................................................................................................................................IV
Caution .....................................................................................................................................................VI
CHAPTER 1. System Specifications 1
1.1 Hardware Descriptions ............................................................................................................... 1
1.1.1 Front View.....................................................................................................................................1
1.1.2 Ports and Switch (After Removing Side Cover)..........................................................................2
1.1.3 Bottom View..................................................................................................................................3
1.2 Specifications............................................................................................................................... 4
1.2.1 CPU, Memory, Switch..................................................................................................................4
1.2.2 System Capacity...........................................................................................................................4
1.2.3 Power Specifications....................................................................................................................5
1.2.4 Environment Specifications..........................................................................................................5
1.2.5 Cable Specifications.....................................................................................................................5
1.2.6 Dimensions...................................................................................................................................5
1.2.7 Others............................................................................................................................................5
CHAPTER 2. Disassembly and Reassembly 1
2.1 Boards and PSU........................................................................................................................... 1
2.1.1 When 3/4TRK is Equipped ..........................................................................................................1
2.1.2 When 2BRI is Equipped...............................................................................................................2
2.2 Disassembly Procedure.............................................................................................................. 3

© SAMSUNG Electronics Co., Ltd. VIII
CHAPTER 3. Troubleshooting 1
3.1 Power Failures ............................................................................................................................. 2
3.2 Base board Failures .................................................................................................................... 4
3.3 SLI Failures................................................................................................................................... 5
3.4 DLI Failures .................................................................................................................................. 9
3.5 MISC Failures..............................................................................................................................11
3.6 Caller ID Failures ....................................................................................................................... 14
3.7 LAN Failures............................................................................................................................... 15
3.8 3/4TRUNK Failures .................................................................................................................... 16
3.9 2BRI Failures.............................................................................................................................. 19
3.10 MGI Failures ............................................................................................................................... 21
CHAPTER 4. H/W Block Diagrams and Schematic Description 1
4.1 H/W Block Diagram...................................................................................................................... 1
4.2 Schematic Description................................................................................................................ 2
4.2.1 Power Supply Unit........................................................................................................................2
4.2.2 Base board....................................................................................................................................4
4.2.3 3/4TRK, 2BRI Board...................................................................................................................19
4.2.4 MGI Board...................................................................................................................................22
4.2.5 Ring Generator...........................................................................................................................23
CHAPTER 5. Exploded View and Parts List 1
5.1 Exploded View.............................................................................................................................. 1
5.2 Parts List....................................................................................................................................... 2
5.2.1 Base Board...................................................................................................................................2
5.2.2 3TRK Board (MPD Type, With CID)..........................................................................................12
5.2.3 3TRK Board (PRS Type, With CID)...........................................................................................16
5.2.4 4TRK Board (MPD Type, Without CID).....................................................................................19
5.2.5 4TRK Board (PRS Type, Without CID).....................................................................................24
5.2.6 2BRI Board .................................................................................................................................28
5.2.7 MGI Board...................................................................................................................................31
ANNEX A. PCB Component Layout 1
A.1 Base board ................................................................................................................................... 1
A.1.1 Component Side...........................................................................................................................1
A.1.2 Solder Side....................................................................................................................................2

© SAMSUNG Electronics Co., Ltd. IX
A.2 3/4TRK Board............................................................................................................................... 3
A.2.1 Component Side...........................................................................................................................3
A.2.2 Solder Side....................................................................................................................................4
A.3 2BRI Board ................................................................................................................................... 5
A.3.1 Component Side...........................................................................................................................5
A.3.2 Solder Side....................................................................................................................................6
A.4 MGI Board..................................................................................................................................... 7
A.4.1 Component Side...........................................................................................................................7
A.4.2 Solder Side....................................................................................................................................7
ABBREVIATION I
A ~ D .......................................................................................................................................................I
F ~ M ......................................................................................................................................................II
N ~ S .....................................................................................................................................................III
T ~ W .....................................................................................................................................................IV

© SAMSUNG Electronics Co., Ltd. X
LIST OF FIGURES
Figure 1.1 Front View of the OfficeServ 12............................................................................................1
Figure 1.2 Ports and Switch of the OfficeServ 12 .................................................................................2
Figure 1.3 Bottom View of the OfficeServ 12 ........................................................................................3
Figure 2.1 OfficeServ 12 Board Configuration (When 3/4TRK is Equipped).......................................1
Figure 2.2 OfficeServ 12 Board Configuration (When 2BRI is Equipped)...........................................2
Figure 4.1 H/W Block Diagram...............................................................................................................1
Figure 4.2 Power Supply System...........................................................................................................2
Figure 4.3 Base board Block Diagram...................................................................................................4
Figure 4.4 /TA(/DTACK) Signal Control.................................................................................................6
Figure 4.5 Engine (STC9604) Interface.................................................................................................8
Figure 4.6 Highway Allocation Block Diagram.......................................................................................9
Figure 4.7 Reset Circuit Block Diagram...............................................................................................10
Figure 4.8 DLI Port Wiring Diagram.....................................................................................................15
Figure 4.9 Hybrid Port Wiring Diagram................................................................................................16
Figure 4.10 SLI Port Wiring Diagram...................................................................................................16
Figure 4.11 Music Source/Paging/Dry Contact Wiring Diagram ........................................................17
Figure 4.12 Battery Backup..................................................................................................................18
Figure 4.13 Analog Trunk Board (3/4TRK)..........................................................................................19
Figure 4.14 2BRI Block Diagram..........................................................................................................21
Figure 4.15 MGI Block Diagram...........................................................................................................22
Figure 5.1 Exploded View of OfficeServ 12...........................................................................................1
LIST OF TABLES
Table 1.1 Front/Side Cover.....................................................................................................................1
Table 1.2 Ports and Switch Descriptions................................................................................................2
Table 1.3 Bottom View Descriptions.......................................................................................................3
Table 1.4 CPU, Memory, Switch.............................................................................................................4
Table 1.5 System Capacity.....................................................................................................................4
Table 1.6 Power Specifications...............................................................................................................5
Table 1.7 Environment Specifications....................................................................................................5
Table 1.8 Cable Specifications................................................................................................................5
Table 1.9 Dimensions..............................................................................................................................5
Table 1.10 Other Specifications..............................................................................................................5

OfficeServ 12
© SAMSUNG Electronics Co., Ltd. 1
System Specifications
This chapter introduces the hardware and specifications of the OfficeServ 12 system.
Compliance with local standards
OfficeServ 12 is designed to comply with the standard of the corresponding country.
1.1 Hardware Descriptions
This section introduces each view and part descriptions of the OfficeServ 12 system.
1.1.1 Front View
Figure 1.1 Front View of the OfficeServ 12
Table 1.1 Front/Side Cover
Item Description
Front Cover The front cover must be removed to view the boards or internal cables
of the system or to disassemble the system.
Side Cover The side cover must be removed to view the ports and switches of the
system.
Front cover
Side cover

© SAMSUNG Electronics Co., Ltd. 2
1.1.2 Ports and Switch (After Removing Side Cover)
Figure 1.2 Ports and Switch of the OfficeServ 12
Table 1.2 Ports and Switch Descriptions
Item Description
CO3, 4/BRI2 port When the 2BRI(Basic Rate Interface) board is installed in the system,
this port is for BRI2 port. When the 3TRK board is installed in the
system, this port is for CO(Central Office)3 port only. When the 4TRK
board is installed in the system, this port is for CO3 or CO4 port.
CO1,2/BRI1 port When the 2BRI board is installed in the system, this port is for BRI1
port. When the 3/4TRK board is installed in the system, this port is for
CO1 or CO2 port.
Memory backup
switch This switch is for using the battery and supplying the power to the OfficeServ 12 system when power is interrupted to keep data for a
predetermined time. The switch must be turned ‘ON’ after the data is input.
DLI1 port DLI1(Digital Line Interface 1) port is for connecting a digital phone
exclusively used for the OfficeServ 12 system to which the phone is
interlocked.
HYB1, HYB2 port HYB1(Hybrid1), HYB2(Hybrid2) ports are for connecting a digital
phone or analog phone.
SLI1~SLI5 port SLI(Single Line Interface) port is for connecting an analog phone
generally used at home or office.
MISC port MISC(Miscellaneous) port is for connecting an external paging device.
MOH(Music On Hold), general purpose dry contact.
Battery port Battery port is for connecting a backup battery.
LAN port LAN(LocalArea Network) port is for connecting a hub orAP(Access Point).
CO3, 4/BRI2 port
CO1, 2/BRI1 port
Memory backup switch
Battery port MISC port(General-purpose dry contact/external
page/external music source port)
SLI1~SLI5 port
HYB1, HYB2 port
LAN port(for Hub/AP)
DLI1 port

© SAMSUNG Electronics Co., Ltd. 3
1.1.3 Bottom View
Figure 1.3 Bottom View of the OfficeServ 12
Table 1.3 Bottom View Descriptions
Item Description
Groove for ground connection cable A groove for grounding.
Power switch Aswitch for turning On/Off theAC power.
Power connector A port for connecting the power adaptor plug.
Groove for wall mounting A groove for wall mounting.
LAN port A port for connecting a hub orAP.
Groove for ground connection cable
Power connector
Power switch
Groove for wall mounting
LAN port

© SAMSUNG Electronics Co., Ltd. 4
1.2 Specifications
The specifications of the OfficeServ 12 system are as follows:
1.2.1 CPU, Memory, Switch
Table 1.4 CPU, Memory, Switch
Item Specification
CPU MPC855T
Boot ROM 512 KB
Flash ROM 8 MB
SRAM 2 MB
Memory
SDRAM 64 MB
Switch Structure 256 × 256 Time Slot
1.2.2 System Capacity
Table 1.5 System Capacity
Item Specification
3TRK 3 Analog trunk lines(with Caller ID)
4TRK 4 Analog trunk lines(with Caller ID)
Trunk
2BRI 2 Digital trunk lines(4 channels)(CO3/BRI2 line(2 Channels) can be
substituted for ISDN station lines)
Station 8 lines(1 line for digital phone, 2 hybrid, and 5 lines for analog phones)
Music-on-hold/
Background music
channel
1(internal or external)
General-purpose
dry contact 1
External Page 1
AP(for WLAN) 1
WIP-5000M phone 4
The OfficeServ 12 system provides 8 station lines(1 DLI port, 2 HYB ports,
and 5 SLI ports).
DLI port supports 2B(KDB-D, KDB-S) and hybrid port supports analog phone and
digital phone(DLI max configuration: 3 ports, SLI max configuration: 7 ports).

© SAMSUNG Electronics Co., Ltd. 5
1.2.3 Power Specifications
Table 1.6 Power Specifications
Item Specification
AC Input 220~240 VAC, 50 Hz, 1.6A
Maximum Power Consumption 55 Watts
1.2.4 Environment Specifications
Table 1.7 Environment Specifications
Item Specification
Operating Temperature 0~40 °C(32~104 °F)
Relative Humidity 10~90 %
Temperature(Storage) -10~50 °C(14~122 °F)
1.2.5 Cable Specifications
Table 1.8 Cable Specifications
Item Specification
Digital Phone 2-line cable, maximum 400 m(1300 Ft)(AWG #24)
Analog Phone 2-line cable, maximum 1 km(3000 Ft)(AWG #24)
DPIM 2-line cable, maximum 300 m(1000 Ft)(AWG #24)
Door Phone 2-line cable, maximum 100 m(330 Ft)(AWG #24)
LAN RJ-45
1.2.6 Dimensions
Table 1.9 Dimensions
Item Height(mm) Width(mm) Depth(mm) Mass(kg)
OfficeServ 12 190 350 60 2.0
DPIM 29 90 120 0.2
1.2.7 Others
Table 1.10 Other Specifications
Item Specification
External music source input
characteristics Impedance: 600 ohm Voltage: Maximum 350 mV
External Page Impedance: 600 ohm

© SAMSUNG Electronics Co., Ltd. 6
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OfficeServ 12
© SAMSUNG Electronics Co., Ltd. 1
Disassembly and Reassembly
This chapter introduces how to disassemble the OfficeServ 12 system.
You can reassemble the OfficeServ 12 system by following the steps in reverse order.
2.1 Boards and PSU
OfficeServ 12 is composed of the base board, 3/4TRK board, 2BRI board, MGI(Media
Gateway Interface) board, and PSU(Power Supply Unit).
2.1.1 When 3/4TRK is Equipped
The following figure shows the board configuration of OfficeServ 12 when the 3/4TRK
analog trunk daughter board is equipped on the base board:
Figure 2.1 OfficeServ 12 Board Configuration (When 3/4TRK is Equipped)