Samsung GT-E1175T User manual

GSM TELEPHONE
GT-E1175T
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
6-1. S/W Download
7. Level 2Repair
7-1. Disassembly and Assembly Instructions
8. Level 3Repair
8-1. Block Diagram
8-2. PCB Diagram
8-3. Troubleshooting
8-4. Service Schematics
9. Reference data
GSM TELEPHONE CONTENTS

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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

2. Specification
2-1
2-1. GSM General Specification
GSM900
Phase 2
DCS1800
Phase 1
Freq.
Band[MHz]
Uplink/Downlink
880~915
925~960
1710~1785
1805~1880
ARFCN range 0~124 &
975~1023 512~885
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 0pcl ~15
pcl
Sensitivity -102dBm -100dBm
TDMA Mux 8 8
Cell Radius 35Km 2Km

Speclflcation
2-2
TX Power
control level
GSM900
533±2
dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3 dBm
18 7±3 dBm
19 5±3 dBm
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2-2. GSM Tx Power Class

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3. Operation Instruction and Installation
3-1
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Main Function
•GSM 900/1800
•1.52" CSTN
•WAP 2.0 Browser
•SMS, MMS
•64
Poly Melody
•Noise Cancellation
•JAVA
•FM radio support
•LED torchlight

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4. Exploded View and Parts List
4-1
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4-1. Cellular phone Exploded View
QFR01
QRE01
QSP01
QCR89
QLC01
QKP01
QMI01
QMP01
QMO01
QBA01
QBC00
QMW02
QIF01

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Exploded View and Parts List
4-2
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Design LOC Description SEC CODE
QSP01 SPEAKER 3001-002509
QCR89 SCREW-TAPPING 6002-001428
QMI01 MICROPHONE-ASSY-GT-E1170 GH30-00649A
QMO01 MOTOR DC-SCH-S369 GH31-00392A
QBA01 INNER BATTERY PACK-1000MAH,BLK,ENG,EU GH43-03184A
QMP01 A/S ASSY-PBA MAIN (COMM) GH82-04732A
QLC01 ASSY LCD-MODULE ASSY(GT-E1100) GH96-03565A
QKP01 ASSY KEYPAD-(OPEN/BLK) GH98-16048A
QBC00 ASSY COVER-BATT GH98-16533A
QRE01 ASSY CASE-REAR GH98-16487A
QIF01 PMO COVER-IF GH72-57917A
QFR01 ASSY CASE-FRONT GH98-16486A
QMW02 PCT WINDOW-MAIN(FM) GH72-58984A
4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List
5-1
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Design LOC SEC CODE Description
D200,D201 0401-001110 DIODE
ZD200 0403-001688 DIODE-ZENER
D300,D301,D302 0406-001231 DIODE
ZD300 0406-001267 DIODE-ZENER
ZD301,ZD302 0406-001286 DIODE-ZENER
TR200 0505-002664 FET-SILICON
LED300 0601-002233 LED
LED304 0601-002846 LED
LED301,LED302,LED303 0601-002846 LED
TR100 1003-001440 IC
UME200 1108-000217 MEMORY
PAM100 1201-002933 PAM
U300 1203-005512 IC
U101 1203-005686 IC
U100 1204-002979 IC
UCP200 1205-003923 IC
TH200 1404-001221 THERMISTOR
R301 2007-000139 R-CHIP
L109 2007-000140 INDUCTOR
R300,R306,R312 2007-000141 R-CHIP
R104,R105 2007-000143 R-CHIP
R208 2007-000144 R-CHIP
R101,R102,R200,R202 2007-000148 R-CHIP
R108 2007-000151 R-CHIP
R107 2007-000162 R-CHIP
R307,R308 2007-000172 R-CHIP
R302,R303,R304,R305 2007-000172 R-CHIP
R309,R310 2007-000173 R-CHIP
R311 2007-000174 R-CHIP
R209 2007-001301 R-CHIP
R210 2007-001333 R-CHIP
R106 2007-003025 R-CHIP
R204 2007-010071 R-CHIP
C103 2203-000233 C-CERAMIC,CHIP
C317 2203-000359 C-CERAMIC,CHIP
U302 2203-000386 IC

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Main Electrical Parts List
5-2
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Design LOC SEC CODE Description
C225,C227 2203-000425 C-CERAMIC,CHIP
C309,C310,C311 2203-000585 C-CERAMIC,CHIP
C302 2203-000679 C-CERAMIC,CHIP
C106 2203-000696 C-CERAMIC,CHIP
C312,C313 2203-000812 C-CERAMIC,CHIP
C111,C112,C114,C228 2203-000812 C-CERAMIC,CHIP
C220,C321,C325 2203-001153 C-CERAMIC,CHIP
C118 2203-001383 C-CERAMIC,CHIP
C116,C117 2203-001385 C-CERAMIC,CHIP
C209,C210,C229 2203-002709 C-CERAMIC,CHIP
C110 2203-005057 C-CERAMIC,CHIP
C113,C115 2203-005281 C-CERAMIC,CHIP
C224 2203-005344 C-CERAMIC,CHIP
C319,C323 2203-006048 C-CERAMIC,CHIP
C215,C231,C301,C303 2203-006048 C-CERAMIC,CHIP
C100,C104,C211,C212 2203-006048 C-CERAMIC,CHIP
C203,C204,C320 2203-006208 C-CERAMIC,CHIP
C101,C102 2203-006260 C-CERAMIC,CHIP
C208,C214,C315,C316 2203-006399 C-CERAMIC,CHIP
C202,C205,C206,C207 2203-006399 C-CERAMIC,CHIP
C109,C314 2203-006562 C-CERAMIC,CHIP
C200,C201,C226 2203-006824 C-CERAMIC,CHIP
C305,C306 2203-006841 C-CERAMIC,CHIP
C308 2203-007270 C-CERAMIC,CHIP
C108 2203-007279 C-CERAMIC,CHIP
C223 2203-007425 C-CERAMIC,CHIP
L106 2703-002170 INDUCTOR
L107 2703-002176 INDUCTOR
L306,L307,L308,L309 2703-002201 INDUCTOR
L302,L303,L304,L305 2703-002201 INDUCTOR
L105 2703-002203 INDUCTOR
L108 2703-002204 INDUCTOR
L111,L110 2703-002208 INDUCTOR
L103 2703-002268 INDUCTOR
L201 2703-003184 INDUCTOR
L301 2703-003476 INDUCTOR

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Main Electrical Parts List
5-3
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Design LOC SEC CODE Description
OSC200 2801-004805 OSC
OSC201 2801-004882 OSC
F100 2904-001879 FILTER
L200 3301-001158 INDUCTOR
L300 3301-001912 INDUCTOR
SC108,SC109 GH70-03276A ONBOARD-CLIP-4
SC105,SC106,SC107 GH70-03276A ONBOARD-CLIP-4
SC102,SC103,SC104 GH70-03276A ONBOARD-CLIP-4
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's
part list.

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6. Level 1Repair
6-1
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6-1. S/W Download
6-1-1. Pre-requsite for S/W Downloading
•Downloader Program(MEA KAI Downloader for SEC v01)
•GT-E1175T Mobile Phone
•Data Cable
•JIG BOX (GH99-36900A)
•RF Test Cable (GH39-00985A)
•JIG Cable(1.5M) (GH39-01160A)
•Adapter (GH99-38251A)
•Serial Cable
•Binary files
※Settings
Connect to ANYWAY JIG BOX
&JIG CABLE (Phone to JIG)

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Level 1Repair
6-2
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6-1-2. S/W Downloader Program
■Load the binary download program by executing the
"MEA KAI Downloader for SEC v01 "←enter this file.
1.Select the connected serial port and the rate of speed.
2.Select the D/L Mode.

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Level 1Repair
6-3
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3.Select the Binary &TFS file.
4.P
ress the "Start" button and connect the Handset.

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Level 1Repair
6-4
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5.When downloading is complete, automatically the small window was showed up.
6.Confirm the downloaded version name and etc. :
*#1234#
Full Reset :
*2767*3855#

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7. Level 2Repair
7-1
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1) Be careful not to make scratch and molding damage! 1) Be careful not to make scratch and molding damage!
1) Be careful not to make scratch and molding damage! 1) Be careful not to make scratch and molding damage!
7-1. Disassembly and Assembly Instructions
7-1-1. Disassembly
Release Screw 2Point at rear
1 2
3Disjoint hook on the right side of the rear Disjoint hook on the left side of the rear
4
Disjoint Hook on the top of the rear

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7. Level 2Repair
7-2
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1)Be careful not to make scratch and molding damage.1) Be careful not to damage to LCD Module.
1) Be careful not to make damage to MIC FPCB
8Disassemble Main PBA from the FRONT .
7Disassemble Main PBA from the FRONT.
5Pull the REAR by lifting it from top to bottom Press front side hook to release Main PBA.
6

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7. Level 2Repair
7-3
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1) Be careful not to damage to LCD Module.
1) Be careful not to make damage to MIC FPCB 1) Beware that you do not damage MIC F-PCB.
7-1-1. Assembly
12
34
Set aPBA and front.
Assemble the hooks on the bottom of the rear
Press front side hook to lock Main PBA.
and insert MIC to front carefully
Assemble PBA to the front

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7. Level 2Repair
7-4
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1) Be careful not to make scratch and molding damage! 1) Be careful not to make scratch and molding damage!
1) Be careful not to make scratch and molding damage!
56Assemble the hooks on the top of the rear
Assemble the left, right hook on the
side of the rear
Drive Screws at 2points with torque 1.2 +/-
0.1 Kgf/㎠.
7

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8. Level 3Repair
8-1
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8-1. Block Diagram