Shuttle Prima XPC Barebone SX38P2 Pro User manual

For the : SX38P2 Pro
XPC User Guide

Shuttle®
XPC Installation Guide
Copyright
©2007 by Shuttle® Inc. All Rights Reserved.
No part of this publication may be reproduced, transcribed, stored in a retrieval system,
translated into any language, or transmitted in any form or by any means such as electronic,
mechanical, magnetic, optical, chemical, photocopy, manual, or otherwise, without prior
written permission from Shuttle® Inc.
Other brands and product names used herein are for identification purposes only and may
be trademarks of their respective owners.
Disclaimer
Shuttle® Inc. shall not be liable for any incidental or consequential damages resulting from
the performance or use of this product.
Shuttle® Inc. makes no representation or warranty regarding the contents of this ma-
nual. Information in this manual had been carefully checked for accuracy;however, no
guarantee is given as to the correctness of the contents. For continuing product improve-
ment, Shuttle® Inc. reserves the right to revise the manual or make changes to the speci-
fications of this product at any time without notice and obligation to any person or entity
regarding such change. The information contained in this manual is provided for general
use by customers.
This device complies to Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
1. This device may not cause harmful interference.
2. This device must withstand any background interference including those that may
cause undesired operation.
Trademarks
Shuttle is a registered trademark of Shuttle Inc.
Intel and Pentium are registered trademarks of Intel Corporation.
PS/2 is a registered trademark of IBM Corporation.
AWARD is a registered trademark of Award Software Inc.
Microsoft and Windows are registered trademarks of Microsoft Corporation.
General Notice
Other brand and product names used herein are for identification purposes only and
may be trademarks of their respective owners.

Safety Information
Read the following precautions before setting up a Shuttle XPC.
Installation Notices
Do not place this device
underneath heavy loads
or in an unstable position.
Do not expose this device to
high levels of direct sunlight,
high-humidity or wet conditions.
Do not use or expose this device
around magnetic elds as magnetic
interference may affect the
performance of the device.
Do not block the air vents
to this device or impede the
airow in any way.
Laser compliance statement
The optical disc drive in this server is a laser product. The drive's
classication label is lacated on the drive.
CLASS 1 LASER PRODUCT
CAUTION： INVISIBLE LASER RADIATION WHEN OPEN.
AVOID EXPOSURE TO BEAM.
CAUTION
Incorrectly replacing the battery may damage this computer. Replace only
with the same or equivalent as recommended by Shuttle. Dispose of used
batteries according to the manufacturer's instructions.

Issue Date: 2007/11/05
Ref. Report No. ISL-07HE194C
ISL-07HE194E
Product Name: : Shuttle XPC
Model Number(s) : SX38P2 Pro ; P23800 Pro ; S111P
Responsible Party : Shuttle Inc.
Address : No. 30, Lane 76, Rei Kuang Rd., Nei-Hu Dist.,,
Taipei,, Taiwan
Contact Person : Stan Cheng
We, International Standards Laboratory, hereby certify that:
The device bearing the trade name and model specified above has been shown to
comply with the applicable technical standards as indicated in the measurement report
and was tested in accordance with the measurement procedures specified in
EUROPEAN COUNCIL DIRECTIVE 2004/108/EC. The device was passed the test
performed according to :
Standards:
EN55022: 1998/A1: 2000/A2: 2003; AS/NZS CISPR 22: 2004: Limits and methods of
measurement of Radio Interference characteristics of Information Technology Equipment.
EN55024: 1998/A1:2001/A2: 2003; AS/NZS CISPR 24: 2002: Information technology
equipment-Immunity characteristics-Limits and methods of measurement.
EN61000-3-2: 2000 /A2:2005; AS/NZS 61000.3.2: 2003: Limits for harmonics current emissions
EN61000-3-3: 1995/A1: 2001; AS/NZS 61000.3.3: 1998: Limits for voltage fluctuations and flicker in
low-voltage supply systems.
I attest to the accuracy of data and all measurements reported herein were performed
by me or were made under my supervision and are correct to the best of my knowledge
and belief. I assume full responsibility for the completeness of these measurements
and vouch for the qualifications of all persons taking them.
___________________________
Jim Chu/ Director
International Standards laboratory
Lung-Tan LAB:
No. 120, Lane 180, San Ho Tsuen, Hsin Ho Rd.
Lung-Tan Hsiang, Tao Yuan County 325, Taiwan
Tel: [phone]; Fax: [phone]
His-Chih LAB:
No. 65, Gu Dai Keng St.. Hsichih, Taipei Hsien
22117, Taiwan.
Tel: [phone]; Fax: [phone]

Issue Date: 2007/11/05
Ref. Report No. ISL-07HE194FB
Product Name: : Shuttle XPC
Model Number(s) : SX38P2 Pro ; P23800 Pro ; S111P
Responsible Party : Shuttle Inc.
Address : No. 30, Lane 76, Rei Kuang Rd., Nei-Hu Dist.,,
Taipei,, Taiwan
Contact Person : Stan Cheng
We, International Standards Laboratory, hereby certify that:
The device bearing the trade name and model specified above has been shown to comply with the
applicable technical standards as indicated in the measurement report and was tested in accordance
with the measurement procedures specified. (refer to Test Report if any modifications were made for
compliance).
Standards:
ANSI C63.4-2003, CFR 47 Part 15 Subpart B Section 15.107 and 15.109
Industry Canada Interference-Causing Equipment Standard ICES-003 Issue 4: 2004
Class B
ANSI C63.4-2003
I attest to the accuracy of data and all measurements reported herein were performed by me or were
made under my supervision and are correct to the best of my knowledge and belief. I assume full
responsibility for the completeness of these measurements and vouch for the qualifications of all
persons taking them.
We certify that no party to this application has been denied the FCC benefits pursuant to Section 5301
of the Anti-Drug Abuse Act of 1988.21 U.S.C. 853(a)
___________________________
Jim Chu/ Director
International Standards Laboratory
Lung-Tan LAB:
No. 120, Lane 180, San Ho Tsuen, Hsin Ho Rd.
Lung-Tan Hsiang, Tao Yuan County 325,
Taiwan
Tel: [phone]; Fax: [phone]
Hsi-Chih LAB:
No. 65, Gu Dai Keng St.. Hsichih, Taipei Hsien
22117, Taiwan.
Tel: [phone]; Fax: [phone]

产品中有毒有害物质或元素的名称及含量
有毒有害物质或元素
部件名称
及型号 铅
(Pb)
汞
(Hg)
镉
(Cd)
六价铬
(Cr6+)
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
主机板 X ○○○○○
机壳 X ○○○○○
线材 ○○○○○○
电源供应器 ○○○○○○
散热模组 X ○○○○○
包材 ○○○○○○
○：表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 11363-2006
标准规定的限量要求以下。
X：表示该有毒有害物至少在该部件某一均质材料中的含量超出 SJ/T 11363-2006
标准规定的限量要求。

TABLE OF CONTENTS
1 Function Introduction ..............................................................................................1
1.1 XPC Introduction .............................................................................................1
1.2 Model Specications .......................................................................................2
1.3 XPC Exterior Dissection ..................................................................................3
1.3.1 XPC Front ..............................................................................................3
1.3.2 XPC Back ..............................................................................................3
1.4 Accessories .....................................................................................................4
1.5 XPC Mainboard ...............................................................................................5
1.5.1 SX38P2 Pro mainboard illustration .......................................................5
1.5.2 Jumper Settings ....................................................................................6
Front Panel Header................................................................................6
CIR Header............................................................................................6
Extended USB Header...........................................................................7
PS/2 Keyboard & Mouse Header...........................................................7
AUX-IN Header .....................................................................................7
Fan Connector .......................................................................................8
GPIO Header .........................................................................................8
BIOS Header..........................................................................................8
2 XPC Installation Guide ............................................................................................9
2.1 Installation........................................................................................................9
2.1.1 Remove the Cover .................................................................................9
2.1.2 Remove the Rack ..................................................................................9
2.2 CPU and ICE Installation ...............................................................................10
2.2.1 Remove the ICE Module......................................................................10
2.2.2 Install the CPU .....................................................................................10
2.2.3 Install the ICE Module..........................................................................11
2.3 Memory module Installation...........................................................................12
2.4 Peripheral Installation.....................................................................................13
2.4.1 Install the Rack.....................................................................................13
2.4.2 Install the Card Reader ........................................................................13
2.4.3 Install the IDE HDD..............................................................................14

2.4.4 Install an Optical Drive ........................................................................15
2.4.5 Install more Serial ATA HDDs ..............................................................16
2.5 Accessories Installation .................................................................................16
2.5.1 Install PCI Express x16 Card ..............................................................16
2.5.2 Install Mini PCIe Card ..........................................................................18
2.6 Final Touches ................................................................................................19
2.6.1 Close the Chassis Cover .....................................................................19
2.6.2 Install Front Feet ..................................................................................19
2.6.3 Complete .............................................................................................19
2.7 XPC Accessories ...........................................................................................20
2.8 Tech Support .................................................................................................20
2.9 Technical Notes: Clear CMOS Button ...........................................................20
3 Driver and Software Installation.............................................................................21
3.1 Mainboard Driver CD ....................................................................................21
3.1.1 Install Mainboard Software .................................................................22
Appendix....................................................................................................................23
Enter the BIOS......................................................................................................23
The Main Menu.....................................................................................................24
Standard CMOS Features ............................................................................26
Advanced BIOS Features .............................................................................29
Integrated Peripherals .................................................................................32
Power Management Setup ...........................................................................35
PnP/PCI Congurations ............................................................................... 37
PC Health Status ..........................................................................................39
Frequency/Voltage Control ...........................................................................40
Load Optimized Defaults ..............................................................................43
Set Supervisor/User Password .....................................................................43
Save & Exit Setup .........................................................................................44
Exit Without Saving ......................................................................................44

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1.1 XPC Introduction
The Shuttle XPC is the original high-performance Small Form Factor (SFF) computer.
Since the first model was introduced in 2001, the XPC has become the world’s best-
selling SFF computer brand.
Each Shuttle XPC is sold as a ”barebone” computer~chassis, power supply and
motherboard. The user must add his own processor, memory, drives and, as ap-
plicable, expansion cards. The XPC has been designed to be easily assembled and
configured directly by the end user. Consumers can choose to buy preconfigured,
ready-to-run XPC’s as well~a list of Shuttle-authorized value-added resellers can be
found at www.shuttle.com.
The Shuttle XPC owes its popularity to its unique combination of small-size, high-
performance and near universal component compatibility. However, unlike ordinary
desktop computers, Shuttle XPC’s have been engineered as complete systems.
The XPC concept can be summarized as:
Use of high-performance, industry-standard components; Minimum size possible,
while preserving component compatibility and system expansion; Focus on quality~a
commitment to quality construction, materials and industrial design.
To meet the above requirements, Shuttle has created and patented dozens of new
technologies, including the Integrated Cooling Engine (ICE), which extend and
enhance the personal computing experience while reducing heat, noise and space
requirements.
Thank you for choosing the Shuttle XPC!
1 Function Introduction

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Form Factor • Shuttle Form Factor
PROCESSOR • Supports 1333/1066/800 MHz FSB for dual-core and single core CPUs
• LGA775, Intel® Core™2 Quad /Core™2 Extreme /Core™2 Duo /Pentium® D
CHIPSET • North Bridge: Intel® X38 Chipset
• South Bridge: ICH9-R
MEMORY • 4x Dual channel unbuffered non-ECC DDR2 667/800MHz DIMM Slots
• DIMM Supports up to 8GB system memory
AUDIO • Realtek ALC888DD
• Supports Analog 7.1 channel output
• Supports Digital S/PDIF in
• Supports Dolby® Digital Live! and DTS™
ETHERNET • Marvell 88E8056 (PCI-E Interface)
• IEEE 802.3u 1000Base-T compliant
• Supports Wake-On-LAN
• 10Mb/s, 100Mb/s and 1000Mb/s operation
IEEE1394 • TI TSB43AB22A, Complise with 1394 OHCI specification revision 1.0
(FireWire) • Support 400Mb/s,200Mb/s,100Mb/s transfer rate
STORAGE • South Bridge (1) Floppy connector
INTERFACE (2) eSATA connectors in back panel
(4) On board SATA 3.0Gb/s connectors
• Jmicron (1) UltraDMA 100 IDE channel connector
• NCQ support
ON BOARD (1) PS/2 Keyboard & Mouse header (1) ATA100 IDE connector
CONNECTORS (4) Fan connectors (2) Power connectors
(2) Front Panel headers (1) AUX_IN header
(4) SATA connectors (1) GPIO header
(1) BIOS header (2) 2x5 USB 2.0 headers
(1) MINI PCIE connector X1 (2) PCI-E X16
(1) SPI_FLASH header (1) CIR header
POWER • Input: 100/240V, Support 80 PLUS • Output: 450W
CHASSIS • P2, Dimension: 325(L) x 210(W) x 220(H) mm
• Bay: (2) 3.5" bays ( internal) (1) 5.25" bay
1.1 Model Specifications

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English
1.3.1 XPC Front
1.3 XPC Exterior Dissection
Shuttle offers a variety of different XPC models loaded with various op-
tions. The illustration below will help familarize you with the included
features in your new XPC.
F8 F9
F1
F1. 5.25” Bay
F2. 3.5” Bay
F3. Eject Button
F4. HDD LED
F5. Power Switch & LED
F6. Fingerprint Sensor
F7. Reset Button
F8. Mic
F9. Headphone
F10. USB Ports
F11. Mini IEEE1394 Port
F12. Speed-Link On/Off
F4
F5
F3
F11
F6
F2
F12
F7
F10
B1
B2
B11
B7
B16
B6
B8
B4
B1. AC Power Switch
B2. AC Power Socket
B3. External Serial ATA Ports
B4. IEEE1394 Port
B5. USB Ports
B6. LAN Port
B7. SPDIF Out (Coaxial)
B8. SPDIF Out (Optical)
B9. Front Out (L/R)
B10. Line-In Port
B11. MIC IN
B12. Center/Bass
B13. Surround Back (L/R)
B14. Side Surr (L/R)
B15. Clear CMOS Button
B16. Wireless LAN Perforation
B5
B12
B10
B13
B14
B9
B15
1.3.2 XPC Back
B3

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English
1.4 Accessories
7. Front feet (2) 8. Heatsink compound (1)
5. Cable tie (2), Cable clip (1), 6. USB to USB cable (1)
Adhesive tape (2), Screws FDD cable (1), Serial ATA cable (1)
1. Power cord (1) 2. ICE Heat-Pipe (1)
Power extension cable (1)
Installation guide
9. Motherboard DVD (1) 10. XPC installation guide (1)
3. Cross fire bridge (2) 4. VGA power cord (1)
Bundled Accessories may differ from specified. If there are items missing,
please contact your local authorized Shuttle dealer.

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English
1.5 XPC Mainboard
1.5.1 SX38P2 Pro mainboard illustration
LGA775
4x 240 pins DDR2 DIMM Slots
FAN Connector- FAN2
Front Panel Connector- JP6
FAN Connector- FAN4
Front Panel Connector- JP5
Floppy Connector- FDD1
IDE Slot- IDE1
Intel X38 Chipset
USB Header- USB7
Front-Out/ Line-In/
MIC In/ Center/Bass/
Surround-Back/ Side-Surr Ports
SPDIF-Out Coaxial/Optical Ports
2x USB 2.0 Ports
ATX Power Connector- PWR2
FAN Connector- FAN1
USB Header- USB6
2x PCI Express x16 Slots
FAN Connector- FAN3
Serial ATA- SATA1,2,3,4
1394 & 2x USB 2.0 Ports
ITE 8718F Chipset
ICH9-R Chipset
LAN & 2x USB 2.0 Ports
ATX Power Connector- PWR1
CIR Connector- JP4
2x SATA External Ports
SPI_FLASH Connector- JP8
AUX-IN Connector- CN3
BIOS Connector- U5
PS/2 Keyboard & Mouse
Port- CN4
GPIO Connector- JP3

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English
1.5.2 Jumper Settings
Front Panel Header
Header JP5 can be used to provide operation status signals to the front daughterboard.
Note that this is an alternative header to the 50pins streamline header that also con-
nects the motherboard to the front daughterboard. Header JP6 is used to connect
cable to front panel connector mounted on front-panel or back-panel.
The front panel is where the hard drive activity lights, reset button, on/off button,
computer power on light, USB connectors, 1394 connectors, and audio headers,
are located.
JP5
9 7 5 3 1
10 8 6 4 2
JP6
Pin Assignments (JP6):
1=HDLEDPWR 2=GRNLEDA
3=-HD_LED 4=GRNLEDB
5=BT_SEL 6=-PWRSW
7=GND 8=GND
9=NC 10=KEY
Pin Assignments (JP5):
1=USBPWR 2=USBPWR 3=USBPWR 4=USBPWR 5=USBPWR
6=USBPWR 7=USBPWR 8=USBPWR 9=USBA+ 10=USBA-
11=USBGND 12=USBGND 13=USBB+ 14=USBB- 15=USBGND
16=USBGND 17=TPA+ 18=TPA- 19=1394GD 20=1394GD
21=TPB+ 22=TPB- 23=1394GD 24=1394GD 25=FMIC
26=MIC_PWR 27=SNESE0 28=AUDIOGD 29=LINE_IL 30=AUDIOGD
31=LINE_IR 32=SENSE1 33=AUDIOGD 34=AUDIOGD 35=LINE_OR
36=LINE_FR 37=AUDIOGD 38=AUDIOGD 39=LINE_OL 40=LINE_FL
41=AUDIOGD 42=AUDIOGD 43=HDPWR 44=GLEDA 45=HDLED
46=GLEDB 47=RST_SW 48=PW_SW 49=VCC 50=VCC
CIR Header
Header JP4 can be used to connect special device.
Pin Assignments (JP4):
1=PIN26 2=5V_DUAL
3=PIN30_CIRTX 4=PIN85_CIRRX
5=PIN27 6=PIN20
7=PIN21 8=PIN23
9=KEY 10=GND
1
3
5
7
9
2
4
6
8
10

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English
Extended USB Header
These headers are used to connect auxillary USB devices to the mainboard. These
headers are directional and will only allow USB cables to be connected in one di-
rection.
USB7
Pin Assignments (USB7):
1=USBPWR7
2=USBPWR7
3=USBP10N
4=USBP1N
5=USBP10P
6=USBP1P
7=GND
8=GND
9=Key
10=N/C
AUX-IN Header
If you have installed a CD-ROM drive or DVD-ROM drive, you can connect the
drive audio cable to the onboard sound system. On the motherboard, locate the 4-
pin Aux-In header, and connect the cable to this header.
4
3
2
1
Pin Assignments (CN3):
1=AUX-IN – Left
2=Ground
3=Ground
4=AUX-IN – Right
Pin Assignments (USB6):
1=USBPWR4
2=USBPWR4
3=USBP4N
4=USBP11_N
5=USBP4P
6=USBP11_P
7=GND
8=GND
9=Key
10=N/C
1 3 5 7 9
USB6
2 4 6 8 10
1
3
5
7
9
2
4
6
8
10
PS/2 Keyboard & Mouse Header
Header CN4 can be used to connect PS/2 Keyboard & Mouse device.
Pin Assignments (CN4):
1=KDAT
2=KCLK
3=5V_DUAL
4=GND
5=MDAT
6=MCLK
1
2
3
4
5
6

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GPIO Header
GPIO Supports three application-definable GPIO LEDs.
1 2 3 4 5
BIOS Header
8 7 6 5
1 2 3 4
Pin Assignments (JP3):
1=VCC
2=KEY
3=VCC
4=GPIO23
5=GPIO22
Pin Assignments (U5):
1=SPI_CS0- 2=SPI_MISO
3=SPI_WP- 4=GND
5=SPI_MOSI 6=SPI_CLK
7=SPI_HOLD- 8=SPI_VDD
Fan Connector
The mainboard provides the onboard 12V cooling fan power connector to support
CPU, Chassis or Chipset cooling fans.
Both cable wiring and type of plug may vary depending on the fan maker.
FAN4 FAN1/FAN2/FAN3
FAN_SENSE
FAN_CTRL (+12V) Ground SPEED_SENSE +12V Ground
PWM_CTRL
11

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2 XPC Installation Guide
2.1 Installation
For safety reasons, please ensure that the power cord is disconnected be-
fore opening the case.
2.1.1 Remove the Cover
2. Slide the cover backwards and
upwards.
2
1
2.1.2 Remove the Rack
2. Remove the racks.
1
2
1. Unscrew 4 thumbscrews of the
chassis cover.
1. Unfasten the serial ATA HDD racks
mount screws.

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2.2 CPU and ICE Installation
2.2.1 Remove the ICE Module
2. Remove the ICE module from the
chassis and put it aside.
Fan Connector
2.2.2 Install the CPU
1. Unfasten the four ICE module
attachment screws and unplug
the fan connector.
1. First unlock and raise the socket lever.
This 775 pin socket is fragile and easily damaged. Always use extreme
care when installing a CPU and limit the number of times that you re-
move or change the CPU.
2. Lift the metal load plate on the CPU
socket.

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2.2.3 Install the ICE Module
1. Place the ICE module on top of the
CPU die and match the screws with
the holes on the motherboard.
Please do not apply excess amount
of thermal paste.
5. Spread thermal paste evenly on the CPU surface.
Thermal Paste application area
INTELCONFZDENTIAL
OJ23ES A4
!03 JM00547PC072M
C34058EA
MC
LGA775 Processor
Triangle Markings
Lever
Please be aware of the CPU orientation, DO NOT force the CPU into the
socket of prevent bending the pins on the socket and damaging the CPU!
3. Remove the protective socket cover.
4. Orientate the CPU and socket, aligning the yellow triangle on the corner of the CPU with
the triangle on the socket. Make sure the CPU is perfectly horizontal, insert the CPU into
the socket. Close the load plate, lower the CPU socket lever and lock in place.

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2. Screw the ICE module to the motherboard.
Note to press down on the opposite diag-
onal corner while tightening each screw.
3. Connect the fan connector.
1
Fan Connector
2
3
4
2.3 Memory module Installation
Latch
Latch
Cutout
Notch
Install a memory module in DIMM1/DIMM2/DIMM3/DIMM4.
1. Unlock the DIMM latch.
2. Align the memory module's cutout with the DIMM slot notch.
Slide the memory module into the DIMM slot.