Shuttle XPC SS59G User manual

XPCUserGuide
Forthe:SS59G

ShuttleXPCEMITestStatement
ShuttleXPChavebeen viathe EMItestintermsofseriesofregulations:EN55022/CISPR22/
AS/NZS3548ClassB,EN55024(1998/AS/NZS),EN4252.1(1994),EN61000,ANSIC63.4(1992),
CFR47 Part15 SubpartB,and CNS13438 (1997).The itemstested areillustrated asfollows:
(A)Voltage:AC110V/60HZ&AC230V/50HZ
(B)Tested ProductInformation:
ProductName:XPC
Status:Sample
ModelName:SS59G
S/N:N/A
CPU:
ExternalFrequency:133 MHz
IntelPentium4,LGA775 Processor:2.40/2.53/2.66/2.80 GHz
ExternalFrequency:200 MHz
IntelPentium4,LGA775 Processor:2.8/3/3.2/3.4GHz
SerialPort: one portwith9pins
VGAPort: one portwith15 pins
KeyboardPort: one portwith6pins
MousePort: one portwith6pins
USB 2.0Port: sixportswith4pinsrespectively
1394 Port: one portwith4pinsand one portwith6pinsrespectively
LANPort: one portwith8pins(10Mbps/100Mbps)
Center/Bass-OutPort: fourports
Mic-InPorts:one port
Line-InPorts:twoports
SPDIF-Out(Coaxial)Port: one port
SPDIF-Out(Optical)Port: one port
SPDIF-In(Optical)Port: one port
ClearCMOSbutton:one port
DIMM Memory(optional):DDR 400 256MB*2
PowerCable:Detachableand Shielded (withaGND pin)
Monitor:CRT+DVI
MaximumResolution:1280 X1024 V:60Hz
All CPUshavecompletelybeen tested,and valuesoffered bythe worstEMIcombination of
CPUexternalfrequency arelisted asfollows:
TestModeExternalFrequencyCPUCPUOpen/Close
1 200MHzP43.4GHzClose
2 200MHzP43.4GHzOpen

3 133MHzP42.8GHzClose
4 133MHzP42.8GHzOpen
(C)Remedyforthe Tested Product&ItsEMIInterference:
Remedy:N/A
EMIInterference:
Crystal:14.318MHz(X2)/25MHz(X6)/32.768KHz(X9)/12MHz(X4)
/24.576MHz(X7)/24.576MHz(X5).
ClockGenerator:U4,U5
(D)Supported HostPeripherals:
HostPeripheralProductNameModelName
#1CaseSS59G
#2PowerSupplyPC30I2003
#3SerialATASeagateST312G026A8
#4CardReaderPC12
#5DVD PlayerP10437007995
(E)NoticesforAssembling Computers:
1.Casesshouldbe made ofiron orothermetalthathasgood electricconductivity.
2.Cylindersinacaseshouldbe made ofmetal,and ashaving amainboardmounted
inacase,makesurescrewsareall utilized and fastened on amainboard.
3.AnI/Oshielding shouldbe contacted withI/Ometallicpartsofamainboard.
4.Cablesshouldappropriatelybe arranged and fixed inacase.Followinstructions:
Ø LeaveIDEcablesnotcrossed upon CPUand SDRAM;
Ø Leavepowercablesminimuminlength,and notcrossed upon amainboard;
Ø LeaveCPUfan cablesminimuminlength,and notnearCPU;
Ø Leavecableson panelsand othersparecablestied inacomputercase.
5.Makesurean EMIshielding attached toacasehasproperlybeen installed.
6.Makesurea5.25"and screwsarefastenedtoan EMIshielding.
7.MakesureacaseiscloselyincontactwithEMIconnected points.
8.Makesurethereisno cleft inacasewhichisnotdeformed.
9.MakesureaPCIdoorisbound toacase.
10.Makesurecablesofotherdevices(fansorsomeothers)arefixed inacase.

Shuttle®
XPCInstallation Guide
Copyright
Copyright©2005 byShuttle®Inc.All RightsReserved.
Nopartofthispublication maybereproduced,transcribed,storedinaretrievalsystem,
translatedintoanylanguage,ortransmittedinanyformorbyanymeans,electronic,
mechanical, magnetic,optical, chemical, photocopying,manual, orotherwise,withoutprior
writtenpermission fromShuttle®Inc.
Disclaimer
Shuttle®Inc.shall notbeliableforanyincidentalorconsequentialdamagesresultingfrom
theperformanceoruseofthisproduct.
Thiscompanymakesno representationsorwarrantiesregardingthecontentsofthisma-
nual. Information inthismanualhasbeencarefullycheckedforreliability;however,no
guarantee isgivenastothecorrectness ofthecontents.Intheinterestofcontinuedproduct
improvement, thiscompanyreservestherighttorevisethemanualorincludechangesin
thespecificationsoftheproductdescribedwithinit atanytimewithoutnoticeand without
obligation tonotifyanyperson ofsuchrevision orchanges.Theinformation containedin
thismanualisprovidedforgeneralusebycustomers.
ThisdevicecomplieswithPart15 oftheFCC Rules,Operation issubjecttothefollowing
twoconditions:
1.Thisdevicemaynotcauseharmfulinterference.
2.Thisdevicemustacceptanyinterferencereceived,includinginterferencethatmay
causeundesiredoperation.
Trademarks
ShuttleisaregisteredtrademarkofShuttleInc.
Inteland PentiumareregisteredtrademarksofIntelCorporation.
PS/2isaregisteredtrademarkofIBMCorporation.
AWARDisaregisteredtrademarkofAwardSoftwareInc.
Microsoft and WindowsareregisteredtrademarksofMicrosoft Corporation.
GeneralNotice
Otherbrand and productnamesusedhereinareforidentification purposesonlyand may
betrademarksoftheirrespective owners.
9M0-A85SS0-59G0

Installation Notices
Donotplace thisdevice underneath
heavy loadsorinanunstableposition.
Donotexpose thisdevice tohigh
levelsofdirectsunlight,high-humidity
orwetconditions.
Donotuse orexpose thisdevice
around magneticfieldsas magnetic
interference may affectthe
performance ofthedevice.
Donotblock theairventstothis
device orimpedetheairflowin
anyway.
CAUTION
Incorrectlyreplacingthebatterymaydamage thiscomputer.Replaceonlywith
the sameorequivalentasrecommendedbyShuttle.Disposeofusedbatteries
accordingtothemanufacturer'sinstructions.
SafetyInformation
ReadthefollowingprecautionsbeforesettingupaShuttleXPC.

TABLEOFCONTENTS
1Function Introduction .......................................................................................... 1
1.1XPCIntroduction ........................................................................................... 1
1.2ModelSpecifications..................................................................................... 2
1.3XPCExteriorDissection ............................................................................... 3
1.3.1XPCFront ............................................................................................. 3
1.3.2XPCBack ............................................................................................. 4
1.4Accessories.................................................................................................... 5
1.5XPCMainboard.............................................................................................. 6
1.5.1SS59Gmainboardillustration ................................................................ 6
1.5.2JumperSettings.................................................................................... 7
FrontPanelConnector(JP9/JP8).......................................................... 7
FanConnectors(FAN1/FAN2)............................................................... 7
ExtendedUSBConnectors(USB1/USB3)............................................ 8
LINE-In(J4),CD-In(CN3),MiniCD-In(CN4)Connectors.......................... 8
SPDIF-In/OutConnector(JP4).............................................................. 9
ParallelPortHeader-EXT.PrinterPort(JP11)....................................... 9
2XPCInstallation Guide....................................................................................... 10
2.1Installation.................................................................................................... 10
2.1.1Removethe Cover............................................................................... 10
2.1.2Removethe Rack .................................................................................11
2.2CPUand ICEInstallation............................................................................. 12
2.2.1Removethe ICEModule...................................................................... 12
2.2.2InstalltheCPU..................................................................................... 14
2.2.3InstalltheICEModule........................................................................... 16
2.3DDR Installation ........................................................................................... 17
2.4Cableand Rack Installation ........................................................................ 19
2.4.1InstalltheFDDCable........................................................................... 19
2.4.2InstalltheRack..................................................................................... 20
2.5PeripheralInstallation ................................................................................ 22
2.5.1InstalltheSerialATAHDD.................................................................... 22

2.5.2InstalltheFloppyDrive......................................................................... 22
2.5.3Install anOpticalDrive.......................................................................... 23
2.6Accessories Installation .............................................................................. 24
2.6.1InstallPCI/AGPCard........................................................................... 24
2.7FinalTouches............................................................................................... 26
2.7.1Closethe ChassisCover..................................................................... 26
2.7.2Complete............................................................................................ 26
2.8XPCAccessories ......................................................................................... 27
2.9TechSupport............................................................................................... 27
2.ATechnicalNotes:ClearCMOSButton ........................................................ 27
3Driverand SoftwareInstallation......................................................................... 28
3.1MainboardCD Overview............................................................................. 28
3.1.1InstallMainboardSoftware................................................................... 29
Appendix................................................................................................................ 30
EntertheBIOS................................................................................................... 30
THEMAINMENU ............................................................................................... 31
STANDARDCMOSFEATURES .................................................................. 33
ADVANCEDBIOSFEATURES .................................................................... 36
ADVANCEDCHIPSETFEATURES ............................................................. 40
INTEGRATEDPERIPHERALS..................................................................... 43
POWERMANAGEMENTSETUP................................................................ 46
PNP/PCICONFIGURATIONS...................................................................... 50
PCHEALTHSTATUS.................................................................................. 51
Frequency/VoltageControl........................................................................... 53
LOADFAIL-SAFEDEFAULTS..................................................................... 54
LOADOPTIMIZEDDEFAULTS..................................................................... 54
SETPASSWORD........................................................................................ 55
SAVE &EXITSETUP.................................................................................. 56
EXITWITHOUTSAVING.............................................................................. 56

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<1.1XPCIntroduction
TheShuttleXPCistheoriginalhigh-performanceSmall FormFactor(SFF)computer.
Sincethefirstmodelwasintroducedin2001,theXPChasbecometheworld’sbest-
sellingSFF computerbrand.
EachShuttleXPCissoldasa”barebone” computer~chassis,powersupplyand
motherboard.Theusermustadd hisownprocessor,memory,drivesand,asapplicable,
expansion cards.TheXPChasbeendesignedtobeeasilyassembledand configured
directlybytheend user.Consumerscanchoosetobuypreconfigured,ready-to-run
XPC’saswell~alistofShuttle-authorizedvalue-addedresellerscanbefound atwww.
shuttle.com.
TheShuttleXPCowesitspopularitytoitsuniquecombination ofsmall-size,high-
performanceand nearuniversalcomponentcompatibility.However,unlike ordinary
desktop computers,ShuttleXPC’shave beenengineeredascompletesystems.
TheXPCconceptcanbesummarizedas:
Useofhigh-performance,industry-standardcomponents;Minimumsize possible,while
preservingcomponentcompatibilityand systemexpansion;Focuson quality~acom-
mitmenttoqualityconstruction,materialsand industrialdesign.
To meettheabove requirements,Shuttlehascreatedand patenteddozensofnew
technologies,includingtheIntegratedCoolingEngine(ICE), whichextend and en-
hancethepersonalcomputingexperiencewhilereducingheat, noiseand space
requirements.
Thankyou forchoosingtheShuttleXPC!
1Function Introduction

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<1.2ModelSpecifications
FormFactor
ShuttleSmall FormFactor
Processor
1.IntelPrescott Desktop Processors intheLGA775 pinpackage with533 /800 MHzFSB.
2.(2004/2005 Mainstream/ValueFMB-04A/05A)
Chipset
FeaturesSiS661FXN.B.and SiS964 S.B..
Memory
Two184-pinDIMM slotstosupportup to2GBofPC2100,PC2700 orPC3200
compliantDDRSDRAMmodule.
Audio
OnBoard5.1ChannelAC97 Audio
Ethernet
RTL8100C,support10/100 Mbpsoperation rateand wake-on-Lan(WOL)function.
IEEE 1394a
VIAVT6307,support400Mb/s,200Mb/s,or100Mb/sdatatransferrate.
SerialATA
SiS964 integratedSATA,TwoChannelUDMA150MB/sS-ATAwithRaid0,1,and
JBOD
Onboardheaders &connectors
(1)ATA100 IDEconnector(1)Floppyconnector(2)SATAconnector
(2)Fanconnectors (1)Power&resetheader(1)Line_Inheader
(1)CD_Inheader(1)MiniCD_Inheader(1)AGP
(2)1x5pinUSB2.0headers (1)Printerportheader(1)PCI
(1)SPDIFIn/Outheader(2)Powerconnector
PSU
Output:200W, Input:100/240VAC,Active PFC,FCC,CE,BSMI,UL,TUV,
CBcertificated
Chassis
G,Dimension:254 (W) x185 (H)x280 (L)
Bay:(2)3.5"bays,(1)5.25"bay

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English
<1.3.1XPCFront
1.5.25"Bay
2.3.5"Bay
3.HDD LED
4.Reset
5.PowerLED
6.Power
7.Aux-in
8.Mic
9.Headphone
10.USBports
11.FireWire® 400 miniport
<1.3XPCExteriorDissection
Note:Shuttleoffers avarietyofdifferentXPCmodelsloadedwithvarious
options.Theillustration belowwill helpfamilarize you withtheincluded
featuresinyournewXPC.
6
5
4
3
1
2
9 10 11
8
7

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<1.3.2XPCBack
1.AC Powersocket
2.COMport
3.VGAport
4.FireWire®400 port
5.USBPorts
6.LANport
7.PS/2Mouse
8.PS/2Keyboard
9.Line-Inport
10.Central/Bass
11.Rearout(R/L)
12.Frontout(R/L)
13.ClearCMOSbutton
A.Wireless LANperforation
B.Parallelportperforation
1
2
4 6 7 10
1394
AB
35 1298 13
11

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Note:BundledAccessoriesmay differfromspecified.If thereareitems
missing,pleasecontactyourlocalauthorizedShuttledealer.
1
23
45 6
8
7
911
12 13
10
<1.4Accessories
1. ICEHeat-Pipe(1)
2.FDD cable(1)
3.Powercord(1)
4.Cableclip(1)
5.Adhesive (1)
6.RAIDDriverFloppyDisk(32bits/64bits)(1)
7.MotherboardCDDriver(32bits/64bits)(2)
8.ShuttleExtrasCD(1)
9.Powerextension cable(1)
10.Heatsinkcompound (1)
11.Screws
12.Cabletie(2)
13.XPCUserGuide(1)
14.RAIDmanual(1)
14

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<1.5XPCMainboard
<1.5.1SS59Gmainboardillustration
SiS
S
i
S
ALC655
ATX Power Connector- CN5
FloppyConnector-FDD1
One IDE Slot- IDE1
Front Panel Connector-JP8
RTL8100C Chipset
SiS 964 Chipset
OneAGPSlot
One PCI Slot
CD-In Connector- CN3
LAN & Dual USB Ports
Socket775
ClearCMOSButton
VGA & COM Ports
PS/2 K/B & M/S Connector
Rear-Out/Front-Out/Center/Bass Audio Connectors
SPDIFIN/OUTConnector-JP4
FAN Connector- FAN1
FrontPanelConnector-JP9
EXT.PrintPort-JP11
Two DIMM Slots
Serial
ATA- SATA1/
Dual Channel
SATA2
ATXPowerConnector-ATX1ITE8705FChip
VT6307Chip
LINE-In Connector- J4
1394 & Dual USB Ports
FAN Connector- FAN2
ALC655Chip
Lind-In Port
MiniCD-InConnector
-CN4
USB Header-USB1
SiS 661FX Chipset
USBHeader- USB3

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English
<1.5.2JumperSettings
PinAssignments(JP8):
1=HDLED_PU2=GLEDA
3=HDLED4=GLEDB
5=Reset_SW6=Power_SW
7=GND 8=GND
9=NC10=KEY
@FrontPanelConnector(JP9/JP8)
HeaderJP8 canbeusedtoprovideoperation statussignalstothefrontdaughterboard.
Notethatthisisanalternative headertothe50pinsstreamlineheaderthatalsocon-
nectsthemotherboardtothefrontdaughterboard.
HeadersJP9 isusedtoconnectcabletofrontpanelconnectormountedon front-panel
orback-panel. Thefrontpaneliswheretheharddrive activitylights,resetbutton,on/
off button,computerpoweron light, USBconnectors,1394 connectors,and audio
headers,arelocated.
@FanConnectors (FAN1/FAN2)
Themainboardprovidestwoonboard12Vcoolingfanpowerconnectorstosup-
portCPU(FAN1), System(FAN2)coolingfans.
Note:Bothcablewiringand typeofplugmay varydependingon thefan
maker.
2
JP9
1
2
49
50
10
RST
HLED
PWON
-
+
GLED/ PWR LED
8642
97531
+
-
+
-
JP8
1
1
GND
SPEED_SENSE
+12V
GND
+12V
SPEED_SENSE
PWMCTRL
FAN2
FAN1

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PinAssignments(USB1/USB3):
1=GND
2=GND
3=Data+
4=Data-
5=VCC
@ExtendedUSBConnectors (USB1/USB3)
TheseheadersareusedtoconnectauxillaryUSBdevicestothemainboard.These
headersaredirectionaland will onlyallowUSBcablestobeconnectedinone
direction.
@LINE-In(J4), CD-In(CN3), MiniCD-In(CN4)Connectors
PortJ4(Blue), CN3(Black)and CN4canbeusedtoconnectastereoaudioinputfrom
CD-ROM,TV-tunerorMPEGcard.
PinAssignments(J4): PinAssignments(CN3): PinAssignments(CN4):
1=Line-inLeft 1=CD-inLeft 1=Ground
2=Ground 2=Ground 2=CD-inRight
3=Ground 3=Ground 3=Ground
4=Line-inRight4=CD-inRight4=CD-inLeft
USB1/USB3
5
4
3
2
1
1234
CD-IN
CN3
1234
Mini CD-In CN4
LINE-IN
J4
1234

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English
@ParallelPortHeader-EXT.PrinterPort(JP11)
ADB25 maleparallelportheaderislocatedneartherearpanelofthemainboard.
Theheaderisusedtoconnectaparallelportsocket(PC8)tothemainboard.The
parallelprinterportcanbepurchasedfromShuttleasanoptionalaccessory.
@SPDIF-In/OutConnector(JP4)
PortJP4 canbeusedtoconnectspecialdevice.
6
5
4
3
2
1
SPDIF- IN/OUT
JP4
14
15
16
17
18
19
20
21
22
23
24
25
26
1
2
3
4
5
6
7
8
9
10
11
12
13
JP11
PinAssignments(JP4):
1=SPDIFIN
2=GND
3=VCC
4=GND
5=VCC
6=SPDIFOUT

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2XPCInstallation Guide
<2.1Installation
Note:Forsafetyreasons,pleaseensurethatthepowercordisdisconnected
beforeopeningthecase.
<2.1.1Remove theCover
1.Unscrewthethree thumbscrews.
2.Slidethecoverbackwardsand upwards.
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Rack
<2.1.2Remove theRack
1.Unfastentherackmountscrews.
2.Remove therack.
1
2
3.Unscrewand remove thefrontbaycovers.
Note:Thereare2screwson eachsideofthemountingrack.

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English
<2.2CPUand ICEInstallation
<2.2.1Remove theICEModule
1.UnfastentheICEfanthumbscrews
on thebackofthechassis.
3.Unfastenthefourattachmentscrews.
2.Unplugthefanpowerconnector.
1
2
3
4

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4.Remove theICEmodulefromthe
chassisand putit aside.
ICEHeat-PipeModule
Heat-pipe
SmartFan
SmartFanPowerConnector