Siemens SIMATIC ET 200SP HA User guide

SIMATIC
ET 200SP HA
ET 200SP HA Distributed I/O system
System Manual
08/2019
A5E39261167-AD
Security information 1
Preface 2
System overview 3
Plant planning 4
Installation 5
Wiring 6
Removal 7
Maintenance 8
Technical specifications 9
Dimension drawings A
Accessories/spare parts B
Leakage resistance of the IO
device C
Service & Support D

Legal information
Warning notice system
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent
damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert
symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are
graded according to the degree of danger.
DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.
WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.
CAUTION
indicates that minor personal injury can result if proper precautions are not taken.
NOTICE
indicates that property damage can result if proper precautions are not taken.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will be
used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to property
damage.
Qualified Personnel
The product/system described in this documentation may be operated only by personnel qualified for the specific
task in accordance with the relevant documentation, in particular its warning notices and safety instructions. Qualified
personnel are those who, based on their training and experience, are capable of identifying risks and avoiding
potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:
WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
documentation. If products and components from other manufacturers are used, these must be recommended or
approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and
maintenance are required to ensure that the products operate safely and without any problems. The permissible
ambient conditions must be complied with. The information in the relevant documentation must be observed.
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may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software described.
Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the information in this
publication is reviewed regularly and any necessary corrections are included in subsequent editions.
Siemens AG
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A5E39261167-AD
Ⓟ 09/2019 Subject to change
Copyright © Siemens AG 2017 - 2019.
All rights reserved

Table of contents
1 Security information......................................................................................................................................7
2 Preface .........................................................................................................................................................9
2.1 Documentation guide for ET 200SP HA.................................................................................12
2.2 2D matrix code (QR code / EAN code) ..................................................................................14
3 System overview ........................................................................................................................................15
3.1 What is the SIMATIC ET 200SP HA distributed I/O system? ................................................15
3.2 Basic components of the IO device........................................................................................17
3.3 Accessories for the IO device ................................................................................................21
4 Plant planning.............................................................................................................................................23
4.1 Topology ................................................................................................................................23
4.2 Basics.....................................................................................................................................25
4.3 Special conditions for safe use of the ET 200SP HA .............................................................26
4.4 Potential relationships in the IO device ..................................................................................27
4.5 Hardware configuration ..........................................................................................................28
4.6 Selecting the carrier module ..................................................................................................30
4.7 Configurations of the slots of I/O modules .............................................................................32
4.7.1 Selecting a terminal block for I/O modules.............................................................................32
4.7.2 Forming potential groups .......................................................................................................34
4.7.2.1 Forming potential groups by arranging terminal blocks .........................................................34
4.7.2.2 Configuration examples for potential groups..........................................................................37
4.7.2.3 Terminal block with potential distributor (L+ potential)...........................................................39
4.7.2.4 Terminal block with potential distributor (M potential) ............................................................41
4.8 Redundancy and changes during operation ..........................................................................43
4.8.1 Connection of the IO device via system redundancy .............................................................44
4.8.2 Connection of the IO device via media redundancy...............................................................47
4.8.3 IO redundancy........................................................................................................................49
4.9 Time synchronization and time stamping...............................................................................52
4.9.1 Overview - Time synchronization and time stamping with ET 200SP HA..............................52
4.9.2 Plant-wide time synchronization and time stamping with a precision of 1 ms........................52
4.9.3 Time synchronization and time stamping with a single CPU .................................................55
4.9.4 Time synchronization and time stamping with redundant CPU..............................................56
5 Installation ..................................................................................................................................................59
5.1 Overview ................................................................................................................................59
5.2 Minimum clearances in the control cabinet ............................................................................60
5.3 Installing the rail .....................................................................................................................61
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5.4 Mounting the interface module...............................................................................................66
5.5 Mounting an carrier module for I/O module slots ...................................................................68
5.6 Installing the terminal block....................................................................................................71
5.7 Installing the server module and power bus cover.................................................................73
6 Wiring .........................................................................................................................................................75
6.1 Markings of IO device components........................................................................................75
6.1.1 Factory markings....................................................................................................................75
6.1.2 Optional markings ..................................................................................................................76
6.1.3 Applying color-coded labels ...................................................................................................77
6.1.4 Applying labeling strips ..........................................................................................................78
6.1.5 Applying reference identification labels..................................................................................79
6.2 Rules and regulations for operation .......................................................................................80
6.3 Operation of the IO device on a grounded power supply.......................................................82
6.4 Wiring rules ............................................................................................................................85
6.5 Wiring the terminal block........................................................................................................86
6.6 Connecting cable shields .......................................................................................................91
6.7 Connecting the power supply to the interface module ...........................................................94
6.8 Connecting interfaces for communication ..............................................................................96
6.8.1 Connecting the BusAdapter ...................................................................................................97
6.9 Inserting I/O modules or slot cover ......................................................................................100
7 Removal ...................................................................................................................................................103
7.1 Removing a server module and power bus cover................................................................103
7.2 Removing a terminal block...................................................................................................105
7.3 Removing the carrier module ...............................................................................................108
7.4 Removing a BusAdapter from the interface module ............................................................110
7.5 Removing the interface module ...........................................................................................111
7.6 Removing the carrier module for the interface module ........................................................112
7.7 Removing I/O modules.........................................................................................................114
7.8 Removing color-coded labels...............................................................................................116
8 Maintenance .............................................................................................................................................117
8.1 Pulling and plugging modules in runtime (overview)............................................................117
8.2 Set the I/O module to the maintenance position ..................................................................119
8.3 Replacing an I/O module......................................................................................................120
8.4 Communication error "IO redundancy warning" (maintenance event: error code 121H) .....122
8.5 Replacing an I/O module with another type .........................................................................123
8.6 Replacing a terminal block ...................................................................................................125
8.7 Removing wires....................................................................................................................128
Table of contents
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8.8 Resetting the interface module to factory settings ...............................................................129
8.9 Firmware update for interface modules / I/O modules ........................................................131
8.10 Firmware update for the server module ...............................................................................132
9 Technical specifications............................................................................................................................133
9.1 Standards and approvals .....................................................................................................133
9.1.1 Currently valid markings and approvals ...............................................................................133
9.1.2 CE marking ..........................................................................................................................134
9.1.3 Explosion protection.............................................................................................................135
9.1.4 cULus approval ....................................................................................................................136
9.1.5 cULus HAZ. LOC. approval..................................................................................................136
9.1.6 cFMus approval....................................................................................................................136
9.1.7 Marking for Australia and New Zealand ...............................................................................136
9.1.8 Korea Certificate ..................................................................................................................137
9.1.9 Marking for the Eurasian Customs Union ............................................................................137
9.2 Electromagnetic compatibility...............................................................................................138
9.3 Shipping and storage conditions ..........................................................................................142
9.4 Mechanical and climatic environmental conditions ..............................................................143
9.5 Information on insulation, protection class, degree of protection and rated voltage ............146
9.6 Technical specifications of subcomponents of the ET 200SP HA .......................................148
9.6.1 Power supply (SELV/PELV).................................................................................................148
9.6.2 Technical specifications for the modules .............................................................................148
9.6.3 Technical specifications - Carrier modules (TM)..................................................................148
9.6.4 Technical specifications - Terminal blocks...........................................................................153
9.6.5 Technical specifications - Server module.............................................................................164
A Dimension drawings .................................................................................................................................165
A.1 Dimension drawings of the rails ...........................................................................................165
A.2 Shield connector ..................................................................................................................167
A.3 Labeling strip........................................................................................................................168
A.4 Reference identification labels .............................................................................................169
A.5 Color-coded labels ...............................................................................................................170
B Accessories/spare parts ...........................................................................................................................171
C Leakage resistance of the IO device ........................................................................................................173
D Service & Support.....................................................................................................................................175
D.1 Mounting rules......................................................................................................................178
D.2 Cable cross-sections and ferrules........................................................................................179
Glossary ...................................................................................................................................................181
Index.........................................................................................................................................................183
Table of contents
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Table of contents
ET 200SP HA Distributed I/O system
6System Manual, 08/2019, A5E39261167-AD

Security information 1
Siemens provides products and solutions with industrial security functions that support the
secure operation of plants, systems, machines and networks.
In order to protect plants, systems, machines and networks against cyber threats, it is
necessary to implement – and continuously maintain – a holistic, state-of-the-art industrial
security concept. Siemens’ products and solutions constitute one element of such a concept.
Customers are responsible for preventing unauthorized access to their plants, systems,
machines and networks. Such systems, machines and components should only be connected
to an enterprise network or the internet if and to the extent such a connection is necessary and
only when appropriate security measures (e.g. firewalls and/or network segmentation) are in
place.
For additional information on industrial security measures that may be implemented, please
visit
https://www.siemens.com/industrialsecurity.
Siemens’ products and solutions undergo continuous development to make them more secure.
Siemens strongly recommends that product updates are applied as soon as they are available
and that the latest product versions are used. Use of product versions that are no longer
supported, and failure to apply the latest updates may increase customer’s exposure to cyber
threats.
To stay informed about product updates, subscribe to the Siemens Industrial Security RSS
Feed under
https://www.siemens.com/industrialsecurity.
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD 7

Security information
ET 200SP HA Distributed I/O system
8System Manual, 08/2019, A5E39261167-AD

Preface 2
Purpose of the documentation
This documentation provides comprehensive information on using the ET 200SP HA
distributed I/O system in the automation system:
● General information on the ET 200SP HA distributed I/O system
● Configuring
● Installation
● Wiring
● Commissioning
Basic knowledge required
A basic knowledge of automation technology is required to understand the documentation.
Validity of the documentation
This documentation applies to the ET 200SP HA distributed I/O system.
The PROFINET IO system based on the ET 200SP HA distributed I/O system can be used in
the following combination:
Process control system As of version CPU in the automation system
SIMATIC PCS 7 V9.0 SIMATIC CPU 410-5H
Configuration of the ET 200SP HA
You can configure the following components of the ET 200SP HA when the following updates
are installed:
Component of the ET 200SP HA Required updates
Shared device for IM155-6 PN HSP0272 V1.01.00
AI (potential distributor terminal block) HSP0273
AQ (potential distributor terminal block) HSP0274
DI 32x24VDC HA HSP0275 V2.00.00
DQ 32x24VDC/0.5A HA HSP0276 V2.00.00
BusAdapter (types: LC/FC; LC/RJ45) HSP0278
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD 9

Conventions
Please pay particular attention to notes highlighted as follows:
Note
Notes contain important information on the product, handling the product or on part of the
documentation to which you should pay particular attention.
Special information
Note
Important note for maintaining operational safety of your plant
Plants with safety-related features are subject to special operational safety requirements on the
part of the operator. Even suppliers are required to observe special measures during product
monitoring. We can notify you of product developments and features that are (or could be)
important for operation of safety-related systems.
To ensure you are always up to date in this regard and can make changes to your system, if
necessary, you need to subscribe to the corresponding notifications.
Newsletter
1. Register for the following newsletters on the Internet (http://www.industry.siemens.com/
newsletter_v4/public/LoginPage.aspx):
– SIMATIC S7-4xx
– PCS 7 as of V9.0
– Distributed I/O
– SIMATIC Industrial Software
2. Select the "Current" check box for these newsletters.
Recycling and disposal
The products are low in pollutants and can be recycled. For environmentally compliant
recycling and disposal of your electronic waste, please contact a company certified for the
disposal of electronic waste.
Additional support
● Information about the technical support available can be found in the appendix to
this documentation (Page 175).
● The technical documentation for the individual SIMATIC products and systems is available
on the Internet (http://www.siemens.com/simatic-tech-doku-portal).
● The online catalog and the ordering system are available on the Internet (https://
mall.industry.siemens.com).
Preface
ET 200SP HA Distributed I/O system
10 System Manual, 08/2019, A5E39261167-AD

Changes compared to the previous version
You can find an overview of the most important changes here:
● V1.2 or higher:
– Counter function integrated
– Additional approvals
See also
Contact (http://support.industry.siemens.com/aspa_app/)
Preface
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD 11

2.1 Documentation guide for ET 200SP HA
The documentation for the distributed I/O system SIMATIC ET 200SP HA is divided into three
areas.
This division allows you easier access to the specific information you require.
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Basic information
● The system manual includes a detailed description of installation and wiring of the
ET 200SP HA.
● Information on configuring ET 200SP HA is available in the following sections of the
documentation:
Configuration with PCS 7:
– Configuration Manual PCS 7 process control system; Engineering System
– Function Manual PCS 7 process control system; High-availability process control
systems
– Function Manual PCS 7 process control system; Time synchronization
– Function manual SIMATIC; ET 200SP HA; High-precision time stamping with ET 200SP
HA
Device information
Product manuals contain a compact description of the module-specific information, such as
properties, terminal diagrams, characteristics and technical specifications.
Comprehensive information
The function manuals contain detailed descriptions of general topics relating to the
ET 200SP HA, for example, diagnostics, communication, designing interference-free
controllers.
Preface
2.1 Documentation guide for ET 200SP HA
ET 200SP HA Distributed I/O system
12 System Manual, 08/2019, A5E39261167-AD

Information on changes
Changes and additions to the manuals are documented in a product information file when
necessary.
Downloads
You can find the full versions of the documentation as of PCS 7 V9.0 as downloads for the
"Technical Documentation of SIMATIC PCS 7" on the Internet (http://www.siemens.com/pcs7-
documentation):
Technical documentation SIMATIC PCS 7 > "Manuals for SIMATIC PCS 7 Vx.x" area >
"Hardware manuals SIMATIC PCS 7 Vx.x" > Distributed I/O
Documentation can be downloaded free of charge.
ET 200SP HA Manual Collection
● The Manual Collection contains the complete documentation for the ET 200SP HA in a
single file.
My Documentation Manager
● The My Documentation Manager is used to combine entire manuals or only parts of these
to your own manual.
You can export the manual as PDF file or in a format that can be edited later.
● You can find the My Documentation Manager on the Internet (http://
support.industry.siemens.com/My/ww/en/documentation).
Application examples
● Applications examples support you with various tools and examples for solving your
automation tasks. Solutions are shown in interplay with multiple components in the system
- separated from the focus in individual products.
● You can find application examples on the Internet (http://support.industry.siemens.com/cs/
ww/en/ps/ae).
CAx data
● You can use the CAx Download Manager to access current product information for your
CAD or CAE system.
● You configure your own download package with a few clicks.
● In doing so you can select:
– Product images, 2D dimension drawings, 3D models, internal circuit diagrams, EPLAN
macro files
– Manuals, characteristics, operating manuals, certificates
– Product master data
● You can find the CAx Download Manager on the Internet (http://
support.industry.siemens.com/my/ww/en/CAxOnline).
Preface
2.1 Documentation guide for ET 200SP HA
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD 13

2.2 2D matrix code (QR code / EAN code)
The 2D matrix code on the product is a coded representation of the product-specific article
number.
Access to product-related information
For reading the 2D matrix code, SIEMENS offers an app for mobile use.
Information about the app and the download can be found on the Internet: "Mobile use via app
(https://support.industry.siemens.com/cs/ww/en/sc/2067)".
The app provides direct access to the technical forum and product related posts, such as:
● FAQs
● Application examples
● Manuals
● Certificates
● Product notices
Preface
2.2 2D matrix code (QR code / EAN code)
ET 200SP HA Distributed I/O system
14 System Manual, 08/2019, A5E39261167-AD

System overview 3
3.1 What is the SIMATIC ET 200SP HA distributed I/O system?
The SIMATIC ET 200SP HA distributed I/O system is a scalable and highly flexible I/O system
that enables you to connect process signals to a higher-level controller via PROFINET IO.
Customer benefits of the system
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Area of application
The SIMATIC ET 200SP HA distributed I/O system is suitable for a variety of applications. The
scalable design allows you to adjust your configuration to the specific local requirements.
The range of I/O modules is constantly expanding.
● You can obtain information on new modules through the newsletter.
● You can find information about the existing product range in the current catalog.
ET 200SP HA is designed with IP 20 degree of protection and for installation in a control cabinet.
Applications for safety engineering
Through use of fail-safe CPUs, you implement applications for safety engineering. You perform
configuration and programming of your safety program, just like the configuration and
programming for your standard CPUs.
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD 15

Configuration example
For use in an automation system, you combine the following components of the
SIMATIC ET 200SP HA distributed I/O system into an IO device. An example configuration of
an IO device is shown in the following figure:

Figure 3-1 Example configuration for an IO device
Table 3-1 Legend for sample configuration (numbering in the installation sequence)
①Rail: The rail is the type-specific installation platform of the IO device.
②Carrier module for interface module: The carrier modules are used for the electrical and mechanical connection of the
individual modules.
③Plug-in connector 4-pin: Connection for supply voltage (X80)
④Interface module: An interface module is the interface of the distributed I/O system to the central unit of the automation
system.
⑤BusAdapter: The BusAdapter connects the IO device to the IO controller (CPU) via PROFINET IO.
⑥Carrier modules for I/O: The slots for the I/O modules are created by the connection of these carrier modules to the
terminal blocks.
⑦
⑧
Terminal blocks: The terminal blocks provide the process terminals for connecting sensors, actuators and other devices.
⑦ Light-colored terminal block TB..D: Separation of potential groups and terminals for connection to the supply voltage
⑧ Dark-colored terminal blocks TB..B: Extending the potential group
⑨I/O modules: The I/O modules are converters between the process signals and the digital data of the interface modules.
⑩Power bus cover: Server module and power bus cover complete the configuration of the IO device.
⑪Server module: Server module and power bus cover complete the configuration of the IO device.
⑫Reference identification label: The reference identification labels are used to identify the slots.
System overview
3.1 What is the SIMATIC ET 200SP HA distributed I/O system?
ET 200SP HA Distributed I/O system
16 System Manual, 08/2019, A5E39261167-AD

3.2 Basic components of the IO device
Basic components for configuration of IO devices
The following tables show the components for configuring IO devices based on the ET 200SP
HA distributed I/O.
Table 3-2 Rail
Function Figure
The rail is the component on which the modules of the IO device are
attached.
The upper part corresponds to a standard rail (width 35 mm).
Table 3-3 Carrier module for interface module
Function Figure
Carrier modules for interface modules are available in the following
versions:
● Carrier module for 1 interface module
(required for singular connection of the IO device to PROFINET
IO)
● Carrier module for 2 interface modules
(required for redundant connection of the IO device to
PROFINET IO)
The carrier modules connect the interface module to the backplane
bus.
They enable data exchange with the I/O modules.
Note:
Interface modules cannot be plugged in if the corresponding con‐
nector for the supply voltage is plugged in beforehand.
System overview
3.2 Basic components of the IO device
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD 17

Table 3-4 Interface module (module for PROFINET IO)
Function Figure
The interface module:
● Connects the IO device to the IO controller
● Exchanges data with I/O modules via the backplane bus.
Table 3-5 BusAdapter
Function Figure
The BusAdapters for PROFINET IO allow you to freely choose the
connection system for the IO device. Several versions of the BusA‐
dapter are available for the interface modules (see documentation
SIMATIC Distributed I/O; BusAdapter for distributed I/O (https://
support.industry.siemens.com/cs/ww/en/view/109747250)):
Examples:
● BusAdapter with standard RJ45-connector
(BusAdapter 2×RJ45) ①
● BusAdapter with FastConnect connector for direct connection of
the bus cable (BA 2×FC) ②
● BusAdapter with connector for fiber-optic cable (BA 2xLC) ③

Table 3-6 Carrier module
Function Figure
The carrier module routes the backplane bus to all I/O modules. The
power bus is extended depending on each placed terminal block.
Carrier modules for I/O modules are available in the following ver‐
sions:
● Carrier module 2x
● Carrier module 8x
Note:
The fixing screws are secured for transport in the factory state.
Remove these transport locks before tightening the fixing screws.
System overview
3.2 Basic components of the IO device
ET 200SP HA Distributed I/O system
18 System Manual, 08/2019, A5E39261167-AD

Table 3-7 Terminal block
Function Figure
The selection of terminal blocks determines the following properties:
● Type of supply voltage
● Formation of potential groups
● Type of the required I/O module
● Redundant configuration of the I/O modules
● Terminal block with potential distributor
Select the terminal blocks according to the plant-specific require‐
ments.
You can find information on this in the section "Selecting a terminal
block for I/O modules (Page 32)".
Example illustration: Basic view of selected terminal blocks (dark-
colored type in this case)
Table 3-8 I/O module
Function Figure
With ET 200SP HA, the I/O modules are inserted in slots, which
arise from the combination of carrier module and terminal block. The
I/O modules detect the current process status or trigger correspond‐
ing reactions through the sensors and actuators connected to the
terminal block.
In addition to the standard modules (DI; DQ; AI; AQ), there are the
following types of modules:
● Relay module (RQ)
● Universal module
Note:
All I/O modules with a signal voltage up to 24 V can be used for IO
redundancy.
Table 3-9 Slot cover
Function Figure
Insert a slot cover on terminal blocks:
● When slots are not plugged with I/O modules.
● When slots are reserved for future expansion (as empty spaces).
You can insert a label strip for the planned I/O module on the front
of the slot cover.
System overview
3.2 Basic components of the IO device
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD 19

Table 3-10 Server module and power bus cover
Function Figure
Server module and power bus cover complete the configuration of
the IO device.
The power bus cover is used to protect the power bus contacts.
Table 3-11 Coding element (for terminal block)
Function Figure
There is a mechanical coding element for the ET 200SP HA distrib‐
uted I/O system. This element encodes the type of the installed I/O
module.
You can find additional information on this in the section "Replacing
an I/O module with another type (Page 123)".
Component for the supply voltage
You can find information on suitable components on the Internet (https://
support.industry.siemens.com/cs/ww/en/view/9172884): Interactive Catalog CA01;
Automation and Drives
System overview
3.2 Basic components of the IO device
ET 200SP HA Distributed I/O system
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