
Interface Module IM 155-6 PN R1 (6ES7155-6AU00-0HM0)
Equipment Manual, 11/2022, A5E51160307-AA 5
Table of contents
Preface ................................................................................................................................................... 3
1 ET 200SP Documentation Guide ............................................................................................................ 7
1.1 Information classes ET 200SP............................................................................................... 7
1.2 Basic tools ........................................................................................................................... 9
1.3 MultiFieldbus Configuration Tool (MFCT) ........................................................................... 10
1.4 SIMATIC Technical Documentation ..................................................................................... 11
2 Product overview................................................................................................................................. 13
2.1 Properties .......................................................................................................................... 13
2.2 Functions .......................................................................................................................... 17
2.2.1 Supported Ethernet services: ICMP, ARP, SNMP, LLDP ......................................................... 19
2.2.2 Port diagnostics ................................................................................................................. 19
2.2.3 Disabling of ports............................................................................................................... 19
2.2.4 Minimum update time 1 ms ............................................................................................... 19
2.2.5 Device replacement without programming device (PG) and without topological
configuration..................................................................................................................... 20
2.2.6 Media redundancy protocol (MRP) ..................................................................................... 21
2.2.7 Distribution of module channels to a maximum of 4 submodules ....................................... 21
2.2.8 Real-time communication .................................................................................................. 21
2.2.9 Use of fail-safe modules..................................................................................................... 22
2.2.9.1 Redundancy switchover times for the fail-safe modules...................................................... 22
2.2.10 System redundancy R1....................................................................................................... 22
2.2.11 Value status of I/O modules................................................................................................ 22
2.2.12 Reading out service data .................................................................................................... 23
2.2.13 Reference temperature distribution.................................................................................... 23
2.2.14 H-Sync forwarding ............................................................................................................. 23
2.2.15 Setting the time................................................................................................................. 24
2.2.16 Time distribution ............................................................................................................... 24
2.2.17 Diagnostic interrupts.......................................................................................................... 24
2.2.18 Hardware interrupts........................................................................................................... 24
2.2.19 Removal/insertion of multiple I/O modules during operation (Multi Hot Swap).................... 25
2.2.20 Maintenance events........................................................................................................... 25
2.2.21 Reset to factory settings via PROFINET IO............................................................................ 25
2.2.22 Firmware update via PROFINET IO ...................................................................................... 25
2.2.23 Identification data I&M 0 to I&M 3...................................................................................... 26
3 Wiring .................................................................................................................................................. 27
3.1 Pin assignment .................................................................................................................. 27
3.2 Schematic circuit diagram.................................................................................................. 28