Siemens Vendor User manual

Manual Number: 19001467
Version 1.0
December 2006
FOR INTERNAL COMPANY USE ONLY!!
Siemens Energy & Automation, Inc.
Large Drives A
ROBICON
500 Hunt Valley Road, New Kensington, PA, USA, 15068
Phone: [phone] Customer Support Phone: [phone] (24-hours)
Fax: [phone] Customer Support Fax: [phone]
Web: Customer Support E-mail: [email protected]
MICROHARMONY CELL
SIZES 40 - 260A
MANUAL
www.robiconperfectharmony.com

For the support representative nearest you, please call Siemens main office at 724.339.9500.
Version History
©2006 by s. No portion of this document may be reproduced either mechanically or electronically without the prior consent of sLD-A
Reference Documents
Always refer to the latest archived revision
40A BOM: 10000424.040
70A BOM: 10000424.070
100A BOM: 10000424.100
140A BOM: 10000424.140
200A BOM: 10000494.200
260A BOM: 10000494.260
40-140A Assembly: D10000424A.ALL
40-140A Schematic: D10000424S.ALL
200-260A Assembly: D10000494A.ALL
200-260A Schematic: D10000494.S.ALL
Production Test Specification: TSI-062
Ratings and Test Parameters: TSF-058
Repair Test Specification: TSI-063
Traceability Standard: QSF-013
Wiring Practices Standard: QSI-011
Fiber Optic Standard: MFI-025
Workmanship Standard: MFI-017
Version 1.0 (original) December 2006

MicroHarmony Cell Sizes 40 - 260A Manual Table of Contents
Table of Contents
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Safety Precautions and Warnings.................................................................................... v
Chapter 1: Cell Overview ..............................................................................................1-1
Introduction ..........................................................................................................1-1
Features ................................................................................................................1-3
Cell Racking System .....................................................................................1-3
Rear Blind-Mate Power Connections............................................................1-3
Snubberless design ........................................................................................1-4
Fusing............................................................................................................1-4
Cell Control Board ........................................................................................1-4
Gate Clamp Board.........................................................................................1-4
Overload........................................................................................................1-4
Heat Sink Design...........................................................................................1-5
Enclosure.......................................................................................................1-5
Increased input voltage rating .......................................................................1-5
Multiple Sources ...........................................................................................1-5
Simple Design ...............................................................................................1-5
Electrolytic Capacitors with Plastic Mounting Tray.....................................1-5
Chapter 2: Physical Description ...................................................................................2-1
Mechanical Specifications....................................................................................2-1
Connections 40-260A...........................................................................................2-2
Environmental Specifications...............................................................................2-2
40-140A Outline...................................................................................................2-4
200-260A Outline.................................................................................................2-5
Access and Connections.......................................................................................2-6
Indicators and Labels............................................................................................2-7
Key Components ..................................................................................................2-8
Bill of Material Structure ...................................................................................2-11
Assembly Notes..................................................................................................2-13
Heat Sink Thermal Compound....................................................................2-13
Semiconductor Torque Specifications ........................................................2-14
Capacitors....................................................................................................2-15
Multiple Sources .........................................................................................2-16

Table of Contents MicroHarmony Cell Sizes 40 - 260A Manual
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Chapter 3: Installation .................................................................................................. 3-1
Packaging Requirements...................................................................................... 3-1
Lifting Preferences............................................................................................... 3-1
System Installation and Removal ........................................................................ 3-2
System Requirements (40-140A)......................................................................... 3-3
Chapter 4: Electrical Description................................................................................ 4-1
Ratings and Performance ..................................................................................... 4-1
De-ratings............................................................................................................. 4-3
Schematic- 40-140A cells (10000424S) .............................................................. 4-4
Schematic- 200-260A cells (10000494S) ........................................................... 4-5
Chapter 5: Cell Control Board - 10000432................................................................. 5-1
New Features ....................................................................................................... 5-1
Outline, Mounting, and Connections................................................................... 5-1
Power Supply....................................................................................................... 5-2
Gate Drive............................................................................................................ 5-3
Typical Gate Drive Circuit ........................................................................... 5-3
Gate Drive Propagation Delay and Dead Time ............................................ 5-3
OOS Detection/Latch.................................................................................... 5-4
Bus Voltage Sensing and Protection............................................................. 5-4
Protection Features .............................................................................................. 5-5
Communication.................................................................................................... 5-6
Chapter 6: Gate Clamp Board ..................................................................................... 6-1
Chapter 7: Testing ......................................................................................................... 7-1
Documents for Testing Cells ............................................................................... 7-1
Testing Equipment............................................................................................... 7-1
Required Tests ..................................................................................................... 7-1
Chapter 8: Repair Hints................................................................................................ 8-1
Reporting Failures................................................................................................ 8-1
Approved Components ........................................................................................ 8-1
Basic Rules .......................................................................................................... 8-1
General Repair Hints and Procedures.................................................................. 8-1
Component Re-use............................................................................................... 8-2
Non-Catastrophic Rectifier Failures............................................................. 8-2
Non-Catastrophic IGBT Failures.................................................................. 8-2
Electrolytic Capacitors.................................................................................. 8-3

MicroHarmony Cell Sizes 40 - 260A Manual Table of Contents
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In all cases the cell must pass all specified testing before re-using .............. 8-3
Chapter 9: Application Notes........................................................................................ 9-1
External Wiring.................................................................................................... 9-1
Fusing................................................................................................................... 9-1
Device Model Parameters .................................................................................... 9-2
40-140A Rectifier Modules .......................................................................... 9-2
200-260A Rectifier Modules ........................................................................ 9-3
IGBT Modules - Primary Sources ................................................................ 9-4
General Information ............................................................................................. 9-5
Cell Loss Calculations.......................................................................................... 9-6
Rectifier Losses vs Output Current............................................................... 9-6
Total IGBT/FWD Cell Losses vs Output Current ........................................ 9-7
Individual IGBT Losses vs Output Current .................................................. 9-8
Capacitor Losses vs Output Current ............................................................. 9-9
Total Cell Losses......................................................................................... 9-10
Heat Sink Temperature Monitor ........................................................................9-11
Exiting Air Temperature .................................................................................... 9-14
Capacitors........................................................................................................... 9-14
Flammability ............................................................................................... 9-14
Shelf Life and Reforming ........................................................................... 9-14
Failure Modes ............................................................................................. 9-15
Useful Life Calculations ............................................................................. 9-15
Disposal....................................................................................................... 9-16
Output Voltage Capability ................................................................................. 9-16
Normal Operation ....................................................................................... 9-16
Output Voltage capability after bypass....................................................... 9-17
Example of calculating Drive Output Voltage capability........................... 9-17
Output Current Capability.................................................................................. 9-17
Output frequency and switching frequency ....................................................... 9-17
MicroHarmony Volt Map .................................................................................. 9-18
Chapter 10: Drive Calc Express ................................................................................. 10-1
Chapter 11: Communication Protocol ....................................................................... 11-1
Operating Modes................................................................................................ 11-1
Reference Documents ........................................................................................ 11-1
Fiber Optic Message Protocol............................................................................ 11-1
Error Handling ................................................................................................... 11-2

Table of Contents MicroHarmony Cell Sizes 40 - 260A Manual
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Parity.................................................................................................................. 11-2
Cell Data ............................................................................................................ 11-3
Mode 00 Data..................................................................................................... 11-4
Modulator to CCB ...................................................................................... 11-4
CCB to Modulator ...................................................................................... 11-5
Mode 01 Data..................................................................................................... 11-6
Modulator to CCB ...................................................................................... 11-6
CCB to Modulator ...................................................................................... 11-6
Mode 10 Data..................................................................................................... 11-7
Modulator to CCB ...................................................................................... 11-7
CCB to Modulator ...................................................................................... 11-7
Mode 11 Data..................................................................................................... 11-8
Modulator to CCB ...................................................................................... 11-8
Device Testing ................................................................................................... 11-8
Device Test Control Data ........................................................................... 11-8
CCB to Modulator ...................................................................................... 11-9
NOTES...........................................................................................................................N-1

MicroHarmony Cell Sizes 40 - 260A Manual Safety Precautions and Warnings
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MicroHarmony Power Cells are designed with considerable thought to personal safety. However, as with any piece of
high power equipment, there are numerous internal connections that present potentially lethal voltages. In addition,
some internal components are thermally hot to the touch. Follow the warnings below when working in or near a
MicroHarmony Power Cell.
Safety Precautions and Warnings
Danger - Electrical Hazards!
•Always follow the proper lock-out/tag-out procedures before beginning any maintenance or trouble-
shooting work on the drive.
•Always follow standard safety precautions and local codes during installation of external wiring. Pro-
tective separation must be kept between extra low voltage (ELV) wiring and any other wiring as spec-
ified in IEC6180-5-1.
•Always use caution when handling the cell chassis. Even though sharp edges are deburred, the edges
can cause lacerations. Protective gloves are recommended when handling the cell.
•Always work with one hand, wear insulated or rubber safety shoes, and wear safety glasses. Also,
always work with another person present.
•Always use extreme caution when handling or measuring components that are inside the enclosure. Be
careful to prevent meter leads from shorting together or from touching other terminals.
•Use only instrumentation (e.g., meters, oscilloscopes, etc.) intended for high voltage measurements
(that is, isolation is provided inside the instrument, not provided by isolating the chassis ground of the
instrument).
•Never assume that switching off the input disconnect will remove all voltage from internal compo-
nents. Hazardous voltage is still present on the terminals of the input disconnect. Also, there may be
voltages present that are applied from other external sources.
• Allow at least 5-8 minutes after disconnecting power before accessing the cell. The DC Bus capacitors
must discharge through the bleeder resistor after the main is disconnected. A DC bus indicator light is
located at the front of the cell on the cell control board, and will stay lit at bus voltages greater than
50VDC.
•Never touch anything within the chassis or anything within the cell until verifying that it is neither
thermally hot nor electrically alive.
•Never remove safety shields (marked with a HIGH VOLTAGE sign) or attempt to measure points
beneath the shields.
•Never run the drive with cabinet doors open. The only exception is the control cabinet which contains
extra low voltages (ELV).
•Never connect any grounded (i.e., non-isolated) meters or oscilloscopes to the WCIII system.
•Never connect or disconnect any meters, wiring, or printed circuit boards while the drive is energized.
•Never defeat the instrument’s grounding.
•Only qualified individuals should install, operate, troubleshoot, and maintain this drive. A qualified
individual is “one familiar with the construction and operation of the equipment and the hazards
involved.”
•Hazardous voltages may still exist within the cell cabinet even when the disconnect switch is open
(off) and the supply power is shut off.

Safety Precautions and Warnings MicroHarmony Cell Sizes 40 - 260A Manual
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Warning!
•Always comply with local codes and requirements if disposal of failed components is
necessary (for example, CPU battery, capacitors, etc.).
•Always ensure the use of an even and flat truck bed to transport the WCIII drive system. Before
unloading, be sure that the concrete pad is level for storage and permanent positioning.
•Always confirm proper tonnage ratings of cranes, cables, and hooks when lifting the
drive system. Dropping the cabinet or lowering it too quickly could damage the unit.
•Never disconnect control power while medium voltage is energized. This could cause
severe system overheating and/or damage.
•Never store flammable material in, on, or near the cell. This includes equipment drawings and manuals.
•Never use fork trucks to lift cabinets that are not equipped with lifting tubes. Be sure
that the fork truck tines fit the lifting tubes properly and are the appropriate length.
•Never run the cell with the chassis lid off or cell control board panel removed unless open area is prop-
erly covered and sealed off. This ensures personal safety and proper air flow.
•Do not energize the cell without air flow. Although the cell may not be loaded, the bleeder resistor will
dissipate heat during no load. This will stress the resistor and possible melt wires. Always have ade-
quate air flow before energizing.
•Always use the recommended fuses. Fuses were specifically selected to coordinate all known types of
faults, overloads, and inrush current. Improper fuse selection can cause nuisance trips or high imped-
ance arcing faults that do not clear which could result in a catastrophic fire.
• When lifting with cranes, be sure the crane, cables, and hooks have proper tonnage rating. Be careful
not to drop the cabinet or lower it too quickly. This could damage the unit.
• When transporting the drive system, the truck bed must be even and flat. Before unloading, be sure that
the concrete pad is level for storage as well as permanent positioning.
ESD Sensitive Equipment!
• IGBT gate emitter leads should be shorted when not installed in the cell or for transportation. Avoid
exposure to corrosive gases and dust.
• Always be aware of electrostatic discharge (ESD) when working near or touching components inside
the MicroHarmony cell. The cell contains components that are sensitive to static electricity. Handling
and servicing of components that are sensitive to ESD should be done only by qualified personnel
and only after reading and understanding proper ESD techniques. The following ESD guidelines
should be followed. Following these rules can greatly reduce the possibility of ESD damage to PC
board components.
• Always transport static sensitive equipment in antistatic bags.
• Always use a soldering iron that has a grounded tip. Also, use either a metallic vacuum-style plunger
or copper braid when desoldering.
• Make certain that anyone handling the printed circuit boards is wearing a properly grounded static
strap. The wrist strap should be connected to ground through a 1 megohm resistor. Grounding kits are
available commercially through most electronic wholesalers.
• Static charge buildup can be removed from a conductive object by touching the object to a properly
grounded piece of metal.
• When handling a PC board, always hold the card by its edges.
• Do not slide printed circuit boards across any surface (e.g., a table or work bench). If possible, per-
form PCB maintenance at a workstation that has a conductive covering that is grounded through a 1
megohm resistor. If a conductive tabletop cover is unavailable, a clean steel or aluminum tabletop is
an excellent substitute.
• Avoid plastic, Styrofoam™, vinyl and other non-conductive materials. They are excellent static gen-
erators and do not give up their charge easily.
• When returning components to Siemens LD A, always use static-safe packing. This limits any further
component damage due to ESD.

MicroHarmony Cell Sizes 40 - 260A Manual Safety Precautions and Warnings
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Additional safety precautions and warnings appear throughout this manual. These important messages should be
followed to reduce the risk of personal injury or equipment damage.
∇∇∇
Warning!
• Never exceed the specified terminal torque on semiconductors and capacitors. Excessive force will
damage the part.
• Use caution when inserting or extracting the gate leads on an IGBT. Excessive force can break or
stress the device.
• Dropping the cell or lowering it too quickly could damage the unit and/or be harmful to personal
safety.
• Be sure power plugs are properly aligned with the input/output bus before operating. Do not exceed
a 50 pound insertion force as this may damage the connectors. Never disconnect the cell while the
main is energized or while the cell is operating.
• Always adhere to the recommended thermal compound and thickness. Excessive or inadequate
compound application may cause an insufficient thermal connection between base plate and heat
sink that may damage the cell.
• Electrolytic capacitors are polarized. Installing a capacitor with the incorrect polarity will damage
the cell.
• If cell sits idle for 6 months or more, the capacitor bank requires reforming. Failure to follow
reforming procedures and guidelines may result in cell damage.
• The cell should be energized with a harmony transformer. The cell may be operated without a har-
mony transformer; however, it is important that the cell is pre-charged to at least 850vdc bus before
operating.
• Never substitute with non-approved components; never parallel or series non-identical manufac-
turer's (or Siemens MDIT numbers) for IGBTs or capacitors in the same power cell.
• Never use halogen type cleaning agents when cleaning a power cell. Use pressurized dry air, iso-
propyl alcohol, or water based solvent cleaning agents.
• Always comply with local codes and requirements if disposal of failed components is necessary (for
example, control boards, capacitors, etc.). Some components may contain lead.

Safety Precautions and Warnings MicroHarmony Cell Sizes 40 - 260A Manual
viii 19001467: Version 1.0
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MicroHarmony Cell Sizes 40 - 260A Manual Cell Overview
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1
1.1 Introduction
The MicroHarmony series power cells are designed to replace GEN 3 (NBH) cell sizes 70-260A.
Figure 1-1: MicroHarmony Cell
The latest air cooled power cells are available in 6 frames: 40A, 70A, 100A, 140A, 200A, and 260A. All cells in the
40-140A frame have an identical footprint and internal design. Only the number of parallel capacitors and IGBT kit
part numbers change from one cell to the next. The same applies to the 200-260A frame.
Figure 1-2: 40-140A Cell Anatomy (*Top Lid not shown)
CHAPTER
1Cell Overview

Cell Overview MicroHarmony Cell Sizes 40 - 260A Manual
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Figure 1-3: 200-260A Cell Anatomy (*Top Lid not shown)

MicroHarmony Cell Sizes 40 - 260A Manual Cell Overview
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1.2 Features
1.2.1 Cell Racking System
No hardware is required for mounting the cells in place within the drive.
The MicroHarmony cell is designed to be mounted on polyethylene coated mounting rails. The cell is equipped with
two locking latches on each side that latch into the mounting rail. The latches provide rear power plug alignment and
cell mounting. The latches are then rotated clockwise to pull the cell into place. Once the latches are in the vertical
position, the cell is properly aligned and locked into place. To remove, the latches are pulled back down to the
horizontal position.
High temperature foam forms an air tight seal between the cell chassis and backplane at the rear of the cell (not
shown).
1.2.2 Rear Blind-Mate Power Connections
No hardware is required for making the cell's input and output power connections.
Connections are made via blind-mate power plugs at the rear of the cell. The system is designed to tolerate as much
as 6 degrees of misalignment in all directions. The locking latches and mounting rails provide alignment.

Cell Overview MicroHarmony Cell Sizes 40 - 260A Manual
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1.2.3 Snubberless design
A simple, low stray inductance bus, coupled with low self inductance capacitors and nomex insulation, eliminates the
need for snubber capacitors at the IGBT power terminals. This reduces parts count, reduces complexity, and
increases IGBT switching performance.
1.2.4 Fusing
Only 2 phases of each cell input are fused. These fuses are mounted externally to the cell in one easy-to-access
location. This reduces the complexity of the cell and allows the fuses to operate properly.
1.2.5 Cell Control Board
A new cell control board based on the 10000092 series has been developed. All MicroHarmony cells sizes 40-140A
and 200-260A use the same part number cell control board. This reduces parts inventory and allows the board to be
purchased with all of the necessary resistor values and jumper settings. This reduces labor costs.
1.2.6 Gate Clamp Board
A gate clamp board is installed on each dual IGBT module. The board protects the IGBT from over voltage
transients. “Personality” gate resistors and capacitors that are specific to the IGBT used, are installed on this board as
well.
1.2.7 Overload
The MicroHarmony cells have built-in output overload current capability. Standard ratings at 110% 1 min/10 min,
150% 1 min/10 min, and 200% 3 sec/10 min are given.

MicroHarmony Cell Sizes 40 - 260A Manual Cell Overview
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1.2.8 Heat Sink Design
The heat sink assembly is designed for optimum IGBT cooling. The modules are arranged close together to reduce
size. The IGBTs are separated for input/output bus locations and to increase thermal performance. The heat sink is a
high performance, low pressure drop, light-weight aluminum design with a very thin base plate. A low pressure drop
mechanically swagged hollow fin design is offered that eliminates the thermal impedance of glue used in
conventional bonded fin designs.
1.2.9 Enclosure
The cell is enclosed in a solid hot-dipped galvanized steel chassis. In the event of a catastrophic failure, the damage
is contained to the faulted cell, protecting adjacent cells from any collateral damage. The top of the cell can be
removed for heat sink and capacitor access. The bottom of the cell houses the cell control board and can be easily
removed.
1.2.10 Increased input voltage rating
All MicroHarmony cells operate with a nominal 750Vrms input. This allows a 9-cell system to produce a 4160V
motor voltage with only 9 cells. Overmodulation is also used to increase the output voltage capability.
1.2.11 Multiple Sources
At least 2 sources for all components are standard on MicroHarmony cells. This encourages good quality control,
lowest cost, and shortest lead times.
1.2.12 Simple Design
The cell was designed with easier assembly, access, and troubleshooting in mind.
1.2.13 Electrolytic Capacitors with Plastic Mounting Tray
Economical 450V, 5600μF (40-140A) 10000μF (200-260A) electrolytic capacitors are used together with a simple
snap-in mounting tray for easy assembly.
∇∇∇

Cell Overview MicroHarmony Cell Sizes 40 - 260A Manual
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MicroHarmony Cell Sizes 40 - 260A Manual Physical Description
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2.1 Mechanical Specifications
Table 2-1: 40-140A Mechanical Specifications
Table 2-2: 200-260A Mechanical Specifications
CHAPTER
2Physical Description
10000424. 040 070 100 140
Weight
52Lbs
23.58kg
3.714 stone
57.5Lbs
26kg
4.11 stone
63Lbs
28.6kg
4.5 stone
68.5Lbs
31kg
4.89 stone
Envelope Dimensions 13.496” W x 10.255” H x 22.086” D
(342.8 x 260.48 x 560.98 mm)
Chassis Dimensions 12.62” W x 9.55” H x 21.77” D, neglecting latches and bolt heads
(320.55 x 242.57 x 552.96 mm)
Volume 2623.74 in^3, 1.518 ft^3, 4.3 m^3, 90.866 pints
10000494. 200 260
Weight
102.8 Lbs
46.63 kg
7.34 stone
112.6 Lbs
51.07 kg
8.04 stone
Envelope Dimensions 13.998” W x 13.117” H x 25.885” D
(355.55 x 333.17x 657.48 mm)
Chassis Dimensions 13.62” W x 12.41” H x 25.57” D, neglecting latches and bolt heads
(345.95 x 315.21 x 649.48 mm)
Volume 4753 in^3, 2.75 ft^3, 7.788 m^3, 164.6 pints

Physical Description MicroHarmony Cell Sizes 40 - 260A Manual
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2.2 Connections 40-260A
Table 2-3: Connections 40-260A
2.3 Environmental Specifications
Table 2-4: Environmental Specifications
Mounting
Bottom mount rails with polyethylene coated slider brackets. Front
accessible self-locking latches. No hardware required. See Access/
Connections section for more details.
Electrical
Connections
Rear blind connection to nickel plated copper bus bars via cell
mounted power plugs. No hardware required. See Access/Connec-
tions section for more details.
Control
Connections Front access fiber optic
Maximum Elevation 3300 FASL (1006 masl) without de-rating, 6563 FASL (200masl) MAX
Maximum Ambient 45 °C (113 °F, 318.15 °K), up to 60 °C with de-rating.
Note that over load and capacitor life are less above 40 °C
Storage Ambient -30 °C (-22 °F) minimum, 60 °C (140 °F) maximum
Ambient Humidity High humidity (93-95% RH) is not a concern unless there is a possibility of
condensation formation.
Ambient Air Quality Non conductive particulate contamination should be limited to <100 microns at
6.5mg/ft^3
40-140A Cell Minimum Air
Flow
180CFM (84.5 L/sec, 400 yd^3/hr) at 45 °C ambient.
Typical air flow is 225-250CFM (105.6-117.36L/sec)
200-260A Cell Minimum Air
Flow
300CFM (141.58 L/sec, 667 yd^3/hr) at 45 °C ambient.
Typical air flow is 300-350CFM (141.58-165.18L/sec)

MicroHarmony Cell Sizes 40 - 260A Manual Physical Description
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CFM 40-140A 200-
260A
50 0.02 0.01
75 0.05 0.03
100 0.08 0.05
125 0.13 0.08
150 0.18 0.12
175 0.25 0.17
200 0.32 0.22
225 0.41 0.27
250 0.51 0.34
275 0.61 0.41
300 0.73 0.49
325 0.86 0.57
350 0.99 0.66
375 1.14 0.76
400 1.30 0.86
Air Flow vs Pressure Drop
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400
Air Flow , ft^3/m in
Pressure drop, inH2O
40-140A
R=8.1E-6 200-260A
R=5.39E-

Physical Description MicroHarmony Cell Sizes 40 - 260A Manual
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2.4 40-140A Outline
*Refer to Installation Section for mounting and bus connection information.
Figure 2-1: 40-140A Outline