SimTech SIMCom SIM5360 Supplement

SIM5360_Hardware Design_V1.01

Smart Machine Smart Decision
Document Title SIM5360 Hardware Design
Version 1.01
Date 2013-11-22
Status Release
Document Control ID SIM5360_Hardware Design_V1.01
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering
efforts that use the products designed by SIMCom. The information provided is based upon requirements
specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search
for additional relevant information, including any information that may be in the customer’s possession.
Furthermore, system validation of this product designed by SIMCom within a larger electronic system
remains the responsibility of the customer or the customer’s system integrator. All specifications supplied
herein are subject to change.
Copyright
This document contains proprietary technical information which is the property of SIMCom Limited,
copying of this document and giving it to others and the using or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design. All specification
supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2013

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Contents
Revision History .......................................................................................................................................... 9
1Introduction ........................................................................................................................................ 10
1.1 Product Outline.............................................................................................................................. 10
1.2 Hardware Interface Overview.........................................................................................................11
1.3 Hardware Diagram..........................................................................................................................11
1.4 Functional Overview...................................................................................................................... 12
2Package Information.......................................................................................................................... 13
2.1 Pin Configuration........................................................................................................................... 13
2.2 Pin description ............................................................................................................................... 15
2.3 Package Dimensions...................................................................................................................... 18
2.4 Footprint Recommendation ........................................................................................................... 20
3Application Interface Specification................................................................................................... 20
3.1 Power Supply................................................................................................................................. 20
3.1.1 Power Supply Pin.................................................................................................................... 21
3.1.2 Design Guide .......................................................................................................................... 21
3.1.3 RTC Backup............................................................................................................................ 23
3.2 Power on/off Time Sequence ......................................................................................................... 25
3.2.1 Power on Sequence ................................................................................................................. 25
3.2.2 Power off Sequence ................................................................................................................ 27
3.3 UART Interface.............................................................................................................................. 28
3.3.1 Pin Description........................................................................................................................ 29
3.3.2 Application Guide................................................................................................................... 29
3.4 SD/MMC Interface ........................................................................................................................ 30
3.4.1 Pin Description........................................................................................................................ 31
3.4.2 Design guide ........................................................................................................................... 31
3.5 USIM Interface .............................................................................................................................. 32
3.5.1 Pin description ........................................................................................................................ 32
3.5.2 Application Guide................................................................................................................... 33
3.5.3 Recommend Components ....................................................................................................... 33
3.6 I2C Interface .................................................................................................................................. 34
3.6.1 Pin Description........................................................................................................................ 35
3.6.2 Signal Description................................................................................................................... 35
3.6.3 Design Guide .......................................................................................................................... 35
3.7 Keypad Interface............................................................................................................................ 35
3.7.1 Pin Description........................................................................................................................ 35
3.7.2 Application Guide................................................................................................................... 36
3.8 USB Interface ................................................................................................................................ 37
3.8.1 Application Guide................................................................................................................... 37
3.9 SPI Interface .................................................................................................................................. 38
3.9.1 Pin Description........................................................................................................................ 38
3.10 GPIO Interface ........................................................................................................................... 39

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3.10.1 Pin Description .................................................................................................................... 39
3.10.2 Application Guide ............................................................................................................... 40
3.11 PCM Interface ............................................................................................................................ 42
3.11.1 Pin Description .................................................................................................................... 42
3.11.2 Signal Description ............................................................................................................... 42
3.12 Global Navigation Satellite System............................................................................................ 46
3.12.1 Technical specification ........................................................................................................ 46
3.12.2 Operate Mode ...................................................................................................................... 46
3.12.3 Application Guide ............................................................................................................... 47
3.13 Multi-functional interface........................................................................................................... 48
3.13.1 Sink Current Source ............................................................................................................ 48
3.13.2 Reset Function ..................................................................................................................... 49
3.13.3 ADC..................................................................................................................................... 50
3.13.4 LDO..................................................................................................................................... 51
4RF Specification.................................................................................................................................. 51
4.1 RF Specification ............................................................................................................................ 51
4.2 Operating Specification ................................................................................................................. 52
4.3 Antenna Design Guide................................................................................................................... 53
5Reliability and Operating Characteristics........................................................................................ 54
5.1 Electronic Characteristics .............................................................................................................. 54
5.2 Operating Mode ............................................................................................................................. 55
5.2.1 Operating Modes Overview.................................................................................................... 55
5.2.2 Minimize Power Consumption ............................................................................................... 56
5.3 Current Consumption..................................................................................................................... 57
5.4 EMC and ESD Notes ..................................................................................................................... 59
6Guide for Production.......................................................................................................................... 60
6.1 Top and Bottom View of SIM5360 ............................................................................................... 60
6.2 Typical Solder Reflow Profile ....................................................................................................... 60
6.3 Moisture Sensitivity Level (MSL)................................................................................................. 61
6.4 Stencil Foil Design Recommendation ........................................................................................... 61
6.5 Recommended Pad Design ............................................................................................................ 61
Appendix.................................................................................................................................................... 62
A. System Design..................................................................................................................................... 62
B. SIM5360 GPIOs List........................................................................................................................... 63
C. Digital I/O Characteristics................................................................................................................... 63
D. Related Documents ............................................................................................................................. 64
E. Terms and Abbreviations..................................................................................................................... 66
F. Safety Caution...................................................................................................................................... 68

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Table Index
Table 1: SIM5360 series frequency bands....................................................................................................................... 10
Table 2: General Feature ................................................................................................................................................. 12
Table 3: Pin definition..................................................................................................................................................... 14
Table 4: Pin description................................................................................................................................................... 15
Table 5: Pin description................................................................................................................................................... 21
Table 7: Power on timing ................................................................................................................................................ 26
Table 8: Power off timing ............................................................................................................................................... 27
Table 9: Pin description................................................................................................................................................... 29
Table 10: Logic level....................................................................................................................................................... 29
Table 11: Electronic characteristic .................................................................................................................................. 31
Table 12: Pin description................................................................................................................................................. 31
Table 16: Electronic characteristic .................................................................................................................................. 32
Table 17: Pin description................................................................................................................................................. 32
Table 18: Pin description................................................................................................................................................. 35
Table 19: Pin description................................................................................................................................................. 36
Table 20: GPIO configuration......................................................................................................................................... 37
Table 21: Electronic characteristic .................................................................................................................................. 37
Table 22: Electronic characteristic .................................................................................................................................. 38
Table 23: Pin description................................................................................................................................................. 39
Table 24: Electronic characteristic .................................................................................................................................. 39
Table 25: Pin description................................................................................................................................................. 40
Table 26: LED status....................................................................................................................................................... 41
Table 27: Control status .................................................................................................................................................. 41
Table 28: Electronic characteristic .................................................................................................................................. 42
Table 29: Pin description................................................................................................................................................. 42
Table 30: Timing parameters........................................................................................................................................... 44
Table 31: Timing parameters........................................................................................................................................... 45
Table 32: Electronic characteristic .................................................................................................................................. 49
Table 33: Electronic Characteristics................................................................................................................................ 50
Table 34: Electronic characteristic .................................................................................................................................. 51
Table 35: Conducted transmission power ....................................................................................................................... 51
Table 36: Operating frequencies ..................................................................................................................................... 52
Table 37: Conducted receive sensitivity.......................................................................................................................... 52
Table 38: GPRS/EDGE data throughout ......................................................................................................................... 52
Table 39: HSDPA throughout.......................................................................................................................................... 53
Table 40: Absolute maximum ratings.............................................................................................................................. 55
Table 41: Recommended operating ratings ..................................................................................................................... 55
Table 42: Operating temperature..................................................................................................................................... 55
Table 43: Operating Modes Overview ............................................................................................................................ 55
Table 44: Current consumption....................................................................................................................................... 57
Table 45: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) .......................................... 59
Table 46: SIM5360 GPIOs list........................................................................................................................................ 63

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Table 47: Digital I/O characteristics................................................................................................................................ 63
Table 48: Related documents .......................................................................................................................................... 64
Table 49: Terms and Abbreviations................................................................................................................................. 66
Table 50: Safety caution.................................................................................................................................................. 68

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Figure Index
Figure 1: SIM5360 functional architecture ..................................................................................................................... 11
Figure 2: Pin view........................................................................................................................................................... 13
Figure 3: Top dimensions (Unit: mm)............................................................................................................................. 18
Figure 4: Side dimensions (Unit: mm)............................................................................................................................ 18
Figure 5: Bottom dimensions (Unit: mm) ....................................................................................................................... 19
Figure 6: Footprint recommendation (Unit: mm)............................................................................................................ 20
Figure 7: VBAT voltage drop during burst emission (GSM/GPRS) ............................................................................... 21
Figure 8: VBAT input application circuit........................................................................................................................ 22
Figure 9: Reference circuit of the LDO power supply .................................................................................................... 22
Figure 10: Reference circuit of the DCDC power supply ............................................................................................... 23
Figure 11: RTC supply from capacitor............................................................................................................................ 24
Figure 12: RTC supply from non-chargeable battery ...................................................................................................... 24
Figure 13: RTC supply from rechargeable battery .......................................................................................................... 24
Figure 14: Seiko XH414H-IV01E Charge-Discharge characteristic............................................................................... 25
Figure 15: Power on Timing Sequence ........................................................................................................................... 26
Figure 16: Power off timing sequence ............................................................................................................................ 27
Figure 17: Full modem.................................................................................................................................................... 28
Figure 18: Null modem................................................................................................................................................... 29
Figure 19: RI behaviour in NULL Modem ..................................................................................................................... 30
Figure 20: RI behaviour in FULL Modem ...................................................................................................................... 30
Figure 21: SD interface circuit........................................................................................................................................ 32
Figure 24: USIM interface reference circuit ................................................................................................................... 33
Figure 25: Amphenol SIM card socket ........................................................................................................................... 34
Figure 26: Reference circuit............................................................................................................................................ 36
Figure 27: USB interface ................................................................................................................................................ 38
Figure 28: Application circuit ......................................................................................................................................... 40
Figure 29: Flight mode switch ........................................................................................................................................ 41
Figure 30: Synchrony timing .......................................................................................................................................... 43
Figure 31: EXT CODEC to MODULE timing................................................................................................................ 43
Figure 32: MODULE to EXT CODEC timing................................................................................................................ 43
Figure 33: Synchrony timing .......................................................................................................................................... 44
Figure 34: EXT CODEC to MODULE timing................................................................................................................ 45
Figure 35: MODULE to EXT CODEC timing................................................................................................................ 45
Figure 36: Active antenna circuit .................................................................................................................................... 47
Figure 37：Passive antenna circuit (Default) ................................................................................................................. 48
Figure 38: Current drive.................................................................................................................................................. 49
Figure 39: Reset circuit................................................................................................................................................... 50
Figure 40: Reference circuit............................................................................................................................................ 51
Figure 41: Antenna matching circuit(MAIN_ANT)........................................................................................................ 54
Figure 42: Antenna matching circuit(DIV_ANT) ........................................................................................................... 54
Figure 42: Top and bottom view of SIM5360 ................................................................................................................. 60
Figure 43: The ramp-soak-spike reflow profile of SIM5360 .......................................................................................... 60

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Figure 44: Recommended pad ........................................................................................................................................ 61
Figure 45: System design................................................................................................................................................ 62

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Revision History
Data Version Description of change Author
2013-11-22 1.01 Original Libing

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1Introduction
This document describes electronic specifications, RF specifications, function interface, mechanical
characteristic and testing conclusions of the SIMCom SIM5360 module. With the help of this document
and other SIM5360 software application notes, user guides, users can quickly understand and use
SIM5360 module to design and develop applications quickly.
1.1 Product Outline
Designed for global market, SIM5360 is a quad-band GSM/GPRS/EDGE and dual-band UMTS /HSDPA
that works on frequencies of GSM 850MHz, EGSM 900 MHz, DCS 1800 MHz, PCS 1900MHz and
WCDMA 2100/900MHz, 1900/850 MHz. User can choose the module based on the wireless network
configuration. In this document, the entire radio band configuration of SIM5360 series is described in the
following table.
Table 1: SIM5360 series frequency bands
Standard Frequency SIM5360E SIM5360A
GSM
GSM 850MHz 33
EGSM 900MHz 33
DCS1800MHz 33
PCS1900MHz 33
WCDMA
WCDMA 850MHz 3
WCDMA 900MHz 3
WCDMA 1900MHz 3
WCDMA 2100MHz 3
HSPA HSDPA 33
HSUPA 33
GNSS GPS 33
GLONASS 33
With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM5360 can meet almost any space
requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,
machine-to-machine, vehicle applications, etc..
There are 82 pins on SIM5360, which provide most application interfaces for customers’ board.

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1.2 Hardware Interface Overview
Sub-interfaces are described in detail in the next chapter, which includes:
● Power Supply
● USB Interface
● Serial Interface
● SD card Interfaces
● SIM Interface
● GPIO
● ADC
● LDO Power Output
● Sink Current Source
● PCM Interface
● Keypad Interface
● SPI Interface
● RTC
● I2C Interface
1.3 Hardware Diagram
The global architecture of the SIM5360 Embedded module is described in the figure below.
GSM/WCDMA
RF Frontend
GSM PA Transceiver
Processor
XO
19.2MHz
XO
32.768kHz
NAND
Flash
WCDMA
PA
MMC/SD
I2C
PCM
Interrupt
Status LED
USB
RTC
SIM
Power On
Reset
UART
GPIOs
ADC
LDO
Vbat*
Vbat*
Vbat* SPI
Keypad(Multiplex with GPIOs)
Sink Current Source
DDR
GNSS
RF
Main Antenna
GNSS Antenna
Power
Management
Qualcomm
Chip
SMT Interface
WCDMA
RF
Frontend
DIV Antenna
Figure 1: SIM5360 functional architecture

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1.4 Functional Overview
Table 2: General Feature
Feature Implementation
Power supply Single supply voltage 3.3～4.2V
Transmission data
● Dual-mode UMTS/HSDPA/EDGE/GPRS operation
● GPRS Class B, multislot class 12 operation, Supports coding scheme:
CS1-4
● EDGE multislot class 12 operation, Supports coding schemes
MSC1-9
● UMTS R99 data rates-384 kbps DL/UL
● Category 6 HSDPA -14 Mbps HSUPA-5.76 Mbps
● CSD feature: 9.6, 14.4, 64 kbps UL/DL
GNSS
● GNSS engine (GPS and GLONASS)
● Protocol: NMEA
● Mobile-Assisted mode
● Mobile-based mode
● Standalone mode
SMS
● MT, MO, CB, Text and PDU mode
● SMS storage: SIM card
● Support transmission of SMS alternatively over CSD or GPRS.
User can choose preferred mode.
SIM interface Support identity card: 1.8V, 3V.
Audio features(optional)
Speech codec modes:
● Half Rate (ETS 06.20)
● Full Rate (ETS 06.10)
● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
● AMR (WCDMA)
● AMR+QCP (GSM)
● A5/1, A5/2, and A5/3 ciphering
Serial interface ● Serial Port standard or null modem mode on Serial Port Interface
● Serial Port can be used to control module by sending AT command
USB Support USB2.0 Slave mode
Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC.
SIM application toolkit Support SAT class 3, GSM 11.14 Release 98
Support USAT
Real Time Clock Support RTC
Timer function Programmable by AT command
Physical characteristics Size:30*30*2.9mm
Weight:TBD g
Firmware upgrade Firmware upgrade over USB interface
PCM Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (υ-law or A-law)
and 16 bit (linear).
Temperature range ● Normal operation temperature: -30°C to +80°C

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● Extended operation temperature: -40°C to +85°C
● Storage temperature -40°C to +90°C
2Package Information
2.1 Pin Configuration
All hardware interfaces which connect SIM5360 to customers’ application platform are through 82 pins
pads (Metal half hole). Figure 2 is SIM5360 outline diagram.
Figure 2: Pin view

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Table 3: Pin definition
Pin No. Define Pin No. Define
1 GND 2 GND
3 POWER_ON 4 RESET
5 GND 6 SPI_CLK
7 SPI_MISO_DATA 8 SPI_MOSI_DATA
9 SPI_CS_N 10 GND
11 USB_VBUS 12 USB_DM
13 USB_DP 14 GND
15 RESERVED 16 RESERVED
17 USIM_DATA 18 USIM_RESET
19 USIM_CLK 20 V_USIM
21 SD_CMD 22 SD_D0
23 SD_D1 24 SD_D2
25 SD_D3 26 SD_CLK
27 KEYSENSE_N1 28 KEYSENSE_N0
29 KEYPAD_0 30 KEYPAD_2
31 KEYSENSE_N2 32 KEYSENSE_N3
33 KEYPAD_1 34 KEYPAD_4
35 KEYPAD_3 36 KEYSENSE_N4
37 GND 38 NC
39 NC 40 GND
41 GND 42 VRTC
43 GND 44 VREG_SD
45 CURRENT_SINK 46 ADC2
47 ADC1 48 GPIO44
49 GPIO40 50 GPIO43
51 GPIO1 52 GPIO41
53 GPIO42 54 GPIO4
55 I2C_SCL 56 I2C_SDA
57 GND 58 GND
59 MAIN_ANT 60 GND
61 GND 62 VBAT
63 VBAT 64 GND
65 GND 66 UART_RTS

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67 UART_CTS 68 UART_RXD
69 UART_RI 70 UART_DCD
71 UART_TXD 72 UART_DTR
73 PCM_DOUT 74 PCM_DIN
75 PCM_SYNC 76 PCM_CLK
77 GND 78 GND
79 GNSS_ANT 80 GND
81 GND 82 DIV_ANT
2.2 Pin description
Table 4: Pin description
Pin name I/O Description Comment
Power Supply
VBAT Power supply voltage
VRTC I/O Power supply for RTC If it is unused, keep open.
VREG_SD O LDO power output
GND Ground
Power on/off
POWER_ON I
POWER_ON should be pulled low at
least 64ms to power on or 500ms to
power off the module.
SD interface
SD_CLK O SDIO clock
If these pins are unused，
keep open.
SD_CMD I/O SDIO command
SD_DATA0 I/O SDIO data
SD_DATA1 I/O SDIO data
SD_DATA2 I/O SDIO data
SD_DATA3 I/O SDIO data
USIM interface
V_USIM O Voltage Supply for SIM card
Support 1.8V or 3V SIM card All signals of SIM
interface should be
protected against
ESD/EMC.
USIM_DATA I/O SIM Data Output/Input
USIM_CLK O SIM Clock
USIM_RESET O SIM Reset
SPI interface
SPI_CLK O SPI clock If it is unused, keep open.

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SPI_CS_N O SPI chip-select
SPI_MOSI_DATA O SPI (master only) master out/slave in
data
SPI_MISO_DATA I SPI (master only) master in/slave out
data
USB
USB_VBUS I USB power supply input
They are compliant with
the USB 2.0 specification.
If it is unused, keep open.
USB_DP I/O
Plus (+) line of the differential,
bi-directional USB signal to/from the
p
eri
p
heral device.
USB_DM I/O
Minus (-) line of the differential,
bi-directional USB signal to/from the
p
eri
p
heral device.
Serial interface
UART_RXD I Receive Data
UART_RXD has been
pulled down with a 12kR
resistor to ground in the
module.
If it is unused, keep open.
UART_TXD O Transmit Data
UART_RTS O Request to send
UART_CTS I Clear to Send
UART_RI O Ring Indicator
UART_DTR I/O DTE get ready
UART_DCD O Carrier detects
I2C interface
I2C_SDA I/O I2C data Pulled up with a 2.2kR
resistor to 2.6V internally.
If it is unused, keep open.
I2C_SCL O I2C clock output
Keypad interface
KEYPAD_0 O Bit 0 drive to the pad matrix
All Keypad pins can be
configured as GPIOs.
If it is unused, keep open.
KEYPAD_1 O Bit 1 drive to the pad matrix
KEYPAD_2 O Bit 2 drive to the pad matrix
KEYPAD_3 O Bit 3 drive to the pad matrix
KEYPAD_4 O Bit 4 drive to the pad matrix
KEYSENSE_N0 I Bit 0 for sensing key press on pad
matrix
KEYSENSE_ N1 I Bit 1 for sensing key press on pad
matrix
KEYSENSE_ N2 I Bit 2 for sensing key press on pad
matrix
KEYSENSE_ N3 I Bit 3 for sensing key press on pad
matrix
KEYSENSE_ N4 I Bit 4 for sensing key press on pad
matrix
PCM interface
PCM_DIN/GPIO0 I General Input PIN with module
wake/interrupt. It also can be
If it is unused, keep open.

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multiplexed as the PCM_DIN pin.
PCM_SYNC/GPIO2 I General Input PIN. It also can be
multiplexed as the PCM_SYNC pin.
PCM_CLK/GPIO3 O General Output PIN. It also can be
multiplexed as the PCM_CLK pin.
PCM_DOUT/GPIO5 O General Output PIN. It also can be
multiplexed as the PCM_DOUT pin.
GPIOs
GPIO1 O Output PIN as LED control for
network status.
If it is unused, keep open.
GPIO4 I Input PIN as RF operating control.
GPIO40 O Output PIN as operating status
indicating of module.
GPIO41 I/O
General input/output PIN. It can be
used as wake/interrupt signal to host
from module
GPIO43 I/O
General input/output PIN. It can be
used as wake/interrupt signal to
module from host.
GPIO44 I/O General input/output PIN.
GPIO42 I/O General input/output PIN.
Other interface
RESET I System reset in, active low.
CURRENT_SINK I Current source of ground-referenced
current sink Refer to 3.13.1
ADC1 I Analog Digital Converter Input Refer to 3.13.3
ADC2 I Battery temperature ADC input pin
MAIN_ANT I/O ANT soldering pad
GNSS_ANT I/O GNSS ANT soldering pad
DIV_ANT I/O Diversity ANT soldering pad

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2.3 Package Dimensions
The following figure shows mechanical dimensions of SIM5360.
Figure 3: Top dimensions (Unit: mm)
Figure 4: Side dimensions (Unit: mm)

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Figure 5: Bottom dimensions (Unit: mm)

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2.4 Footprint Recommendation
Figure 6: Footprint recommendation (Unit: mm)
3Application Interface Specification
3.1 Power Supply
The power supply pins of SIM5360 include two VBAT pins . VBAT directly supplies the power to RF PA
and baseband system. For the VBAT, the ripple due to GSM/GPRS emission burst (every 4.615ms）may
cause voltage drop, and the current consumption rises typically to peak of 2A. So the power supply must
be able to provide sufficient current up to more than 2A. The following figure is the VBAT voltage ripple
wave at the maximum power transmit phase.
The test condition: VBAT =4.0V, VBAT maximum output current =2A, CA=100 µF tantalum capacitor
(ESR=0.7Ω) and CB=1µF(Please refer to Figure 8—Application circuit).