Sirona ORTHOPHOS SL 2D User manual

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ORTHOPHOSSL / Ceph Service Manual

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Table of contents
1About this Service Manual........................................................................................ 13
1.1 Other relevant documents............................................................................. 13
1.2 Scope ............................................................................................................ 13
1.3 Tools and auxiliary materials......................................................................... 13
1.4 Structure of the document............................................................................. 14
1.4.1 Identification of the danger levels..................................................... 14
1.4.2 Formats and symbols used .............................................................. 14
2Safety instructions .................................................................................................... 15
2.1 Potentially lethal shock hazard...................................................................... 15
2.2 Modifications to the unit ................................................................................ 15
2.3 Fixed connection ........................................................................................... 15
2.4 Electromagnetic compatibility........................................................................ 15
2.5 Electrostatic discharge .................................................................................. 16
2.6 Switching the unit on ..................................................................................... 16
2.7 Condensation ................................................................................................ 16
2.8 Laser light localizer ....................................................................................... 16
2.9 Ventilation slots ............................................................................................. 16
2.10 Qualifications of service personnel ............................................................... 16
2.11 Radiation protection ...................................................................................... 17
2.12 Safety checks................................................................................................ 17
2.13 Functional check ........................................................................................... 17
3Unit description......................................................................................................... 18
3.1 Hardware....................................................................................................... 18
3.1.1 Information on the unit ..................................................................... 18
3.1.2 System version................................................................................. 19
3.1.3 Sensor versions ............................................................................... 20
3.1.4 Installation versions.......................................................................... 21
3.1.5 Modules and components ................................................................ 22
3.1.5.1 Slide................................................................................ 23
3.1.5.2 Stand .............................................................................. 24
3.1.5.3 Cephalometer ................................................................. 25
3.1.5.4 Remote control ............................................................... 25
3.1.6 Cabling overview.............................................................................. 26

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3.1.7 Board photos.................................................................................... 30
3.1.7.1 Boards in the slide .......................................................... 30
3.1.7.2 Boards in the stand......................................................... 36
3.1.7.3 Boards in the cephalometer (left- and right-arm
versions)
36
3.1.7.4 Board in the remote control ............................................ 37
3.1.8 Covers.............................................................................................. 37
3.1.9 Technical data.................................................................................. 40
3.1.9.1 Unit data ......................................................................... 40
3.1.9.2 Operating and transport conditions ................................ 42
3.1.9.3 Diagrams ........................................................................ 43
3.1.9.4 Requirements for the PC system.................................... 44
3.2 Firmware ....................................................................................................... 45
4General operating procedures.................................................................................. 47
4.1 Switching the unit on ..................................................................................... 47
4.1.1 Factory setting after switch-on ......................................................... 48
4.2 Setting up the X-ray component.................................................................... 49
4.3 Opening / saving "Unit information"............................................................... 59
4.4 Activating functions ....................................................................................... 62
4.4.1 Activation via Easypad ..................................................................... 62
4.4.2 Activation via PC .............................................................................. 64
4.5 Updating the unit firmware ............................................................................ 68
4.6 Backing up / restoring / installing sensor data............................................... 71
4.6.1 Access the “Backup / restore sensor data” menu ............................ 71
4.6.2 Backing up sensor data.................................................................... 73
4.6.3 Restoring sensor data ...................................................................... 74
4.6.4 Installing sensor data ....................................................................... 75
4.7 Calling the Info screen .................................................................................. 76
4.8 Using demo mode – operation without radiation release .............................. 77
4.8.1 Switching on demo mode................................................................. 77
4.8.2 Switching off demo mode................................................................. 78
4.8.3 Important information for repacking and transport ........................... 79
5Messages ................................................................................................................. 80
5.1 Help messages ............................................................................................. 80
5.2 Status displays .............................................................................................. 81
5.3 Error messages............................................................................................. 82
5.3.1 Error code: Ex yy zz ......................................................................... 82
5.3.2 Ex - Error type .................................................................................. 82
5.3.3 yy - Location..................................................................................... 83
5.3.4 General handling of error messages................................................ 83

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5.4 List of error messages.................................................................................. 84
5.4.1 Location 06: Tube assembly/DX6 ................................................... 84
5.4.2 Location 07: Easypad/DX7.............................................................. 90
5.4.3 Location 10: System hardware........................................................ 93
5.4.4 Location 11: Power PC/Board DX11 ............................................... 94
5.4.5 Location 12: CAN bus ..................................................................... 96
5.4.6 Location 13: Stand/Peripherals ....................................................... 97
5.4.7 Location 14: Digital extension, SIDEXIS 4 ...................................... 110
5.4.8 Location 15: Configuration, update ................................................. 112
5.4.9 Location 20: Sensor unit, general.................................................... 113
5.4.10 Location 22: DCS sensor ................................................................ 118
5.4.11 Location 23: Flat Panel Detector..................................................... 119
5.4.12 Location 42: Remote control ........................................................... 120
5.4.13 Location 61: Diaphragm control, board DX61 ................................. 124
5.4.14 Location 81, board DX81, ceph slot ................................................ 130
5.4.15 Location 83: Sensor unit.................................................................. 134
5.4.16 Location 91: Cephalometer, board DX91........................................ 135
6Troubleshooting....................................................................................................... 139
6.1 Error logging memory................................................................................... 139
6.1.1 Example of error logging data ......................................................... 140
6.2 Checking the CAN bus ................................................................................. 141
6.2.1 Checking the CAN bus with the diagnostic function of board DX1.. 145
6.2.2 Jumper positions in the CAN bus .................................................... 145
6.3 Checking the boards .................................................................................... 146
6.3.1 Checking board DX32 ..................................................................... 148
6.4 Checking the motors .................................................................................... 150
6.5 Checking the light barriers............................................................................ 151
6.6 Device leakage current too high................................................................... 152
6.7 Checking the cables ..................................................................................... 153
6.8 Checking fiber-optic cables .......................................................................... 154
6.9 Error analysis of X-RAY control signal path ................................................. 156
6.10 Checking the data paths............................................................................... 159
7Unit adjustment and calibration ............................................................................... 160
7.1 General information on unit adjustment and calibration ............................... 162
7.1.1 Displays and help messages during adjustment and calibration..... 163
7.1.2 Calibration menu ............................................................................. 164
7.1.2.1 Opening the calibration menu........................................ 164
7.1.2.2 Menu structure............................................................... 166
7.1.3 Enabling exposure readiness .......................................................... 175
7.1.4 Taking an exposure......................................................................... 175

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7.1.5 Save values..................................................................................... 175
7.1.6 Test phantom for adjustment and calibration .................................. 176
7.1.6.1 Needle phantom for panoramic adjustment................... 176
7.1.6.2 Adjustment phantom for adjustment of the cephalometer 178
7.1.6.3 Geometry phantom for volume calibration..................... 179
7.2 Adjustment and calibration via the calibration menu .................................... 181
7.2.1 2D adjustment/calibration................................................................ 181
7.2.1.1 Pan sensor adjustment.................................................. 181
7.2.1.2 Pan aperture adjustment ............................................... 187
7.2.1.3 Pan symmetry adjustment ............................................. 193
7.2.1.4 Pan sensor calibration (DCS) ........................................ 197
7.2.1.5 Adjustment of the ceph primary diaphragm................... 199
7.2.1.6 Adjustment of the ceph secondary diaphragm .............. 204
7.2.1.7 Adjustment of the ceph secondary diaphragm
(QuickShot)
212
7.2.1.8 Adjustment of the ceph main X-ray beam...................... 217
7.2.1.9 Adjusting the earplug alignment .................................... 221
7.2.2 3D adjustment/calibration................................................................ 226
7.2.2.1 Sensor adjustment......................................................... 226
7.2.2.2 Diaphragm adjustment................................................... 228
7.2.2.3 Sensor calibration.......................................................... 229
7.2.2.4 Diaphragm configuration................................................ 230
7.2.2.5 Geometry calibration...................................................... 232
7.2.2.6 Dosimetry....................................................................... 234
7.2.3 Resetting adjustment/calibration ..................................................... 235
7.3 Adjusting the touchscreen via the web service ............................................ 236
8Service routines....................................................................................................... 240
8.1 Perform service routines via the control panel ............................................. 240
8.1.1 Overview of service routines ........................................................... 240
8.1.1.1 List of all service routines available for selection........... 240
8.1.1.2 Alphabetical list of service routine functions.................. 243
8.1.2 Service menu and service routines ................................................. 246
8.1.2.1 Displays and symbols in the service menu.................... 246
8.1.3 Basic operating procedures in the service menu of the control panel 248
8.1.3.1 Calling the service menu ............................................... 248
8.1.3.2 Selecting service routines and test steps ...................... 249
8.1.3.3 Select parameters.......................................................... 251
8.1.3.4 Saving parameters......................................................... 251
8.1.3.5 Exiting the test step and service routine ........................ 252
8.1.4 S001: Radiation without rotary movement, fixed maximum radiation
time
253

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8.1.5 S002: Radiation without rotary movement, selectable kV/mA level
and maximum radiation time
255
8.1.5.1 S002: Test step 1 ........................................................... 255
8.1.5.2 S002: Test step 3 ........................................................... 256
8.1.5.3 S002: Test step 4 ........................................................... 258
8.1.6 S005: General X-ray tube assembly service.................................... 260
8.1.6.1 S005: Test step 2 ........................................................... 260
8.1.6.2 S005: Test step 4 ........................................................... 261
8.1.6.3 S005: Test step 5 ........................................................... 262
8.1.6.4 S005: Test step 6 ........................................................... 262
8.1.6.5 S005: Test step 7 ........................................................... 264
8.1.7 S007: Fault buffer............................................................................. 265
8.1.7.1 S007: Test step 1 ........................................................... 265
8.1.7.2 S007: Test step 2 ........................................................... 266
8.1.8 S008: Update service....................................................................... 267
8.1.8.1 S008: Test step 2 ........................................................... 267
8.1.8.2 S008: Test step 3 ........................................................... 267
8.1.9 S009: Flash file system .................................................................... 268
8.1.9.1 S009: Test step 4 ........................................................... 268
8.1.9.2 S009: Test step 5 ........................................................... 268
8.1.10 S011: Dosimetry (without ring movement) ....................................... 269
8.1.10.1 S011: Test step 14 ......................................................... 269
8.1.10.2 S011: Test step 24 ......................................................... 271
8.1.11 S012: CAN bus service .................................................................... 272
8.1.11.1 S012: Test step 1 ........................................................... 272
8.1.11.2 S012: Test step 2 ........................................................... 273
8.1.11.3 S012: Test step 3 ........................................................... 274
8.1.11.4 S012: Test step 4 ........................................................... 274
8.1.12 S014: Rotation motor service........................................................... 275
8.1.12.1 S014: Test step 3 ........................................................... 275
8.1.12.2 S014: Test step 4 ........................................................... 275
8.1.13 S015: Actuator service ..................................................................... 276
8.1.13.1 S015: Test step 5 ........................................................... 276
8.1.14 S017: Configuration service ............................................................. 277
8.1.14.1 S017: Test step 2 ........................................................... 278
8.1.14.2 S017: Test step 3 ........................................................... 281
8.1.14.3 S017: Test step 4 ........................................................... 282
8.1.14.4 S017: Test step 6 ........................................................... 283
8.1.14.5 S017: Test step 8 ........................................................... 284
8.1.14.6 S017: Test step 13 ......................................................... 285
8.1.14.7 S017: Test step 14 ......................................................... 286
8.1.14.8 S017: Test step 15 ......................................................... 287
8.1.14.9 S017: Test step 18 ......................................................... 288

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8.1.15 S018: Service for height adjustment ............................................... 289
8.1.15.1 S018: Test step 2........................................................... 289
8.1.15.2 S018: Test step 3........................................................... 290
8.1.15.3 S018: Test step 4........................................................... 291
8.1.15.4 S018: Test step 5........................................................... 292
8.1.15.5 S018: Test step 6........................................................... 292
8.1.15.6 S018: Test step 7........................................................... 293
8.1.15.7 S018: Test step 8........................................................... 295
8.1.15.8 S018: Test step 9........................................................... 297
8.1.15.9 S018: Test step 10......................................................... 299
8.1.16 S020: Service for temple support.................................................... 300
8.1.16.1 S020: Test step 1........................................................... 300
8.1.17 S021: Service for the packing position ............................................ 302
8.1.17.1 S021: Test step 3........................................................... 302
8.1.17.2 S021: Test step 4........................................................... 303
8.1.18 S032: Sensor test............................................................................ 304
8.1.18.1 S032: Test step 10......................................................... 304
8.1.18.2 S032: Test step 50......................................................... 305
8.1.18.3 Explanations on the test procedure ............................... 305
8.1.18.4 Possible results of self-test and troubleshooting
measures
306
8.1.19 S033: Test of ceph image path (for ceph units only)....................... 307
8.1.19.1 S033: Test step 10......................................................... 307
8.1.20 S034: Service for the digital cephalometer...................................... 309
8.1.20.1 S034: Test step 4........................................................... 309
8.1.20.2 S034: Test step 5........................................................... 313
8.1.20.3 S034: Test step 6........................................................... 316
8.1.20.4 S034: Test step 8........................................................... 317
8.1.20.5 S034: Test step 9........................................................... 318
8.1.21 S037: Network service .................................................................... 320
8.1.21.1 S037: Test step 1........................................................... 320
8.1.21.2 S037: Test step 2........................................................... 322
8.1.21.3 S037: Test step 3........................................................... 323
8.1.21.4 S037: Test step 4........................................................... 324
8.2 Running service routines via the web service .............................................. 327

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9Repair...................................................................................................................... 330
9.1 Safety checks ............................................................................................... 331
9.2 Height adjustment motor (M1_4)/spindle...................................................... 332
9.2.1 Preparing for motor replacement..................................................... 332
9.2.1.1 Moving the slide manually ............................................. 332
9.2.2 Removing board DX32 .................................................................... 335
9.2.3 Replacing the height adjustment motor/spindle .............................. 337
9.2.4 Laying of cables when replacing the height adjustment motor........ 339
9.2.5 What has to be done after replacing the height adjustment motor
(M1_4) or the spindle?
341
9.3 Ring motor (M1_3)........................................................................................ 342
9.3.1 Replacing the ring motor ................................................................. 342
9.3.2 Replacing the pinion at the ring motor............................................. 342
9.3.3 Laying of cables when replacing the ring motor .............................. 344
9.3.4 What has to be done after replacing the ring motor (M1_3)/pinion? 344
9.4 Pan actuators (M1_1/2) ................................................................................ 345
9.4.1 Replacing actuators......................................................................... 345
9.4.2 Laying of cables when replacing the actuator ................................. 346
9.4.3 What has to be done after replacing the actuators?........................ 346
9.5 Head support................................................................................................ 347
9.5.1 Replacing the headrest ................................................................... 347
9.5.2 Laying of cables when replacing the headrest ................................ 348
9.5.3 What has to be done after replacing the headrest? ........................ 348
9.6 Control panel ................................................................................................ 349
9.6.1 Replacing the user interface............................................................ 349
9.6.1.1 What has to be done after replacing the user interface? 350
9.6.2 Replacing the control panel............................................................. 351
9.6.2.1 What has to be done after replacing the control panel? 352
9.6.3 Laying cables for control panel replacement................................... 352
9.7 Laser light localizers..................................................................................... 353
9.7.1 FH laser light localizer (Pan) ........................................................... 353
9.7.1.1 Replacing the laser module in the FH (Pan) laser light
localizer
353
9.7.1.2 Adjusting the laser light localizer FH (PAN)................... 354
9.7.2 FH laser light localizer (Ceph)......................................................... 356
9.7.2.1 Replacing the ceph laser module in the FH laser light
localizer (ceph)
356
9.7.2.2 Adjusting the FH laser light localizer (Ceph).................. 357
9.7.3 MS laser light localizer (pan) ........................................................... 359
9.7.3.1 Replacing the laser module in the MS laser light localizer
(pan)
359
9.7.3.2 Adjusting the MS laser light localizer (PAN) .................. 360

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9.7.4 Laser area display (VOL) ................................................................ 362
9.7.4.1 Replacing the laser area display (VOL) ......................... 362
9.7.4.2 Adjusting the laser area display (VOL) .......................... 364
9.7.5 Checking the connection of the MS and FH (pan) laser light
localizers
366
9.8 Occlusal bite block ....................................................................................... 367
9.8.1 Replacing the occlusal bite block .................................................... 367
9.8.2 What has to be done after replacing the occlusal bite block? ......... 367
9.9 Bite block holder........................................................................................... 368
9.9.1 Replacing the bite block holder ....................................................... 368
9.9.2 Replacing the silicone rings............................................................. 369
9.9.3 What has to be done after replacing the bite block holder / silicone
ring?
369
9.10 Diaphragm unit ............................................................................................. 370
9.10.1 Replacing the diaphragm unit.......................................................... 370
9.10.2 What has to be done after replacing the diaphragm unit?............... 371
9.11 X-ray tube unit.............................................................................................. 372
9.11.1 Replacing the X-ray tube assembly................................................. 372
9.11.2 Replacing the fan in the X-ray tube assembly................................. 374
9.11.2.1 Replacing the fan........................................................... 374
9.11.2.2 What has to be done after replacing the fan?................ 374
9.11.3 Cables and connectors for replacement of the X-ray tube assembly 375
9.11.4 What has to be done after replacing the X-ray tube assembly?...... 377
9.12 Sensor unit ................................................................................................... 378
9.12.1 Flat Panel Detector.......................................................................... 378
9.12.1.1 Replacing the flat panel detector ................................... 378
9.12.1.2 Connecting a sensor unit............................................... 380
9.12.1.3 What has to be done after replacing the flat panel
detector?
381
9.12.2 DCS sensor ..................................................................................... 382
9.12.2.1 Replacing the DCS sensor ............................................ 382
9.12.2.2 Connecting a sensor unit............................................... 384
9.12.2.3 What has to be done after replacing the DCS sensor? . 385
9.12.3 Replace board DX83....................................................................... 386
9.12.4 Replacing fan package.................................................................... 390
9.13 Cephalometer............................................................................................... 391
9.13.1 Replacing the ceph sensor holder................................................... 391
9.13.1.1 What has to be done after replacing the ceph sensor
holder?
391
9.13.2 Replacing the ceph sensor.............................................................. 392
9.13.2.1 What has to be done after replacing the ceph sensor? . 392

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9.14 Light barriers ................................................................................................. 393
9.14.1 Replacing the light barriers .............................................................. 393
9.14.2 What has to be done after replacing the light barriers? ................... 394
9.15 Boards........................................................................................................... 395
9.15.1 Important notes about replacing boards........................................... 395
9.15.2 Replacing boards ............................................................................. 396
9.15.2.1 Replacing PC board DX1 ............................................... 396
9.15.2.2 Replacing board DX11 ................................................... 397
9.15.2.3 Replacing board DX32 ................................................... 397
9.15.3 Measures following replacement of boards...................................... 398
9.15.3.1 After changing the DX11 board ...................................... 398
9.16 Cable............................................................................................................. 400
9.16.1 Replacing energy chain 1 completely .............................................. 400
9.16.2 Replacing cables.............................................................................. 404
9.16.2.1 Replacing fiber-optic cable L5, L6 or L15 ....................... 405
9.16.2.2 Cable exchange (L3, L5, L6, L11, L12, and L15)/Laying
the cable/corrugated tube at the rotation unit
406
9.16.2.3 Replacing cable L117 or L108 in cable track 2............... 408
9.16.2.4 Replacing cable L1 or grounding strap in cable track 1.. 410
10 Maintenance............................................................................................................. 411
10.1 Calibrating the unit ........................................................................................ 411
10.2 Checking the height adjustment.................................................................... 412
10.3 Checking the forehead and temple supports ................................................ 413
10.4 Check rotation unit on the sensor unit for ease of access ............................ 414
10.5 Testing the rotating unit for smooth running.................................................. 414
10.6 Inspecting the bite block holder..................................................................... 415
10.7 Checking the ceph sensor holder.................................................................. 416
10.8 Checking the laser light localizers................................................................. 417
10.9 Checking the X-ray images ........................................................................... 420
10.10 Checking the tube data ................................................................................. 421
10.10.1 Checking the tube voltage................................................................ 421
10.10.2 Checking the tube current ................................................................ 422
10.10.3 Checking the fan and temperature sensor in the tube assembly
housing
425
10.10.4 Checking the radiation time.............................................................. 426

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10.11 Test exposures/Test images ......................................................................... 427
10.11.1 Calling "Test exposures" menu ........................................................ 428
10.11.2 2D test exposures ............................................................................ 429
10.11.2.1 Pan - diaphragm test exposure (2D) .............................. 429
10.11.2.2 Pan - Symmetrical test exposure (2D)............................ 430
10.11.2.3 Pan - quality test exposure (2D) ..................................... 431
10.11.2.4 Pan - test image (2D) ..................................................... 433
10.11.2.5 Pan - dark current exposure (2D) ................................... 435
10.11.2.6 Ceph - secondary diaphragm (2D) ................................. 437
10.11.2.7 Ceph - quality test exposure (2D)................................... 438
10.11.2.8 Ceph - test image (2D) ................................................... 441
10.11.3 3D test exposures ............................................................................ 443
10.11.3.1 Diaphragm test exposure (open) (3D) ............................ 443
10.11.3.2 Diaphragm test exposure (collimated) (3D).................... 445
10.11.3.3 Diaphragm test exposure (standard) (3D) ...................... 447
10.11.3.4 Quality test exposure (3D).............................................. 449
10.11.3.5 Quality test exposure DIN 6868-161 (3D) ...................... 451
10.11.3.6 Test image (3D).............................................................. 452
10.11.3.7 Dosimetry (3D) ............................................................... 454
10.11.3.8 Dosimetry DIN 6868-161 (3D) ........................................ 455
10.11.3.9 Dark current exposure (3D) ............................................ 456
10.12 Checking the cables for damage................................................................... 458
10.13 Checking the idling rollers ............................................................................. 459
10.14 Checking the grounding straps ..................................................................... 460
10.15 Checking the cable shields ........................................................................... 461
10.16 Checking the protective ground wires ........................................................... 462
10.17 Checking the device leakage current ............................................................ 466
11 Dismantling and disposal ......................................................................................... 467
11.1 Dismantling and reinstallation ....................................................................... 467
11.2 Disposal ........................................................................................................ 467
12 Service Manual History ............................................................................................ 469

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Sirona Dental Systems GmbH 1About this Service Manual
Service Manual ORTHOPHOS SL 1.1Other relevant documents
båÖäáëÜ
1About this Service Manual
1.1 Other relevant documents
In addition to this manual, you need the following documents:
Spare parts list
● ORTHOPHOS XG/SL List of Spare Parts: REF 59 38 423
Orthophos SL wiring diagrams
Wiring diagrams
● ORTHOPHOS SL Wiring References: REF 64 95 233
Installation Instructions
● ORTHOPHOS SL Software Installation: REF 65 44 287
● SIDEXIS 4 Installation Instructions: REF 64 47 200
DVD text
Current Service Documentation, such as the Service Manual, can be
downloaded from the Sirona dealer website.
1.2 Scope
This Service Manual describes the servicing of the ORTHOPHOS SL
digital volume tomograph. It is intended for use exclusively by trained and
authorized distributors and service technicians.
1.3 Tools and auxiliary materials
● Screwdriver set (slot and Phillips)
● Torx offset screwdrivers TX10, TX20, TX25
(included in the scope of supply)
● Open-end wrench, SW13
● Socket wrench, SW13
● Side cutting pliers
● Caliper gage
● Spirit level
● Digital Multimeter, Accuracy Class 1
● Mult-O-Meter 512L
● Fiber test device [e.g. Fiberpoint®250MD
● Soldering tool for repairing cables
● Cable ties
● Teflon tape
● Loctite

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1.4Structure of the document Service Manual ORTHOPHOS SL
1.4 Structure of the document
1.4.1 Identification of the danger levels
To prevent personal injury and material damage, please observe the
warning and safety information provided in these operating instructions.
Such information is highlighted as follows:
Tip: Information on making work easier.
1.4.2 Formats and symbols used
The formats and symbols used in this document have the following
meaning:
DANGER
An imminent danger that could result in serious bodily injury or death.
WARNING
A possibly dangerous situation that could result in serious bodily injury
or death.
CAUTION
A possibly dangerous situation that could result in slight bodily injury.
NOTICE
A possibly harmful situation which could lead to damage of the product
or an object in its environment.
IMPORTANT
Application instructions and other important information.
Prerequisite
1. First action step
2. Second action step
or
➢Alternative action
Result
➢Individual action step
Prompts you to do something.
See "Formats and symbols
used [ → 14]"
Identifies a reference to another text
passage and specifies its page
number.
● List Designates a list.
"Command / menu item" Indicates commands, menu items or
quotations.

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Sirona Dental Systems GmbH 2Safety instructions
Service Manual ORTHOPHOS SL 2.1Potentially lethal shock hazard
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2Safety instructions
2.1 Potentially lethal shock hazard
XGPF-36475; Risk of electric shock
2.2 Modifications to the unit
Modifications to this unit which might affect the safety of the system
owner, patients or other persons are prohibited by law!
For reasons of product safety, this product may be operated only with
original Sirona accessories or third-party accessories expressly approved
by Sirona. The user is responsible for any damage resulting from the use
of non-approved accessories.
2.3 Fixed connection
2.4 Electromagnetic compatibility
The unit complies with the requirements of standard IEC 60601-1-2.
Medical electrical equipment is subject to special EMC-related
precautions. It must be installed and operated as specified in the
document "Installation Requirements".
If high-voltage systems, radio link systems or MRI systems are located
within 5 m of the unit, please observe the specifications stated in the
installation requirements.
Portable and mobile RF communications equipment may affect medical
electrical equipment. Therefore, the use of mobile wireless phones in
medical office or hospital environments must be prohibited.
DANGER
Perilous shock hazard!
When replacing parts or in the event of extensions in the power supply
line, power switch, board DX32, or X-ray tube assembly area, there is
danger to life due to a potentially lethal shock hazard.
Before you start:
➢It is essential to ensure the unit is not supplied with voltage.
➢Always disconnect the unit from the junction box of the building
installation.
DANGER
Potentially lethal shock hazard!
Fixed connection!
Installing a mains plug instead of the specified fixed connection infringes
international medical regulatory actions and is prohibited. In case of
error, this puts patients, users, and other parties seriously at risk.

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2Safety instructions Sirona Dental Systems GmbH
2.5Electrostatic discharge Service Manual ORTHOPHOS SL
2.5 Electrostatic discharge
Electrostatic discharge (abbreviated: ESD – ElectroStatic Discharge)
Electrostatic discharge from people can damage electronic components
when the components are touched.
Touch a ground point to discharge static electricity before touching any
boards.
2.6 Switching the unit on
XGPF-63464; Patient position when switching on
Safety information for switching on the unit: Service engineer
Due to the risk of injury caused by malfunction, no person may be
positioned in the unit when it is switched on.
2.7 Condensation
Safety information for condensation: Service engineer
Extreme fluctuations of temperature may cause condensation inside the
unit. Do not switch the unit on before it has reached normal room
temperature. See also the chapter "Technical details"
2.8 Laser light localizer
Safety information for light localizer: Service engineer
The system incorporates Class 1 laser products.
A minimum distance of 10 cm (4") is required between the eye and the
laser. Do not stare into the beam.
Do not use the system with any other lasers, and do not make any
changes to settings or processes that are not described in these
operating instructions. This may lead to a dangerous exposure to
radiation.
2.9 Ventilation slots
Ventilation slots
Never cover the ventilation slots on the unit under any circumstances,
since this may obstruct air circulation. This can cause the unit to overheat.
SL sensor ventilation slots
Under no circumstances may the ventilation slots on the sensor unit be
covered, since otherwise the air circulation in the sensor unit will be
obstructed. This can cause the sensor unit to overheat.
2.10 Qualifications of service personnel
Installation and startup may be carried out only by personnel specifically
authorized by Sirona.

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Sirona Dental Systems GmbH 2Safety instructions
Service Manual ORTHOPHOS SL 2.11Radiation protection
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2.11 Radiation protection
Safety information for radiation protection: Service engineer
The valid radiation protection regulations and measures must be
observed. The statutory radiation protection equipment must be used.
During an exposure, the service engineer should move as far away from
the X-ray tube assembly as the coiled cable of the manual release
permits.
With the exception of the service engineer, no other persons are allowed
to stay in the room during an exposure.
In case of malfunctions, cancel the exposure immediately by letting go of
the exposure release button.
Information about radiation protection for Canada
2.12 Safety checks
Safety checks
Once repairs are completed, the circuit breaker test and unit leakage
current test must be carried out (see chapter "Checking the circuit
breaker" and "Checking the unit leakage current").
2.13 Functional check
Following any form of service and maintenance work, a functional check
must be performed on the device.
Perform the following test steps:
1. Perform a restart of the unit:
–Switch the unit off.
– Wait 1 minute.
–Switch the unit on.
– Wait for the self-test.
2. Perform a 2D test exposure using the needle phantom included in the
scope of supply.
3. Perform a 3D test exposure using the constancy test phantom / DIN
DVT test phantom included in the scope of supply.
NOTICE
3D imaging should not be used for screening examinations. 3D imaging
examinations must be clinically warranted and each exam must be
justified by demonstrating that the benefits outweigh the risks.
NOTICE
Where it is likely that evaluation of soft tissues will be required as part of
the patient's radiological assessment, the appropriate imaging should
be conventional medical CT or MR, rather than 3D imaging using Cone
Beam technology.
CAUTION
Be sure to observe the descriptions and safety information given in the
chapter titled "Switch on the unit" and "Test exposures / test images".

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3Unit description Sirona Dental Systems GmbH
3.1Hardware Service Manual ORTHOPHOS SL
3Unit description
3.1 Hardware
3.1.1 Information on the unit
The following symbols are applied to the unit:
This symbol can be found next to the rating plate on the unit.
Meaning: Observe the Operating Instructions when operating the unit.
This symbol can be found on the rating plate on the unit.
Meaning: The accompanying documents are available on the Sirona
homepage.
Electrostatic discharge (ESD)
Connector pins or sockets bearing ESD warning labels must not be
touched or interconnected without ESD protective measures. See also
"Electrostatic Discharge" and "Electromagnetic Compatibility" [ → 15].
XGPF-36245; Single use hygienic protective sleeves
Identification of single use devices
Prior to each exposure, the hygienic protective sleeves (single use
devices) must be fitted.
Single use devices are identified with the symbol shown on the left. They
must be disposed of immediately after use. Do not use single use devices
more than once.

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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS SL 3.1Hardware
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3.1.2 System version
Version Description
A ORTHOPHOS SL 2D
Digital X-ray unit with DCS sensor
Pan sensor: Digital CdTe sensor
with direct converter technology for
panoramic exposure technology
ORTHOPHOS SL 3D
Digital X-ray unit with digital Flat
Panel Detector and DCS sensor
Flat Panel Detector: Digital Flat
Panel Detector with a-Si
technology (amorphous silicon)
Pan sensor: Digital CdTe sensor
with direct converter technology for
panoramic exposure technology
AB
C

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3Unit description Sirona Dental Systems GmbH
3.1Hardware Service Manual ORTHOPHOS SL
3.1.3 Sensor versions
2D sensor unit:
Sensor unit for panoramic X-ray (PAN): DCS sensor (2D)
2D/3D sensor unit:
Sensor unit for panoramic X-ray (PAN) and volume exposures (3D):
DCS sensor (2D) and flat panel detector (3D)
CEPH sensor: Sensor for cephalometric X-ray (Ceph) (2D)
B ORTHOPHOS SL 2D/3D
Ceph, left-arm version
Digital X-ray unit ORTHOPHOS SL
(all variants A) with cephalometer,
left-arm version
C ORTHOPHOS SL 2D/3D
Ceph, right-arm version
Digital X-ray unit ORTHOPHOS SL
(all variants A) with cephalometer,
right-arm version
Version Description