Sirona Orthophos XG 3D Ceph User manual

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ORTHOPHOS XG 3D / Ceph Service Manual

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Sirona Dental Systems GmbH Table of contents
Service Manual ORTHOPHOS XG 3D / Ceph
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Table of contents
1About this Service Manual....................................................................................... 13
1.1 Scope ........................................................................................................... 13
1.2 Other documentation required...................................................................... 13
1.3 Tools and auxiliary materials........................................................................ 13
1.4 Structure of the document ............................................................................ 14
1.4.1 Identification of the danger levels.................................................... 14
1.4.2 Formats and symbols used ............................................................. 14
2Safety instructions ................................................................................................... 15
2.1 Modifications to the unit................................................................................ 15
2.2 Fixed connection .......................................................................................... 15
2.3 Electromagnetic compatibility....................................................................... 15
2.4 Electrostatic discharge ................................................................................. 15
2.5 Switching the unit on .................................................................................... 15
2.6 Condensation ............................................................................................... 16
2.7 Laser light localizer....................................................................................... 16
2.8 Ventilation slots ............................................................................................ 16
2.9 Qualifications of service personnel............................................................... 16
2.10 Radiation protection ..................................................................................... 16
2.11 Safety checks ............................................................................................... 17
2.12 Functional check .......................................................................................... 17
3Unit description........................................................................................................ 18
3.1 Hardware...................................................................................................... 18
3.1.1 Information on the unit..................................................................... 18
3.1.2 System versions .............................................................................. 19
3.1.3 Sensor versions............................................................................... 20
3.1.4 Installation versions......................................................................... 21
3.1.5 Modules and components ............................................................... 22
3.1.5.1 Slide.................................................................................. 23
3.1.5.2 Stand ................................................................................ 24
3.1.5.3 Cephalometer ................................................................... 25
3.1.5.4 Remote control ................................................................. 25
3.1.6 Cabling overview............................................................................. 26
3.1.7 Board photos ................................................................................... 32
3.1.7.1 Boards in the slide............................................................ 32
3.1.7.2 Boards in the stand........................................................... 39
3.1.7.3 Boards in the cephalometer (left- and right-arm versions)40

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3.1.7.4 Board in the remote control ............................................... 41
3.1.8 Covers.............................................................................................. 41
3.1.9 Technical Data ................................................................................. 44
3.2 Firmware ....................................................................................................... 49
4General operating procedures.................................................................................. 60
4.1 Switching the unit on ..................................................................................... 60
4.1.1 Factory setting after switch-on ......................................................... 61
4.2 Updating the unit firmware ............................................................................ 62
4.2.1 Update mode.................................................................................... 67
4.2.2 Check program releases .................................................................. 69
4.3 Opening "Details" .......................................................................................... 71
4.4 Setup of an X-ray component ....................................................................... 73
4.4.1 Selecting an X-ray component ......................................................... 74
4.4.2 Approval of the X-ray component..................................................... 80
4.4.3 Deleting an X-ray component........................................................... 82
4.5 Using demo mode – operation without radiation release .............................. 83
4.5.1 Switching on demo mode................................................................. 83
4.5.2 Switching off demo mode................................................................. 84
4.5.3 Important information for repacking and transport ........................... 85
5Messages ................................................................................................................. 88
5.1 Help messages ............................................................................................. 89
5.2 System messages......................................................................................... 90
5.3 Status displays .............................................................................................. 90
5.4 Error messages............................................................................................. 91
5.4.1 Error code: Ex yy zz ......................................................................... 91
5.4.2 Ex - Error type .................................................................................. 91
5.4.3 yy - Location..................................................................................... 93
5.4.4 General handling of error messages................................................ 93
5.5 List of error messages................................................................................... 94
5.5.1 Location 06: Tube assembly/DX6 .................................................... 94
5.5.2 Location 07: Easypad/DX7............................................................... 101
5.5.3 Location 10: System hardware......................................................... 105
5.5.4 Location 11: Power PC/Board DX11................................................ 108
5.5.5 Location 12: CAN bus ...................................................................... 111
5.5.6 Location 13: Stand/Peripherals ........................................................ 111
5.5.7 Location 14: Digital extension, SIDEXIS XG.................................... 125
5.5.8 Location 15: Configuration, update .................................................. 129
5.5.9 Location 42: Remote control ............................................................ 131
5.5.10 Location 61: Diaphragm control, board DX61 .................................. 135
5.5.11 Location 81, zz=1-23: Board DX81, pan slot.................................... 142

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5.5.12 Location 81, zz=51-78: Board DX81, ceph slot............................... 146
5.5.13 Location 88: Combisensor............................................................... 150
5.5.14 Location 91: Cephalometer, board DX91 ........................................ 155
6Troubleshooting....................................................................................................... 160
6.1 Error logging memory................................................................................... 161
6.1.1 Example of error logging data ......................................................... 161
6.2 Checking the CAN bus ................................................................................. 163
6.2.1 Checking the CAN bus with the diagnostic function of board DX1.. 167
6.2.2 Jumper positions in the CAN bus .................................................... 168
6.3 Checking the boards .................................................................................... 169
6.3.1 Checking board DX32 ..................................................................... 171
6.4 Checking the motors .................................................................................... 173
6.5 Checking the light barriers............................................................................ 174
6.6 Device leakage current too high................................................................... 175
6.7 Checking the cables ..................................................................................... 176
6.8 Error analysis of X-RAY control signal path ................................................. 177
6.9 Checking the data paths............................................................................... 180
6.9.1 Creating 2D test images.................................................................. 180
6.9.2 Creating a 3D test image................................................................. 182
7Adjusting and calibrating the unit............................................................................. 184
7.1 General information about unit adjustment and calibration .......................... 186
7.1.1 Displays and help messages during adjustment/calibration............ 187
7.1.2 "Adjustment/Calibration" menu........................................................ 188
7.1.2.1 Calling the "Adjustment/Calibration" menu....................... 188
7.1.2.2 Menu structure.................................................................. 189
7.1.3 Enabling exposure readiness .......................................................... 197
7.1.4 Taking an exposure......................................................................... 197
7.1.5 Save values..................................................................................... 197
7.1.6 Test phantoms for adjustment and calibration ................................ 198
7.1.6.1 OP XG needle phantom for panoramic adjustment.......... 198
7.1.6.2 OP XG 3D ceph adjustment phantom for the adjustment
of the cephalometer
200
7.1.6.3 Geometry phantom for volume calibration........................ 201
7.2 Adjustment and calibration via the "Unit adjustment/calibration" menu ....... 203
7.2.1 2D adjustment ................................................................................. 203
7.2.1.1 Pan sensor adjustment..................................................... 203
7.2.1.2 Pan diaphragm ................................................................. 206
7.2.1.3 Pan symmetry................................................................... 210
7.2.1.4 Ceph - Primary diaphragm ............................................... 214
7.2.1.5 Ceph - Fixed point of rotation ........................................... 218

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7.2.1.6 Ceph - Main X-ray beam direction..................................... 222
7.2.1.7 Ceph - Fixed point of rotation for QuickShot ..................... 225
7.2.1.8 Ear plug alignment ............................................................ 229
7.2.2 3D adjustment/calibration................................................................. 234
7.2.2.1 Sensor ............................................................................... 234
7.2.2.2 Aperture............................................................................. 235
7.2.2.3 Shading ............................................................................. 237
7.2.2.4 Shading (5x5) .................................................................... 238
7.2.2.5 Geometry........................................................................... 239
7.2.2.6 Dosimetry .......................................................................... 240
7.2.3 Saving adjustment/calibration data .................................................. 241
7.2.4 Resetting adjustment/calibration ...................................................... 242
7.3 Checking and adjusting the touchscreen ...................................................... 244
7.4 Mechanical adjustments................................................................................ 246
7.4.1 Mechanical adjustment: Ceph secondary diaphragm ...................... 246
8Perform service routines via the control panel ......................................................... 248
8.1 Overview of service routines ......................................................................... 248
8.1.1 List of all service routines available for selection ............................. 248
8.1.2 Alphabetical list of service routine functions .................................... 251
8.2 Service menu and service routines ............................................................... 254
8.2.1 Displays and symbols in the service menu ...................................... 254
8.2.1.1 Easypad ............................................................................ 254
8.3 Basic operating procedures in the service menu .......................................... 256
8.3.1 Activating the service menu ............................................................. 256
8.3.1.1 Easypad ............................................................................ 256
8.3.2 Selecting service routines and test steps......................................... 258
8.3.2.1 Selecting a service routine ................................................ 258
8.3.2.2 Selecting a test step .......................................................... 258
8.3.2.3 Service routines with security access................................ 259
8.3.3 Select parameters ............................................................................ 261
8.3.4 Saving parameters ........................................................................... 262
8.3.5 Exiting the test step and service routine .......................................... 262
8.4 S001: Radiation without rotary movement, fixed maximum radiation time ... 263
8.5 S002: Radiation without rotary movement, selectable kV/mA level and
maximum radiation time
265
8.5.1 S002: Test step 1 ............................................................................. 265
8.5.2 S002: Test step 3 ............................................................................. 267
8.5.3 S002: Test step 4 ............................................................................. 269
8.5.4 S002: Test step 5 ............................................................................. 271
8.6 S005: General X-ray tube assembly service................................................. 272
8.6.1 S005: Test step 1 ............................................................................. 272

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8.6.2 S005: Test step 2 ............................................................................ 274
8.6.3 S005: Test step 4 ............................................................................ 275
8.6.4 S005: Test step 5 ............................................................................ 276
8.6.5 S005: Test step 6 ............................................................................ 276
8.6.6 S005: Test step 7 ............................................................................ 278
8.7 S007: Error logging memory ........................................................................ 280
8.7.1 S007: Test step 1 ............................................................................ 280
8.7.2 S007: Test step 2 ............................................................................ 282
8.7.3 S007: Test step 5 ............................................................................ 283
8.7.3.1 Displaying the log with a web browser ............................. 284
8.8 S008: Update service ................................................................................... 286
8.8.1 S008: Test step 2 ............................................................................ 286
8.8.2 S008: Test step 3 ............................................................................ 287
8.9 S009: Flash file system ................................................................................ 288
8.9.1 S009: Test step 4 ............................................................................ 288
8.9.2 S009: Test step 5 ............................................................................ 289
8.9.3 S009: Test step 8 ............................................................................ 290
8.10 S011: Dosimetry (without ring movement) ................................................... 291
8.10.1 S011: Test step 14 .......................................................................... 291
8.10.2 S011: Test step 24 .......................................................................... 293
8.11 S012: CAN bus service ................................................................................ 294
8.11.1 S012: Test step 1 ............................................................................ 294
8.11.2 S012: Test step 2 ............................................................................ 296
8.11.3 S012: Test step 3 ............................................................................ 297
8.11.4 S012: Test step 4 ............................................................................ 298
8.12 S014: Rotation motor service ....................................................................... 299
8.12.1 S014: Test step 1 ............................................................................ 299
8.12.2 S014: Test step 2 ............................................................................ 300
8.12.3 S014: Test step 3 ............................................................................ 301
8.12.4 S014: Test step 4 ............................................................................ 301
8.13 S015: Actuator service ................................................................................. 302
8.13.1 S015: Test step 5 ............................................................................ 302
8.14 S017: Configuration service ......................................................................... 303
8.14.1 S017: Test step 2 ............................................................................ 304
8.14.2 S017: Test step 3 ............................................................................ 307
8.14.3 S017: Test step 4 ............................................................................ 308
8.14.4 S017: Test step 5 ............................................................................ 309
8.14.5 S017: Test step 6 ............................................................................ 311
8.14.6 S017: Test step 8 ............................................................................ 312
8.14.7 S017: Test step 12 .......................................................................... 313
8.14.8 S017: Test step 13 .......................................................................... 314
8.14.9 S017: Test step 14 .......................................................................... 315

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8.14.10 S017: Test step 15 ........................................................................... 317
8.14.11 S017: Test step 17 ........................................................................... 318
8.14.12 S017: Test step 18 (occlusal bite block only)................................... 321
8.14.13 S017: Test step 21 ........................................................................... 323
8.15 S018: Service for height adjustment ............................................................. 324
8.15.1 S018: Test step 2 ............................................................................. 325
8.15.2 S018: Test step 3 ............................................................................. 326
8.15.3 S018: Test step 4 ............................................................................. 327
8.15.4 S018: Test step 5 ............................................................................. 328
8.15.5 S018: Test step 6 ............................................................................. 329
8.15.6 S018: Test step 7 (occlusal bite block only)..................................... 330
8.15.7 S018: Test step 8 (occlusal bite block only)..................................... 332
8.15.7.1 Codes of possible error modes ......................................... 333
8.15.8 S018: Test step 9 (occlusal bite block only)..................................... 334
8.15.9 S018: Test step 10 (occlusal bite block only)................................... 336
8.16 S020: Service for temple support.................................................................. 337
8.16.1 S020: Test step 1 ............................................................................. 337
8.17 S021: Service for motor-driven diaphragm ................................................... 339
8.17.1 S021: Test step 1 ............................................................................. 339
8.18 S032: Sensor test.......................................................................................... 341
8.18.1 S032: Test step 10 ........................................................................... 341
8.18.1.1 S032: Test step 10: Explanations on the test procedure... 343
8.18.1.2 S032: Test step 10: Result of synchronized readout
sequence
343
8.18.2 S032: Test step 50 ........................................................................... 344
8.18.2.1 Possible results of self-test and troubleshooting measures 344
8.18.3 S032: Test step 56 ........................................................................... 345
8.19 S033: Test of ceph image path without SIDEXIS XG (for ceph units only)... 346
8.19.1 S033: Test step 10 ........................................................................... 346
8.20 S034: Service for the digital cephalometer ................................................... 348
8.20.1 S034: Test step 4 ............................................................................. 348
8.20.2 S034: Test step 5 ............................................................................. 352
8.20.3 S034: Test step 6 ............................................................................. 355
8.20.4 S034: Test step 8 ............................................................................. 356
8.20.5 S034: Test step 9 ............................................................................. 358
8.21 S037: Network service .................................................................................. 360
8.21.1 S037: Test step 1 ............................................................................. 360
8.21.2 S037: Test step 2 ............................................................................. 362
8.21.3 S037: Test step 3 ............................................................................. 364
8.21.4 S037: Test step 4 ............................................................................. 365
9Repair....................................................................................................................... 368

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9.1 Safety checks ............................................................................................... 369
9.2 Height adjustment motor (M1_4)/spindle...................................................... 370
9.2.1 Preparing for motor replacement..................................................... 370
9.2.1.1 Moving the slide manually ................................................ 370
9.2.2 Removing board DX32 .................................................................... 374
9.2.3 Replacing the height adjustment motor/spindle .............................. 376
9.2.4 Laying of cables when replacing the height adjustment motor........ 378
9.2.5 What has to be done after replacing the height adjustment motor
(M1_4) or the spindle?
380
9.3 Ring motor (M1_3)........................................................................................ 381
9.3.1 Replacing the ring motor ................................................................. 381
9.3.2 Replacing the pinion at the ring motor............................................. 382
9.3.3 Laying of cables when replacing the ring motor.............................. 383
9.3.4 What has to be done after replacing the ring motor (M1_3)/pinion? 383
9.4 Pan actuators (M1_1/2) ................................................................................ 384
9.4.1 Replacing actuators......................................................................... 384
9.4.2 Laying of cables when replacing the actuator ................................. 385
9.4.3 What has to be done after replacing the actuators?........................ 385
9.5 Head support................................................................................................ 386
9.5.1 Replacing the headrest ................................................................... 386
9.5.2 Laying of cables when replacing the headrest ................................ 387
9.5.3 What has to be done after replacing the headrest? ........................ 387
9.6 Control panel ................................................................................................ 388
9.6.1 Replacing the user interface............................................................ 388
9.6.1.1 What has to be done after replacing the user interface?..389
9.6.2 Replacing the control panel............................................................. 390
9.6.2.1 What has to be done after replacing the control panel? ...391
9.6.3 Laying cables for control panel replacement................................... 391
9.7 Laser light localizers..................................................................................... 392
9.7.1 FH double laser light localizer (pan)................................................ 392
9.7.1.1 Replacing the laser module in the FH double laser light
localizer (pan)
392
9.7.1.2 Adjusting the FH double laser light localizer (PAN).......... 393
9.7.2 FH laser light localizer (Ceph) ......................................................... 395
9.7.2.1 Replacing the ceph laser module in the FH laser light
localizer (ceph)
395
9.7.2.2 Adjusting the FH laser light localizer (Ceph) .................... 396
9.7.3 MS laser light localizer (pan) ........................................................... 398
9.7.3.1 Replacing the laser module in the MS laser light localizer
(pan)
398
9.7.3.2 Adjusting the MS laser light localizer (PAN) ..................... 399
9.8 Occlusal bite block ....................................................................................... 401

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9.8.1 Replacing the occlusal bite block ..................................................... 401
9.8.2 What has to be done after replacing the occlusal bite block? .......... 401
9.9 Bite block holder............................................................................................ 402
9.9.1 Replacing the bite block holder ........................................................ 402
9.9.2 Replacing the silicone rings ............................................................. 403
9.9.3 What has to be done after replacing the bite block holder/silicone
ring?
403
9.10 Diaphragm unit.............................................................................................. 404
9.10.1 Replacing the diaphragm unit .......................................................... 404
9.10.2 What has to be done after replacing the diaphragm unit? ............... 405
9.11 X-ray tube unit............................................................................................... 406
9.11.1 Replacing the X-ray tube assembly ................................................. 406
9.11.2 Cables and connectors for replacement of the X-ray tube assembly 408
9.11.3 What has to be done after replacing the X-ray tube assembly? ...... 410
9.12 Fan (X-ray tube assembly)............................................................................ 412
9.12.1 Replacing the fan (tube assembly 1.0)............................................. 412
9.12.2 Replacing the fan (tube assembly 2.0)............................................. 413
9.12.3 What has to be done after replacing the fan? .................................. 414
9.13 Combisensor ................................................................................................. 415
9.13.1 Replacing the rotation unit ............................................................... 415
9.13.2 Replacing the 3D module................................................................. 417
9.13.2.1 What has to be done after replacing the 3D module? ....... 420
9.13.3 Replacing the 2D sensor (Pan) ........................................................ 421
9.13.3.1 What has to be done after replacing the 2D sensor (Pan)? 423
9.14 Cephalometer................................................................................................ 424
9.14.1 Replacing the ceph sensor holder.................................................... 424
9.14.1.1 What has to be done after replacing the ceph sensor
holder?
424
9.14.2 Replacing the ceph sensor............................................................... 425
9.14.2.1 What has to be done after replacing the ceph sensor?..... 425
9.15 Light barriers ................................................................................................. 426
9.15.1 Replacing the light barriers .............................................................. 426
9.15.2 What has to be done after replacing the light barriers? ................... 427
9.16 Boards........................................................................................................... 428
9.16.1 Important notes about replacing boards........................................... 428
9.16.2 Replacing boards ............................................................................. 429
9.16.2.1 Replacing PC board DX1 .................................................. 430
9.16.2.2 Replacing board DX11 ...................................................... 431
9.16.2.3 Replacing board DX32 ...................................................... 431
9.16.3 Measures following replacement of boards...................................... 432
9.16.3.1 After changing the DX11 board ......................................... 435
9.17 Cable............................................................................................................. 437

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9.17.1 Replacing energy chain 1 completely.............................................. 437
9.17.2 Replacing cables ............................................................................. 441
9.17.2.1 Replacing fiber-optic cable L5, L6 or L15 ......................... 441
9.17.2.2 Cable exchange (L3, L5, L6, L11, L12, and L15)/Laying
the cable/corrugated tube at the rotation unit
442
9.17.2.3 Replacing cable L117 or L108 in cable track 2................. 444
9.17.2.4 Replacing cable L1 or grounding strap in cable track 1.... 446
10 Maintenance............................................................................................................ 447
10.1 Calibrating the unit ....................................................................................... 447
10.2 Checking the height adjustment ................................................................... 448
10.3 Checking the forehead and temple supports................................................ 449
10.4 Checking the rotation unit of the combisensor for smooth and easy running 450
10.5 Testing the rotating unit for smooth running................................................. 450
10.6 Inspecting the bite block holder.................................................................... 451
10.7 Checking the ceph sensor holder................................................................. 452
10.8 Checking the laser light localizers................................................................ 453
10.9 Checking the X-ray images .......................................................................... 457
10.10 Checking the tube data ................................................................................ 458
10.10.1 Checking the tube voltage............................................................... 458
10.10.1.1Checking the tube voltage characteristic during exposure
(tube assembly 1.0)
458
10.10.1.2Testing the tube voltage (tube assembly 2.0) .................. 463
10.10.2 Checking the tube current ............................................................... 464
10.10.3 Checking the radiation time............................................................. 467
10.10.4 Checking the fan and temperature sensor ...................................... 468
10.11 Test exposures/Test images ........................................................................ 469
10.11.1 2D test exposures ........................................................................... 470
10.11.1.1Panoramic diaphragm test exposure (2D)........................ 470
10.11.1.2Pan - Symmetry test exposure (2D) ................................. 472
10.11.1.3Ceph - Fixed point of rotation test exposure (2D) ............ 475
10.11.1.4Quality test exposure (2D)................................................ 477
10.11.1.52D test pattern.................................................................. 478
10.11.2 3D test exposures ........................................................................... 480
10.11.2.1Diaphragm test exposure (3D) ......................................... 480
10.11.2.2Quality test exposure (3D)................................................ 484
10.11.2.3Sensor test image (3D) .................................................... 485
10.11.2.4Dosimetry (3D) ................................................................. 487
10.11.2.5Dark current exposure (3D).............................................. 488
10.12 Checking the cables for damage.................................................................. 490
10.13 Checking the idling rollers ............................................................................ 491

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10.14 Checking the grounding straps ..................................................................... 492
10.15 Checking the cable shields ........................................................................... 493
10.16 Checking the protective ground wires ........................................................... 494
10.17 Checking the device leakage current ............................................................ 499
11 Dismantling and disposal ......................................................................................... 500
11.1 Dismantling and reinstallation ....................................................................... 500
11.2 Disposal ........................................................................................................ 500
12 Service Manual History ............................................................................................ 502

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Sirona Dental Systems GmbH 1About this Service Manual
Service Manual ORTHOPHOS XG 3D / Ceph 1.1Scope
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1About this Service Manual
1.1 Scope
Scope of the Service Manual: XG 3D
This Service Manual describes the servicing of the ORTHOPHOS XG 3D/
Ceph digital volume tomograph. It is intended for use exclusively by
trained and authorized distributors and service technicians.
1.2 Other documentation required
In addition to this manual, you need the following documents:
Spare parts list
● GALILEOS List of Spare Parts: Order No. 61 25 699
Wiring diagrams
● GALILEOS Wiring References: Order No. 61 25 640
DVD text
Current Service Documentation, such as the Service Manual, can be
downloaded from the Sirona dealer website.
1.3 Tools and auxiliary materials
Tools and auxiliary materials: XG
● Screwdriver set (slot and Phillips)
● Torx offset screwdrivers TX10, TX20, TX25
(included in the scope of supply)
● Open-end wrench, 13 mm A/F
● Socket wrench, 13 mm A/F
● Side cutting pliers
● Spirit level
● Digital Multimeter, Accuracy Class 1
● Mult-O-Meter 512L
● Soldering tool for repairing cables
● Cable ties
● Teflon tape
● Loctite

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1.4Structure of the document Service Manual ORTHOPHOS XG 3D / Ceph
1.4 Structure of the document
1.4.1 Identification of the danger levels
To prevent personal injury and material damage, please observe the
warning and safety information provided in these operating instructions.
Such information is highlighted as follows:
Tip: Information on making work easier.
1.4.2 Formats and symbols used
The formats and symbols used in this document have the following
meaning:
DANGER
An imminent danger that could result in serious bodily injury or death.
WARNING
A possibly dangerous situation that could result in serious bodily injury
or death.
CAUTION
A possibly dangerous situation that could result in slight bodily injury.
NOTICE
A possibly harmful situation which could lead to damage of the product
or an object in its environment.
IMPORTANT
Application instructions and other important information.
Prerequisite
1. First action step
2. Second action step
or
➢Alternative action
Result
➢Individual action step
Prompts you to do something.
See "Formats and symbols
used [ → 14]"
Identifies a reference to another text
passage and specifies its page
number.
● List Designates a list.
"Command / menu item" Indicates commands, menu items or
quotations.

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Sirona Dental Systems GmbH 2Safety instructions
Service Manual ORTHOPHOS XG 3D / Ceph 2.1Modifications to the unit
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2Safety instructions
2.1 Modifications to the unit
Modifications to this unit which might affect the safety of the system
owner, patients or other persons are prohibited by law!
For reasons of product safety, this product may be operated only with
original Sirona accessories or third-party accessories expressly approved
by Sirona. The user is responsible for any damage resulting from the use
of non-approved accessories.
2.2 Fixed connection
2.3 Electromagnetic compatibility
The unit complies with the requirements of standard IEC 60601-1-2.
Medical electrical equipment is subject to special EMC-related
precautions. It must be installed and operated as specified in the
document "Installation Requirements".
If high-voltage systems, radio link systems or MRI systems are located
within 5 m of the unit, please observe the specifications stated in the
installation requirements.
Portable and mobile RF communications equipment may affect medical
electrical equipment. Therefore, the use of mobile wireless phones in
medical office or hospital environments must be prohibited.
2.4 Electrostatic discharge
Electrostatic discharge (abbreviated: ESD – ElectroStatic Discharge)
Electrostatic discharge from people can damage electronic components
when the components are touched.
Touch a ground point to discharge static electricity before touching any
boards.
2.5 Switching the unit on
XGPF-63464; Patient position when switching on
Safety information for switching on the unit: Service engineer
Due to the risk of injury caused by malfunction, no person may be
positioned in the unit when it is switched on.
DANGER
Potentially lethal shock hazard!
Fixed connection!
Installing a mains plug instead of the specified fixed connection infringes
international medical regulatory actions and is prohibited. In case of
error, this puts patients, users, and other parties seriously at risk.

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2Safety instructions Sirona Dental Systems GmbH
2.6Condensation Service Manual ORTHOPHOS XG 3D / Ceph
2.6 Condensation
Safety information for condensation: Service engineer
Extreme fluctuations of temperature may cause condensation inside the
unit. Do not switch the unit on before it has reached normal room
temperature. See also the chapter "Technical details"
2.7 Laser light localizer
Safety information for light localizer: Service engineer
The system incorporates Class 1 laser products.
A minimum distance of 10 cm (4") is required between the eye and the
laser. Do not stare into the beam.
Do not use the system with any other lasers, and do not make any
changes to settings or processes that are not described in these
operating instructions. This may lead to a dangerous exposure to
radiation.
2.8 Ventilation slots
Ventilation slots
Never cover the ventilation slots on the unit under any circumstances,
since this may obstruct air circulation. This can cause the unit to overheat.
2.9 Qualifications of service personnel
Installation and startup may be carried out only by personnel specifically
authorized by Sirona.
2.10 Radiation protection
Safety information for radiation protection: Service engineer
The valid radiation protection regulations and measures must be
observed. The statutory radiation protection equipment must be used.
During an exposure, the service engineer should move as far away from
the X-ray tube assembly as the coiled cable of the manual release
permits.
With the exception of the service engineer, no other persons are allowed
to stay in the room during an exposure.
In case of malfunctions, cancel the exposure immediately by letting go of
the exposure release button.
Information about radiation protection for Canada
NOTICE
3D imaging should not be used for screening examinations. 3D imaging
examinations must be clinically warranted and each exam must be
justified by demonstrating that the benefits outweigh the risks.
NOTICE
Where it is likely that evaluation of soft tissues will be required as part of
the patient's radiological assessment, the appropriate imaging should
be conventional medical CT or MR, rather than 3D imaging using Cone
Beam technology.

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Sirona Dental Systems GmbH 2Safety instructions
Service Manual ORTHOPHOS XG 3D / Ceph 2.11Safety checks
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2.11 Safety checks
Safety checks
Once repairs are completed, the circuit breaker test and unit leakage
current test must be carried out (see chapter "Checking the circuit
breaker" and "Checking the unit leakage current").
2.12 Functional check
Note for XG 3D:
Following any form of service and maintenance work, a functional check
must be performed on the device.
Perform the following test steps:
1. Perform a restart of the unit:
–Switch the unit off.
– Wait 1 minute.
–Switch the unit on.
– Wait for the self-test.
2. Perform a 2D test exposure using the needle phantom included in the
scope of supply.
3. Perform a 3D test exposure using the constancy test phantom / DIN
DVT test phantom included in the scope of supply.
CAUTION
Be sure to observe the descriptions and safety information given in the
chapter titled "Switching the unit on [ → 60]" and "Test exposures/Test
images [ → 469]".

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3Unit description Sirona Dental Systems GmbH
3.1Hardware Service Manual ORTHOPHOS XG 3D / Ceph
3Unit description
3.1 Hardware
3.1.1 Information on the unit
The following symbols are applied to the unit:
Accompanying documents
Accompanying documents
This symbol is affixed next to the unit rating plate.
Meaning: When operating the unit, observe the operating instructions.
This symbol is affixed on the unit rating plate.
Meaning: The accompanying documents are available on the homepage
of Sirona.
Electrostatic discharge (ESD)
Connector pins or sockets bearing ESD warning labels must not be
touched or interconnected without ESD protective measures. See also
"Electrostatic Discharge" and "Electromagnetic Compatibility" [ → 15].
XGPF-36245; Single use hygienic protective sleeves
Identification of single use devices
Prior to each exposure, the hygienic protective sleeves (single use
devices) must be fitted.
Single use devices are identified with the symbol shown on the left. They
must be disposed of immediately after use. Do not use single use devices
more than once.

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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS XG 3D / Ceph 3.1Hardware
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3.1.2 System versions
XG3D device version
A ORTHOPHOS XG 3D, digital volume tomograph
B ORTHOPHOS XG 3D/Ceph,
digital volume tomograph with cephalometer, left-arm version
C ORTHOPHOS XG 3D/Ceph,
digital volume tomograph with cephalometer, right-arm version
AB
C

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3Unit description Sirona Dental Systems GmbH
3.1Hardware Service Manual ORTHOPHOS XG 3D / Ceph
3.1.3 Sensor versions
Sensor XG PAN: Sensor for panoramic X-ray (PAN)
Sensor XG CEPH: Sensor for panoramic and cephalometric
(CEPH) X-ray
PAN/3D combisensor:
Sensor for panoramic X-ray (PAN) and volume exposures (3D)