Sony XM-1600GSD Marketing Specifications,... User manual

1
SERVICE MANUAL
US Model
Canadian Model
XM-1600GSD
MONAURAL POWER AMPLIFIER
Other Specifications
Circuit system OTL (output transformerless) circuit
Pulse power supply
Inputs RCA pin jacks
High level input connector
Outputs Speaker terminals
Through out pin jacks
Speaker impedance 1 – 8 Ω
Maximum outputs 600 W (at 4 Ω)
1200 W (at 2 Ω)
Rated outputs (supply voltage at 14.4 V)
300 W (20 Hz – 300 Hz, 0.2% THD, at 4 Ω)
600 W (20 Hz – 300 Hz, 0.6% THD, at 2 Ω)
1000 W (20 Hz – 300 Hz, 1.2% THD, at 1 Ω)
Frequency response 5 Hz – 300 Hz ( dB)
Harmonic distortion 0.06% or less (at 100 Hz, 4 Ω)
Input level adjustment range
0.2 – 6.0 V (RCApin jacks)
0.4 – 12.0 V (High level input)
Low-pass filter 50 – 300 Hz, –18 dB/oct
Low boost 0 – 10 dB (40 Hz)
Power supply voltage 10.5 – 16 V
Current drain at rated output : 40 A (4 Ω)
Remote input : 2 mA
Dimensions Approx. 358 ×50 ×264 mm (w/h/d)
(14 1/8 ×2 ×10 1/2 in.) not incl.
projecting parts and controls
Mass Approx. 3.5 kg (7 lb. 11 oz.) not incl. accessories
Supplied accessories Mounting screws (4)
Design and specifications are subject to change without
notice.
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS
POWER OUTPUTAND TOTAL HARMONIC DISTORTION
300 watts minimum continuous average power into 4 ohms, 20 Hz to
300 Hz with no more than 0.2% total harmonic distortion per Car
Audio Ad Hoc Committee standards.
+0.5
–3
Ver 1.0 2002. 01
9-873-465-01
2002A0400-1
© 2002. 1
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.

2
TABLE OF CONTENTS
1. GENERAL
Features ................................................................................... 3
Location and Function of Controls.......................................... 3
Instllation ................................................................................. 3
Connections ............................................................................. 4
2. DISASSEMBLY
2-1. Bottom Plate ........................................................................ 6
2-2. Main Board Section ............................................................ 6
2-3. Main Board ......................................................................... 7
2-4. LED Board .......................................................................... 7
3. DIAGRAMS
3-1. Block Diagram .................................................................... 9
3-2. Printed Wiring Board –Main Section– ..............................10
3-3. Schematic Diagram –Main Section (1/2)– ........................ 11
3-4. Schematic Diagram –Main Section (2/2)– ........................ 12
4. EXPLODED VIEWS
4-1. Heat Sink (Main) Section.................................................. 15
4-2. Main Board Section .......................................................... 16
5. ELECTRICAL PARTS LIST ........................................ 17
XM-1600GSD

3
XM-1600GSD
SECTION 1
GENERAL This section is extracted
from instruction manual.

4
XM-1600GSD

5
XM-1600GSD

6
XM-1600GSD SECTION 2
DISASSEMBLY
1 BTP 3x6
5 bottom plat
e
7 insulating sheet
2 BTP 3x6
3 BTP 3x6
4 P 2.6x2.8
6
Note : Follow the disassembly procedure in the numerical order given.
2-1. BOTTOM PLATE
2-2. MAIN BOARD SECTION
4 CN1
3
1
B.TT. 3x14
2 B.TT. 3x14
5 MAIN board

7
XM-1600GSD
1 BTP 3x6
2 LED board
heat sink (main)
1 P 3x8
2 P 3x8
4 MAIN board
3 front (1ch) panel
2-3. MAIN BOARD
2-4. LED BOARD

8
XM-1600GSD SECTION 3
DIAGRAMS
( ): SIDE B
D1 G-6
(D2) F-8
D3 F-7
D5 E-6
(D8) F-8
D9 E-7
D11 D-7
(D12) D-9
(D13) D-9
(D14) D-10
(D15) E-5
(D16) E-5
(D19) C-2
(D20) C-12
(FET1) G-2
(FET2) G-2
(FET3) F-2
(FET4) E-2
(FET5) D-2
(FET6) D-2
(FET7) G-12
(FET8) G-12
(FET9) F-12
(FET10) E-12
(FET11) D-12
(FET12) D-12
IC1 G-7
IC2 G-8
IC3 G-6
IC4 G-9
IC5 D-7
(IC6) D-3
IC7 F-6
IC8 D-8
(LED1) D-14
(LED2) E-14
(LED3) F-14
(LED4) G-14
(PTC1) E-8
(PTC2) F-8
(Q1) F-8
(Q2) F-7
(Q3) D-8
(Q4) E-8
Q5 F-7
Q6 F-7
Q7 E-6
Q8 E-6
Q9 E-6
Q10 G-10
Q11 G-6
(Q12) C-3
Q13 C-3
Q14 F-6
Q15 F-6
Q16 E-6
Q17 E-9
(Q18) E-8
(Q19) E-9
(Q20) F-9
(Q21) E-9
(Q22) E-9
(Q23) E-9
(Q24) E-10
(Q25) E-9
(Q26) E-10
(Q27) F-9
(Q28) F-10
(Q29) F-9
(Q30) F-10
(Q31) F-9
(Q32) G-9
(Q33) G-8
Q34 G-10
Q35 D-9
Q36 E-8
Q39 F-6
Q42 F-7
Q43 F-7
Q44 E-6
(ZD1) G-8
(ZD2) G-7
(ZD3) D-7
(ZD4) D-7
(ZD5) F-8
Ref. No. Location
• Semiconductor Location
Ref. No. Location
16 15 14 13 12 11 10 9
1 2 3 4 5 6 7 8
OSC
REF. REG.
ERROR
ERROR
0.1V
NON INV
+IN
NON INV
-IN
NON INV
-IN
NON INV
+IN
PWMCOMP
IN
DEADTIME
CONTROL
CT
RT
GND
C1 E1
E2
C2
VCC
OUTPUT
CONTROL
VREF
IC6 TL494CN
• IC Block Diagram
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
• % : indicates tolerance.
•f: internal component.
•C: panel designation.
•A: B+ Line.
•B: B– Line.
• Powervoltage isdc 14.4Vand fed withregulated dcpower
supply from +12 V and REMOTE terminals.
• Voltagesaretaken with a VOM(Input impedance 10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: AUDIO
for printed wiring boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•z: Through hole.
•: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Partsonthepattern faceside seenfrom the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Waveform
1
IC6 5(CT)
3.2Vp-p
12µsec

99
XM-1600GSD
3-1. BLOCK DIAGRAM
5
1
275
1
5751
5
67
3
21
67
3
37 3
21
DRIVE
AMP
Q23-26
DRIVE
AMP
Q27-30
GND
CHANGE
Q5,PTC2
POWER
AMP
FET10-12
LPF
POWER
AMP
FET7-9
AMP
Q18,19
21,22,31
8 4
OSC
POWER
LED4
LEVEL
VR1-1
LEVEL
VR1-2
FILTER
VR3-3VR3-2VR3-1 VR3-4
OFF SET
LED2
THERMAL
LED1
OVER
CURRENT
LED3
LPF
B+ REG
Q3
B+ REG
Q1
B- REG
Q2
B- REG
Q32,33
TEST
TONE
LOW BOOST
(40Hz)
VR2
GND
CHANGE
Q36,PTC1
LED
DRIVE
Q39,42
OFFSET
DETECT
Q10
OVER LOAD
DETECT
Q35
AMP
Q17,34
LED
DRIVE
Q11,43
LED
DRIVE
Q14,15
THERMAL
AMP
Q7–9
ON/OFF
DRIVE
FET4-6
ON/OFF
DRIVE
FET1-3
B- REG
Q4
8
11
12
13
2
1
ON/OFF
CONTROL
ON/OFF
CONTROL
PWN
CONTROL
POWER
CONTROL
Q12,13
VCC
DC-DC CONVERTER
IC6
C1
T1 PT1
C2
OUT
CTL
JK1-1
L(MONO)
INPUT
L
JK1-3
L
OUTPUT
(THROUGH)
JK1-2
R
INPUT
JK1-4
R
OUTPUT
(THROUGH)
R
HIGH LEVEL
INPUT
L+R
R+L
SPEAKER
OUT
+12V
GND
REV
TM1
CNT1
TM2 13V
B-
B-
B-
B+
+17V
-17V
B+
OVER LOAD
DETECT
IC8
THR1 THR2 THR3
PRE AMP
IC1(2/2)
13V
LOW BOOST AMP
IC2(2/2) AMP
IC4(2/2) PHASE AMP
IC4(1/2)
LINE AMP
IC5(2/2)
LINE AMP
IC5(1/2)
FILTER AMP
IC2(1/2)
AMP
IC3(2/2)
PRE AMP
IC1(1/2)
TEST TONE GEN
IC3(1/2)
B+ CHECK
IC7(1/4),(2/4)
THERMAL DETECT
IC7(3/4)
Q16
TM3
TM4
SW1
FAULT DETECT
IC7(4/4)
Signal path
: AUDIO
FUSE 1-3
B+ REG
Q20
2 3
7
149
1
2
5
6
13
10

1010
XM-1600GSD
1
A
B
C
D
E
F
G
H
I
J
2 3 4 5 6 7 8 9 10 11 12 13 14
R95 R50
R51 R52
C15
D11
C7
C40
R66
R19
R65
R18
RG1
RG2
RG3
RG4
RG5
RG6
R81
R55
C35
R54
C36
R85
R84
R80
R67 R74
R78
R75
C31
R77 R56
R29
R27 R28
R32
R31
R160
C3
R35
R34 C13
C30
R10
C52
C29
C51
C28
C50
R11
C53 C24
C2
C23
C1
R22R21
R20
R25
Q34
Q10
RX1
R40
R41
R12
R14
R16 R15
C8
R38 R39
1-682-202- 11
1-682-203- 11
R13
C27
C4
C26
C12
R33
R36
R37
R2
R9 R8
R6
R163
R7
R4
R1
R157
R23
R24
C11
R70R68 R69 C6
R79
R82
R87
R17
R57
C39 R59
R43
R61 C38
R88
R76
R135
R120
R132
R133R125
R129 R127
R130 R131
R128 R126
R110
R109
R111
R171 R64
R181
R182
R180
R149
R170
R103
R154 R152
R104
R151
R158
C25
R3
R156
R153
R150
R162 R174
R105
R122
R112
R134
R123
R173
R172
R169
R106 R107
C41
R117
R115 R114
R136
R121
R116
R113
THR2
R118 R119
R164
R155
R166
R159
R161
C14
R60
R62
R53
R91
R58
C32
C33
C34
R86
R71
R94
C37
R89
R90 R93
R100
R83
R99
R92
MAIN BOARD (SIDE A)
LED BOARD
(SIDE A)
IC3
14
85
IC1
58
41
IC2
14
85
IC5
14
85
IC4
14
85
IC8
58
41
IC7
17
14 8
Q13
Q17
Q35
Q36
Q6
D9
Q42
Q43
Q5
Q39Q14
Q11
D1
Q8 Q7
Q44
Q16
Q15
D5 Q9
D3
BE
C
BE
C
BE
C
BE
C
BE
C
BE
C
BE
C
BE
C
EB
C
BE
C
BE
C
EB
C
EB
C
EB
C
EB
C
EB
C
BE
C
BE
C
BE
C
3-2. PRINTED WIRING BOARD — MAIN SECTION — • Refer to page 8 for Semiconductor Location.