1-1
SEL24105G
1. SERVICE NOTE
1-1. CHEMICALS
Some chemicals used for servicing are highly volatile.
Their evaporation caused by improper management affects your
health and environment, and wastes resources.
Manage the chemicals carefully as follows.
• Store chemicals sealed in a specific place to prevent from exposure
to high temperature or direct sunlight.
• Avoid dividing chemicals into excessive numbers of small con-
tainers to reduce natural evaporation.
• Keep containers sealed to avoid natural evaporation when chemi-
cals are not in use.
• Avoid using chemicals as much as possible. When using chemi-
cals, divide only required amount to a small plate from the con-
tainer and use up it.
1-2. EXTERIOR PARTS
Be careful to the following points for exterior parts used in this unit.
• Use a piece of cleaning paper or cleaning cloth for cleaning
exterior parts. Avoid using chemicals.
Even if you have to use chemicals to clean heavy dirt, do not
use paint thinner, ketone, nor alcohol.
• Insert the specific screws vertically to the part when installing
an exterior part.
Be careful not to tighten screws too much.
1-3. UNLEADED SOLDER
This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
• Set the soldering iron tip temperature to 350 °C approximately.
If cannot control temperature, solder/unsolder at high tempera-
ture for a short time.
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone
to flow) than ordinary solder so use caution not to let
solder bridges occur such as on IC pins, etc.
• Be sure to control soldering iron tips used for unleaded solder
and those for leaded solder so they are managed separately.
Mixing unleaded solder and leaded solder will cause detach-
ment phenomenon.
注意
如果电池更换不当会有爆炸危险。
只能用同样类型或等效类型的电池来更换。
务必按照说明处置用完的电池。
1-4. SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transis-
tors, that were installed during a previous repair. Point them out
to the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 350 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when solder-
ing or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED
LINE WITH MARK 0ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE OP-
ERATION. REPLACE THESE COMPONENTS WITH SONY
PARTS WHOSE PART NUMBERS APPEAR AS SHOWN
IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COMPO-
SANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉ-
ROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
