Sony SRF-M55 User manual

Ver 1.0 1999.09
MICROFILM
SRF-M55
SERVICE MANUAL
FM STEREO PLL SYNTHESIZED RADIO
SPECIFICATIONS
AEP Model
E Model
Chinese Model

– 2 –
Specifications ........................................................................... 1
1. GENERAL
Location and Function of Controls .................................... 2
2. DISASSEMBLY
2-1. “Cabinet ASSY, Front”, “Cabinet ASSY, Rear” ......... 3
2-2. Main Board ................................................................. 3
2-3. LCD201 ...................................................................... 4
2-4. Microcomputer Board................................................. 4
3. ADJUSTMENTS .......................................................... 5
4. DIAGRAMS
4-1. Explanation of IC Terminals....................................... 6
4-2. Block Diagrams .......................................................... 7
4-3. Printed Wiring Boards .............................................. 10
4-4. Schematic Diagram................................................... 13
5. EXPLODEDVIEW..................................................... 17
6. ELECTRICAL PARTS LIST.................................... 18
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
SECTION 1
GENERAL
LOCATION AND FUNCTION OF CONTROLS

– 3 –
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1.“CABINET ASSY, FRONT”,“CABINET ASSY, REAR”
2-2. MAIN BOARD
rThe equipment can be removed using the following procedure.
Cabinet ASSY, Front
Cabinet ASSY, Rear
Set Main board
Microcomputer board
LCD201
1 Screws (B1.7x8)
2 Claws
2 Claws
3
4
Flexible board
(10 core)
5 LCD flexible board (13 core)
Cabinet ASSY, rear
Cabinet ASSY, front
2 Claw
3 Claw
4
1
2
Main board
Cabinet ASSY, front
Button (power)
Lid, battery case
3 Claw

– 4 –
2-3. LCD201
2-4. MICROCOMPUTER BOARD
1 Claws
2
Cabinet ASSY, fron
t
LCD201
1 Screws (1.4)
3
5
Cabinet ASSY, rear
4 Claw
4 Claws
2 Claws
Microcomputer board
Cover, side

– 5 –
FM STEREO (19kHz) Adjustment
Setting :
Procedure :
1. Connect the frequency counter to TP (19kHz).
2. Turn the set to 98MHz.
3. Adjust RV1 for 19kHz reading frequency counter.
Standard Value : 18.9 –19.1kHz
Connection:
SECTION 3
ADJUSTMENTS
FM Section
Setting :
Connection:
For FM frequency coverage adjustment
• Repeat the procedures in each adjustment several times, and the
frequency coverage and tracking adjustments should be finally
done by the trimmer capacitors.
FM IF ADJUSTMENT
Adjust for a maximum reading on level meter.
T1 10.7MHz
FM FREQUENCY COVERAGE ADJUSTMENT
Adjust for a maximum reading on level meter.
CT2 87.5MHz adjustment value: 2V
standard value: 1.5 – 2.5V
Confirm 108.0MHz standard value: 9 – 13V
FMTRACKING ADJUSTMENT
Adjust for a maximum reading on level meter.
CT1 98MHz
FM RF signal
generator
22.5kHz frequency deviation by
400Hz signal.
Output level : as low as possible
TP (ANT)
0.01
µ F
set
16
Ω
headphones jack EP1 ( i )
level mete
r
FM RF signal
generator
Carrier frequency : 98MHz
Modulation : 1kHz, 22.5kHz deviation
Output level : 1mV (more than 60dB)
TP (ANT)
0.01
µ F
1-676-002-
C
C101
C102
R106
R105 R109
R119
R120
R111
R107
R102
R108
R101
R104
R103
R
C103 C124
C105
C104
C125
Q
CF1
BPF101
CF2
D101
D102
BE
C
BCE
Q104
Q101
Q105
ECB
TP
(ANT)
TP
(LPF)
digital
voltmeter
TP
(ANT)
[MAIN BOARD]
(SIDE A)
TP (LPF)
1
5
13
15
20
24
10
12
IC101
C114 C115
C113
C
109
C
108
R121
R115
1
12 R113 R114
C111
C110
C107 C116
C112
CF3
TP
(19kHz)
frequency counte
r
TP (19kHz)
1
µ F/50V
[MAIN BOARD] (SIDE A)
0 dB=1µV
Adjustments Location :
CT2 : FM Frequency Coverage
Adjustment
CT1 : FM Tracking Adjustment
T1 : FM IF Adjustment
RV1 : FM Stereo (19kHz) Adjustmen
t
[MAIN BOARD] (SIDE A)

– 6 –
SECTION 4
DIAGRAMS
4-1. EXPLANATION OF ICTERMINALS
IC301 µPD17015GS-556-GJG (SYSTEM CONTROL, LCD DRIVE)
Pin No. Pin name I/O Description
1 POB2 I Key return input.
2 PCO0 O Key source output.
3 PCO1 O Key source output.
4 PCO2 I Power (AUTO OFF) key input.
5 PCO3 I HOLD key input.
6 POD0/BEEP O Beep output.
7 POA0 I Key return input (Fixed at “L”).
8 POA1 I Voltage decrease information input. E: On-and-off
9 POA2 O Power ON/OFF output. “H” : ON
10 POA3 O Mute signal output. “H” : Mute ON
11 CE I Voltage decrease information input. E: Lighting
12 XOUT O System clock output (75 kHz).
13 XIN I System clock input (75 kHz).
14 VDD — Power supply.
15 GND — Ground.
16 EO O PLL error output.
17 VREG O Voltage regulator output.
18 VCOH I FM VCO input.
19 VCOL — Not used (OPEN).
20 – 28 LCD 0 – 8 O LCD segment output.
29 – 32 COM 0 – 3 O LCD common output.
33 VLCD1 — Power supply for LCD drive.
34 CAP1 — Connecting pins of the capacitor for LCD drive voltage.
35 CAP0
36 VLCD0 — Power supply for LCD drive.
37 POB0 I Key return input.
38 POB1

– 7 – – 9 –– 8 –
SRF-M55
• Signal path.
F: FM
4-2. BLOCK DIAGRAMS

23 4 5 6 7 89 10 11 12
A
1
B
C
D
E
F
G
02
[MICROCOMPUTER BOARD]
(SIDE B)
[MICROCOMPUTER BOARD]
(SIDE A) [MAIN BOARD] (SIDE B) [MAIN BOARD] (SIDE A)
11
(11)
1-676-003- 11
(11)
1-676-003-
11
(11)
1-676-002- 11
(11)
1-676-002-
C302
C326
C320
C321
C316
C318
C323
C317
C203
R332
R301
R321
R334
R306
R316
R317
R311
R310
R309
R312
R204
R202
R302
R304
R331
R330
R333
R305
R318
R303
R319 R320
R313
R308
R307
R203
R205
C206
R206
R201
C324
C305
C303
C304
C327
C328
C311
C315
C314
C319
C202
C204
C205
S202
POWER
(AUTO OFF)
S201
HOLD
S203
MODE
1
2
4
3
12
43
IC201
12
45
3
IC302
IC202
C201
X201
CN201
CN202
1
1
5
10
510
13
LCD201
LIQUID
CRYSTAL
DISPLAY
S205(JOG)
1
5
10
15
19 20
25
30
35
36
IC301
ECB ECB
Q305Q304
C312 C313
L304
D301
D306
D305
D303
C329
L303
T301
C301
Q301 Q307
ECB
Q308
ECB
BE
C
Q306
Q310
RV2
\VOL\∑
C27
C5 C6
C29
C26
C1 C18
C23
C22
C9
C21
C20
R9
R30
R3
R2
R1
R5
R4
R8 R99
C10
R98 R97 R96
C24
C16
C17
C8
C7
C19
C15
C13
C14
C25
C11
L4
1
56
10
IC3
157
14 10 8
IC2
C2
C28
C4
C12
L3
L1
RV1
T1
CT1
S1
S2
S1
FM SENS
DX
LOCAL
S2
GROOVE
MEGA BASS
OFF
CT2
L2
1
45
8
IC1
CN1
1
510
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION R03)
1PC, 1.5V
EP1
2
C120
C119 C122
C121
R118
R116 R117
R123
R122
C123
L5
L7
L6
BE C
Q103
1
5
13
15
20
24
10
12
IC101
C114 C115
C113
C109 C108
C106
C101
C102
R106
R105 R109
R119
R121
R115
R124
R120
R111
R107
R102
R108
R101
R104
R103
R110
R112 R113 R114
C103 C124
C105
C104
C111
C125
C110
C107 C116
C112
BCE
Q102
CF1
CF3
BPF101
CF2
D101
D102
BE
C
BCE
Q104
Q101
Q105
ECB
TP
(ANT)
TP
(19kHz)
TP
(LPF)
S202
-1
-2
BATT2
LITHIUM
BATTERY
BCE
– 10 – – 12 –– 11 –
SRF-M55 4-3. PRINTEDWIRING BOARDS
Note on Printed Wiring Boards:
Note:
•X: parts extracted from the component side.
•r:Through hole.
•b: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
D101 F-11
D102 F-11
D301 F-4
D303 F-4
D305 D-5
D306 D-5
IC1 F-8
IC2 D-8
IC3 C-5
IC101 E-12
IC201 D-3
IC202 D-3
IC301 C-5
IC302 E-5
Q101 F-12
Q102 E-11
Q103 B-12
Q104 G-12
Q105 G-12
Q301 G-5
Q304 D-4
Q305 D-4
Q306 F-5
Q307 G-5
Q308 F-5
Q310 F-5
Ref. No. Location
rSemiconductor
Location
Note on Schematic Diagram:
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•U: B+ Line.
•H: adjustment for repair.
• Power voltageis dc 1.5V and fedwith regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
• Voltages aretaken with aVOM(Inputimpedance10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: FM

– 13 – – 15 –– 14 –
SRF-M55
4-4. SCHEMATIC DIAGRAM
rWAVEFORMS
1
Q301-2 C
2
3
4
VOLT/DIV : 1 V AC
TIME/DIV : 0.1 µsec
T301
IC301 qs
XOUT
IC302 5
VOLT/DIV : 1 V AC
TIME/DIV : 0.2 µsec
VOLT/DIV : 0.1 V AC
TIME/DIV : 5 µsec
VOLT/DIV : 0.5 V AC
TIME/DIV : 5 µsec
4.6Vp-p
360 nsec
5.2Vp-p
982 nsec
330mVp-
p
75kHz
2.9 Vp-p
21
µ sec
rRefer to page 10 for Notes. rRefer to page 16 for IC Block Diagrams.

– 19 –
L4 1-412-010-41 INDUCTOR CHIP 22uH
L5 1-412-987-31 INDUCTOR 4.7uH
L6 1-412-987-31 INDUCTOR 4.7uH
L7 1-412-987-31 INDUCTOR 4.7uH
< TRANSISTOR >
Q101 8-729-423-52 TRANSISTOR 2SC3931-C
Q102 8-729-423-52 TRANSISTOR 2SC3931-C
Q103 8-729-800-71 TRANSISTOR 2SB815B7-TB
Q104 8-729-800-71 TRANSISTOR 2SB815B7-TB
Q105 8-729-037-71 TRANSISTOR UN9210J-(TX).SO
< RESISTOR >
R1 1-216-833-91 RES,CHIP 10K 5% 1/16W
R2 1-216-847-11 METAL CHIP 150K 5% 1/16W
R3 1-216-847-11 METAL CHIP 150K 5% 1/16W
R4 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R5 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R8 1-216-797-11 METAL CHIP 10 5% 1/16W
R9 1-216-829-11 RES, CHIP 4.7K 5% 1/16W
R30 1-216-811-11 RES, CHIP 150 5% 1/16W
R96 1-216-838-11 RES, CHIP 27K 5% 1/16W
R97 1-216-838-11 RES, CHIP 27K 5% 1/16W
R98 1-216-821-11 RES, CHIP 1K 5% 1/16W
R99 1-216-821-11 RES, CHIP 1K 5% 1/16W
R101 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
(EXCEPT Panama)
R102 1-216-807-11 METAL CHIP 68 5% 1/16W
(Panama)
R102 1-216-813-11 METAL CHIP 220 5% 1/16W
(EXCEPT Panama)
R103 1-216-845-11 METAL CHIP 100K 5% 1/16W
R104 1-216-845-11 METAL CHIP 100K 5% 1/16W
R105 1-216-845-11 METAL CHIP 100K 5% 1/16W
R106 1-216-845-11 METAL CHIP 100K 5% 1/16W
R107 1-216-797-11 METAL CHIP 10 5% 1/16W
R108 1-216-837-11 METAL CHIP 22K 5% 1/16W
R109 1-216-813-11 METAL CHIP 220 5% 1/16W
R110 1-216-845-11 METAL CHIP 100K 5% 1/16W
R111 1-216-797-11 METAL CHIP 10 5% 1/16W
R112 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R113 1-216-835-11 METAL CHIP 15K 5% 1/16W
R114 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R115 1-216-826-11 METAL CHIP 2.7K 5% 1/16W
R116 1-216-843-11 METAL CHIP 68K 5% 1/16W
R117 1-216-843-11 METAL CHIP 68K 5% 1/16W
R118 1-216-821-11 METAL CHIP 1K 5% 1/16W
R119 1-216-821-11 METAL CHIP 1K 5% 1/16W
R120 1-216-805-11 METAL CHIP 47 5% 1/16W
R121 1-216-809-11 METAL CHIP 100 5% 1/16W
R122 1-216-833-91 RES,CHIP 10K 5% 1/16W
R123 1-216-833-91 RES,CHIP 10K 5% 1/16W
R124 1-216-815-11 METAL CHIP 330 5% 1/16W
< VARIABLE RESISTOR >
RV1 1-223-276-11 RES, ADJ, CERMET 22K (STEREO 19kHz)
RV2 1-227-140-11 RES, VAR (VOL w)
< SWITCH >
S1 1-571-275-11 SWITCH, SLIDE (FM SENS)
S2 1-571-506-41 SWITCH, SLIDE (GROOVE/MEGA BASS/OFF)
< TRANSFORMER >
T1 1-416-020-11 TRANSFORMER, IF (TV IFT) (FM IF)
**************************************************************
*A-3683-122-A MICROCOMPUTER BOARD, COMPLETE
***********************
< BATTERY >
BATT2 1-528-412-11 BATTERY, PAS SECONDARY
< CAPACITOR >
C201 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C202 1-115-156-11 CERAMIC CHIP 1uF 10V
C203 1-162-957-11 CERAMIC CHIP 220PF 5% 50V
C204 1-107-826-91 CERAMIC CHIP 0.1uF 10% 16V
C205 1-107-826-91 CERAMIC CHIP 0.1uF 10% 16V
C206 1-115-156-11 CERAMIC CHIP 1uF 10V
C301 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V
C302 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C303 1-107-826-91 CERAMIC CHIP 0.1uF 10% 16V
C304 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C305 1-164-346-11 CERAMIC CHIP 1uF 16V
C311 1-107-826-91 CERAMIC CHIP 0.1uF 10% 16V
C312 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C313 1-110-501-11 CERAMIC CHIP 0.33uF 10% 16V
C314 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C315 1-164-357-11 CERAMIC CHIP 1000PF 5% 50V
C316 1-164-362-11 CERAMIC CHIP 470PF 5% 50V
C317 1-162-957-11 CERAMIC CHIP 220PF 5% 50V
C318 1-162-957-11 CERAMIC CHIP 220PF 5% 50V
C319 1-162-957-11 CERAMIC CHIP 220PF 5% 50V
C320 1-162-919-11 CERAMIC CHIP 22PF 5% 50V
C321 1-162-919-11 CERAMIC CHIP 22PF 5% 50V
C323 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C324 1-115-156-11 CERAMIC CHIP 1uF 10V
C326 1-115-156-11 CERAMIC CHIP 1uF 10V
C327 1-162-957-11 CERAMIC CHIP 220PF 5% 50V
C328 1-162-957-11 CERAMIC CHIP 220PF 5% 50V
C329 1-104-847-11 TANTAL. CHIP 22uF 20% 4V
< CONNECTOR >
CN201 1-691-351-11 CONNECTOR, FFC/FPC (ZIF) 13P
CN202 1-691-348-11 CONNECTOR, FFC/FPC (ZIF) 10P
< DIODE >
D301 8-719-073-01 DIODE MA111-(K8).S0
D303 8-719-420-87 DIODE MA8130
D305 8-719-049-09 DIODE 1SS367-T3SONY
D306 8-719-049-09 DIODE 1SS367-T3SONY
< IC >
IC201 8-759-530-11 IC S-80812ANNP-E72-T2
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
MAIN MICROCOMPUTER

– 20 –
IC202 8-759-472-77 IC S-80810ANNP-E70-T2
IC301 8-759-650-20 IC uPD17015GS-556-GJG
IC302 8-759-650-21 IC S-8323A25MC-ELF-T2
< COIL >
L303 1-419-311-21 INDUCTOR 100uH
L304 1-410-393-11 INDUCTOR CHIP 100uH
< TRANSISTOR >
Q301 8-729-402-13 TRANSISTOR XN1501
Q304 8-729-037-92 TRANSISTOR 2SD2216J-R(TX).SO
Q305 8-729-037-92 TRANSISTOR 2SD2216J-R(TX).SO
Q306 8-729-821-12 TRANSISTOR 2SB815B6B7.TB
Q307 8-729-037-71 TRANSISTOR UN9210J-(TX).SO
Q308 8-729-037-92 TRANSISTOR 2SD2216J-R(TX).SO
Q310 8-729-425-50 TRANSISTOR 2SB1462-Q
< RESISTOR >
R201 1-216-845-11 METAL CHIP 100K 5% 1/16W
R202 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R203 1-216-857-11 METAL CHIP 1M 5% 1/16W
R204 1-216-857-11 METAL CHIP 1M 5% 1/16W
R205 1-216-837-11 METAL CHIP 22K 5% 1/16W
R206 1-216-797-11 METAL CHIP 10 5% 1/16W
R301 1-216-797-11 METAL CHIP 10 5% 1/16W
R302 1-216-845-11 METAL CHIP 100K 5% 1/16W
R303 1-216-821-11 METAL CHIP 1K 5% 1/16W
R304 1-216-841-11 METAL CHIP 47K 5% 1/16W
R305 1-216-833-91 RES,CHIP 10K 5% 1/16W
R306 1-216-845-11 METAL CHIP 100K 5% 1/16W
R307 1-216-833-91 RES,CHIP 10K 5% 1/16W
R308 1-216-833-91 RES,CHIP 10K 5% 1/16W
R309 1-216-845-11 METAL CHIP 100K 5% 1/16W
R310 1-216-821-11 METAL CHIP 1K 5% 1/16W
R311 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R312 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R313 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R316 1-216-857-11 METAL CHIP 1M 5% 1/16W
R317 1-216-857-11 METAL CHIP 1M 5% 1/16W
R318 1-216-845-11 METAL CHIP 100K 5% 1/16W
R319 1-216-821-11 METAL CHIP 1K 5% 1/16W
R320 1-216-821-11 METAL CHIP 1K 5% 1/16W
R321 1-216-821-11 METAL CHIP 1K 5% 1/16W
R330 1-216-853-11 METAL CHIP 470K 5% 1/16W
R331 1-216-853-11 METAL CHIP 470K 5% 1/16W
R332 1-216-853-11 METAL CHIP 470K 5% 1/16W
R333 1-216-853-11 METAL CHIP 470K 5% 1/16W
R334 1-216-857-11 METAL CHIP 1M 5% 1/16W
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
< SWITCH >
S201 1-692-088-11 SWITCH, TACTILE (HOLD)
S202 1-692-088-11 SWITCH, TACTILE (POWER (AUTO OFF))
S203 1-692-088-11 SWITCH, TACTILE (MODE)
S205 1-475-240-12 ENCODER, ROTARY (JOG)
< TRANSFORMER >
T301 1-449-021-21 COIL, DC/DC CONVERTER
< VIBRATOR >
X201 1-767-388-11 VIBRATOR, CRYSTAL (75kHz)
**************************************************************
MISCELLANEOUS
*************
5 1-676-005-11 FLEXIBLE BOARD(B-B)
23 1-676-004-11 FLEXIBLE BOARD(B-E)
BATT2 1-528-412-11 BATTERY, PAS SECONDARY
LCD201 1-803-816-11 DISPLAY PANEL, LIQUID CRYSTAL
S205 1-475-240-12 ENCODER, ROTARY (JOG)
**************************************************************
ACCESSORIES & PACKING MATERIALS
********************************
3-867-758-11 MANUAL, INSTRUCTION (ENGLISH, FRENCH,
SPANISH, PORTUGUESE, CHINESE)
3-867-758-21 MANUAL, INSTRUCTION (GERMAN, DUTCH,
SWEDISH, ITALIAN, FINNISH)(AEP)
8-953-187-90 HEADPHONE MDR-ED136
SRF-M55
9-927-177-11 Sony Corporation
Personal Audio Company 99I0261-1
Printed in Japan © 1999.9
Published by General Engineering Dept.
MICROCOMPUTER