Sony RCD-W222ES - Cd/cdr Recorder User manual

RCD-W222ES
US Model
COMPACT DISC RECORDER
SERVICE MANUAL
SPECIFICATIONS
Model Name Using Similar Machanism NEW
CD Mechanism Type CDM65-RBD1
Base Unit Name RBD1
Optical Pick-up Name KRS-220C
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM53L-30B61B
Base Unit Name BU-30BBD61B
Optical Pick-up Name A-MAX.3
CD-R
section
CDP
section
9-874-116-01
2002I0200-1
© 2002.09
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
Ver 1.0 2002.09
DECK A (the CD player section)
System Compact disc digital audio system
Laser Semiconductor laser (λ=780 nm)
Emission duration: continuous
Frequency response 20 Hz – 20,000 Hz (±0.5 dB)
Wow and flatter Below measurable limit
DECK B (the CD-R and CD-RW recording section)
System Compact disc digital audio system
Laser Semiconductor laser (λ=780 nm)
Emission duration: continuous
Playable discs CD, CD-R, CD-RW
Recordable discs CD-R, CD-RW (for music use)
Frequency response 20 Hz - 20,000 Hz (±0.5 dB)
Wow and flatter Below measurable limit
Inputs
ANALOG IN
(Phono jacks) Impedance: 47 kilohms
Rated input: 500 mVrms
Minimum input: 250 mVrms
DIGITAL OPTICAL IN
(Square optical connector jack) Optical wavelength: 660nm
DIGITAL COAXIAL IN
(Phono jack) Impedance: 75 ohms
Rated input: 0.5 Vp-p,±20 %
Outputs
ANALOG OUT
(Phono jacks) Impedance: 47 kilohms
Rated output: 2 Vrms
Load impedance: over 10 kilohms
DIGITAL OPTICAL OUT
(Square optical connector jack) Optical wavelength: 660nm
Rated output: –18 dBm
DIGITAL COAXIAL OUT
(Phono jack) Rated output: 0.5 Vp-p, ±20 %
Load impedance: 75 ohms
PHONES
(Stereo phono jack) Rated output: 28mW
Load impedance: 32 ohms
General
Power requirements 120 V AC, 60 Hz
Power consumption 29 W
Dimensions (approx.) (w/h/d) incl. projecting parts and control
430 x 110 x 400 mm
( 17 x 4 3/8x 15 3/4inch)
Mass (approx.) 7.5 kg (16 1/2lbs)
Supplied accsessories
•Audio connecting cords
Phono jack x 2 (red/white) yPhono jack x 2 (red/white) (2)
•Remote commander (remote) (1)
•Size AA (R6) batteries (2)
Design and specifications are subject to change
without notice.

2
RCD-W222ES
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
age current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINE
WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Fig. A. Using an AC voltmeter to check AC leakage.
0.15µF
To Exposed Metal
Parts on Set
1.5kΩ
AC
voltmeter
(0.75V)
Earth Ground
CAUTION
The use of opticalinstruments with this product will increase eye
hazard.As the laser beam used in this Compact Disc Recorder is
harmful to eyes, do not attempt to disassemble the cabinet.
Refer servicing to qualified personnel only.
The following caution label is located inside the apparatus.

3
RCD-W222ES
TABLE OF CONTENTS
1. SERVICING NOTE .......................................................... 4
2. GENERAL .......................................................................... 7
3. DISASSEMBLY
3-1. Case (Top) ............................................................................ 8
3-2. Front Panel Section ..............................................................9
3-3. Power SW board, HP board, RM board,
LED board, CD SW board, Display Board .......................... 9
3-4. Deck A (CDM53L-30B61B), Deck B (CDM65-RBD1) ... 10
3-5. CD-R Board, Tray And Optical Pick-Up Block
(KRM-220) (Deck B)......................................................... 11
3-6. CD Base Unit (BU-30BBD61B) (Deck A) ........................ 12
3-7. Fitting Base (Guide) Assy, Bracket (Chassis)
And Magnet Assy (Deck A) ............................................... 12
3-8. Tray (Sub) (Deck A) .......................................................... 13
3-9. Chassis (Mold B) Section, Stocker Section
And Slider (Selection)........................................................ 13
4. ASSEMBLY ....................................................................... 14
5.TEST MODE...................................................................... 17
6. ELECTRICAL ADJUSTMENT ................................... 20
7. DIAGRAMS
7-1. Circuit Boards Location .................................................... 51
7-2. Block diagrams – BD Section –........................................ 52
Block diagrams – CD-R Section – .................................... 53
Block diagrams – MAIN Section –................................... 54
7-3. Schematic Diagram – CD-R (1/3) Section –..................... 55
7-4. Schematic Diagram – CD-R (2/3) Section –..................... 56
7-5. Schematic Diagram – CD-R (3/3) Section –..................... 57
7-6. Printed Wiring Board – CD-R Section (Side A) – ............ 58
Printed Wiring Board – CD-R Section (Side B) – ............ 59
7-7. Printed Wiring Board – BD Section –............................... 60
7-8. Schematic Diagram – BD Section – ................................ 61
7-9. Printed Wiring Board – CDM Section – ........................... 62
7-10. Schematic Diagram – CDM Section – ............................. 63
7-11. Printed Wiring Board – MAIN Section (Side A) – ........... 64
Printed Wiring Board – MAIN Section (Side B) – ........... 65
7-12. Schematic Diagram – MAIN (1/2) Section –................... 66
7-13. Schematic Diagram – MAIN (2/2) Section –................... 67
7-14. Printed Wiring Board – LED, HP Section –...................... 68
7-15. Schematic Diagram – LED, HP Section – ....................... 69
7-16. Printed Wiring Board – Display, Power Section – ............ 70
7-17. Schematic Diagram – Display, Power Section –............... 71
7-18. IC Pin Functions................................................................ 72
7-19. IC Block Diagrams............................................................ 83
8. EXPLODEDVIEWS
8-1. Case Section ........................................................................ 85
8-2. Front Panel Section ............................................................. 86
8-3. Chassis Section ................................................................... 87
8-4. CD Play Mechanism Section (Deck A)-1
(CDM53L-30B61B)........................................................... 88
8-5. CD Play Mechanism Section (Deck A)-2
(CDM53L-30B61B)........................................................... 89
8-6. CD Play Mechanism Section (Deck A)-3
(CDM53L-30B61B)........................................................... 90
8-7. Stocker Overall, Optical Pick-Up Section (Deck A) .......... 91
8-8. Base Unit (Deck A) ............................................................. 92
8-9. CD-R Mechanism Deck Section (Deck B) ......................... 93
9. ELECTRICAL PARTS LIST .................................94
SELF-DIAGNOSIS FUNCTION
When the self-diagnosis function is activated to prevent the player from
malfunctioning, three character service numbers in a combination with a
message appears in the display. In this case, check the following table.
Message Explanation
C12/ You are trying to record a disc that cannot be played
Cannot Copy back in DECK-A or with an external device, such
as CD-ROM or VIDEO CD.
• Remove the disc, and then insert a music CD for
playback.
C13/ Recording has not been completed successfully be-
Rec Error cause of vibration.
• Relocate the unit in a place free of vibration and
restart the recording again.
The disc you try to record is excessively dirty (such
as oilstained or finger marked) or scratched. Or the
disc is not normal.
• Replace the disc with another one and restart the
recording again.
C14/ The unit did not read the TOC information.
TOC Error • Insert other discs.
C41/ The sound source you are trying to record is a copy
Cannot Copy of a commercial music software. Or you are trying
to record on a CD-R/CD-RW digitally.
• Because of the restriction of the Serial Copy Man-
agement System, you cannot record a copy of a
commercial music software.
Neither can you record a CD-R/ CD-RW digitally.
• Use analog recording through the ANALOG IN
jack when you record from other units. Or use Syn-
chro-Recording when you record from DECK A.
(The recording mode is automatically changed to
analog recording.)
C71/ If this message is displayed momentarily, this is not
Din Unlock an error. It is caused by the digital signal during re-
cording. During recording of a digital sound source, the con-
necting cable has been disconnected or the player of
the sound source has turned off.
• Connect the cable or turn on the digital player.

4
RCD-W222ES
SECTION 1
SERVICING NOTE
NOTES REGARDING HANDLING OF THE PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully , taking care to avoid external pressure and impact.
If it is subjected to pressure or impact, the result may be an operational malfunction and/or damage to the
printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason the
adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used for
camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton swab
should be used, taking care not to distort this.
6) Never attempt to disassemble the pick-up.
Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not use any
other liquid cleaners, because they will damage the lens.) Take care not to use too much of this alcohol on the swab,
and do not allow the alcohol to get inside the pick-up.
Storage in conductive bag
NEVER look directly at the laser beam, and don’t let contact
fingers or other exposed skin.
Magnet
How to hold the pick-up
Conductive Sheet
Cotton swab
Pressure
Pressure
Drop impact

5
RCD-W222ES
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These compo-
nents are sensitive to, and easily affected by, static electricity. If such static is high voltage, components
can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must
be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong
magnetism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1MΩ)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent
static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Resistor
(1MΩ) Conductive
Sheet
Resistor
(1MΩ)
Armband

6
RCD-W222ES
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components com-
monly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated cir-
cuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-
face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are ready
to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive
foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL
OTHER SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen -
erate static electricity sufficient to damage an ESD device).

7
RCD-W222ES
SECTION 2
GENERAL
12 3 4 567 890qaqs qd qf
qgqhqjql qkw;wawswdwfwh wgwjwkwle;eaesed
1POWER button
2g(remote sensor)
3DISC 1-5 Abuttons
4CD SYNCHRO NORMAL/HIGH buttons
5MENU/NO button
6Disc tray-Deck B
7YES button
8TIME-Deck B button
9OPEN/CLOSE button -Deck B
0PLAY MODE button -Deck B
qa INPUT button
qs FINALIZE button
qd ERASE button
qf SBM button and indicator
qg REC LEVEL knob
qh REC button -Deck B
qj (stop) button -Deck B
qk X (pause) button -Deck B
ql N (play) button -Deck B
w; DISPLAY button
wa l AMS L/PUSH ENTER-Deck B
ws CLEAR-Deck B
wd Display button
wf Disc tray-Deck A
wg l AMS L/PUSH ENTER knob -Deck A
wh CLEAR button -Deck A
wj PLAY MODE button -Deck A
wk (stop) button -Deck A
wl X (pause) button -Deck A
e; N (play) button -Deck A
ea TIME button -Deck A
es PHONES jack
ed PHONE LEVEL knob
Parts and Controls

8
RCD-W222ES
SECTION 3
DISASSEMBLY
3-1. CASE (TOP )
Note: Disassemble the unit in the order as shown below.
Note: Follow the disassembly procedure in the numerical order given.
Case(top)Set Front panel section POWER SW board, HP board, RM board, CD SW board, LED board and DISPLAY board
Deck A CD changer mechanism deck (CDM53L-30B61B)
Deck B CD-R/CD-RW mechanism deck (CDM65-RBD1)
Tray (sub)
Chassis (mold B) section, Stocker section and Slider (selection)
CD-R board, Tray and Optical pick-up block (KRM-220C)
CD base unit (BU-30BBD61B)
Fitting base (guide) assy, Bracket (chassis) and Magnet assy
1 Two screws (Flat head)
3 Two screws (Flat head)
4 Screw (Flat head)
2 Two screws (Flat head
)
5 Case

9
RCD-W222ES
3-2. FRONT PANEL SECTION
3-3. POWER SW BOARD, HP BOARD, RM BOARD, LED BOARD, CD SW BOARD, DISPLAY BOARD
A
1
White lever
Insert a screwdriver to the square hole on the bottom,
and slide the white lever in the arrow
A direction to
open the tray.
Then remove the loading panel.
(CD-R/CD-RW Recorder (deck B) only.)
2 Loading panel
7 Screw (+BVTP 3X8)
8 Four screw (BV /RING)
qs Front panel
6 Connector (CN920)
5 Connector (CN901)
3 Connector (CN690)
4 Wire (Flat type) (CN671)
9 Claw
9 Claw
0
qa
qa
1 Three knobs
2 Tw o screws (+BVTP 2.6x8)
4 Tw o screws
(+BVTP 2.6x8)
3 POWER SW board
6 Nineteen screws
(+BVTP 2.6x8)
5 HP board
0 CD SW board
qa DISPLAY board
7 Hook
8 RM board
9 LED board

10
RCD-W222ES
3-4. DECK A (CDM53L-30B61B), DECK B (CDM65-RBD1)
2 Wire (Flat type)
(CN640)
9 Wire (Flat type)
(CN701)
1 Connector
(CN641)
7 Connector
(CN713)
3 Wire (Flat type)
(CN660)
qa Wire (Flat type)
(CN630)
qg Wire (Flat type)
(CN110)
qh Connector
(CN111)
8 Wire (Flat type) (23 core)
6
5
Tw o screws (+BVTP 3x8)
4 Tw o screws (+BVTP 3x8)
qs Tw o screws
(+BVTP 3x8)
qd Tw o screws
(+BVTP 3x8)
qf
0
Deck A CD changer mechanism deck
(CDM53L-30B61B)
qj Deck B
CD-R/CD-RW mechanism dec
k
(CDM65-RBD1)

11
RCD-W222ES
3-5. CD-R BOARD, TRAY AND OPTICAL PICK-UP BLOCK (KRM-220C) (DECK B)
1 Tw o screws
(+BVTP 2.6x8)
2 Tw o screws
(+BVTP 2.6x8)
9 CD-R board
3 Bottom plate
4 Connector
(CN101)
5 Connector
(CN102)
8 Hook
8 Hook
6 Connector
(CN103)
7 Connector
(CN104)
qs Tr ay
Bottom view
of both sides
on chassis
0 Slide the tray out and stopped,
spread the tray stoppers on both
sides in the arrow direction
from the bottom to release
the tray.
Tray stoppers
qa
qd
Tw o hooks
qd Tw o hooks
qf
qg
Holder (MG) sub assy
qh Three screws (+BVTP 2.6x8)
qj Dust cover
qk Tw o screws (+PTP 2x9)
ql Tw o step
screws
w; Connector
wa Optical pick-up block
(KRM-220C)
Front

12
RCD-W222ES
3-7. FITTING BASE (GUIDE) ASSY, BRACKET (CHASSIS) AND MAGNET ASSY (DECK A)
3-6. CD BASE UNIT (BU-30BBD61B) (DECK A)
4 Two screw (BVTP2.6)
6 Two coil springs
(insulator)
5 Stopper (BU)
1 Floating screw
2 Two screw (BVTP2.6)
3 Two coil springs
(insulator)
7 CD base unit
(BU-30BBD61B)
8 Four screws
(BVTP M2.6)
6 Bracket
(chassis)
4 Two screws
(BVTP M2.6)
2 Four screws
(BVTP M2.6)
3 Fiiting base
(guide) assy
1 Two connectors
(CN709, 715)
5 Two screws
(BVTP M2.6)
9 Magnet assy
7 Connecto
r
(CN710)

13
RCD-W222ES
3-8. TRAY (SUB) (DECK A)
3-9. CHASSIS (MOLD B) SECTION, STOCKER SECTION AND SLIDER (SELECTION)
A
2
4
B
1
Rotating the pulley (LD), shift the slider (selection) in the direction of arrow A .
2 Rotating the pulley (mode) in the arrow direction, adjust the tray (sub) to be removed.
3 Rotating the pulley (LD), shift the slider (selection) in the direction of arrow B .
4 Rotating the pulley (mode) in the arrow direction, remove the tray (sub).
slider (selection)
pulley (LD)
stocker section
tray (sub)
pulley (mode)
Note: On mounting parts, refer to pages 14 to 16.
1 Three screws
(BVTP M2.6)
2 Chassis (mold B) section
3 Gear (eject)
4 Tw o step screws
5 Tw o step screws
6 Stocker
section
7 Tw o screws
(PTPWH M2.6)
8 Slider (selection)
9 Washer
0 Compression
spring
pulley (LD)
Note: Rotating the pulley (LD),
shift the slider (selection)
to the left.

14
RCD-W222ES
SECTION 4
ASSEMBLY
Note : Follow the assembly procedure in the numerical order given.
4-1. GEARS INSTALLATION
GEARS INSTALLATION
(Page 14)
SLIDER (SELECTION) INSTALLATION
(Page 15)
STOCKER SECTION INSTALLATION
(Page 15)
CHASSIS (MOLD B) SECTION
INSTALLATION (Page 16)
3 Gear (gear B)
2 Gear (U/D slider)
4 Gear (gear A)
1 Slide the slider (u/d)
fully in the arrow
direction.
Portion A
Adjust the gear (gear B) with the
portion A as shown.
Slider (U/D) gear
Adjust the gear so that ot meshes with
the bottom tooth of slider (U/D) gear,
as shown.
Gear
(gear B) Linearly
Adjust so as to be aligned with
gear B linearly, as shown.

15
RCD-W222ES
4-2. SLIDER (SELECTION) INSTALLATION
4-3. STOCKER SECTION INSTALLATION
2 Gear (chucking)
5 Washer
4 Compression spring
3 Convex portion of
slider (selection)
1 Rotary encoder
7 Insert the slider (selection)
into the portion A.
6 Tw o screws
(PTPWH M2.6
Rotary encoder
Align with the slot of
rotary encoder. Portion A
Gear (chucking)
Insert a convex portion into
a groove of gear (chucking)
Align marking
1 Stocker section
4 Two step screws
3 Two step screws
2 Portion A of tray (sub)
Hook the portion A of tray (sub)
to the slider (selection).
Portion A
of tray (sub)
Sticking of
slider (selection)

16
RCD-W222ES
4-4. CHASSIS (MOLD B) SECTION INSTALLATION
Gear (LD deceleration)
Portion B of
slider (selection)
3 Three screws
(BVTP M2.6)
1 Insert the portion A of
chassis (mold B) sectio
n
into the portion B of
slider (selection).
2 Insert the gear (eject)
under the gear (LD
deceleration). Portion A

17
RCD-W222ES
SECTION 5
TEST MODE
Setting the Test Mode
Procedure:
1. Press the POWER button to POWER on.
2. Press the l AMS L (DECK A), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.
3. Turn the l AMS L (DECK B) knob to select the menu.
4. Press the l AMS L (DECK B) knob to execute the test
mode.
Releasing the Test Mode
Procedure 1:
1. Turn the l AMS L (DECK B) knob to select the Ship
Mode.
2. Press the l AMS L (DECK B) knob to execute the Ship
Mode.
3. Press the POWER button to POWER off.
Contents of test mode
No. Display Function
1SYS Version System version display
2CDR Version CDR version display
3BU Test Deck A BU test mode
4SERVICE Deck A Service mode
5Ship Mode CD Shipment mode
6FL ALL ON Fluorescent indicator tube test
7FL ALL OFF Fluorescent indicator tube test
8FL ITIMATSU Fluorescent indicator tube test
9LED CHECK LED check
10 KEY CHECK Keyboard check
11 RM CHECK Remote commander check
12 CDR History CDR error history display
13 Play Speed Deck A x4 speed
System Version Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “SYS Version”, and press the l AMS L
(DECK B) knob.
2. The system version is displayed.
3. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
4. Press the POWER button to POWER off.
CDR Version Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “CDR Version”, and press the l AMS L
(DECK B) knob.
2. The CDR version is displayed.
3. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
4. Press the POWER button to POWER off.
Service Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “SERVICE”, and press the l AMS L
(DECK B) knob.
2. “SERVICE MODE” is displayed.
3. Press the ERASE button, the “SLED OUT” is displayed and
the sled moves to the outermost position.
4. Press the FINALIZE button, the “SLED IN” is displayed and
the sled moves to the innermost position.
5. Press the l AMS L (DECK B) knob, then “SERVICE
MODE” is displayed again.
6. To exit from this mode, press the l AMS L (DECK A),
[SBM] and l AMS L (DECK B) buttons in order with-
out releasing the button.
7. Press the POWER button to POWER off.
Note: Always move the pick-up to the most inside position when
exiting from this mode.
Ship Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob.
2. “Push POWER!” is displayed.
3. Press the POWER button to POWER off.
FL ALL ON Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ALL ON”, and press the l AMS L
(DECK B) knob.
2. All segments of fluorescent indicator tube and all LEDS turn on.
3. Press the MENU/NO button, then “FL ALL ON” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
FL ALL OFF Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ALL OFF”, and press the l AMS L
(DECK B) knob.
2. All segments of fluorescent indicator tube and all LEDs turn off.
3. Press the MENU/NO button, then “FL ALL OFF” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
FL ITIMATSU Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ITIMATSU”, and press the l AMS
L (DECK B) knob.
2. Checkered patterns of segments are displayed.
3. Press the MENU/NO button, then “FL ITIMATSU” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
LED Check Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “LED CHECK”, and press the l AMS L
(DECK B) knob.
2. Turn the l AMS L (DECK A) or (DECK B) knob clock-
wise. The green LED (DISC 1) turns on, then the orange LED
(DISC 1) turns on. The each orange LED turns on after the green
LED from DISC 1 to DISC 5. The LED (SBM) turns on at last.
Counterclockwise rotation gives a performance in reverse order.

18
RCD-W222ES
3. Press the MENU/NO button, then “LED CHECK” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
KEY Check Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “KEY CHECK”, and press the l AMS L
(DECK B) knob.
2. “Got l keys” is displayed.
3. Press the buttons, and when all the buttons are pressed (without
the POWER button), “Got 35 keys” will be displayed.
4. To exit from this mode, press the l AMS L (DECK A),
[SBM] and l AMS L (DECK B) buttons in order with-
out releasing the button.
5. Press the POWER button to POWER off.
Remote Commander Check
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “RM CHECK”, and press the l AMS L
(DECK B) knob.
2. Press the Hkey on the remote commander, then “Got
PlayCom” is displayed.
3. Press the MENU/NO button, then “RM CHECK” is displayed again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
CDR History Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “CDR History”, and press the l AMS L
(DECK B) knob.
2. “00 ######## ########” is displayed as the first error hitory.
3. Turn the l AMS L (DECK B) knob to select the error
history. The number of error histories is ten in all.
(Refer to “Contents of CDR error history”.)
4. Press the MENU/NO button, then “CDR History” is displayed
again.
5. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
6. Press the POWER button to POWER off.
Play Speed Selection Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “Play Speed”, and press the l AMS L
(DECK B) knob.
2. “x4 Play” is displayed. If a CD is in the deck A, pressing the
Nbutton executes the 4 times speed playback.
3. Press the xbutton to stop the playback.
4. Press the MENU/NO button, then “Play Speed” is displayed
again.
5. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
6. Press the POWER button to POWER off.
Contents of CDR error history
display(example)
(hexadecimal)
1Order of the error history
00 to 09: ten error histories in all
2Error contents
01: unable to focus on
02: Q code/ATIP discontinuous (several frames preceding)
03: Q code/ATIP unreadable
04: search taking more than sixteen seconds
05: focus failure
06: sled over run
07: not passing by start time to write
08: audio buffer over
09: sync failure
example : 05 is focus failure
3Operation mode
bit 7: Speed
0: normal speed
1: x4 speed
bit 6 to bit 0: Number of inner condition
01: POWER off condition/during shift to POWER on
02: POWER off and shipment setting/during shift to POWER
off and shipment setting
03: stop condition/during stop
04: during start up of servo
05: during TOC reading and others
06: during CD TEXT reading
07: during standby(waiting for command from the CD sys-
tem)/during search
08: during playback
09: during manual search(playback)
0A:during pause
0B: during manual search(pause)
0C: during OPC
0D:recording standby/during recording pause
(enable to shift to recording)
0E: during recording
0F: unable to record (waiting for shift to being recordable)
10: PMA updating
11: during operation of unfinalize
12: during operation of finalize
13: PMA erasing
14: emergency
15: recording preparation
16: recording end
00 05070D80
000E2E0D
1 2
5 6
3 4

19
RCD-W222ES
examples :
4Start time of read in(compression method)
bit 15 to bit 13 : (min)
0: 97 min
1: 96 min
2: 95 min
7: others
bit 12 to bit 7: (sec)
bit 6 to bit 0: (frame)
examples :
5Write POWER (integer of mW x 10, available during write
processing)
examples: 00 means unavailable
(when 3operation mode is not recording)
: A3 means 163(decimal), i.e. 16.3 mW
6ATIME (min)/(sec)/(frame)
example: 0E, 2E, 0D means 14 : 46 : 13
Abbreviations:
ATIP : Absolute Time In Pre-groove
OPC : Optimum POWER Control
PMA : Program Memory Area
0000 0111
07
91 1001 0001
7
7
654 321
11 1
0 Operation mode
normal speed, during
standby(waiting for
command from the CD
system)/during search
x4 speed,
during operation of
unfinalize
00
bit
HEX
0000 1101 1000 0000
0001 0001 0001 0110
0D,80
11,16
7
0(frame)
654 321
34(sec)97(min) 22(frame)
015 14 13 12 11 10 9 8 Start time of read in
97 : 27 : 00
97 : 34 : 22
97(min) 27(sec)
bit
HEX

20
RCD-W222ES
Note :
1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10MΩimpedance.
4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
S Curve Check
Connection:
Procedure:
1. Connect an oscilloscope to test point TP(FE) and TP (DVC) on
the BD board.
2. Turn the power on.
3. Load the disc (YEDS-18).
4. Enter the test mode, select the BU Test asd press the l
AMS L (DECK B) knob to display “bdt S CURVE”.
5. Press the l AMS L (DECK B) knob. “LD AL” is
displayed and playback starts automatically.
6. Check the oscilloscope waveform (S-curve) is symmetrical
between A and B. And confirm peak to peak level within 3.6 ±
0.5 Vp-p.
7. Press the MENU/NO button to stop playback.
8. Exit from the test mode.
(Refer to the TEST MODE Section)
Note: Try to measure several times to make sure than the ratio of A
: B or B : A is more than 10 : 7.
RF Level Check
Connection:
Procedure:
1. Connect an oscilloscope to TP (RFAC) and TP (DVC).
2. Turn the power on.
3. Load the disc (YEDS-18) and playback the number five track.
4. Confirm that oscilloscope waveform is clear and check RF signal
level is correct or not.
CD SECTION (DECK A) Note: A clear RF signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
E-F Balance (1Track jump) Check
Connection:
Procedure:
1. Connect an oscilloscope to TP (TE) and TP (DVC).
2. Turn the power on.
3. Load the disc (YEDS-18) and playback the number five track.
4. Press the X(DECK A) button.
(Becomes the 1 track jump mode.)
5. Confirm the level B and A (DC voltage) on the oscilloscope
waveform.
Specificationlevel: x100=less than ±22%
[BDBOARD]ﾑSIDEAﾑ
A
B
SECTION 6
ELECTRICAL ADJUSTMENTS
+
–
BD (CD) board
TP (FE)
TP (DVC)
oscilloscop
e
(DC range)
A
B
symmetry
within 3.6
± 0.5 Vp-
p
VOLT/DIV : 1V
TIME/DIV : 2ms
+
–
BD (CD) board
TP (RFAC)
TP (DVC)
oscilloscop
e
(AC range)
IC101
IC103
IC104
TP (DVC)
TP (TE)
TP (RFAC)
TP (FE)
0V
Center of
waveform
B
Symmetry
A (DC voltage
)
level=1.1 ± 0.6Vp-p
+
–
BD (CD) board
TP (TE)
TP (DVC)
oscilloscope
(DC range)
VOLT/DIV : 200mV
TIME/DIV : 500ns
level : 1.1 ± 0.3Vp-p