Sony HCD-GNX700 User manual

HCD-GNX700/GNX800
E Model
HCD-GNX700/GNX800
Australian Model
HCD-GNX800
SERVICE MANUAL
MiNi Hi-Fi COMPONENT SYSTEM
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation
9-887-068-01
2006B02-1
© 2006.02
SPECIFICATIONS
Ver.1.0 2006.02
– Continued on next page –
•HCD-GNX700/GNX800 is the Amplifier,
CD player, tape deck and tuner
section in MHC-GNX700/GNX800.
Model Name Using Similar Mechanism HCD-GN880
CD CD Mechanism Type CDM74KF-F1BD81A
Section Base Unit Name BU-F1BD81A
Optical Pick-up Name KSM-215DCP/C2NP
TAPE Model Name Using Similar Mechanism HCD-GNX80
Section Tape Transport Mechanism Type CWN42FF601
Amplifier section
HCD-GNX800
The following are measured at AC 120, 220, 240 V, 50/60 Hz
Front/Surround speaker
DIN power output (rated) 180 + 180 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
225 + 225 watts
(6 ohms at 1 kHz, 10% THD)
Subwoofer
Continuous RMS power output (reference)
200 watts
(8 ohms at 100 Hz, 10% THD)
HCD-GNX700
The following are measured at AC 120, 220, 240 V, 50/60 Hz
Front speaker
DIN power output (rated) 170 + 170 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
220 + 220 watts
(6 ohms at 1 kHz, 10% THD)
Subwoofer
Continuous RMS power output (reference)
160 watts
(8 ohms at 100 Hz, 10% THD)
Inputs
VIDEO/MD (AUDIO) IN (phono jacks):
voltage 250/450 mV,
impedance 47 kiloohms
TV (AUDIO) IN (phono jack): voltage 250 mV,
impedance 47 kiloohms
MIC (phone jack): sensitivity 1 mV,
impedance 10 kiloohms
Outputs
PHONES (stereo mini jack): accepts headphones of 8 ohms or more
FRONT SPEAKER/SURROUND SPEAKER/
SUBWOOFER OUT: Use only the supplied speaker
Photo: HCD-GNX800

2
HCD-GNX700/GNX800
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE WITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Disc player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=780 nm)
Emission duration: continuous
Laser Output Max. 44.6 µW*
* This output is the value measured at
a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Wave length 780 – 790 nm
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
OPTICAL CD DIGITAL OUT
(Square optical connector jack, rear panel)
Wave length 660 nm
Output Level –18 dBm
Tape deck section
Recording system 4-track 2-channel stereo
Frequency response 50 – 13,000 Hz (±3 dB),
using Sony TYPE I tape
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
Antenna FM lead antenna
Antenna terminals 75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
Latin American models: 530 – 1,710 kHz
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
Other models: 531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
Australian model: 230 – 240 V AC, 50/60 Hz
Argentina models: 220 V AC, 50/60 Hz
Other models: 120 V, 220 V or 230 – 240 V AC, 50/
60 Hz
Adjustable with voltage selector
Power consumption
MHC-GNX800 350 watts
MHC-GNX700 290 watts
Dimensions (w/h/d) (Approx.) 281 ×362 ×404.5 mm
Mass (Approx.)
HCD-GNX800 14.3 kg
HCD-GNX700 14.0 kg
Design and specifications are subject to change without notice.

3
HCD-GNX700/GNX800
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 4
2. GENERAL
Locating the Controls ...................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 7
3-2. Side Panel, Top Case ....................................................... 8
3-3. Loading Panel .................................................................. 8
3-4. Front Panel Assy .............................................................. 9
3-5. Tuner Pack ....................................................................... 9
3-6. Tape Mechanism Deck, MIC Board ................................ 10
3-7. CD-SW Board, PANEL Board ........................................ 10
3-8. FUNCTION Board, JOG Board ...................................... 11
3-9. CD Mechanism Deck ...................................................... 11
3-10. Back Panel ....................................................................... 12
3-11. PRIMARY Board, EFFECTOR Board ............................ 12
3-12. Power Amp Pc Board Assy, MAIN Board ...................... 13
3-13. SURROUND Board, PA Board ....................................... 13
3-14. Power Transformer (T1200) ............................................ 14
3-15. DRIVER Board, SW Board ............................................. 14
3-16. CD Board ......................................................................... 15
3-17. SENSOR Board ............................................................... 15
3-18. MOTOR (TB) Board ....................................................... 16
3-19. MOTOR (LD) Board ....................................................... 16
4. TEST MODE .............................................................. 17
5. MECHANICAL ADJUSTMENTS ....................... 21
6. ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 21
CD Section ...................................................................... 22
7. DIAGRAMS
7-1. Block Diagram – CD Section – ...................................... 27
7-2. Block Diagram – Tape/Tuner Section – ......................... 28
7-3. Block Diagram – Main Section – ................................... 29
7-4. Block Diagram – AMP Section – ................................... 30
7-5. Block Diagram – Display/Power Section – .................... 31
7-6. Printed Wiring Board – CD Board – .............................. 32
7-7. Schematic Diagram – CD Board – ................................. 33
7-8. Printed Wiring Boards – CD Mechanism Sectiom – ...... 34
7-9. Schematic Diagram – CD Mechanism Section – ........... 35
7-10. Printed Wiring Board – MAIN Board – ......................... 36
7-11. Schematic Diagram – MAIN Board (1/3) – ................... 37
7-12. Schematic Diagram – MAIN Board (2/3) – ................... 38
7-13. Schematic Diagram – MAIN Board (3/3) – ................... 39
7-14. Printed Wiring Board – PANEL Board – ....................... 40
7-15. Schematic Diagram – PANEL Board – ........................... 41
7-16. Printed Wiring Boards
– CD-SW, JOG, MIC and FUNCTION Boards – ........... 42
7-17. Schematic Diagram
– CD-SW, JOG, MIC and FUNCTION Boards – ........... 43
7-18. Printed Wiring Board – PA Board – ............................... 44
7-19. Schematic Diagram – PA Board – .................................. 45
7-20. Printed Wiring Board – SURROUND Board – .............. 46
7-21. Schematic Diagram – SURROUND Board – ................. 47
7-22. Printed Wiring Board – EFFECTOR Board – ................ 48
7-23. Schematic Diagram – EFFECTOR Board – ................... 49
7-24. Printed Wiring Boards – Power Section – ...................... 50
7-25. Schematic Diagram – Power Section – .......................... 51
7-26. IC Pin Function Description ............................................ 56
8. EXPLODED VIEWS
8-1. Case (Top), Back Panel Section ...................................... 62
8-2. Front Panel Section-1 ...................................................... 63
8-3. Front Panel Section-2 ...................................................... 64
8-4. Chassis Section ................................................................ 65
8-5. CD Mechanism Deck Section-1
(CDM74KF-F1BD81A) .................................................. 66
8-6. CD Mechanism Deck Section-2
(CDM74KF-F1BD81A) .................................................. 67
9. ELECTRICAL PARTS LIST ................................ 68

4
HCD-GNX700/GNX800
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.
•MODEL IDENTIFICATION
– Back Panel –
MODEL PART No.
GNX800: E2 model 2-661-760-0[]
GNX700: E2 model 2-661-760-1[]
GNX800: E3 model 2-672-142-3[]
GNX700: E3 model 2-672-142-4[]
GNX800: E51 model 2-675-973-0[]
GNX700: E51 model 2-675-973-1[]
AR model 2-675-974-0[]
AUS model 2-675-975-0[]
•Abbreviation
AR : Argentina model
AUS : Australian model
E2 : 120 V AC Area in E model
E3 : 240 V AC Area in E model
E51 : Chilean and Peruvian model
PART No.

5
HCD-GNX700/GNX800
SECTION 2
GENERAL This section is extracted
from instruction manual.
LOCATING THE CONTROLS
Main unit
ALBUM +/– ql
AMP MENU ed
CD r;
CD SYNC qf
Deck A ef
Deck B ws
DELAY ea
DIRECTION wd
DISC 1 ~ 3 1
Disc tray qs
DISPLAY 6
Display q;
ECHO LEVEL wh
ENTER wg
EQ BAND wf
EX-CHANGE/DISC SKIP 2
FLANGER 7
GROOVE w;
ILLUMINATION 5
IR Receptor ra
KARAOKE wd
MASTER VOLUME wk
MIC 1/2 (jack) wl
MIC 1/2 LEVEL wj
MP3 BOOSTER qa
OPEN/CLOSE 3
OPERATION DIAL 4
PHONES (jack) es
Power illuminator 9
REC PAUSE/START qd
SOUND FLASH e;
SURROUND
1) 8
SURR SPEAKER MODE2) 8
TAPE A/B ek
Tape lid ws ef
TUNER/BAND el
TUNING +/– qk
TV ej
VIDEO/MD eh
?/1 (power) rs
ZOPEN/CLOSE 3
N (play) qg
>/. (forward/go backward) qk
M/m (fast forward/rewind) ql
X(pause) qh
x(stop) qj
AZ (Eject A) eg
B Z(Eject B) wa
1)For MHC-GNX700
2)For MHC-GNX800
ALPHABETICAL ORDER
A – D
E – L
M – R
S – Z
SYMBOLS
Top Panel
Front Panel
2
4
13
56
78 9q;qaqs
qd
qf
qg
qh
qj
qk
ql
w;
wa
ws
wg
wf
wd
whwjwkwle;eaes
ed
ef
eg
eh
ej
ek
el
r;
ra
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