Sony MHC-RG40 - Mini Hi-fi Component System User manual

MHC-DX30/RG40
US Model
Canadian Model
AEP Model
MHC-RG40
E Model
Australian Model
MHC-DX30
SERVICE MANUAL
MINI Hi-Fi COMPONENT SYSTEM
Sony Corporation
Home Audio Company
ShinagawaTec Service Manual Production Group
9-873-150-01
2001E1600-1
© 2001.5
•MHC-DX30/RG40 are composed of following models.
As for the service manual, it is issued for each
component model, then, please refer to them.
Ver 1.0 2001. 05
COMPONENT MODEL NAME
MHC-DX30 MHC-RG40
COMPACT DISK DECK HCD-DX30 HCD-RG40
RECEIVER SYSTEM
SPEAKER SYSTEM SS-DX30 SS-RG40
PARTS LIST
Part No. Description Remark
ACCESSORIES & PACKING MATERIALS
********************************
1-476-503-11 COMMANDER, STANDARD (RM-SR210) (DX30,RG40:AEP)
1-476-512-11 COMMANDER, STANDARD(RM-SR210AU)
(RG40:US,Canadian)
1-501-374-11 ANTENNA, LOOP
1-501-594-11 ANTENNA (FM) (RG40:AEP,DX30:KR)
1-501-659-41 ANTENNA (FM)
(DX30:AUS,E2,E51,MX,SP,AR,TH,RG40:US,Canadian)
4-210-254-01 CUSHION (FOOT)
4-223-953-01 COVER,BATTERY(FOR RM-SR210) (DX30,RG40:AEP)
4-228-953-01 COVER,BATTERY(FOR RM-SR210AU) (RG40:US,Canadian)
4-233-605-11 MANUAL, INSTRUCTION (ENGLISH) (RG40)
4-233-605-21 MANUAL, INSTRUCTION (FRENCH) (RG40:Canadian)
4-233-605-41 MANUAL, INSTRUCTION (FRENCH,SPANISH) (RG40:AEP)
4-233-605-51 MANUAL, INSTRUCTION
(GERMAN,DUTCH,ITALIAN,SWEDISH,POLISH) (RG40:AEP)
4-234-236-11 MANUAL, INSTRUCTION (ENGLISH)
(DX30:AUS,E2,E51,SP,AR)
4-234-236-31 MANUAL, INSTRUCTION (SPANISH) (DX30:E51,MX)
4-234-236-41 MANUAL, INSTRUCTION (FRENCH,SPANISH) (DX30:E2,SP)
4-234-236-61 MANUAL, INSTRUCTION (CHINESE) (DX30:SP)
4-234-236-71 MANUAL, INSTRUCTION (KOREAN) (DX30:KR)
4-234-994-11 MANUAL, INSTRUCTION (THAI,ENGLISH) (DX30:TH)
• Abbreviation
AR : Argentina model
AUS : Australian model
E2 : 120 V AC Area in E model
E51 : Chilean and peruvian model
KR : Korea model
MX : Mexican model
SP : Singapore model
TH : Thai model

MHC-DX30/RG40
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver.Date Description of Revision
1.0 2001.05 New

HCD-DX30/RG40
US Model
Canadian Model
AEP Model
HCD-RG40
E Model
Australian Model
HCD-DX30
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
— Continued on next page —
SPECIFICATIONS
Ver 1.1 2002. 05
Photo : HCD-DX30
•HCD-DX30/RG40 are the tuner,
deck, CD and amplifier section in
MHC-DX30/RG40.
Model Name Using Similar Mechanism NEW
CD CD Mechanism Type CDM58B-K6BD38
Section Base Unit Name BU-K2BD38
Optical Pick-up Name KSM-213DCP
Tape deck Model Name Using Similar Mechanism NEW
Section
AUDIO POWER SPECIFICATIONS:
(HCD-RG40 USA models only)
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
with 6 ohm loads both channels driven, from
120 – 10,000 Hz; rates 100 watts per channel
minimum RMS power, with no more than 10%
total harmonic distortion from 250 milliwatts to
rated output.
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 50 W)
Amplifier section
US, Canadian models:
HCD-RG40
Continuous RMS power output (reference)
100 + 100 watts (6 ohms
at 1 kHz, 10% THD)
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 50 W)
AEP models:
HCD-RG40
DIN power output (rated) 65 + 65 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
80 + 80 watts (6 ohms at
1kHz, 10% THD)
Music power output (reference)
160 + 160 watts (6 ohms
at 1 kHz, 10% THD)
Other models:
HCD-DX30
The following measured at AC 120, 220, 240 V
50/60 Hz
DIN power output (rated) 100 + 100 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
120 + 120 watts (6 ohms
at 1 kHz, 10% THD)
Inputs
MD/VIDEO (AUDIO) IN (phono jacks):
voltage 450/250 mV,
impedance 47 kilohms
GAME (AUDIO) IN (phono jack):
voltage 450 mV,
impedance 47 kilohms
MIC (mini jack): sensitivity 1 mV,
impedance 10 kilohms
Outputs
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
FRONT SPEAKER: accepts impedance of 6 to
16 ohms
SURROUND SPEAKER (MHC-RG60 only):
accepts impedance of 6 to
16 ohms
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
Laser output Max. 44.6 µW*
*This output is the value
measured at a distance of
200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture.
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Wavelength 780 – 790 nm
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength 660 nm
Output Level –18 dBm
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-873-149-02
2002E1600-1
© 2002.05

2
HCD-DX30/RG40
Tape deck section
Recording system 4-track 2-channel stereo
Frequency response 40 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
Antenna FM lead antenna
Antenna terminals 75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
US, Canadian, Mexican, Argentina models:
530 – 1,710 kHz (with the
interval set at 10 kHz)
531 – 1,710 kHz (with the
interval set at 9 kHz)
European and Middle Eastern models:
531 – 1,602 kHz (with the
interval set at 9 kHz)
Other models: 531 – 1,602 kHz (with the
interval set at 9 kHz)
530 – 1,710 kHz (with the
interval set at 10 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
US, Canadian models: 120 V AC, 60 Hz
European models: 230 V AC, 50/60 Hz
Australian models: 230 – 240 V AC,
50/60 Hz
Mexican models: 120 V AC, 50/60 Hz
Other models: 120 V, 220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
Power consumption
USA models:
HCD-RG40: 140 watts
Canadian models:
HCD-RG40: 140 watts
European models:
HCD-RG40: 140 watts
HCD-RG40: 0.5 watts (at the Power
Saving Mode)
Other models:
HCD-DX30: 175 watts
Dimensions (w/h/d)
Approx. 280 ×325 ×421 mm
Mass
North American models:
HCD-RG40: Approx. 9.0 kg
European models:
HCD-RG40: Approx. 9.0 kg
Other models:
HCD-DX30: Approx. 10.0 kg
Design and specifications are subject to change
without notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
To Exposed Metal
Parts on Set
0.15 µF1.5 kΩ
AC
Voltmeter
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized”knobs,screws,
and all other exposed metal parts forAC leakage. Check leakage as
described below.
LEAKAGE
TheAC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operatedAC voltmeter. The“limit”indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
SAFETY CHECK-OUT

3
HCD-DX30/RG40
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
otherthan thosespecifiedherein mayresultin hazardous radiation
exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
TABLE OF CONTENTS
MODEL IDENTIFICATION
— BACK PANEL —
MODEL
US, CND models
AEP model
AR, E, E51, SP models
AUS, KR, MX, TH models
PARTS No.
4-234-032-6s
4-234-032-5s
4-234-091-1s
4-234-091-7s
•Abbreviation
CND : Canadian model
AUS:Australian model
SP : Singapore model
TH :Thai model
PARTS No.
1. SERVICE NOTE ······························································· 4
2. GENERAL ·········································································· 5
3. DISASSEMBLY ································································ 7
4. TEST MODE···································································· 12
5. ELECTRICAL ADJUSTMENTS ······························· 16
6. DIAGRAMS······································································ 19
6-1. Circuit Board Location ················································ 20
6-2. Block Diagrams Tuner/CD Section ···························· 21
Main Section ······························································· 22
6-3. Schematic Diagram Main Section (1/4) ···················· 23
6-4. Schematic Diagram Main Section (2/4) ···················· 24
6-5. Schematic Diagram Main Section (3/4) ···················· 25
6-6. Schematic Diagram Main Section (4/4) ···················· 26
6-7. Printed Wiring Board Main Section ·························· 27
6-8. Printed Wiring Board BD Section ····························· 28
6-9. Schematic Diagram BD Section································ 29
6-10.Printed Wiring Board Power AMP Section ··············· 30
6-11.Schematic Diagram Power AMP Section·················· 31
6-12.Printed Wiring Board Panel Section·························· 32
6-13.Schematic Diagram Panel Section ···························· 33
6-14.Printed Wiring Board Key Section ···························· 34
6-15.Schematic Diagram Key Section······························· 35
6-16.Printed Wiring Board Driver Section ························ 36
6-17.Schematic Diagram Driver Section ··························· 37
6-18.Printed Wiring Board Trans Section·························· 38
6-19.Schematic Diagram Trans Section ···························· 39
6-20.IC Pin Function Description········································ 40
6-21.IC Block Diagrams ······················································ 42
7. EXPLODEDVIEWS
7-1. Main Section ······························································· 45
7-2. Front Panel Section ····················································· 46
7-3. Main Board Section····················································· 47
7-4. CD Mechanism Deck Section ····································· 48
8. ELECTRICAL PARTS LIST ······································· 49
KR : Korea model
MX : Mexican model
AR : Argentina model
E51 : Chilean and Peruvian model
Ver 1.1 2002.05

4
HCD-DX30/RG40 SECTION 1
SERVICE NOTE
1 Connector
13p (CN712)
2 Cut the seven melted-connection points
with a cutting plier.
4 Cut the six melted-connection points
with a cutting plier.
3 Panel board
5 Key boar
d
Panel board
(ten screw holes)
Key board
(eight screw holes)
Screw hole
In order to re-install the panel board and the key board,
fix them by using the screws (+BVTP 2.6
× 8 ) respectively.
Screw in to the respective screw holes.
Do not tighten the screws excessively.
* The panel board and the key board only are connected to the front panel
by means of hot-melting the plastics.
Note for installing the panel board and the key board
REMOVING THE PANEL BOARD AND THE KEY BOARD
Hot melt

5
HCD-DX30/RG40
This section is extracted
from instruction manual.
SECTION 2
GENERAL
Main unit
ql
w;
qj
qh
qk
qg
qd
qf
wawswdwfwgwhwj wk
eg
ef
ed
es
e;
wl
1234 6589q;qaqs7
ea
AUDIO jacks ed
CD qs
CD SYNC wf
Deck A wl
Deck B w;
DIRECTION*
17
DISC 1 –3 wa
DISC SKIP EX-CHANGE ea
Disc tray 8
DISPLAY 7
EDIT 7
EFFECT ON/OFF 4
ENTER 0
GAME eg
GAME EQ 2
GROOVE 3
KARAOKE PON*2es
MD (VIDEO) qg
MIC jack*2e;
MIC LEVEL control*2wj
MOVIE EQ 9
MUSIC EQ 6
P FILE qa
PHONES jack qk
PLAY MODE 7
PTY/DIRECTION 7
REC PAUSE/START wd
REPEAT 7
SPECTRUM 7
STEREO/MONO 7
TAPE A/B qf
TUNER MEMORY 7
TUNER/BAND qd
VIDEO jack ef
VOLUME control qh
BUTTON DESCRIPTIONS
v/V/b/B5
Z(deck A) wk
Z(deck B) ql
M (fast forward) ws
.(go back) wg
ZOPEN/CLOSE qj
?/1 (power) 1
x(stop) wg
nN (play) wg
X(pause) wg
>(go forward) wg
m (rewind) wh
*
1PTY/DIRECTION for
European model
*2HCD-DX30 only

6
HCD-DX30/RG40
Remote Control
5
6
7
8
9
0
qa
qs
12 34
qd
qf
qg
qh
ql
qk
qj
CD qj
CLEAR 6
CLOCK/TIMER SELECT 2
CLOCK/TIMER SET 3
D.SKIP ql
EFFECT ON/OFF qa
ENTER qf
GAME qk
MD (VIDEO) 9
P FILE qd
PRESET EQ qg
SLEEP 1
SURROUND 0
TAPE A/B 8
TUNER/BAND qh
VOL +/–7
BUTTON DESCRIPTIONS
v/V/b/Bqs
M(fast forward)/TUNING
+ 5
.(go back)/PRESET
–5
?/1 (power) 4
x(stop) 5
nN (play) 5
X(pause) 5
>(go forward)/PRESET
+ 5
m(rewind)/TUNING –5
4Press ENTER.
5Press vor Vrepeatedly to set the hour.
6Press B.
The minute indication flashes.
7Press vor Vrepeatedly to set the
minute.
8Press ENTER.
Tip
If you made a mistake or want to change the time,
start over from step 1.
Note
The clock settings are canceled when you disconnect
the power cord or if a power failure occurs.
Setting the time
1Turn on the system.
2Press CLOCK/TIMER SET on the
remote.
Proceed to step 5 when “CLOCK”appears
in the display.
3Press vor Vrepeatedly to select “SET
CLOCK”.

7
HCD-DX30/RG40
SECTION 3
DISASSEMBLY
3-1. CASE (TOP)
Note : Disassemble the unit in the order as shown below.
Note : Follow the disassembly procedure in the numerical order given.
Driver board, Moter board and Address sensor boar
d
Case (Top)
CD door
Front panel section
Key boardPanel boardTape mechanism deck
Sub trans board, Trans board, Sensor board and Video out board
Main board and Power board
Base unit
Set
Case (Side-R)
Case (Side-L)
5
qd
qs
qs
q;
Case (Top)
6 Two screws (Case 3 TP2)
8 Screw
(+BVTP 3
× 10)
3 Screw
(+BVTP 3
× 10
)
9 Screw
(+BVTT 3
× 8)
4 Screw
(+BVTT 3
× 8)
1 Two screws
(Case 3 TP2)
qa Four screws (+BVTP 3 × 10)
7 Screw (Case 3 TP2)
2 Screw (Case 3 TP2)

8
HCD-DX30/RG40
3-2. CD DDOR
3-3. FRONT PANEL SECTION
2 Pull-out the disc tray.
1 Turn the pulley to the direction of arrow.
pulley
CD door
Front panel side
CD mechanism deck (CDM58B)
3
qd
qs
5
CD mechanism deck (CDM58B)
Front panel section
q; Connector 7p
9 Connector 3p
7 Connector
2p (CN714)
6 Wire (flat type) 17p (CN2)
1 Wire (flat type)
19p (CN102)
2 Connector
10p (CN701)
qa Three screws (+BVTP 3 × 6 )
8 Screw
(+BVTP 3
× 10)
3 Screw
(+BVTP 3
× 10)
4 Screw (+BVTP 3 × 10)

9
HCD-DX30/RG40
3-4. TAPE MECHANISM DECK
3-5. PANEL BOARD
1 Six screws
(+BVTP 2.6
× 8
)
2 Tape mechanism deck
1 Volume knob
2 Vol knob ring
4 Connector
13p (CN712)
Note: When attching the panel board,
refer to "Service Note" on page 4.
6 Panel board
3
5 Cut the seven melted-connection points with a cutting plier.

10
HCD-DX30/RG40
3-6. KEY BOARD
3-7. SUB TRANS BOARD,TRANS BOARD, SENSOR BOARD AND VIDEO OUT BOARD
Note: When attching the Key board,
refer to "Service Note" on page 4.
2 Key board
1 Cut the six melted-connection points with a cutting plier.
6 Two screws
(+BVTT 4
× 6)
qf Five screws
(+BVTP 3
× 10)
qg Two screws
(+BVTT 3 × 6)
qh
qj Two screws
(+BVTP 3
× 10)
q; Two screws
(+BVTP 3 × 10)
ql Screw (+BVTP 3 × 10)
Back panel
7 Two screws
(+BVTT 4 × 6)
8 Power transformer
(T911)
5 Connector 13P (CN915)
1 Connector 2p (CN2) (EXCEPT:SP,E51,E2,AR)
Connector 4p (CN2) (SP,E51,E2,AR)
2 Connector 3p
(CN903)
9 Connector 2p
(CN504)
qd Sensor board
qs Cover (Duct)
w; Video out board
qa Screw
(+BVTP 3
× 10)
4 Sub trans
board
qk DC fan (M961)
Trans board
3 Two screws
(+BVTP 3
× 10)

11
HCD-DX30/RG40
3-8. MAIN BOARD AND POWER BOARD
3-9. BASE UNIT
4 Three screws (+BVTT 3 × 6)
6 Two screws (+BVTT 3 × 6)
7 Heat sink
3 Two screws (+BVTP 3 × 16)
1 Two screws (+BVTT 3 × 6)
2 Main boar
d
5 Power board
Main board
Base unit
qa
9 Two screws (+PTPWH M2.6)
1 Screw (+PTPWH M2.6)
q; Screw (DIA. 12)
7 Two screws (+BVTP 2.6 × 8)
6 BD board
qs Two insulators
2 Holder (BU) assy
qs Two insulators
8 Two stoppers (BU)
3 Wire (flat type) 19p (CN101)
4 Wire (flat type) 16p (CN102)
5 Screw (+BVTP 2.6 × 8)

12
HCD-DX30/RG40
3-10. DRIVER BOARD, MOTOR BOARD AND ADDRESS SENSOR BOARD
9 Pull-out the disc tray.
4 Two screws (+BVTP 2.6 × 8)
q; Screw (+PTPWH 2.6 × 8)
qa Tray
1 Screw (+BVTP 2.6 × 8)
qs Screw (+BVTP 2.6 × 8)
6 Wire (flat type) 8p (CN721)
3 Wire (flat type)
8p (CN702)
8 Motor board
qd Address sensor board
2 Driver board
5 Remove the two solderings of motor.
7 Connector 4p (CN722)

13
HCD-DX30/RG40
SECTION 4
TEST MODE
[MC Cold Reset]
•The cold reset clears all data including preset data stored in the
RAM to initial conditions. Execute this mode when returning
the set to the customer.
Procedure:
1. Press three buttons x, ENTER , and ?/1simultaneously.
2. The fluorescent indicator tube displays “COLD RESET”and
the set is reset.
[CD Ship Mode]
•This mode moves the pickup to the position durable to vibra-
tion. Use this mode when returning the set to the customer after
repair.
Procedure:
1. Press 1/ubutton to turn the set ON until “STANDBY”
appears.
2. Press CD button and 1/ubutton simultaneously.
3. When you releaset he buttons, a message “LOCK”is displayed
on the fluorescent indicator tube, and the CD ship mode is set.
[MC Hot Reset]
•This mode resets the set with the preset data kept stored in the
memory. The hot reset mode functions same as if the power
cord is plugged in and out.
Procedure:
1. Press three buttons x, ENTER , and DISPLAY simultaneously.
2. The fluorescent indicator tube becomes blank instantaneously,
and the set is reset.
[CD Service Mode]
•This mode can run the CD sled motor freely. Use this mode, for
instance, when cleaning the pickup.
Procedure:
1. Press ?/1button to turn the set ON.
2. Select the function “CD”.
3. Press three buttons x, ENTER , and OPEN/CLOSE simul-
taneously.
4. The CD service mode is selected.
5. With the CD in stop status, turn the shuttle knob clockwise to
move the pickup to outside track, or turn the shuttle knob
counter-clockwise to inside track.
6. To exit from this mode, perform as follows:
1) Move the pickup to the most inside track.
2) Press three buttons in the same manner as step 2.
Note: •Always move the pickup to most inside track when exiting from
this mode. Otherwise, a disc will not be unloaded.
•Do not run the sled motor excessively, otherwise the gear can be
chipped.
[Change-over of AM Tuner Step between 9 kHz and
10 kHz]
•A step of AM channels can be changed over between 9 kHz and
10 kHz.
Procedure:
1. Press ?/1button to turn the set ON.
2. Select the function “TUNER”, and press TUNER/BAND
button to select the BAND “MW”.
3. Press ?/1button to turn the set OFF.
4. Press ENTER and ?/1buttons simultaneously, and the display
of fluorescent indicator tube changes to “AM 9 k STEP”or
“AM 10 k STEP”, and thus the channel step is changed over.
[GC Test Mode]
•This mode is used to check the software version, FL tube, LED,
keyboard, headphone and volume.
Procedure:
1. Press three buttons x, ENTER and DISC 2 simultaneously.
2. LEDs and fluorescent indicator tube are all turned on.
3. When ENTER and DISC2 are pressed at the same time, the
key number check mode starts up. In this mode, the key numbers
of each key series are displayed.
4. In the key check mode, the fluorescent indicator tube displays
“KEY 000”. Each time a button is pressed.
5. When ENTER and DISC2 are pressed at the same time, the
key count check mode starts up. In this mode, the message “KEY
CNT @@”is displayed on the FL display tube. When each
button is pressed, the key row number is incremented first. Then
the key value is then incremented. However, one the button is
pressed, the key value cannot be counted.
6. When ENTER and DISC2 are pressed at the same time, the
headphones check mode starts up. In this mode, the message
“H_P ON”is displayed when the headphones are inserted.When
the headphones are not inserted. the message “H_P OFF”is
displayed.
7. When ENTER and DISC2 are pressed at the same time, the
volume check mode starts up. In this mode, the message
“VOLUME FLAT”is displayed on the FL display tube. When
the volume control knob is rotated in the positive (+) direction,
the message “VOLUME UP”is displayed. When the volume
control knob is rotated in the negative (-) direction, the message
“VOLUME DOWN”is displayed.
8. In order to quit the mode, either press ENTER and DISC2 at
the same time or press the three buttons at the same time as in
step 1.
9. To exit from this mode, press three buttons in the same manner
as step 1, or disconnect the power cord.

14
HCD-DX30/RG40
[MC Test Mode]
•This mode is used to check operations of the respective sections
of Amplifier, TUNER, CD and Tape.
Procedure:
1. Press the ?/1button to turn on the set.
2. Press the three buttons of x, ENTER and DISC 3
simultaneously.
3. A message “TEST MODE”appears on the FL display tube.
•The messagesVACS1 toVACS5 are displayed when theVACS
is changed in this mode.
•The number of repeats of TAPE and CD is set to the infinite
number as the default setting.
4 When v(CURSOR UP) button is pressed, GEQ increases to
its maximum and a message “GEQ MAX”appears.
5. When V(CURSOR DOWN) button is pressed, GEQ decreases
to its minimum and a message “GEQ MIN”appears.
6. When b(CURSOR LEFT) or B(CURSOR RIGHT) button
is pressed, GEQ is set to flat and a message “GEQ FLAT”
appears.
7. In the test mode, the default-preset channel is called even when
the TUNER is selected and an attempt is made to call the preset
channel that has been stored in memory, by operating the Shuttle
knob. (It means that the memory is cleared.)
8. When a tape is inserted in the Deck B and the TAPE B function
is selected, and when the REC PAUSE/START button is
pressed twice, recording starts.
The VIDEO function is selected automatically as the input
source.
9. Select the desired loop by pressing the PLAY MODE button
in the TAPE B function. Insert a test tape AMS-110A or AMS-
RO to Deck A.
10. Press the SPECTRUM button to enter the AMS test mode.
11. After a tape is rewound first, the FF AMS is checked, and the
mechanism is shut off after detecting the AMS signal twice.
12. Then the REW AMS is checked and the mechanism is shut off
after detecting the AMS signal twice.
13. When the check is complete, a message of either OK or NG
appears.
14. When the two buttons of SPECTRUM and DISC1 are pressed
at the same time in any function modes, either the “VACS ON”
display to enable theVACS function or the “VACS OFF”display
to disable the VACS function can be selected.
15. When you want to exit this mode, press the ?/1button twice.
The cold reset is enforced at the same time.
[Microprocessor version display]
•If the following operation is performed during the POWER OFF
in the modes other than the POWER SAVE mode (i.e., while the
Demo display shows the watch time),
1. When three buttons of STOP , ENTER , V(CUSOR DOWN)
are pressed at the same time, the MC and the GC microprocessor
version numbers are displayed as “M1.00 G1.00”.
2. When three buttons of STOP , ENTER , v(CUSOR UP) are
pressed at the same time, the model name and destination are
displayed as “BG1 AS1A3”.

15
HCD-DX30/RG40
[Aging Mode]
This mode can be used for operation check of CD section and tape deck section.
•If an error occurred:
The aging operation stops and display status.
•If no error occurs:
The aging operation continues repeatedly.
1. Operating method of Aging Mode
Turn on the main power and select “CD”of the function.
1) Set a disc in DISC1 tray. Select ALL DISC CONTINUE, and REPEAT OFF.
2) Load the tapes recording use into the decks A and B respectively.
3) Press three buttons x, ENTER , and
DISC SKIP EX-CHANGE simultaneously.
4) Aging operations of CD and tape are started at the same time.
5) To exit the aging mode, perform [MC Cold Reset].
3. Aging Mode in CD section
1) Display state
•No error occurs
Note:
[*][*][*][*] : Number of aging operations
Error display
E** s## $$ %%
1234 5
•When the buttons x , ENTER and DISC 1 are pressed simultaneously, number of time of the mechanism error and the NO DISC error
can be checked.
Display: EMC**EDC** **: Number of times of error (Maximum three times)
EMC: Mechanism error
EDC: NO DISC error
•When aging operation is complete, be sure to perform the MC Cold Reset to reset the error history.
D: No disc error
01: FOCUS ERROR
02: GFS ERROR
03: SETUP ERROR
01: NO DISC judgment without chucking retry
02: NO DISC judgment after chucking retry
Status at the time of NO DISC judgment
(High order digits only)
1: STOP
2: SETUP
3: TOC READ
4: ACCESS
5: PLAY BACK
6: PAUSE
7: MANUAL SEARCH (PLAY)
8: MANUAL SEARCH (PAUSE)
AGING[*][*][*][*]
1**
2s
3##
4$$
5%%
M: Mechanism error
Don’t care
High order digits only
D: Stopped during closing due to problems other than mechanism.
E: Stopped during opening due to problems other than mechanism.
C: Stopped during chucking due to problems other than mechanism.
F: Stopped during EX-opening due to problems other than mechanism.
Emergency related errors (High order digits only)
1: Stopped during chuck-up
2: Stopped during chuck-down
3: Time out by EX-OPEN
5: Time out by EX-CLOSE
The error No. 00 indicates the newest error. As the error No. increases, it means the older error.
When you want to retrieve the error history, press the PLAY MODE button in the case of mechanism error.
Or press the REPEAT button in the case of NO DISC error.
Display

16
HCD-DX30/RG40
2) Operation during aging mode
In the aging mode, the program is executed in the following
sequence.
(1) The disc tray opens and closes.
(2) The mechanism accesses DISC 2 and makes an attempt to
read TOC. However, since there are no discs, a message
“CD2 NO DISC”appears.
(3) The mechanism accesses DISC 3 and a message “CD3 NO
DISC”appears.
(4) The disc tray turns to select a disc1.
(5) A disc is chucked.
(6) TOC of disc is read.
(7) The pickup accesses to the track 1, and playing 2 seconds.
(8) The pickup accesses to the last track, and playing 2 seconds.
(9) Every time when an aging operation of step 1 to step 8 is
complete, the display “AGING[*][*][*][*]”value increases
as the number of aging operations is counted up.
(10) Returns to step 1.
3. Aging Mode in Tape Deck section
1) Display state
•No error occurs
Display action now
•Error occurred
Display action last time
2) Operation during aging mode
In the aging mode, the program is executed in the following
sequence.
(1) Rewind is executed up to the top of tape A and B.
(2) A tape on FWD side is played for 2 minutes.
(3) FF is executed up to either made for 20 second or the end of
tape.
(4) A tape is reversed, and the tape on REV side is played for 2
minutes.
The tape on the REV side is played in both A and B.
(5) Rewind is executed up to the top of tape.
(6) Returns to step 2, and repeat steps from 2 to 5.
[Function Change Mode]
* elect either VIDEO or MD of the external FUNCTION input.
Procedure:
1. Turn on the power.
2. Press the two buttons MD (VIDEO) and ?/1at the same
time.
The main power is turned on and the other function of the
previous function is selected and displayed. “MD”or
“VIDEO”.
NO. Display action Action contents Final timing
1TAPE A AG-6 Rewind the TAPE A The top of tape
TAPE B AG-1 Rewind the TAPE B
2 TAPE A AG-2 FWD play the TAPE A 2 minutes playing
3 TAPE A AG-3 F.F. the TAPE A 20 second FF or the end
of tape
4 TAPE A AG-4 REV play the TAPE A 2 minutes playing
5 TAPE A AG-5 Rewind the TAPE A The top of tape
6 TAPE B AG-2 FWD play the TAPE B 2 minutes playing
7 TAPE B AG-3 F.F. the TAPE B 20 second FF or the end
of tape
8 TAPE B AG-4 REV play the TAPE B 2 minutes playing
9 TAPE B AG-5 Rewind the TAPE B The top of tape

17
HCD-DX30/RG40
SECTION 5
ELECTRICAL ADJUSTMENTS
FM Tuned Level Adjustment
Procedure:
1. Supply a 98 MHz signal at 28 dB from theANTENNA terminal.
2. Tune the set to 98 MHz.
3. Adjust RV101 to the point (moment) when the TUNED
indicator will change from going off to going on.
Adjustment Location: MAIN board
Null Adjustment
Procedure:
1. Supply a 98 MHz signal at 60 dB from theANTENNA terminal.
2. Tune the set to 98 MHz.
3. Measure voltage between pin 21 and pin 23 of IC 101. Adjust
T101 ubtil the voltage becomes 0 V.
Adjustment Location: MAIN board
Adjustment Location
[MAIN BOARD] Component side
FM RF Signalgenerator
75
Ω coaxial
Carrier frequency : 98 MHz
Modulation : AUDIO 1 kHz, 75 kHz
deviation (100%)
Output level : 28 dB (at 75
Ω open)
FM ANTENNA terminal
(TM101)
set
FM RF Signalgenerator
75
Ω coaxial
Carrier frequency : 98 MHz
Modulation : AUDIO 1 kHz, 75 kHz
deviation (100%)
Output level : 60 dB (at 75
Ω open)
FM ANTENNA terminal
(TM101)
set
CD SECTION
Note :
1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10MΩimpedance.
4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
S-Curve Check
Procedure :
1. Connect oscilloscope to TP (FEO).
2. Connect between TP (FEI) and TP (VC) by lead wire.
3. Connect betweenTP (AGCCON) andTP (D GND) by lead wire.
4. Turn Power switch on.
5. Load a disc (YEDS-18) and actuate the focus search. (In
consequence of open and close the disc tray, actuate the focus
search)
6. Confirm that the oscilloscope waveform (S-curve) is
symmetrical between A and B. And confirm peak to peak level
within 4 ±1 Vp-p.
7. After check, remove the lead wire connected in step 2 and 3.
Note : •Try to measure several times to make sure than the ratio
of A : B or B : A is more than 10 : 7.
•Take sweep time as long as possible and light up the
brightness to obtain best waveform.
RF Level Check
Procedure :
1. Connect oscilloscope to TP (RF).
2. Connect betweenTP (AGCCON) andTP (D GND) by lead wire.
3. Turned Power switch on.
4. Load a disc (YEDS-18) and playback.
5. Confirm that oscilloscope waveform is clear and check RF signal
level is correct or not.
6. After check, remove the lead wire connected in step 2.
BD board
Oscilloscope
TP(FEO)
TP(VC)
symmetry
S-curve waveform
within 4 ±1Vp-p
A
B
TP(RF)
TP(VC)
BD board
oscilloscope
T101
RV661
RV101
IFT101 T102
RV661:TAPE SPEED
T101:NULL
RV101:FM TUNED LEVEL

18
HCD-DX30/RG40
Note : Clear RF signal waveform means that the shape “◊”can be clearly
distinguished at the center of the waveform.
E-F Balance (1 Track jump) Check
Procedure :
1. Connect oscilloscope to TP (TEO) and TP (VC).
2. Turned Power switch on.
3. Load a disc (YEDS-18) and playback the number five track.
4. Press the gG button. (Becomes the 1 track jump mode.)
5. Confirm that the level B andA (DC voltage) on the oscilloscope
waveform.
6. After check, remove the lead wire connected in step 1.
RF PLL Free-run Frequency Check
Procedure :
1. Connect frequency counter to test point (XPCK) with lead wire.
2. Turned Power switch on.
3. Put the disc (YEDS-18) in to play the number five track.
Confirm that reading on frequency counter is 4.3218MHz.
RF signal waveform
VOLT/DIV : 200mV
TIME/DIV : 500ns
level : 1.45 ±0.3Vp-p
TP(TEO)
TP(VC)
BD board
oscilloscop
e
level=1.3±0.6Vp-p symmetry
A (DC voltage
)
center of
waveform
B
0V
1 track jump waveform
Specified level: –– ×100=less than ±22%
B
A
BD board
TP (XPCK)
frequency counte
r
TP
(XPCK)
TP
(TEO)
TP
(FEO) TP
(FEI)
TP
(RF)
TP
(VC)
TP
(DGND)
TP
(AGCCON)
1
12
24 1
2021
40
60
80
41
61
IC101
IC103
Adjustment Location:
[BD BOARD] (Conductor Side)