Sony MHC-V44D User manual

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
MHC-V44D
HOMEAUDIO SYSTEM
9-890-676-02
2016E81-1
© 2016.05
Russian Model
E Model
Australian Model
Ver. 1.1 2016.05
SPECIFICATIONS
CD/DVD Section
Model Name Using Similar Mechanism HCD-GT3D
CD Mechanism Type CDM90-DVBU204//C
Optical Pick-up Name CMS-S76RFS7G1 or CMS-S76RFS7GP
Note:
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus affected unit was found during
service, contact your Service Headquarters.
– Continued on next page –
Speaker section
Speaker system
3-way, Sound Pressure Horn
Speaker unit
Tweeter L/R: 40 mm, cone type
Midrange L/R: 80 mm, cone type
Woofer: 200 mm, cone type
Rated impedance
Tweeter L/R: 4 ohms
Midrange L/R: 4 ohms
Woofer: 2 ohms
Inputs
AUDIO/PARTY CHAIN IN (TV) L/R
Voltage 2 V, impedance 47 kilohms
TV (ARC)
Supported audio signal: 2-channel
Linear PCM
MIC1, MIC2
Sensitivity 1 mV, impedance
10 kilohms
Outputs
AUDIO/PARTY CHAIN OUT L/R
Voltage 2 V, impedance 1 kilohm
VIDEO OUT
Max. output level 1 Vp-p,
unbalanced, Sync. negative load
impedance 75 ohms
HDMI OUT (TV)
Supported audio signal: 2-channel
Linear PCM (up to 48 kHz), Dolby
Digital
HDMI section
Connector
Type A (19 pin)
USB section
Supported bit rate
WMA: 48 kbps – 192 kbps, VBR, CBR
AAC: 48 kbps – 320 kbps, VBR, CBR
WAV: 16 bit
Sampling frequencies
WMA: 44.1 kHz
AAC: 44.1 kHz
WAV: 44.1 kHz/48 kHz
Supported USB device
Mass Storage Class
Maximum current
1 A
(USB) port
Type A
Disc/USB section
Supported bit rate
MPEG1 Layer-3:
32 kbps – 320 kbps, VBR
Sampling frequencies
MPEG1 Layer-3:
32 kHz/44.1 kHz/48 kHz
Xvid
Video codec: Xvid
Bit rate: 4.854 Mbps (MAX)
Resolution/Frame rate:
720 × 480, 30 fps
720 × 576, 25 fps
Audio codec: MP3
MPEG4
File format: MP4 File Format
Video codec:
MPEG4 Simple Profile
(AVC is not compatible.)
Bit rate: 4 Mbps
Resolution/Frame rate:
720 × 576, 30 fps
Audio codec: AAC-LC
(HE-AAC is not compatible.)
DRM: Not compatible
Disc player section
System
Compact disc and digital audio and
video system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value measure
ment at a distance of 200 mm from
the objective lens surface on the
Optical Pick-up Block with 7 mm
aperture.
Frequency response
20 Hz – 20 kHz
Video color system format
NTSC and PAL
FM Tuner section
System
FM stereo, FM superheterodyne
tuner
Antenna
FM lead antenna
Tuning range
87.5 MHz – 108.0 MHz (50 kHz step)
BLUETOOTH section
Communication system
BLUETOOTH Standard version 3.0
Output
BLUETOOTH Standard Power
Class 2
Maximum communication range
Line of sight approx. 10 m1)
Frequency band
2.4 GHz band (2.4000 GHz –
2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread
Spectrum)
Compatible BLUETOOTH profiles2)
A2DP (Advanced Audio Distribu-
tion Profile)
AVRCP (Audio Video Remote
Control Profile)
SPP (Serial Port Profile)
Supported codecs
SBC3), AAC, LDAC
1) The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
2) BLUETOOTH standard profiles indicate
the purpose of BLUETOOTH communica-
tion between devices.
3) Subband Codec
General
Power requirements
AC 120 V – 240 V, 50/60 Hz
Power consumption
120 W
Power consumption (at the Power Saving
mode)
For RU model only:
0.5 W (When “BT STBY” is set to
“OFF” and [CONTROL FOR
HDMI] is set to [OFF].)
3 W4) (When “BT STBY” is set to
“ON” and [CONTROL FOR HDMI]
is set to [ON].)
Dimensions (w/h/d) (Approx.)
293 mm × 798 mm × 288 mm
Mass (Approx.)
14.0 kg
The power consumption of the system
will be less than 0.5 W when there is no
HDMI connection and “BT STBY” is set
to “OFF”.
Unpacking
• Remote control (1)
• R03 (size AAA) batteries (2)
• FM lead antenna (1)
• AC power cord (mains lead) (1)
• AC plug adaptor (1) (supplied only for
certain areas)
The AC plug adaptor is not use in
Chile. Use this plug adaptor in the
countries where it is necessary.
Design and specifications are subject to
change without notice.

MHC-V44D
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. Acommercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operatedAC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2VAC range are suitable. (See
Fig. A)
1.5 kΩ0.15 μFAC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
License and Trademark Notice
•
is a trademark of DVD Format/Logo Licensing Corporation.
• “DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”, and
the “CD” logos are trademarks.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• Windows Media is either a registered trademark or trademark
of Microsoft Corporation in the United States and/or other
countries.
• This product is protected by certain intellectual property rights
of Microsoft Corporation. Use or distribution of such technology
outside of this product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
• “WALKMAN” and “WALKMAN” logo are registered trade-
marks of Sony Corporation.
• This system incorporates Dolby* Digital.
* Manufactured under license from Dolby Laboratories. Dolby and
the double-D symbol are trademarks of Dolby Laboratories.
• This system incorporates High-Definition Multimedia Interface
(HDMI™) technology. The terms HDMI and HDMI High-
Definition Multimedia Interface, and the HDMI Logo are
trademarks or registered trademarks of HDMI Licensing LLC in
the United States and other countries.
• “BRAVIA” is a trademark of Sony Corporation.
• LDAC™ and LDAC logo are trademarks of Sony Corporation.
• The BLUETOOTH®word mark and logos are registered trade-
marks owned by Bluetooth SIG, Inc. and any use of such marks
by Sony Corporation is under license. Other trademarks and
trade names are those of their respective owners.
• The N Mark is a trademark or registered trademark of NFC Fo-
rum, Inc. in the United States and in other countries.
• Android™ is a trademark of Google Inc.
• Google Play™ is a trademark of Google Inc.
• Apple, the Apple logo, iPhone, and iPod touch are trademarks of
Apple Inc., registered in the U.S. and other countries. App Store
is a service mark of Apple Inc.
• “Made for iPod” and “Made for iPhone” mean that an electronic
accessory has been designed to connect specifically to iPod or
iPhone, respectively, and has been certified by the developer to
meet Apple performance standards. Apple is not responsible for
the operation of this device or its compliance with safety and
regulatory standards. Please note that the use of this accessory
with iPod or iPhone may affect wireless performance.
• THIS PRODUCT IS LICENSED UNDER THE MPEG-4 VISUAL
PATENT PORTFOLIO LICENSE FOR THE PERSONAL AND
NON-COMMERCIAL USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE WITH THE MPEG-4
VISUAL STANDARD (“MPEG-4 VIDEO”)
AND/OR
(ii)DECODING MPEG-4 VIDEO THAT WAS ENCODED BY
A CONSUMER ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS OBTAINED FROM
A VIDEO PROVIDER LICENSED TO PROVIDE MPEG-4
VIDEO.
NO LICENSE IS GRANTED OR SHALL BE IMPLIED FOR ANY
OTHER USE. ADDITIONAL INFORMATION INCLUDING THAT
RELATING TO PROMOTIONAL, INTERNAL AND COMMER-
CIAL USESAND LICENSING MAY BE OBTAINED FROM MPEG
LA, L.L.C.
HTTP://WWW.MPEGLA.COM
• All other trademarks are trademarks of their respective owners.
• In this manual, ™ and ® marks are not specified.
•Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
E12 : 220-240 V AC area in E model
E93 : 240 V AC area in E model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
Ver. 1.1

MHC-V44D
3
1. SERVICING NOTES ............................................. 4
2. DISASSEMBLY
2-1. Disassembly Flow........................................................... 10
2-2. Side (L) Panel, Side (R) Panel........................................ 11
2-3. Top Panel Section ........................................................... 11
2-4. Loading Panel Assy ........................................................ 12
2-5. CDM Section .................................................................. 13
2-6. Back Panel Section ......................................................... 14
2-7. DAMP Board .................................................................. 15
2-8. Bracket Chassis............................................................... 16
2-9. MOTHERBOARD Board............................................... 17
2-10. SMPS Board ................................................................... 18
2-11. Chassis ............................................................................ 18
2-12. Front Panel Section......................................................... 19
2-13. Loudspeaker (200 mm)-157-11 ...................................... 20
2-14. Loudspeaker (69 mm)-155-11 ........................................ 21
2-15. Service Optical Device (7G), Wire (Flat Type) .............. 22
3. TEST MODE ............................................................ 23
4. ELECTRICAL CHECK ......................................... 25
5. TROUBLESHOOTING .......................................... 26
6. DIAGRAMS ............................................................... 32
6-1. Block Diagram - CD/USB/HDMI Section -................... 33
6-2. Block Diagram - MAIN Section -................................... 34
6-3. Block Diagram - DAMP Section -.................................. 35
6-4. Block Diagram
- PANEL/POWER SUPPLY Section -............................ 36
6-5. Printed Wiring Board - MOTHERBOARD Board -....... 38
6-6. Printed Wiring Board - DAMP Board -.......................... 39
6-7. Printed Wiring Board - STR Board - .............................. 40
6-8. Schematic Diagram - STR Board (1/2) -........................ 41
6-9. Schematic Diagram - STR Board (2/2) -........................ 42
6-10. Printed Wiring Board - SMPS Board -........................... 43
6-11. Printed Wiring Board - MIC Board -.............................. 44
6-12. Schematic Diagram - MIC Board -................................. 44
6-13. Printed Wiring Board - PARTY LED Board -................ 45
6-14. Schematic Diagram - PARTY LED Board -................... 45
6-15. Printed Wiring Board - IR Board - ................................. 45
6-16. Schematic Diagram - IR Board -.................................... 45
6-17. Printed Wiring Board - SPEAKER LED_R Board -...... 46
6-18. Schematic Diagram - SPEAKER LED_R Board -......... 46
6-19. Printed Wiring Board - SPEAKER LED_L Board -....... 46
6-20. Schematic Diagram - SPEAKER LED_L Board -......... 46
TABLE OF CONTENTS
7. EXPLODED VIEWS
7-1. Side Panel Section .......................................................... 49
7-2. Loading Panel Section.................................................... 50
7-3. Back Panel Section ......................................................... 51
7-4. MOTHERBOARD Board Section.................................. 52
7-5. Chassis Section............................................................... 53
7-6. Front Panel Section......................................................... 54
7-7. Speaker Cabinet Section................................................. 55
7-8. Top Panel Section ........................................................... 56
7-9. CDM Section .................................................................. 57
7-10. CD Mechanism Section
(CDM90-DVBU204//C)................................................. 58
8. ELECTRICAL PARTS LIST .............................. 59
Accessories are listed in the last part of the electrical parts
list.

MHC-V44D
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
This appliance is classified as a CLASS 1
LASER product under IEC 60825-1:2007.
This marking is located on the rear exterior.
Model Part No.
LA9 4-584-043-0[]
AR 4-584-043-1[]
E4 4-584-043-2[]
E93 4-584-043-3[]
E12 4-584-043-4[]
MY 4-584-043-5[]
AUS 4-584-043-6[]
TH 4-584-043-7[]
RU 4-584-043-8[]
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
E12 : 220-240 V AC area in E model
E93 : 240 V AC area in E model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
PLAYABLE DISCS
• DVD VIDEO
• DVD-R/DVD-RW in DVD VIDEO format or video mode
• DVD+R/DVD+RW in DVD VIDEO format
• VIDEO CD (Ver. 1.0, 1.1, and 2.0 discs)
• Super VCD
• CD-R/CD-RW/CD-ROM in VIDEO CD format or super VCD
format
• AUDIO CD
• CD-R/CD-RW inAUDIO CD format
PLAYABLE FILES ON DISCS/USB DEVICE
• Music: MP3 files1)2) (.mp3), WMAfiles2)3) (.wma),AAC files2)3)
(.m4a/.mp4/.3gp), WAV files3) (.wav)
• Video: MPEG4 files4) (.mp4/.m4v), Xvid files (.avi)
1) MP3 (MPEG 1 Audio Layer 3) is a standard format defined by
ISO/MPEG for compressed audio data. MP3 files must be in
MPEG 1 Audio Layer 3 format.
2) Files with copyright protection (Digital Rights Management)
cannot be played back by the system.
3) USB device only.
4) MPEG4 files must be recorded in MP4 file format. Supported
video codec and audio codec are as follows:
– Video codec: MPEG4 Simple Profile (AVC is not supported.)
– Audio codec: AAC-LC (HE-AAC is not supported.)
Part No.
Destination Code
– Rear View –
MODEL NUMBER LABEL
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HOME AUDIO SYSTEM
MADE IN CHINA
Ver. 1.1

MHC-V44D
5
Note
• JIG
When disassembling the set, use the following jig (for front
panel removal).
Part No.: J-2501-238-A JIG FOR SPEAKER REMOVAL
NOTE OF REPLACEMENT OF THE MS-476 BOARD
When the MS-476 board is defective, exchange the entire CDM90
ASSY.
TEST DISCS
Use following TEST DISC when this unit confirms the operation
and checks it.
• For CD
Part No. Description
3-702-101-01 DISC (YEDS-18), TEST
4-225-203-01 DISC (PATD-012), TEST
J-2501-307-A DISC (HLX-A1), TEST
• For DVD SL (Single Layer)
Part No. Description
J-6090-069-A DISC (HLX-503), TEST (NTSC)
J-6090-088-A DISC (HLX-504), TEST (NTSC)
J-2501-305-A DISC (HLX-513), TEST (NTSC)
J-6090-077-A DISC (HLX-506), TEST (PAL)
• For DVD DL (Double Layer)
Part No. Description
J-6090-071-A DISC (HLX-501), TEST (NTSC)
J-6090-089-A DISC (HLX-505), TEST (NTSC)
J-2501-306-A DISC (HLX-514), TEST (NTSC)
J-6090-078-A DISC (HLX-507), TEST (PAL)
IF “PROTECTX” (X IS A NUMBER)
APPEARS IN THE DISPLAY PANEL
Immediately unplug the AC
power cord (mains lead), and
check the following items.
• Is anything blocking the
ventilation holes of the unit?
• Is the USB port short-circuited?
After checking the above items and
fixing any problems, plug in the AC
power cord (mains lead) again and
turn on the system.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press [1] button to turn the power on.
2. Press the [FUNCTION] button until the message “DVD/CD”
is displayed.
3. Press the [ENTER] button and [VOCAL FADER] button
simultaneously and hold down for around 3 seconds.
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When “LOCKED”is displayed, the slot lock is not released by
turning power on/off with the [1]button.
NOTE OF REPLACING THE IC2002 AND IC2003 ON
THE DAMP BOARD AND THE COMPLETE DAMP
BOARD
When IC2002 and IC2003 on the DAMP board and the complete
DAMP board are replaced, it is necessary to spread the compound
between parts and heat sink.
Part No. Description
7-300-009-67 THERMAL COMPOUND (TIG2000)
Spread the compound referring to the figure below.
– DAMP Board (Component Side) –
thermal compound (TIG2000)
IC2003
IC2002
thermal compound (TIG2000)

MHC-V44D
6
NOTE OF REPLACING THE IC965, Q908 AND Q909
ON THE SMPS BOARD
When IC965, Q908 and Q909 on the SMPS board are replaced, it
is necessary to spread the compound between parts and heat sink.
Part No. Description
7-300-009-67 THERMAL COMPOUND (TIG2000)
Spread the compound referring to the figure below.
NOTE OF REPLACING MOTHERBOARD BOARD OR
BLUETOOTH MODULE OR RC-S730 (WW) BOARD
When the MOTHERBOARD board or BLUETOOTH module or
RC-S730 (WW) board are replaced, please execute the below
service mode.
Pairing this system with a Bluetooth device
1. Press the [1] button to turn the power on.
2. Place the Bluetooth device within 1 meter (3 feet) from the
system.
3. Press BLUETOOTH on the unit to select Bluetooth function.
“BTAUDIO” appears in the display panel.
Notes
• When there is no pairing information on the system, the sys-
tem enters the pairing mode automatically and “PAIRING”
flashes in the display panel. Proceed to step 5.
• If the system is connected to a BLUETOOTH device, press
BLUETOOTH on the unit to disconnect the BLUETOOTH
device.
4. Hold down BLUETOOTH on the unit for 2 seconds or more.
“PAIRING” flashes in the display panel.
5. Perform the pairing procedure on the Bluetooth device.
6. Select the model number of the unit on the display of the
Bluetooth device.
For example, select “MHC-V44D”. If passkey is required on
the Bluetooth device, enter “0000”.
7. Perform the Bluetooth connection on the Bluetooth device.
8. When pairing is completed and the Bluetooth connection is
established, the Bluetooth device name appears in the display
panel.
9. To cancel pairing operation, hold down BLUETOOTH on the
unit for 2 seconds or more until “BTAUDIO” appears in the
display panel.
Connecting with a smartphone by one touch (NFC)
Note: The operation in this mode must use a NFC-compatible smartphone
(Smartphones with a built-in NFC function [OS: Android 2.3.3 or
later, excluding Android 3.x])
1. Press the [1] button to turn the power on.
2. Download and install the app “NFC Easy Connect”.
Download the freeAndroid app from Google Play by searching
for “NFC Easy Connect”.
3. Start the app “NFC Easy Connect” on the smartphone.
Make sure that the application screen is displayed.
4. Touch the smartphone to the N-Mark on the system until the
smartphone vibrates.
Complete the connection by following the instructions
displayed on the smartphone.
5. When pairing is completed and the Bluetooth connection is
established, the Bluetooth device name appears in the display
panel.
–
SMPS Board (Component Side) –
thermal compound
(TIG2000)
IC965
thermal compound
(TIG2000)
D909 D908

MHC-V44D
7
Playing music from a Bluetooth device
For a Bluetooth device
1. Press the [1] button to turn the power on.
2. Press BLUETOOTH on the unit to select Bluetooth function.
“BTAUDIO” appears in the display panel.
3. Establish connection with the Bluetooth device.
Press BLUETOOTH on the unit to connect to the last
connected Bluetooth device.
Perform the Bluetooth connection from the Bluetooth device if
the device is not connected.
Once the connection is established, the Bluetooth device name
appears in the display panel.
4. Press N.
Depending on the Bluetooth device,
– you may have to press Ntwice.
– you may need to start playback of an audio source on the
Bluetooth device.
For an NFC-compatible smartphone
1. Press the [1] button to turn the power on.
Touch the smartphone to the N-Mark on the system to establish
the Bluetooth connection.
Start playback of an audio source on the smartphone. For
details on playback, refer to the operating instructions of your
smartphone.
To disconnect the Bluetooth device
For a Bluetooth device
Press BLUETOOTH on the unit.
“BTAUDIO” appears in the display panel.
For an NFC-compatible smartphone
Touch the smartphone to the N-Mark on the system again.
To erase all the pairing registration information perform
COLD RESET test mode (Refer page 23).
BOND FIXATION OF ELECTRIC PARTS
When DAMP board or SMPS board are replaced, it is necessary to
fix parts to the boards by using a specified bond without fail.
• Object boards
1. Complete DAMP board
2. Complete SMPS board
• Use bond
HM-40 (E318202) 300ML
• Parts position
1. DAMP board (page 7)
2. SMPS board (page 7)
1. DAMP board
2. SMPS board
– DAMP Board (Component Side) –
The portion which applies bond:
C2076
– SMPS Board (Component Side) –
The portion which applies bond:
C905
C914
VDR901
C992
C2010
C917
R998
R996
C1003
A932
A933

MHC-V44D
8
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
Note 1: After the side panel and top panel are removed, this work is done.
Note 2: Please prepare the thin wire (clip etc. processed to the length of 8 cm or more).
3
8 cm or more
– Top view –
CD mechanism deck
tray
Insert the clip etc. processed to the
length of 8 cm or more in the hole
on the side of the chassis and push.
Note: Push after it inserts it
in this hole well.
1Remove the side L, R panel, top panel block.
(Illustration of disassembly is omitted.)
– Left view –
hole

MHC-V44D
9
DAMP Board (Conductor side view)
In checking the DAMP board, make 1 capacitor discharge of C2076 for electrical shock prevention.
800 :/5 W
C2076
CAPACITOR DISCHARGE FOR ELECTRIC SHOCK PREVENTION
SMPS Board (Conductor side view)
In checking the SMPS board, make 3 capacitors discharge of C914, C1003 and C1006 for eletrical shock prevention.
800 :/5 W
800 :/5 W
800 :/5 W
C1006
C1003
C914

MHC-V44D
10
Note: Disassemble the unit in the order as shown below.
2-1. DISASSEMBLY FLOW
SECTION 2
DISASSEMBLY
2-3. TOP PANEL SECTION
(Page 11)
2-4. LOADING PANEL ASSY
(Page 12)
2-5. CDM SECTION
(Page 13)
2-2. SIDE (L) PANEL,
SIDE (R) PANEL
(Page 11)
2-15.SERVICE OPTICAL DEVICE (7G),
WIRE (FLAT TYPE)
(Page 22)
2-6. BACK PANEL SECTION
(Page 14)
2-7. DAMP BOARD
(Page 15)
2-8. BRACKET CHASSIS
(Page 16)
2-9. MOTHERBOARD BOARD
(Page 17)
2-10.SMPS BOARD
(Page 18)
2-11. CHASSIS
(Page 18)
2-12.FRONT PANEL SECTION
(Page 19)
2-13.LOUDSPEAKER (200MM)-157-11
(Page 20)
2-14.LOUDSPEAKER (69MM)-155-11
(Page 21)
SET

MHC-V44D
11
Note: Follow the disassembly procedure in the numerical order given.
2-2. SIDE (L) PANEL, SIDE (R) PANEL
2-3. TOP PANEL SECTION
1one screw
(SCREW, TAPPING) 3two screws (+BVTP 3 x 8)
3two screws
(+BVTP 3 x 8)
4three claws
1one screw
(SCREW,
TAPPING)
2three screws
(SCREW, TAPPING)
2three screws
(SCREW,
TAPPING)
4three claws
5Remove the panel, side (R)
in the direction of the arrow.
5Remove the panel, side (L)
in the direction of the arrow.
6panel, side (L)
6panel, side (R)
– Front view –
4three claws
1one screw (+BVTP 3 x 8)
6wire (flat type) (21 core) (CN126)
8CN451 (4P)
q; CN3500
(4P)
qa CN3007 (3P)
7wire (flat type) (6 core) (CN105)
3one screw
(+BV3 (3-CR))
3one screw
(+BV3 (3-CR))
qs top panel section
5Remove the top panel section
in the direction of the arrow. A
A
B
C
C
B
2Remove hemilon,
10xLx0.4. 2Remove
hemilon,
10xLx0.4.
MOTHERBOARD board
top
:ire VettinJ
:ire VettinJ
MOTHERBOARD board
hemilon, 10xLx0.4
fan, DC
hemilon,
10xLx0.4
top
:ire VettinJtop
9Remove wires from clip,
coating.

MHC-V44D
12
2-4. LOADING PANEL ASSY
– Front view –
– Top view –
CD mechanism deck
8 cm or more
tray
Insert the clip etc. processed to the
length of 8 cm or more in the hole
on the side of the chassis and push.
Note: Push after it inserts it
in this hole well.
1Insert the clip etc.
2Draw out the tray.
3three claws
4panel, loading
assy
– Left view –
hole

MHC-V44D
13
2-5. CDM SECTION
8four screws (+BVTP 3 x 8)
1two screws (+BVTP 3 x 8)
2two screws
(+BVTP 3 x 8)
3two claws
5CN401 (6P)
6wire (flat type)
(5 core)
(CN303) 7wire (flat type)
(24 core)
(CN302) 4Remove the CDM section
in the direction of the arrow.
q; CDM90-DVBU204//C
qa bracket, CDM
9
– Rear view –

MHC-V44D
14
2-6. BACK PANEL SECTION
:LUHVHWWLQJ
rear side
clip, coating
hemilon, 10xLx0.4
fan,DC
MOTHERBOARD board
1Remove the wire from clip, coating.
3CN2001 (2P)
2Remove
hemilon,
10xLx0.4.
9panel, back section
4four screws
(+BVTP 3 x 8)
5three screws
(+BVTP 3 x 8)
8one screw
(+B 3 x 6)
6two screws
(+BVTP 3 x 8)
7one screw
(+BVTP 3 x 8)
–5HDUYLHZ–

MHC-V44D
15
2-7. DAMP BOARD
front side
DAMP board
:LUHVHWWLQJ
6clip, coating
1Remove wire from clip, coating.
7DAMP board
8three screws (+BVTP 3 x 10)
5four screws (+BVTP 3 x 8)
2CN2003 (6P)
3CN2002 (10P)
4wire (flat type)
(25 core)
(CN2004)
9heatsink (AMP)
Note: When you install the heatsink (AMP),
spread the compound referring to
“NOTE OF REPLACING THE IC2002
AND IC2003 ON THE DAMP BOARD
AND THE COMPLETE DAMP BOARD”
on servicing notes (page 5).

MHC-V44D
16
2-8. BRACKET CHASSIS
– Rear view –
1Remove
hemilon,
10xLx0.4.
3Remove
hemilon,
10xLx0.4.
front side
:LUHVHWWLQJ
bracket, chassis
top side
front side
:LUHVHWWLQJ
:LUHVHWWLQJ
3Remove
hemilon,
10xLx0.4.
MOTHERBOARD board
hemilon,
10xLx0.4
hemilon,
10xLx0.4
hemilon,
10xLx0.4
front side
:LUHVHWWLQJ
MOTHERBOARD board
MOTHERBOARD board
MOTHERBOARD board
6CN001 (9P)
2CN123 (2P)
7four screws (+BV3 (3-CR))
q; CN2002 (10P)
4wire (flat type)
(10 core) (CN102)
qa bracket,
chassis
8Remove
bracket,
chassis in the
direction of
arrow.
9Draw out the wire from
bracket, chassis.
5Remove wire from clip, coating.

MHC-V44D
17
2-9. MOTHERBOARD BOARD
Note: When the MOTHERBOARD BOARD is replaced, refer to
“NOTE OF REPLACING MOTHERBOARD BOARD OR BLUE-
TOOTH MODULE OR RC-S730 (WW) BOARD” on page 6.
3MOTHERBOARD board
1five screws (+BVTP 3 x 8)
2clip, coating
2clip, coating
2clip, coating
–5HDUYLHZ–

MHC-V44D
18
2three screws
(+PWH 3 x 8 (SUMITITE))
1six screws
(+PWH 3 x 8 (SUMITITE))
3SMPS board
– Rear view –
2-10. SMPS BOARD
2-11. CHASSIS
1six screws (STEP SCREW M4)
2one claw
2one claw
3chassis
– Rear view –

MHC-V44D
19
2-12. FRONT PANEL SECTION
:LUHVHWWLQJ
5 Push the protrusion, and remove
the terminal (wide side).
5Push the protrusion, and remove
the terminal (narrow side). top side
protrusion
:LUHVHWWLQJ
top side
5 Push the protrusion,
and remove the terminal
(narrow side).
5 Push the protrusion, and
remove the terminal
(wide side).
protrusion
loudspeaker
(4cm)
–)URQWYLHZ–
loudspeaker
(4cm)
total sixteen bosses
3 Insert the jig into a space and slowly
remove the front panel section.
Note 1: When using a jig, please work
so as not to injure front panel
section and speaker cabinet.
7 front panel section
Note 2: When installing the front panel section,
remove the used glue and use
a new glue to fix the front panel.
1 one screw ((3.5 x 14), TAPPING)
2 two screws ((3.5 x 14), TAPPING)
3 Insert the jig into a space and slowly
remove the front panel section.
Note 1: When using a jig, please work
so as not to injure front panel
section and speaker cabinet.
4 All bosses are removed while moving
jig in the direction of the arrow, and
front panel section is removed.
4 All bosses are removed while moving
jig in the direction of the arrow, and
front panel section is removed.
6Remove the
front panel
section in
the direction
of an arrow.

MHC-V44D
20
2-13. LOUDSPEAKER (200MM)-157-11
4loudspeaker (200mm)-157-11
1four screws ((4 x 20), +BV TAPPING)
2Remove the loudspeaker
(200mm)-157-11 in the direction of the arrow.
terminal
(narrow side)
terminal
(wide side)
loudspeaker (200mm)-157-11
terminal position
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PP
:LUHVHWWLQJ
protrusion
top side
3Push the protrusion, and remove
the terminal (narrow side).
3Push the protrusion, and remove
the terminal (wide side).
–)URQWYLHZ–
loudspeaker
(200mm)-157-11