ST UM2966 User manual

Introduction
The ASTRA platform (STEVAL-ASTRA1B) is a development kit and reference design that simplifies prototyping, testing and
evaluating advanced asset tracking applications such as livestock monitoring, fleet management, and logistics.
The kit consists of four boards (not available for separate sale): STEVAL-ASTRA1 (main board), STEVAL-ASTRA1SB (system
on board), STEVAL-ASTRA1BC (expansion board) and STEVAL-ASTRA1NA (flexible NFC antenna).
It comes with comprehensive software, firmware libraries, tools, battery, and plastic case. Thanks to its modular and optimized
design, it simplifies the development of tracking and monitoring innovative solutions.
The STEVAL-ASTRA1B is built around the STM32WB5MMG module and the STM32WL55JC SoC for short and long range
connectivity (BLE, LoRa, and 2.4 GHz and sub 1-GHz proprietary protocols). ST25DV64K for NFC connectivity is also available.
The on-board STSAFE-A110 enhances security features.
The kit embeds a complete set of environmental and motion sensors (LIS2DTW12, LSM6DSO32X, HTS221, STTS22H,
LPS22HH). Moreover, the Teseo-LIV3F GNSS module provides outdoor positioning.
The power management, built around ST1PS02 and STBC03, is optimized for long battery life.
Figure 1. STEVAL-ASTRA1B development kit
Getting started with the STEVAL-ASTRA1B multiconnectivity asset tracking
reference design based on STM32WB5MMG and STM32WL55JC
UM2966
User manual
UM2966 - Rev 1 - February 2022
For further information contact your local STMicroelectronics sales office. www.st.com

1Getting started
1.1 Precautions for use
Danger: Charge the STEVAL-ASTRA1B with a DC 5 V–500 mA USB charger at an ambient
temperature between 5°C to 35°C. Do not use a USB charger without short-circuit
protection to prevent fire hazard.
Use the STEVAL-ASTRA1B at the recommended working temperature range and store
it according to the permitted storage conditions (see Table 1). Never expose the kit to
excessive heat such as direct sunlight, fire, or heating equipment.
Use only the battery provided with the kit, the replacement of the battery with an incorrect
type might invalidate the safeguards.
LiPo batteries can be damaged and even explode if they are short-circuited or overcharged
or improperly used (mechanical crushes, hot oven, or battery cutting).
Table 1. Precautions for use
Parameter Range
Operating temperature 10°C to 35°C
Charging temperature 10°C to 35°C
Humidity From 50% to 80%
Operating altitude Up to 2000 m
1.2 Features
• Ultra-low-power and multiconnectivity asset tracking platform
•Two wireless SoCs:
–STM32WB5MMG 2.4 GHz wireless dual core SoC module as main application processor, which
supports Bluetooth® Low Energy 5.0
–STM32WL55JC sub 1-GHz wireless dual core SoC, which supports multimodulation (LoRa and GFSK)
•ST25DV64K for NFC connectivity
•Teseo-LIV3F GNSS module with simultaneous multiconstellation
• Environmental and motion sensors: STTS22H, LPS22HH, HTS221, LIS2DTW12, and LSM6DSO32X
•STSAFE-A110 secure element
• Battery-operated solution with smart power management architecture (ST1PS02, STBC03, and TCPP01-
M12)
•FP-ATR-ASTRA1 function pack compatible with STM32CubeMX, which can be downloaded from and
installed directly into STM32CubeMX
• End-to-end proof of concept ecosystem mobile app and cloud dashboard:
–DSH-ASSETRACKING web cloud dashboard
–STAssetTracking mobile app available on Google Play and App store
• 480 mAh LiPo battery
• Plastic case
• SMA antenna
• NFC antenna
• Operating conditions: +5 to 35°C
1.3 Kit components
The STEVAL-ASTRA1B is a development kit consists of three boards and a flexible NFC antenna (none of them
available for separate sale):
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• the STEVAL-ASTRA1SB system on board (with STEVAL$ASTRA1SBA finished good and AB0037 code
printed on the PCB);
•the STEVAL-ASTRA1 main board (with STEVAL$ASTRA1A finished good and AB0038 code printed on the
PCB);
• the STEVAL-ASTRA1BC expansion board (with STEVAL$ASTRA1BCA finished good and AB0058 code
printed on the PCB);
• the STEVAL-ASTRA1NA flexible NFC antenna (with STEVAL$ASTRA1NAA finished good and AB0077
code printed on the PCB).
Moreover, the kit includes, only for evaluation purposes, a plastic case to host the boards and the LiPo battery
included.
The figure below shows how the boards are mechanically connected to each other:
• the STEVAL-ASTRA1SB system on board is soldered on top of the main board;
• the STEVAL-ASTRA1BC expansion board is connected to the main board through the 34-pin expansion
connector;
• the STEVAL-ASTRA1NA flexible NFC antenna is connected to the main board via an FPC connector.
Figure 2. STEVAL-ASTRA1B components and assembly
1.3.1 STEVAL-ASTRA1SB system on board
1.3.1.1 Architecture and pinout
The system on board hosts long and short-range connectivity as well as security functionalities. Moreover, it
embeds part of the power management circuitry.
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Figure 3. Block diagram of the STEVAL-ASTRA1SB system on board
This board main components are:
•The STM32WB5MMG (AB0037.U902) ultra-low-power, small-form factor, certified 2.4 GHz wireless module.
It integrates the high performance STM32WB dual core Arm® Cortex® M4/M0+, crystals, and the chip
antenna together with the matching network. The module implements a Bluetooth Low Energy stack,
but it can also support Zigbee, Open Thread and other 2.4 GHz proprietary protocols. As an application
processor, it exposes its main peripherals for application purposes and also acts as AT master towards the
STM32WL55JC.
• The STM32WL55JC (AB0037.U903) long-range wireless and ultra-low-power system-on-chip. It is a dual
core Arm® Cortex®-M4/M0+ that supports sub 1-GHz multimodulation, such as LoRa, GFSK, and others.
By default, the STM32WL55JC plays the role of network processor running the LoRaWAN modem AT
slave firmware. It is connected to the STM32WB5MMG through the LPUART interface together with wake-
up, reset, and interrupt signals. The STM32WL55JC drives the sub-GHz RF front end, acting on high
power, low power, and LNA networks. In this STEVAL-ASTRA1B version, the RF front end is tuned at
high frequency bands (868/915/920 MHz). Low frequencies bands can be achieved with a BOM change
of the STM32WL55JC RF network. By default, the sub-GHz antenna is connected to a SMA connector
(AB0037.J935) but you can optionally solder a micro-FL connector (AB0037.J936).
• The STSAFE-A110 (AB0037.U901) secure element hooked to the STM32WB5MMG for authentication and
secure data management services. It consists of a full turnkey solution for IoT, with a secure operating
system, running on the latest generation of secure microcontrollers.
• The ST1PS02CQTR (AB0037.U900) nano-quiescent synchronous step-down converter. It manages power
and can provide up to 400 mA regulated output current. You can select the output voltage via firmware (see
Section 1.3.1.2 ).
The figure below shows the main component placement on the system on board.
The PCB size is about 34 mm x 28 mm. It consists of six layers optimized for RF performance. The edge and
the bottom side of the PCB include several pads. The main peripherals and functionalities are exposed on the 56
edge pins and completed by the 110 pins on the bottom side.
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Figure 4. System on board - main component placement and pinout
The flexible architecture allows moving some functionalities from the STM32WB5MMG to the STM32WL55JC
microcontroller. You can reach this goal by acting on the 30 solder jumpers (AB0037.J900 to AB0037.J929),
which are placed on the top side of the system on board, close to the edge of the PCB. You can use a 0 ohm
(0402 package) resistor or a tiny solder drop to close the jumpers, thus creating a shortcut between the selected
STM32WB5MMG and STM32WL55JC pins.
Figure 5. Solder jumpers for remapping
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Table 2. System on board - edge pinout
Pin Function
E1 GND
E2 WL_RESET
E3 WL_PA14 SWCLK
E4 WL_PA13 SWDIO
E5 WL_VDD
E6 WB_PE0
E7 WB_PD9
E8 WB_PC7
E9 WB_PD11
E10 WB_PA3
E11 WB_PA2
E12 WB_PC5
E13 WB_PA0
E14 WB_PA1
E15 WB_PA15
E16 WB_PD15
E17 WB_PA5
E18 WB_PA4
E19 WB_PA6
E20 WB_PB5
E21 WB_PC1
E22 V_REG_EN
E23 WB_PB9
E24 WB_PB8
E25 WB_PC11
E26 WB_PB6
E27 WB_PB7
E28 WB_PE3
E29 WB_PC4
E30 WB_PD4
E31 WB_PD5
E32 WB_PA7
E33 WB_PD7
E34 WB_PD3
E35 WB_PB10
E36 GND
E37 WB_VDD_USB
E38 WB_PA12
E39 WB_PA11
E40 WB_PC13
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Pin Function
E41 WB_PD12
E42 WB_PD14
E43 WL_PA10
E44 WL_PA9
E45 WL_PB14
E46 WL_PB13
E47 WB_PB11 STSAFE_SDA
E48 WB_PC0 STSAFE_SCL
E49 WB_VDD
E50 WB_PA13 SWDIO
E51 WB_PA14 SWCLK
E52 WB_RESET
E53 V_REG_2
E54 V_REG
E55 V_UNREG
E56 GND
The bottom side of the system on board embeds 110 pins. Some of them form two extended debug connector
footprints. Each footprint is connected to a microcontroller (see Figure 6).
The supported connectors are: SAMTEC FTSH-107-01-F-DV-K-P-TR (STLINK-V3MINI receptacle) and SAMTEC
FTSH-111-01-L-DV-K-P-TR (neither of this connector is included in the kit). The remaining 62 pins support minor
features of the two microcontrollers.
Table 3. System on board - bottom pinout (from B1 to B68)
Pin Function
B1 WB_PD0
B2 WB_PD2
B3 WB_PD8
B4 WB_PH0
B5 WB_PD10
B6 WB_PB1
B7 WB_PH1
B8 WB_PD13
B9 WB_PC12
B10 WB_PE1 POWER GOOD
B11 WB_PB15
B12 WL_PA3
B13 WL_PA2
B14 WL_PA1
B15 WL_PB2
B16 WL_PA11
B17 WB_PD1
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Pin Function
B18 WB_PB0
B19 WB_PC6
B20 WB_PA8
B21 WL_PA15
B22 WL_PA12
B23 WB_PB12
B24 WB_PD6
B25 Not connected
B26 WB_PA13 SWDIO
B27 WB_PA14 SWCLK
B28 WB_PB3
B29 WB_PA15
B30 WB_RESET
B31 WB_PA9
B32 WB_PB4
B33 WB_PB2
B34 WB_PB13
B35 WB_PE2
B36 Not connected
B37 WB_VDD
B38 WB_GND
B39 WB_GND
B40 WB_PA14
B41 WB_GND
B42 WB_PA10
B43 WB_PB3
B44 WB_PC3
B45 Not connected
B46 Not connected
B47 Not connected
B48 WB_PB14
B49 WL_PC1
B50 WL_PC6
B51 WL_PC0
B52 WL_PB10
B53 WL_PA7
B54 WL_PA6
B55 WL_PA4
B56 Not connected
B57 Not connected
B58 Not connected
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Pin Function
B59 Not connected
B60 WL_PC3
B61 WL_PC4
B62 WL_PC5
B63 WL_PB11
B64 WL_PA5
B65 WL_PB0
B66 WB_PC2
B67 WL_PA9
B68 WL_PA10
Table 4. System on board - bottom pinout (from B69 to B110)
Pin Function
B69 Not connected
B70 WL_PA13 SWDIO
B71 WL_PA14 SWCLK
B72 WL_PB3
B73 WL_PA15
B74 WL_RESET
B75 WL_PB6
B76 WL_PB4
B77 WL_PB5
B78 WL_PA8
B79 WL_PC2
B80 Not connected
B81 WL_VDD
B82 WL_GND
B83 WL_GND
B84 WL_PA14
B85 WL_GND
B86 WL_PB7
B87 WL_PB3
B88 WL_PB4
B89 Not connected
B90 Not connected
B91 Not connected
B92 Not connected
B93 Not connected
B94 WL_PB15
B95 WL_VDD
B96 WL_PH3
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Pin Function
B97 WB_GND
B98 WB_VDD
B99 WB_PD13 D0_1_2
B100 WB_PE4
B101 WL_PA0
B102 WL_PB1
B103 WL_PB4
B104 WL_PB9
B105 WL_PB8
B106 WL_PC13
B107 WL_PB12
B108 WB_VDD
B109 WB_PH3
B110 WL_GND
Figure 6. Extended debug footprints and supported connectors
1.3.1.2 Power management
The ST1PS02CQTR step-down converter on the system on board is part of the power management circuit.
It generates the power domains (V_REG and V_REG_1) that translate the input voltage (V_UNREG). The
V_REG_EN signals, which come from the power switch on the main board, enable the step-down converter.
At startup the output voltages (V_REG and V_REG_1) are set at 2.5 V. By acting on the D0_1_2 signal, it is
possible to switch to 3.3 V. POWER GOOD reports when the output voltage target is reached.
The STM32WB5MMG microcontroller activates the second energy domain (V_REG_2) acting on the
VOUT2_CTRL signal.
The following figure shows the power management block diagram of the system on board. It also shows the edge
and bottom pins that allow accessing the signals.
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Figure 7. System on board - power management block diagram
1.3.1.3 RGB LED
The RGB (red, green, and blue) LED (AB0037.D902) signals the application status. The colors and their flashing
frequency are strictly linked to the loaded application firmware (refer to the firmware user manual for further
details).
1.3.2 STEVAL-ASTRA1 main board
The system on board is soldered on top of the STEVAL-ASTRA1 main board. It embeds:
•the environmental and motion sensors;
• the user and the power-on button (which also acts as a second user button);
• the GNSS, the GNSS RF front end, and the patch antenna;
• the dynamic NFC memory;
• part of the power management circuitry and the battery connector;
• the debug interface of the microcontrollers selectable through switches;
• the additional secure element (not mounted, hooked to STM32WL55JC for LoRa provisioning)
The additional RGB LEDs are intended for future applications but not mounted in this version of the kit.
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Figure 8. Main board block diagram
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Figure 9. Main board component placement (top view)
1. NFC antenna connector
2. ST25DV64K
3. STTS22H
4. LSM6DSO32X
5. HTS221
6. LPS22HH
7. LIS2DTW12
8. STSAFE-A110
9. Power on/wake-up button
10. User button
11. Jumpers to program pin configuration (for STM32WB5MMG or STM32WL55JC)
12. System on board
13. Screw hole for board-to-board strengthening
14. Screw hole for board-to-board strengthening
15. Screw hole for board-to-board strengthening
16. Teseo-LIV3F
17. ST1PS02CQ
18. GNSS antenna
12
34
56
78
910
16
11 12
13 14
43.3 mm
58.29 mm
15 17
18
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Figure 10. Main board component placement (bottom view)
1. Battery connector
2. 34-pin connector (socket)
1
2
1.3.2.1 Sensors
The STEVAL-ASTRA1 main board includes the following environmental and motion sensors:
•STTS22H (AB0038.U201) ultra-low-power, high accuracy, digital temperature sensor. Thanks to its factory
calibration, the STTS22H offers high-end accuracy performance over the entire operating temperature
range, without requiring any further calibration at the application level. The operating temperature goes from
-40°C to +125°C with a ±0.5°C (-10°C to +60°C) accuracy. The sensor operating mode is user-configurable
and allows selecting between different output data rates (ODR) down to 1 Hz or the one-shot mode for
battery saving.
•LPS22HH (AB0038.U203) ultra-compact piezoresistive absolute pressure sensor, which functions as a
digital output barometer. The device embeds a sensing element and an IC interface, which communicates
from the sensing element to the application. The operating pressure range goes from 260 to 1260 hPa.
The absolute accuracy is 0.5hPa (-20°C to +80°C). Operating temperature range goes from -40°C +85°C,
providing a temperature absolute accuracy ±1.5°C (0 to 80°C).
•HTS221 (AB0038.U204) combines a relative humidity and a temperature sensor in an ultra-small package. It
includes a sensing element and a mixed signal ASIC to provide the measurement information through digital
serial interfaces. The humidity range goes from 0% to 100% and the humidity accuracy is ± 3.5% rH (+20%
to +80% rH). The temperature range goes from -40°C to +125°C and the temperature accuracy is ± 0.5°C
(+15°C to +40°C).
•LIS2DTW12 (AB0038.U200) ultra-low power, 3-axis accelerometer, enhanced with embedded digital
functions (such as free fall, 6D/4D orientation, wake up/inactivity, tap, and double tap). The LIS2DTW12
has user-selectable full scales of ±2g/±4g/±8g/±16g. It can measure accelerations with output data rates
(ODR) from 1.6 Hz to 1600 Hz. The embedded self-test capability allows the user to check whether the
sensor is correctly working in the application. It is guaranteed to operate over an extended temperature
range from -40°C to +85°C.
•LSM6DSO32X (AB0038.U202) system-in-package that features a 3-axis digital accelerometer at 32 g
and a 3-axis digital gyroscope. It boosts power performance at 0.55 mA in high-performance mode and
enables always-on low-power features for an optimal motion experience in wearable, hard-fall detection,
navigation, and asset tracking applications. The LSM6DSO32X embeds a dedicated Machine Learning
Core (MLC) processing and a finite state machine (FSM) that provides system flexibility. It allows moving
some algorithms to the MEMS sensor with the advantage of a consistent reduction in power consumption.
The LSM6DSO32X has a full-scale acceleration range of ±4/±8/±16/±32 g and an angular rate range of
±125/±250/±500/±1000/±2000 dps. The operating temperature range goes from -40°C +85°C.
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The environmental sensors and the LSM6DSO32X motion sensor share the I²C bus, while the LIS2DTW12
communicates over the SPI bus. Different buses together with the power management architecture allow using
environmental sensors and LSM6DSO32X sensor on demand. Thus, you can implement different options to
reduce power consumption when some sensors are not used.
The LIS2DTW12 belongs to the same power domain of the microcontrollers. Thus, it is always powered. In
low-power mode, the interrupt signal (SENS_INT1), generated by the activity/inactivity function, can be used to
wake up the microcontroller.
Figure 11. STEVAL-ASTRA1B sensor schematic diagram
SENS_I2C_SCL
SENS_I2C_SDA
SENS_INT1
VDD_SENSORS
GND
SENS_INT2
SENS_SPI_CS
SENS_SPI_CLK
SENS_SPI_MOSI
SENS_SPI_MISO
VDD_SENSORS_PRIMARY
SB207
0R
C203
100nF
C200
100nF
R200
10k
U204
HTS221TR
SPI_Enable 6
GND
5
SDA/SDO 4
DRDY 3
SCL/SPC 2
VDD
1
SB202
0R
SB210
0R
SB208
0R
TP204
SB203
0R
SB200 0R
C206
100nF
SB206
0R
U201
STTS22HTR
SCL 1
VDD
3ALERT/INT 2
Addr 4 GND
5SDA 6
Exp
7
C205
100nF
SB212
0R
C202
100nF
TP206
TP200
TP205
SB205 0R
C204
100nF
SB211
0R
N.M.
U203
LPS22HH
SDO/SA0 5
VDD_IO
1SCL/SPC 2
CS 6
INT_DRDY 7
GND1
8
GND2
9
VDD
10
RES
3
SDA/SDI/SDO 4
TP208
U202
LSM6DSO32X
NC 10
SDO/SA0
1
VDDIO
5
INT1
4SCx
3SDx
2
CS 12
INT2 9
GND2
7
VDD 8
GND1
6
NC1 11
SCL 13
SDA 14
SB201 0R N.M.
SB209 0R
SB213
0R
SB214
0R N.M.
C201
100nF
R201
1M
TP201
SB204 0R
U200
LIS2DTW12TR
SCL/SPC
1
CS
2
SDO/SA0
3
SDA/SDI/SDO
4
NC
5
GND
6
RES 7
GND1 8
VDD 9
VDDIO 10
INT2 11 INT1 12
TP202
VDD_SENSORS
GND
SENS_I2C_SCL
SENS_I2C_SDA
SENS_INT1
SENS_INT2
LIS2DTW12_INT2 VDD_SENSORS_PRIMARYLIS2DTW12_VDD
LIS2DTW12_VDD
INTERNAL_VDD
SDA
SCL
SCL
SDA
SDA
LIS2DTW12_INT1 SENS_INT1LIS2DTW12_VDD
SCL
SDA
LSM6DSOX_INT
INTERNAL_VDD
INTERNAL_VDD
INTERNAL_VDD
SCL
SDA
HTS221_DRDY
INTERNAL_VDD
SCL
LPS22HB_DRDY
SENS_INT2
STTS22H_INT
SENS_INT2
INTERNAL_VDD
LSM6DSO32X / STTS22HTR
I2C address
0x70
I2C address
0xD6
I2C address
0xBE
I2C address
0xBA
wakeup
1.3.2.2 NFC
The ST25DV64K (AB0038.U600) is an NFC RFID tag equipped with 64 Kbit of electrically erasable
programmable memory (EEPROM). It offers two communication interfaces: an I²C serial link and an RF link.
The first one can be operated from a DC power supply, whereas the second one is activated when the
ST25DV64K acts as a contactless memory powered by the received carrier electromagnetic wave.
In I²C mode, the ST25DV64K user memory contains up to 512 bytes, 2048 bytes and 8192 bytes, which could
be split into four flexible and protectable areas. In RF mode, following ISO/IEC 15693 or NFC forum type 5
recommendations, the ST25DV64K user memory contains up to 2048 blocks of 4 bytes, which could be split into
four flexible areas.
The ST25DV64K GPO pin (MEM_INT) provides data about incoming events, like RF field detection, RF activity in
progress, or mailbox message availability.
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Figure 12. STEVAL-ASTRA1 NFC tag schematic diagram
Ant enna
VDD_MEM
GND
MEM_INT
MEM_I2C_SCL
MEM_I2C_SDA
C601
100nF
J600
Con 4X0.5mm FFC-FPC
1
2
3
4
U600
ST25DV64K-JFR6D3
LPD
1
NC
2
V_EH
3
AC0
4
AC1
5
VSS
6SDA 7
SCL 8
NC1 9
VDCG 10
GPO 11
VCC 12
Exp
13
SB600 0R
TP600
R600 10k
TP601
C600
100nF
SB601
0R GND
VDD_MEM
1.3.2.3 GNSS
The Teseo-LIV3F (AB0038.U100) is a precision GNSS receiver in a tiny module with TCXO and RTC crystal.
It embeds the Teseo III single-die standalone positioning receiver IC, which simultaneously works on multiple
constellations (GPS/Galileo/Glonass/BeiDou/QZSS).
Thanks to the embedded 16 Mbit flash memory, the Teseo-LIV3F features data logging, seven-day autonomous
assisted GNSS, firmware reconfigurability, and firmware upgrades.
Teseo-LIV3F also provides the autonomous assisted GNSS to predict satellite data on the basis of a prior
observation of the satellite.
The temperature operating range goes from -40°C to 85°C.
The Teseo-LIV3F drives the RF front end, which ends with the patch antenna (AB0038.J100). Optionally, you can
remove and replace the patch antenna with a microFL (AB0038.J101) or a SMA (AB0038.J102) connector.
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Figure 13. STEVAL-ASTRA1 GNSS schematic diagram
VDD_GNSS
GND
LIV3_RSTn
LIV3_WAKEUP
LIV3_PPS
LIV3_RX
LIV3_TX
LIV3_I2C_SCL
LIV3_I2C_SDA
LIV3_VDD_RF
LIV3_VDD_RF
LIV3_VDD_RF
SB100 0R
J100
C101
1.56gHZ Ceramic
10nF
C105
56pF
N.M.
J102 N.M.
CON-SMA-R_A_SMD
TP101
L103
100nH
1
N.M.
2
SB104 0R
U102
1
2 3 5
B39162B4327P810
4
TP100
C103
56pF
N.M.
SB103 0R
1
J101 N.M.
UFL Wurth_636101111001
2
L1025.6nH
R101 0R
R103
10k
R102 0R
SB102 0R
L100
27nF
1 2
C107 120pF
C106
1nF
C108 120pF
C104
56pF
N.M.
R104
0R
N.M.
C102
56pF
N.M.
R105
0R
N.M.
R100 0R
U100
LIV3F
GND 1
2
TX0
3
RX0
4
1PPS
9
SYS_RSTn
6
VBATT
5
Wake-Up
7
VCC_IO
8
VCC
10 GND_RF_10
12 GND_RF_12
11 RF_IN
13 AntOFF
14 VCC_RF
15 RESERVED
16 I2C_SDA
17 I2C_SCL
18 RESERVED1
U101
5
IN
3
BGA725L6E6327FTSA1
OUT
4 1
GND_RF
GND
6
EN
2
VCC
SB101 0R
C100
56pF
GND
VDD_GNSS
LIV3_RX
LIV3_TX
LIV3_RSTn
LIV3_WAKEUP
LIV3_PPS
LIV3_I2C_SCL
LIV3_I2C_SDA
LIV3_RSTn
LIV3_WAKEUP
LIV3_I2C_SCL
LIV3_I2C_SDA
LIV3_PPS
ANTOFF
RF_IN
ANTOFF
RF_IN
The device and the microcontroller communicate via the UART bus. You can optionally route them to the I²C
bus. Moreover, some GPIOs (LIV3_PPS, LIV3_RSTn, and LIV3_WAKEUP) complete the connections between
the device and the microcontroller.
The Teseo-LIV3F is supplied by the V_REG1_MAIN domain. Optionally, you can supply it through V_REG2
generated by the system on board (see Section 1.3.2.10 for further details).
1.3.2.4 Debug and programming interface switch
The STEVAL-ASTRA1B is compatible with the STLINK-V3MINI debugging and programming probe for STM32
microcontrollers.
It supports the SWD protocol to communicate with any STM32 microcontroller. It also provides a virtual COM port
interface, which allows the host PC to communicate with the target microcontroller through UART.
The STEVAL-ASTRA1B embeds two microcontrollers: the STM32WB5MMG, which is the application processor,
and the STM32WL55JC, which plays the role of network processor, acting as modem AT slave.
By default, application firmware changes are applied to STM32WB5MMG but if necessary the STM32WL55JC
firmware can be updated as well.
On the top side of the main board, the three-pin jumper selectors are organized in three groups, according to their
function: firmware upgrade/debugging, tracking, and extended functions.
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Figure 14. STEVAL-ASTRA1 three-pin jumper selectors (default configuration)
Table 5. Configuration map of the three-pin jumper selectors
Jumper Group Configuration Description
J400 Firmware upgrade
SWDIO net is connected to the
STM32WB5MMG microcontroller
as a jumper is connected
between pins 1 and 2 (default
setting).
SWDIO net is connected to the
STM32WL55JC microcontroller
as a jumper is connected
between pins 2 and 3.
J404 Firmware upgrade
SWCLK net is connected to the
STM32WB5MMG microcontroller
as a jumper is connected
between pins 1 and 2 (default
setting).
SWCLK net is connected to the
STM32WL55JC microcontroller
as a jumper is connected
between pins 2 and 3.
J405 Firmware upgrade
RESET net is connected to the
STM32WB5MMG microcontroller
as a jumper is connected
between pins 1 and 2 (default
setting).
RESET net is connected to the
STM32WL55JC microcontroller
as a jumper is connected
between pins 2 and 3.
J407 Tracking
USART_TX net is connected
to the STM32WB5MMG
microcontroller as a jumper is
connected between pins 1 and 2
(default setting).
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Jumper Group Configuration Description
J407 Tracking
USART_TX net is connected
to the STM32WL55JC
microcontroller as a jumper is
connected between pins 2 and 3.
J408 Tracking
USART_RX net is connected
to the STM32WB5MMG
microcontroller as a jumper is
connected between pins 1 and 2
(default setting).
USART_RX net is connected
to the STM32WL55JC
microcontroller as a jumper is
connected between pins 2 and 3.
J422
Extended functions
RESET net coming from the
expansion board is connected
to WB_PD7 as a jumper is
connected between pins 1 and 2.
Extended functions
RESET net coming from the
expansion board is connected to
the microcontrollers as a jumper
is connected between pins 1 and
2 (default setting).
The configuration of each jumper must be consistent with the one of the groups it belongs to. For example, if you
change one of the jumpers belonging to a group, you have to move the other jumpers that belong to the same
group accordingly.
Warning: Leave the jumpers in their default position unless it is specifically requested in the official
documentation.
Figure 15. STEVAL-ASTRA1 jumper configuration to program STM32WB5MMG
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Figure 16. STEVAL-ASTRA1 jumper configuration to program STM32WL55JC
J422 controls the routing of the reset signal. In the default configuration (Figure 14), the reset signal that comes
from the expansion board is used to reset the two microcontrollers, according to the position of the J405 selector.
1.3.2.5 RGB LED (optional)
The STEVAL-ASTRA1 main board also embeds an RGB (red, green, and blue) LED (AB0038.D502), which is an
additional LED to the one embedded in the system on board. The STM32WB5MMG GPIOs manage both LEDs.
However, the main board LED is deactivated as a solder jumper (AB0038.J502) is not assembled.
1.3.2.6 Push buttons, antitampering, and buzzer
The STEVAL-ASTRA1 main board embeds two push buttons:
1. the power/wake-up button (AB0038.SW501) on the edge, with a dual role: it acts on the application power
circuit and sends an interrupt signal (BTN2) to the GPIO PC11 of the STM32WB5MMG microcontroller.
Moreover, it contributes to the generation of the STM32WB5MMG wake-up signal (WAKEUP) as described
in Section 1.3.2.7 ;
2. the user button (AB0038.SW500) connected to the GPIO PC13 of the STM32WB5MMG microcontroller that
manages the BTN1 signal.
The J503 connector (not mounted) allows using the BTN1 signal as antitampering when it is connected to a
normally closed (NC) external switch. Moreover, it allows connecting a buzzer driven through a PWM signal
(BUZZER) generated by the STM32WB5MMG PA1 GPIO. You can use this PA1 for debugging purposes.
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